TWI567956B - 特別用於運算式攝影機之晶圓級光學裝置之製造 - Google Patents

特別用於運算式攝影機之晶圓級光學裝置之製造 Download PDF

Info

Publication number
TWI567956B
TWI567956B TW101131007A TW101131007A TWI567956B TW I567956 B TWI567956 B TW I567956B TW 101131007 A TW101131007 A TW 101131007A TW 101131007 A TW101131007 A TW 101131007A TW I567956 B TWI567956 B TW I567956B
Authority
TW
Taiwan
Prior art keywords
optical
wafer
spacer
members
processing step
Prior art date
Application number
TW101131007A
Other languages
English (en)
Chinese (zh)
Other versions
TW201327790A (zh
Inventor
哈馬特 盧德曼
馬修斯 馬路克
亞歷山大 拜斯奇
彼得 羅英特根
海格那 史帝芬
Original Assignee
新加坡恒立私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新加坡恒立私人有限公司 filed Critical 新加坡恒立私人有限公司
Publication of TW201327790A publication Critical patent/TW201327790A/zh
Application granted granted Critical
Publication of TWI567956B publication Critical patent/TWI567956B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49748—Repairing by shaping, e.g., bending, extruding, turning, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Lens Barrels (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW101131007A 2011-08-25 2012-08-27 特別用於運算式攝影機之晶圓級光學裝置之製造 TWI567956B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161527355P 2011-08-25 2011-08-25

Publications (2)

Publication Number Publication Date
TW201327790A TW201327790A (zh) 2013-07-01
TWI567956B true TWI567956B (zh) 2017-01-21

Family

ID=46969906

Family Applications (3)

Application Number Title Priority Date Filing Date
TW101131007A TWI567956B (zh) 2011-08-25 2012-08-27 特別用於運算式攝影機之晶圓級光學裝置之製造
TW105134073A TWI620310B (zh) 2011-08-25 2012-08-27 特別用於運算式攝影機之晶圓級光學裝置之製造
TW101131008A TWI582969B (zh) 2011-08-25 2012-08-27 具有前焦距校正之晶圓級光學裝置之製造

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW105134073A TWI620310B (zh) 2011-08-25 2012-08-27 特別用於運算式攝影機之晶圓級光學裝置之製造
TW101131008A TWI582969B (zh) 2011-08-25 2012-08-27 具有前焦距校正之晶圓級光學裝置之製造

Country Status (8)

Country Link
US (2) US20140307081A1 (OSRAM)
EP (2) EP2748854B1 (OSRAM)
JP (2) JP6223975B2 (OSRAM)
KR (2) KR102056501B1 (OSRAM)
CN (2) CN103890948B (OSRAM)
SG (4) SG2014008726A (OSRAM)
TW (3) TWI567956B (OSRAM)
WO (2) WO2013026174A2 (OSRAM)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130122247A1 (en) * 2011-11-10 2013-05-16 Omnivision Technologies, Inc. Spacer Wafer For Wafer-Level Camera And Method For Manufacturing Same
US9595553B2 (en) 2012-11-02 2017-03-14 Heptagon Micro Optics Pte. Ltd. Optical modules including focal length adjustment and fabrication of the optical modules
CN105765722B (zh) 2013-11-22 2019-10-22 赫普塔冈微光有限公司 紧凑光电模块
US9977153B2 (en) 2014-02-07 2018-05-22 Heptagon Micro Optics Pte. Ltd. Stacks of arrays of beam shaping elements including stacking, self-alignment and/or self-centering features
WO2015126328A1 (en) * 2014-02-18 2015-08-27 Heptagon Micro Optics Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
WO2015191001A1 (en) 2014-06-10 2015-12-17 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules including hybrid arrangements of beam shaping elements, and imaging devices incorporating the same
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9507143B2 (en) 2014-09-19 2016-11-29 Intel Corporation Compact illumination system
EP3207416B1 (en) 2014-10-14 2020-02-26 Heptagon Micro Optics Pte. Ltd. Optical element stack assemblies
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
KR102329129B1 (ko) * 2015-05-12 2021-11-19 삼성전자주식회사 샘플값 보상을 위한 영상 부호화 방법과 그 장치, 및 샘플값 보상을 위한 영상 복호화 방법과 그 장치
WO2016191142A2 (en) * 2015-05-27 2016-12-01 Verily Life Sciences Llc Nanophotonic hyperspectral/lightfield superpixel imager
JP6619174B2 (ja) * 2015-07-31 2019-12-11 ソニーセミコンダクタソリューションズ株式会社 製造装置および方法
WO2017023211A1 (en) * 2015-08-06 2017-02-09 Heptagon Micro Optics Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
DE102015215833A1 (de) 2015-08-19 2017-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung mit Optiksubstrat
CN108700721B (zh) 2015-11-12 2021-12-31 赫普塔冈微光有限公司 光学元件堆叠组件
KR20170073910A (ko) 2015-12-21 2017-06-29 에스케이하이닉스 주식회사 라이트 필드 이미징 장치 및 그 제조방법
DE102016200285A1 (de) * 2016-01-13 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung, Abbildungssystem und Verfahren zum Erfassen eines Objektbereichs
CN108941932A (zh) * 2017-05-23 2018-12-07 东莞东阳光科研发有限公司 人工晶体制备方法
US10677964B2 (en) * 2017-10-23 2020-06-09 Omnivision Technologies, Inc. Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
WO2020183600A1 (ja) 2019-03-12 2020-09-17 オリンパス株式会社 内視鏡用撮像装置、および、内視鏡
JP7654570B2 (ja) 2020-01-30 2025-04-01 古河電気工業株式会社 光モジュールおよび光学装置
US11664399B2 (en) * 2021-02-01 2023-05-30 Visera Technologies Company Limited Solid-state image sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080230934A1 (en) * 2007-03-23 2008-09-25 Heptagon Oy Method of producing a wafer scale package
TW200903792A (en) * 2007-05-11 2009-01-16 Micron Technology Inc Image sensor
TW200929456A (en) * 2007-11-27 2009-07-01 Heptagon Oy Encapsulated lens stack
TW201115204A (en) * 2009-10-20 2011-05-01 Tessera North America Inc Focus compensation for optical elements and applications thereof

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232549A (en) * 1992-04-14 1993-08-03 Micron Technology, Inc. Spacers for field emission display fabricated via self-aligned high energy ablation
DE10058305A1 (de) * 2000-11-24 2002-06-06 Wacker Siltronic Halbleitermat Verfahren zur Oberflächenpolitur von Siliciumscheiben
WO2002065165A2 (en) * 2001-02-09 2002-08-22 Digital Optics Corporation Compensation and/or variation of wafer level produced lenses and resultant structures
JP4397819B2 (ja) * 2002-09-17 2010-01-13 アンテルヨン、ベスローテン、フェンノートシャップ カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法
DE102005002545A1 (de) 2005-01-19 2006-07-20 Airbus Deutschland Gmbh Energiepuffereinrichtung für ein Flugzeug
CA2558898C (en) * 2005-09-07 2013-11-05 Purdue Research Foundation Laser assisted machining process with distributed lasers
JP2007110588A (ja) * 2005-10-17 2007-04-26 Funai Electric Co Ltd 複眼撮像装置
CN101009779B (zh) 2006-01-24 2010-06-16 采钰科技股份有限公司 高精密度成像控制的影像感应模块
US7721564B2 (en) 2006-11-21 2010-05-25 B/E Aerospace, Inc. Wild frequency avionic refrigeration system and controller therefor
EP2223173B1 (en) 2007-12-19 2013-09-04 Heptagon Micro Optics Pte. Ltd. Camera device and manufacturing methods therefor
US20090159200A1 (en) 2007-12-19 2009-06-25 Heptagon Oy Spacer element and method for manufacturing a spacer element
TWI478808B (zh) * 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
US8319301B2 (en) * 2008-02-11 2012-11-27 Omnivision Technologies, Inc. Self-aligned filter for an image sensor
CN102037383B (zh) * 2008-03-27 2014-09-17 数字光学公司 包括至少一个复制面的光学器件及其相关方法
WO2010074743A1 (en) * 2008-12-22 2010-07-01 Tessera North America, Inc. Focus compensation for thin cameras
TW201115205A (en) 2009-03-18 2011-05-01 Artificial Muscle Inc Wafer level optical system
JP2011018974A (ja) * 2009-07-07 2011-01-27 Renesas Electronics Corp Ｄ／ａコンバータ
US8193599B2 (en) * 2009-09-02 2012-06-05 Himax Semiconductor, Inc. Fabricating method and structure of a wafer level module
US8059341B2 (en) * 2009-09-23 2011-11-15 Visera Technologies Company Limited Lens assembly and method for forming the same
US8885257B2 (en) * 2009-10-20 2014-11-11 Flir Systems Trading Belgium Bvba Focus compensation for optical elements and applications thereof
WO2011063347A2 (en) 2009-11-20 2011-05-26 Pelican Imaging Corporation Capturing and processing of images using monolithic camera array with heterogeneous imagers
WO2011156928A2 (en) 2010-06-14 2011-12-22 Heptagon Oy Camera, and method of manufacturing a plurality of cameras

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080230934A1 (en) * 2007-03-23 2008-09-25 Heptagon Oy Method of producing a wafer scale package
TW200903792A (en) * 2007-05-11 2009-01-16 Micron Technology Inc Image sensor
TW200929456A (en) * 2007-11-27 2009-07-01 Heptagon Oy Encapsulated lens stack
TW201115204A (en) * 2009-10-20 2011-05-01 Tessera North America Inc Focus compensation for optical elements and applications thereof

Also Published As

Publication number Publication date
CN103890949B (zh) 2017-10-03
TW201316497A (zh) 2013-04-16
TW201724487A (zh) 2017-07-01
KR102056501B1 (ko) 2019-12-16
TWI620310B (zh) 2018-04-01
CN103890948A (zh) 2014-06-25
JP6282225B2 (ja) 2018-02-21
KR20140054280A (ko) 2014-05-08
US20140299587A1 (en) 2014-10-09
WO2013026174A3 (en) 2013-04-11
JP6223975B2 (ja) 2017-11-01
CN103890949A (zh) 2014-06-25
EP2748853B1 (en) 2023-10-11
EP2748854A1 (en) 2014-07-02
EP2748853A2 (en) 2014-07-02
WO2013026174A2 (en) 2013-02-28
TWI582969B (zh) 2017-05-11
KR101966480B1 (ko) 2019-04-05
TW201327790A (zh) 2013-07-01
SG2014008718A (en) 2014-04-28
US10444477B2 (en) 2019-10-15
WO2013026175A1 (en) 2013-02-28
CN103890948B (zh) 2017-12-01
US20140307081A1 (en) 2014-10-16
JP2014524597A (ja) 2014-09-22
SG10201606884TA (en) 2016-10-28
EP2748854B1 (en) 2021-06-02
JP2014526067A (ja) 2014-10-02
SG2014008726A (en) 2014-04-28
SG10201606882XA (en) 2016-10-28
KR20140068984A (ko) 2014-06-09

Similar Documents

Publication Publication Date Title
TWI620310B (zh) 特別用於運算式攝影機之晶圓級光學裝置之製造
TWI629525B (zh) 包含焦距調整之光學模組及光學模組之製造
CN103376527B (zh) 用于晶片级照相机的透镜板及其制造方法
TWI647824B (zh) 製造被動光學元件的方法及包含該元件的裝置
CN104822517B (zh) 截断型镜片、截断型镜片对及相应装置的制造
TW201535694A (zh) 晶圓級光學模組及其製造方法
HK1186777A (en) Lens plate for wafer-level camera and method of manufacturing same
HK1186777B (en) Lens plate for wafer-level camera and method of manufacturing same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees