TWI568798B - 光半導體元件封裝用硬化性矽酮組合物、樹脂封裝光半導體元件之製造方法、及樹脂封裝光半導體元件 - Google Patents

光半導體元件封裝用硬化性矽酮組合物、樹脂封裝光半導體元件之製造方法、及樹脂封裝光半導體元件 Download PDF

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TWI568798B
TWI568798B TW101134820A TW101134820A TWI568798B TW I568798 B TWI568798 B TW I568798B TW 101134820 A TW101134820 A TW 101134820A TW 101134820 A TW101134820 A TW 101134820A TW I568798 B TWI568798 B TW I568798B
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Taiwan
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sio
optical semiconductor
composition
mass
semiconductor element
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TW101134820A
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Chinese (zh)
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TW201323525A (zh
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宮本侑典
吉武誠
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道康寧東麗股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F30/00—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F30/04—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F30/08—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
TW101134820A 2011-09-21 2012-09-21 光半導體元件封裝用硬化性矽酮組合物、樹脂封裝光半導體元件之製造方法、及樹脂封裝光半導體元件 TWI568798B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011205480A JP6057503B2 (ja) 2011-09-21 2011-09-21 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子

Publications (2)

Publication Number Publication Date
TW201323525A TW201323525A (zh) 2013-06-16
TWI568798B true TWI568798B (zh) 2017-02-01

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TW101134820A TWI568798B (zh) 2011-09-21 2012-09-21 光半導體元件封裝用硬化性矽酮組合物、樹脂封裝光半導體元件之製造方法、及樹脂封裝光半導體元件

Country Status (7)

Country Link
US (1) US8912302B2 (https=)
EP (1) EP2758473B1 (https=)
JP (1) JP6057503B2 (https=)
KR (1) KR101818412B1 (https=)
CN (1) CN103814087B (https=)
TW (1) TWI568798B (https=)
WO (1) WO2013042794A1 (https=)

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EP3041897B1 (en) * 2013-09-03 2017-05-24 Dow Corning Corporation Additive for a silicone encapsulant
US20150307759A1 (en) * 2014-04-28 2015-10-29 Ames Rubber Corporation Solventless curable coating systems and uses thereof
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WO2017126199A1 (ja) * 2016-01-19 2017-07-27 セントラル硝子株式会社 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置
TWI762659B (zh) * 2017-06-19 2022-05-01 美商陶氏有機矽公司 用於轉注或射出成型光學部件的聚矽氧液狀組成物、從其製成的轉注或射出成型光學部件、以及使用該組成物轉注或射出成型光學部件的方法
KR20210019000A (ko) 2018-06-12 2021-02-19 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 난연성 폴리오르가노실록산 조성물, 난연성 경화물, 및 광학용 부재
WO2019240124A1 (ja) * 2018-06-12 2019-12-19 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 成形用ポリオルガノシロキサン組成物、光学用部材、および成形方法
JP6981939B2 (ja) * 2018-08-28 2021-12-17 信越化学工業株式会社 付加硬化型シリコーン組成物及び半導体装置
TWI844552B (zh) * 2018-09-10 2024-06-11 美商陶氏有機矽公司 用於生產光學聚矽氧總成之方法、及藉其生產之光學聚矽氧總成
KR20220094128A (ko) 2020-12-28 2022-07-05 롬엔드하스전자재료코리아유한회사 광 디바이스용 구조체, 이의 제조방법, 및 이를 위한 광경화성 실록산 수지 조성물

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JP2006213789A (ja) * 2005-02-02 2006-08-17 Ge Toshiba Silicones Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2006299099A (ja) * 2005-04-21 2006-11-02 Shin Etsu Chem Co Ltd 光半導体素子封止用樹脂組成物及び光半導体素子
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Also Published As

Publication number Publication date
WO2013042794A1 (en) 2013-03-28
US8912302B2 (en) 2014-12-16
KR20140078655A (ko) 2014-06-25
CN103814087A (zh) 2014-05-21
CN103814087B (zh) 2016-06-08
EP2758473B1 (en) 2018-12-19
KR101818412B1 (ko) 2018-01-15
TW201323525A (zh) 2013-06-16
JP2013067683A (ja) 2013-04-18
EP2758473A1 (en) 2014-07-30
US20140235806A1 (en) 2014-08-21
JP6057503B2 (ja) 2017-01-11

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