JP2015519740A5 - - Google Patents

Download PDF

Info

Publication number
JP2015519740A5
JP2015519740A5 JP2015508995A JP2015508995A JP2015519740A5 JP 2015519740 A5 JP2015519740 A5 JP 2015519740A5 JP 2015508995 A JP2015508995 A JP 2015508995A JP 2015508995 A JP2015508995 A JP 2015508995A JP 2015519740 A5 JP2015519740 A5 JP 2015519740A5
Authority
JP
Japan
Prior art keywords
signal
value
monitoring system
values
series
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015508995A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015519740A (ja
JP6181156B2 (ja
Filing date
Publication date
Priority claimed from US13/456,801 external-priority patent/US9308618B2/en
Application filed filed Critical
Publication of JP2015519740A publication Critical patent/JP2015519740A/ja
Publication of JP2015519740A5 publication Critical patent/JP2015519740A5/ja
Application granted granted Critical
Publication of JP6181156B2 publication Critical patent/JP6181156B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015508995A 2012-04-26 2013-04-05 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測 Active JP6181156B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/456,801 US9308618B2 (en) 2012-04-26 2012-04-26 Linear prediction for filtering of data during in-situ monitoring of polishing
US13/456,801 2012-04-26
PCT/US2013/035514 WO2013162857A1 (en) 2012-04-26 2013-04-05 Linear prediction for filtering of data during in-situ monitoring of polishing

Publications (3)

Publication Number Publication Date
JP2015519740A JP2015519740A (ja) 2015-07-09
JP2015519740A5 true JP2015519740A5 (enExample) 2016-06-02
JP6181156B2 JP6181156B2 (ja) 2017-08-16

Family

ID=49477713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015508995A Active JP6181156B2 (ja) 2012-04-26 2013-04-05 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測

Country Status (5)

Country Link
US (1) US9308618B2 (enExample)
JP (1) JP6181156B2 (enExample)
KR (1) KR101919032B1 (enExample)
TW (1) TWI569919B (enExample)
WO (1) WO2013162857A1 (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8694144B2 (en) 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
US9490186B2 (en) * 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
US9375824B2 (en) * 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US9945909B2 (en) 2015-02-25 2018-04-17 Onesubsea Ip Uk Limited Monitoring multiple subsea electric motors
US10026537B2 (en) 2015-02-25 2018-07-17 Onesubsea Ip Uk Limited Fault tolerant subsea transformer
US9679693B2 (en) 2015-02-25 2017-06-13 Onesubsea Ip Uk Limited Subsea transformer with seawater high resistance ground
US9727054B2 (en) 2015-02-25 2017-08-08 Onesubsea Ip Uk Limited Impedance measurement behind subsea transformer
US10065714B2 (en) * 2015-02-25 2018-09-04 Onesubsea Ip Uk Limited In-situ testing of subsea power components
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
US10565701B2 (en) * 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
JP2017102051A (ja) * 2015-12-03 2017-06-08 ニッタ株式会社 圧力測定装置及び圧力測定プログラム
JP2018001296A (ja) * 2016-06-28 2018-01-11 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム
CN109791881B (zh) 2016-09-21 2021-02-19 应用材料公司 具有补偿滤波的端点检测
JP6989317B2 (ja) 2017-08-04 2022-01-05 キオクシア株式会社 研磨装置、研磨方法、およびプログラム
CN111132802B (zh) * 2017-11-16 2025-10-10 应用材料公司 用于抛光垫磨损率监测的预测滤波器
JP7098311B2 (ja) * 2017-12-05 2022-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
JP7237083B2 (ja) * 2018-03-12 2023-03-10 アプライド マテリアルズ インコーポレイテッド 研磨のインシトゥモニタリングにおけるフィルタリング
KR102706476B1 (ko) * 2018-03-14 2024-09-13 어플라이드 머티어리얼스, 인코포레이티드 패드 컨디셔너 절삭률 모니터링
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology
US12164279B2 (en) * 2019-07-16 2024-12-10 Nec Corporation Estimation apparatus, control system, estimation method, and program
EP3800008B1 (de) * 2019-10-02 2024-12-04 Optikron GmbH Vorrichtung und verfahren zum schleifen und/oder polieren planer flächen von werkstücken
JP7374710B2 (ja) * 2019-10-25 2023-11-07 株式会社荏原製作所 研磨方法および研磨装置
JP7504713B2 (ja) * 2020-08-19 2024-06-24 キオクシア株式会社 半導体製造装置及び半導体製造方法
US11794305B2 (en) 2020-09-28 2023-10-24 Applied Materials, Inc. Platen surface modification and high-performance pad conditioning to improve CMP performance
JP7599330B2 (ja) * 2020-12-25 2024-12-13 株式会社荏原製作所 研磨装置、及び研磨方法
US11980995B2 (en) 2021-03-03 2024-05-14 Applied Materials, Inc. Motor torque endpoint during polishing with spatial resolution
US12440942B2 (en) 2021-03-03 2025-10-14 Applied Materials, Inc. Pressure signals with different frequencies during friction monitoring to provide spatial resolution
JP2023124546A (ja) * 2022-02-25 2023-09-06 株式会社荏原製作所 研磨装置および研磨装置における研磨終点検出方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5069002A (en) * 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
US5846882A (en) 1996-10-03 1998-12-08 Applied Materials, Inc. Endpoint detector for a chemical mechanical polishing system
US5865665A (en) * 1997-02-14 1999-02-02 Yueh; William In-situ endpoint control apparatus for semiconductor wafer polishing process
US6165051A (en) * 1998-10-29 2000-12-26 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
US6464824B1 (en) * 1999-08-31 2002-10-15 Micron Technology, Inc. Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
US6293845B1 (en) * 1999-09-04 2001-09-25 Mitsubishi Materials Corporation System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
US6290572B1 (en) * 2000-03-23 2001-09-18 Micron Technology, Inc. Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
WO2001089765A1 (en) 2000-05-19 2001-11-29 Applied Materials, Inc. In-situ endpoint detection and process monitoring method and apparatus for chemical mechanical polishing
JP4857468B2 (ja) * 2001-01-25 2012-01-18 ソニー株式会社 データ処理装置およびデータ処理方法、並びにプログラムおよび記録媒体
US6747283B1 (en) * 2001-03-19 2004-06-08 Lam Research Corporation In-situ detection of thin-metal interface using high resolution spectral analysis of optical interference
US6935922B2 (en) * 2002-02-04 2005-08-30 Kla-Tencor Technologies Corp. Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing
US7087527B2 (en) * 2002-08-28 2006-08-08 Micron Technology, Inc. Extended kalman filter incorporating offline metrology
US6859765B2 (en) 2002-12-13 2005-02-22 Lam Research Corporation Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection
US6884147B2 (en) * 2003-03-28 2005-04-26 Yield Dynamics, Inc. Method for chemical-mechanical polish control in semiconductor manufacturing
JP2005011977A (ja) * 2003-06-18 2005-01-13 Ebara Corp 基板研磨装置および基板研磨方法
US7292906B2 (en) * 2004-07-14 2007-11-06 Tokyo Electron Limited Formula-based run-to-run control
JP4159594B1 (ja) 2007-05-21 2008-10-01 株式会社東京精密 研磨終了時点の予測・検出方法とその装置
JP5057892B2 (ja) * 2007-08-30 2012-10-24 株式会社東京精密 トルク変化を利用した研磨終端時点検知方法及びその装置
US8930013B2 (en) * 2010-06-28 2015-01-06 Applied Materials, Inc. Adaptively tracking spectrum features for endpoint detection

Similar Documents

Publication Publication Date Title
JP2015519740A5 (enExample)
KR101919032B1 (ko) 인-시츄 폴리싱 모니터링 중에 데이터의 필터링을 위한 선형 예측
JP2015212863A5 (enExample)
JP2015138864A5 (enExample)
WO2016139068A3 (en) Vehicle state estimation apparatus and method
MX2023000807A (es) Metodo de prediccion de imagenes y aparato de prediccion de imagenes.
EP4527291A3 (en) Improved accuracy continuous glucose monitoring method, system, and device
WO2013144342A3 (fr) Procede et dispositif de localisation d'un objet magnetique
FR3019295B1 (fr) Procede d'estimation du caractere normal ou non d'une valeur mesuree d'un parametre physique d'un moteur d'aeronef
Majumder et al. Lattice Boltzmann method for multi-dimensional population balance models in crystallization
RU2015112126A (ru) Устройство и способ для обеспечения информированной оценки вероятности и присутствия многоканальной речи
WO2012175944A3 (en) Tracking algorithm
WO2013019553A3 (en) Precise borehole geometry and bha lateral motion based on real time caliper measurements
EP2479974A3 (en) Image processing apparatus and pixel interpolation method
JP2013258283A5 (enExample)
RU2020100879A (ru) Оценивание фонового шума в аудиосигналах
JP2016507087A5 (enExample)
JP2016116743A5 (enExample)
WO2012150434A3 (en) Estimation of background radiation in spectral datea by polynomial fitting
GB201308019D0 (en) Inverter controller and method of controlling an inverter
GB2592166A9 (en) Methods of estimating a position of a rotor in a motor under transient and systems thereof
JP2017068625A (ja) 学習制御器の特性測定を行う機能を有するサーボ制御装置
EP4375993A3 (en) Apparatus and method for improved concealment of the adaptive codebook in acelp-like concealment employing improved pitch lag estimation
JP2018204952A (ja) 変位量算出システム、プログラム及び記録媒体
Gatica et al. Analysis of an augmented pseudostress-based mixed formulation for a nonlinear Brinkman model of porous media flow