JP6181156B2 - 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測 - Google Patents

研磨のインシトゥ監視時にデータをフィルタリングするための線形予測 Download PDF

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JP6181156B2
JP6181156B2 JP2015508995A JP2015508995A JP6181156B2 JP 6181156 B2 JP6181156 B2 JP 6181156B2 JP 2015508995 A JP2015508995 A JP 2015508995A JP 2015508995 A JP2015508995 A JP 2015508995A JP 6181156 B2 JP6181156 B2 JP 6181156B2
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signal
value
polishing
monitoring system
values
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Japanese (ja)
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JP2015519740A5 (enExample
JP2015519740A (ja
Inventor
ドミニク ジェイ． ベンヴェニュ，
ドミニク ジェイ． ベンヴェニュ，
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Applied Materials Inc
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Applied Materials Inc
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Numerical Control (AREA)
JP2015508995A 2012-04-26 2013-04-05 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測 Active JP6181156B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/456,801 US9308618B2 (en) 2012-04-26 2012-04-26 Linear prediction for filtering of data during in-situ monitoring of polishing
US13/456,801 2012-04-26
PCT/US2013/035514 WO2013162857A1 (en) 2012-04-26 2013-04-05 Linear prediction for filtering of data during in-situ monitoring of polishing

Publications (3)

Publication Number Publication Date
JP2015519740A JP2015519740A (ja) 2015-07-09
JP2015519740A5 JP2015519740A5 (enExample) 2016-06-02
JP6181156B2 true JP6181156B2 (ja) 2017-08-16

Family

ID=49477713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015508995A Active JP6181156B2 (ja) 2012-04-26 2013-04-05 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測

Country Status (5)

Country Link
US (1) US9308618B2 (enExample)
JP (1) JP6181156B2 (enExample)
KR (1) KR101919032B1 (enExample)
TW (1) TWI569919B (enExample)
WO (1) WO2013162857A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI885376B (zh) * 2018-03-12 2025-06-01 美商應用材料股份有限公司 在研磨原位監測期間的濾波

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8694144B2 (en) 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US9490186B2 (en) 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
US10065714B2 (en) * 2015-02-25 2018-09-04 Onesubsea Ip Uk Limited In-situ testing of subsea power components
US9727054B2 (en) 2015-02-25 2017-08-08 Onesubsea Ip Uk Limited Impedance measurement behind subsea transformer
US9679693B2 (en) 2015-02-25 2017-06-13 Onesubsea Ip Uk Limited Subsea transformer with seawater high resistance ground
US10026537B2 (en) 2015-02-25 2018-07-17 Onesubsea Ip Uk Limited Fault tolerant subsea transformer
US9945909B2 (en) 2015-02-25 2018-04-17 Onesubsea Ip Uk Limited Monitoring multiple subsea electric motors
US10565701B2 (en) * 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
JP2017102051A (ja) * 2015-12-03 2017-06-08 ニッタ株式会社 圧力測定装置及び圧力測定プログラム
JP2018001296A (ja) * 2016-06-28 2018-01-11 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム
CN109791881B (zh) 2016-09-21 2021-02-19 应用材料公司 具有补偿滤波的端点检测
JP6989317B2 (ja) 2017-08-04 2022-01-05 キオクシア株式会社 研磨装置、研磨方法、およびプログラム
US11504821B2 (en) 2017-11-16 2022-11-22 Applied Materials, Inc. Predictive filter for polishing pad wear rate monitoring
JP7098311B2 (ja) * 2017-12-05 2022-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
US11577362B2 (en) 2018-03-14 2023-02-14 Applied Materials, Inc. Pad conditioner cut rate monitoring
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
JP7151900B2 (ja) * 2019-07-16 2022-10-12 日本電気株式会社 推定装置、制御システム、推定方法及びプログラム
EP3800008B1 (de) * 2019-10-02 2024-12-04 Optikron GmbH Vorrichtung und verfahren zum schleifen und/oder polieren planer flächen von werkstücken
JP7374710B2 (ja) * 2019-10-25 2023-11-07 株式会社荏原製作所 研磨方法および研磨装置
JP7504713B2 (ja) * 2020-08-19 2024-06-24 キオクシア株式会社 半導体製造装置及び半導体製造方法
US11794305B2 (en) 2020-09-28 2023-10-24 Applied Materials, Inc. Platen surface modification and high-performance pad conditioning to improve CMP performance
JP7599330B2 (ja) * 2020-12-25 2024-12-13 株式会社荏原製作所 研磨装置、及び研磨方法
WO2022186993A1 (en) * 2021-03-03 2022-09-09 Applied Materials, Inc. Motor torque endpoint during polishing with spatial resolution
US12311494B2 (en) * 2021-03-03 2025-05-27 Applied Materials, Inc. Pressure signals during motor torque monitoring to provide spatial resolution
JP2023124546A (ja) * 2022-02-25 2023-09-06 株式会社荏原製作所 研磨装置および研磨装置における研磨終点検出方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5069002A (en) * 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
US5846882A (en) 1996-10-03 1998-12-08 Applied Materials, Inc. Endpoint detector for a chemical mechanical polishing system
US5865665A (en) * 1997-02-14 1999-02-02 Yueh; William In-situ endpoint control apparatus for semiconductor wafer polishing process
US6165051A (en) * 1998-10-29 2000-12-26 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
US6464824B1 (en) * 1999-08-31 2002-10-15 Micron Technology, Inc. Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
US6293845B1 (en) * 1999-09-04 2001-09-25 Mitsubishi Materials Corporation System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
US6290572B1 (en) * 2000-03-23 2001-09-18 Micron Technology, Inc. Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
DE60132385T2 (de) 2000-05-19 2008-05-15 Applied Materials, Inc., Santa Clara Polierkissen
JP4857468B2 (ja) * 2001-01-25 2012-01-18 ソニー株式会社 データ処理装置およびデータ処理方法、並びにプログラムおよび記録媒体
US6747283B1 (en) * 2001-03-19 2004-06-08 Lam Research Corporation In-situ detection of thin-metal interface using high resolution spectral analysis of optical interference
US7030018B2 (en) * 2002-02-04 2006-04-18 Kla-Tencor Technologies Corp. Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
US7087527B2 (en) * 2002-08-28 2006-08-08 Micron Technology, Inc. Extended kalman filter incorporating offline metrology
US6859765B2 (en) 2002-12-13 2005-02-22 Lam Research Corporation Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection
US6884147B2 (en) * 2003-03-28 2005-04-26 Yield Dynamics, Inc. Method for chemical-mechanical polish control in semiconductor manufacturing
JP2005011977A (ja) * 2003-06-18 2005-01-13 Ebara Corp 基板研磨装置および基板研磨方法
US7292906B2 (en) * 2004-07-14 2007-11-06 Tokyo Electron Limited Formula-based run-to-run control
JP4159594B1 (ja) 2007-05-21 2008-10-01 株式会社東京精密 研磨終了時点の予測・検出方法とその装置
JP5057892B2 (ja) * 2007-08-30 2012-10-24 株式会社東京精密 トルク変化を利用した研磨終端時点検知方法及びその装置
US8930013B2 (en) * 2010-06-28 2015-01-06 Applied Materials, Inc. Adaptively tracking spectrum features for endpoint detection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI885376B (zh) * 2018-03-12 2025-06-01 美商應用材料股份有限公司 在研磨原位監測期間的濾波

Also Published As

Publication number Publication date
WO2013162857A1 (en) 2013-10-31
TWI569919B (zh) 2017-02-11
JP2015519740A (ja) 2015-07-09
KR20150005674A (ko) 2015-01-14
US9308618B2 (en) 2016-04-12
TW201350261A (zh) 2013-12-16
US20130288572A1 (en) 2013-10-31
KR101919032B1 (ko) 2018-11-15

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