JP2015519740A5 - - Google Patents

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Publication number
JP2015519740A5
JP2015519740A5 JP2015508995A JP2015508995A JP2015519740A5 JP 2015519740 A5 JP2015519740 A5 JP 2015519740A5 JP 2015508995 A JP2015508995 A JP 2015508995A JP 2015508995 A JP2015508995 A JP 2015508995A JP 2015519740 A5 JP2015519740 A5 JP 2015519740A5
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JP
Japan
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signal
value
monitoring system
values
series
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JP2015508995A
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Japanese (ja)
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JP6181156B2 (ja
JP2015519740A (ja
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Priority claimed from US13/456,801 external-priority patent/US9308618B2/en
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JP2015508995A 2012-04-26 2013-04-05 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測 Active JP6181156B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/456,801 US9308618B2 (en) 2012-04-26 2012-04-26 Linear prediction for filtering of data during in-situ monitoring of polishing
US13/456,801 2012-04-26
PCT/US2013/035514 WO2013162857A1 (en) 2012-04-26 2013-04-05 Linear prediction for filtering of data during in-situ monitoring of polishing

Publications (3)

Publication Number Publication Date
JP2015519740A JP2015519740A (ja) 2015-07-09
JP2015519740A5 true JP2015519740A5 (enExample) 2016-06-02
JP6181156B2 JP6181156B2 (ja) 2017-08-16

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ID=49477713

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JP2015508995A Active JP6181156B2 (ja) 2012-04-26 2013-04-05 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測

Country Status (5)

Country Link
US (1) US9308618B2 (enExample)
JP (1) JP6181156B2 (enExample)
KR (1) KR101919032B1 (enExample)
TW (1) TWI569919B (enExample)
WO (1) WO2013162857A1 (enExample)

Families Citing this family (28)

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Publication number Priority date Publication date Assignee Title
US8694144B2 (en) 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US9490186B2 (en) 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
US10065714B2 (en) * 2015-02-25 2018-09-04 Onesubsea Ip Uk Limited In-situ testing of subsea power components
US9727054B2 (en) 2015-02-25 2017-08-08 Onesubsea Ip Uk Limited Impedance measurement behind subsea transformer
US9679693B2 (en) 2015-02-25 2017-06-13 Onesubsea Ip Uk Limited Subsea transformer with seawater high resistance ground
US10026537B2 (en) 2015-02-25 2018-07-17 Onesubsea Ip Uk Limited Fault tolerant subsea transformer
US9945909B2 (en) 2015-02-25 2018-04-17 Onesubsea Ip Uk Limited Monitoring multiple subsea electric motors
US10565701B2 (en) * 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
JP2017102051A (ja) * 2015-12-03 2017-06-08 ニッタ株式会社 圧力測定装置及び圧力測定プログラム
JP2018001296A (ja) * 2016-06-28 2018-01-11 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム
CN109791881B (zh) 2016-09-21 2021-02-19 应用材料公司 具有补偿滤波的端点检测
JP6989317B2 (ja) 2017-08-04 2022-01-05 キオクシア株式会社 研磨装置、研磨方法、およびプログラム
US11504821B2 (en) 2017-11-16 2022-11-22 Applied Materials, Inc. Predictive filter for polishing pad wear rate monitoring
JP7098311B2 (ja) * 2017-12-05 2022-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
JP7237083B2 (ja) * 2018-03-12 2023-03-10 アプライド マテリアルズ インコーポレイテッド 研磨のインシトゥモニタリングにおけるフィルタリング
US11577362B2 (en) 2018-03-14 2023-02-14 Applied Materials, Inc. Pad conditioner cut rate monitoring
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
JP7151900B2 (ja) * 2019-07-16 2022-10-12 日本電気株式会社 推定装置、制御システム、推定方法及びプログラム
EP3800008B1 (de) * 2019-10-02 2024-12-04 Optikron GmbH Vorrichtung und verfahren zum schleifen und/oder polieren planer flächen von werkstücken
JP7374710B2 (ja) * 2019-10-25 2023-11-07 株式会社荏原製作所 研磨方法および研磨装置
JP7504713B2 (ja) * 2020-08-19 2024-06-24 キオクシア株式会社 半導体製造装置及び半導体製造方法
US11794305B2 (en) 2020-09-28 2023-10-24 Applied Materials, Inc. Platen surface modification and high-performance pad conditioning to improve CMP performance
JP7599330B2 (ja) * 2020-12-25 2024-12-13 株式会社荏原製作所 研磨装置、及び研磨方法
WO2022186993A1 (en) * 2021-03-03 2022-09-09 Applied Materials, Inc. Motor torque endpoint during polishing with spatial resolution
US12311494B2 (en) * 2021-03-03 2025-05-27 Applied Materials, Inc. Pressure signals during motor torque monitoring to provide spatial resolution
JP2023124546A (ja) * 2022-02-25 2023-09-06 株式会社荏原製作所 研磨装置および研磨装置における研磨終点検出方法

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US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5069002A (en) * 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
US5846882A (en) 1996-10-03 1998-12-08 Applied Materials, Inc. Endpoint detector for a chemical mechanical polishing system
US5865665A (en) * 1997-02-14 1999-02-02 Yueh; William In-situ endpoint control apparatus for semiconductor wafer polishing process
US6165051A (en) * 1998-10-29 2000-12-26 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
US6464824B1 (en) * 1999-08-31 2002-10-15 Micron Technology, Inc. Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
US6293845B1 (en) * 1999-09-04 2001-09-25 Mitsubishi Materials Corporation System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
US6290572B1 (en) * 2000-03-23 2001-09-18 Micron Technology, Inc. Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
DE60132385T2 (de) 2000-05-19 2008-05-15 Applied Materials, Inc., Santa Clara Polierkissen
JP4857468B2 (ja) * 2001-01-25 2012-01-18 ソニー株式会社 データ処理装置およびデータ処理方法、並びにプログラムおよび記録媒体
US6747283B1 (en) * 2001-03-19 2004-06-08 Lam Research Corporation In-situ detection of thin-metal interface using high resolution spectral analysis of optical interference
US7030018B2 (en) * 2002-02-04 2006-04-18 Kla-Tencor Technologies Corp. Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
US7087527B2 (en) * 2002-08-28 2006-08-08 Micron Technology, Inc. Extended kalman filter incorporating offline metrology
US6859765B2 (en) 2002-12-13 2005-02-22 Lam Research Corporation Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection
US6884147B2 (en) * 2003-03-28 2005-04-26 Yield Dynamics, Inc. Method for chemical-mechanical polish control in semiconductor manufacturing
JP2005011977A (ja) * 2003-06-18 2005-01-13 Ebara Corp 基板研磨装置および基板研磨方法
US7292906B2 (en) * 2004-07-14 2007-11-06 Tokyo Electron Limited Formula-based run-to-run control
JP4159594B1 (ja) 2007-05-21 2008-10-01 株式会社東京精密 研磨終了時点の予測・検出方法とその装置
JP5057892B2 (ja) * 2007-08-30 2012-10-24 株式会社東京精密 トルク変化を利用した研磨終端時点検知方法及びその装置
US8930013B2 (en) * 2010-06-28 2015-01-06 Applied Materials, Inc. Adaptively tracking spectrum features for endpoint detection

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