CN103814087B - 用于密封光学半导体元件的可固化有机硅组合物、制备树脂密封的光学半导体元件的方法、以及树脂密封的光学半导体元件 - Google Patents

用于密封光学半导体元件的可固化有机硅组合物、制备树脂密封的光学半导体元件的方法、以及树脂密封的光学半导体元件 Download PDF

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CN103814087B
CN103814087B CN201280044796.XA CN201280044796A CN103814087B CN 103814087 B CN103814087 B CN 103814087B CN 201280044796 A CN201280044796 A CN 201280044796A CN 103814087 B CN103814087 B CN 103814087B
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sio
semiconductor element
composition
silicon
organopolysiloxane
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CN103814087A (zh
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宫本侑典
吉武诚
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Duropco Materials Co ltd
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F30/00—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F30/04—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • C08F30/08—Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
CN201280044796.XA 2011-09-21 2012-09-18 用于密封光学半导体元件的可固化有机硅组合物、制备树脂密封的光学半导体元件的方法、以及树脂密封的光学半导体元件 Active CN103814087B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011205480A JP6057503B2 (ja) 2011-09-21 2011-09-21 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子
JP2011-205480 2011-09-21
PCT/JP2012/074601 WO2013042794A1 (en) 2011-09-21 2012-09-18 Curable silicone composition for sealing an optical semiconductor element, method of producing a resin-sealed optical semiconductor element, and resin-sealed optical semiconductor element

Publications (2)

Publication Number Publication Date
CN103814087A CN103814087A (zh) 2014-05-21
CN103814087B true CN103814087B (zh) 2016-06-08

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Country Status (7)

Country Link
US (1) US8912302B2 (https=)
EP (1) EP2758473B1 (https=)
JP (1) JP6057503B2 (https=)
KR (1) KR101818412B1 (https=)
CN (1) CN103814087B (https=)
TW (1) TWI568798B (https=)
WO (1) WO2013042794A1 (https=)

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JP2014082284A (ja) * 2012-10-15 2014-05-08 Dow Corning Toray Co Ltd 凸状硬化物及び基材を備える一体化物の製造方法
JP6297070B2 (ja) * 2013-02-22 2018-03-20 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
EP3041897B1 (en) * 2013-09-03 2017-05-24 Dow Corning Corporation Additive for a silicone encapsulant
US20150307759A1 (en) * 2014-04-28 2015-10-29 Ames Rubber Corporation Solventless curable coating systems and uses thereof
WO2017087351A1 (en) * 2015-11-18 2017-05-26 Dow Corning Corporation Curable silicone composition
WO2017126199A1 (ja) * 2016-01-19 2017-07-27 セントラル硝子株式会社 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置
TWI762659B (zh) * 2017-06-19 2022-05-01 美商陶氏有機矽公司 用於轉注或射出成型光學部件的聚矽氧液狀組成物、從其製成的轉注或射出成型光學部件、以及使用該組成物轉注或射出成型光學部件的方法
KR20210019000A (ko) 2018-06-12 2021-02-19 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 난연성 폴리오르가노실록산 조성물, 난연성 경화물, 및 광학용 부재
WO2019240124A1 (ja) * 2018-06-12 2019-12-19 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 成形用ポリオルガノシロキサン組成物、光学用部材、および成形方法
JP6981939B2 (ja) * 2018-08-28 2021-12-17 信越化学工業株式会社 付加硬化型シリコーン組成物及び半導体装置
TWI844552B (zh) * 2018-09-10 2024-06-11 美商陶氏有機矽公司 用於生產光學聚矽氧總成之方法、及藉其生產之光學聚矽氧總成
KR20220094128A (ko) 2020-12-28 2022-07-05 롬엔드하스전자재료코리아유한회사 광 디바이스용 구조체, 이의 제조방법, 및 이를 위한 광경화성 실록산 수지 조성물

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JP2006213789A (ja) * 2005-02-02 2006-08-17 Ge Toshiba Silicones Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2006299099A (ja) * 2005-04-21 2006-11-02 Shin Etsu Chem Co Ltd 光半導体素子封止用樹脂組成物及び光半導体素子
JP2009185226A (ja) * 2008-02-08 2009-08-20 Shin Etsu Chem Co Ltd 加熱硬化性シリコーン組成物とそれを用いた光学部材用成形物
CN101671483A (zh) * 2008-09-11 2010-03-17 信越化学工业株式会社 固化性有机硅树脂组合物、固化物及遮光性有机硅粘接片
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Also Published As

Publication number Publication date
WO2013042794A1 (en) 2013-03-28
US8912302B2 (en) 2014-12-16
KR20140078655A (ko) 2014-06-25
TWI568798B (zh) 2017-02-01
CN103814087A (zh) 2014-05-21
EP2758473B1 (en) 2018-12-19
KR101818412B1 (ko) 2018-01-15
TW201323525A (zh) 2013-06-16
JP2013067683A (ja) 2013-04-18
EP2758473A1 (en) 2014-07-30
US20140235806A1 (en) 2014-08-21
JP6057503B2 (ja) 2017-01-11

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Address after: 2-11-1 Chiyoda cho, Chiyoda ku, Tokyo, Japan

Patentee after: DuPont Dongli special materials Co.,Ltd.

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