JP6223975B2 - 光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作 - Google Patents

光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作 Download PDF

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Publication number
JP6223975B2
JP6223975B2 JP2014526351A JP2014526351A JP6223975B2 JP 6223975 B2 JP6223975 B2 JP 6223975B2 JP 2014526351 A JP2014526351 A JP 2014526351A JP 2014526351 A JP2014526351 A JP 2014526351A JP 6223975 B2 JP6223975 B2 JP 6223975B2
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optical
spacer
wafer
members
processing step
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Japanese (ja)
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JP2014526067A5 (OSRAM
JP2014526067A (ja
Inventor
ラドマン，ハルトムート
マルック，マティアス
ビーチ，アレクサンダー
レントゲン，ペーター
ハイムガルトナー，シュテファン
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Ams Sensors Singapore Pte Ltd
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Heptagon Micro Optics Pte Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49748—Repairing by shaping, e.g., bending, extruding, turning, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Lens Barrels (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2014526351A 2011-08-25 2012-08-24 光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作 Active JP6223975B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161527355P 2011-08-25 2011-08-25
US61/527,355 2011-08-25
PCT/CH2012/000200 WO2013026174A2 (en) 2011-08-25 2012-08-24 Wafer-level fabrication of optical devices. in particular of modules for computational cameras

Publications (3)

Publication Number Publication Date
JP2014526067A JP2014526067A (ja) 2014-10-02
JP2014526067A5 JP2014526067A5 (OSRAM) 2015-10-15
JP6223975B2 true JP6223975B2 (ja) 2017-11-01

Family

ID=46969906

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014526351A Active JP6223975B2 (ja) 2011-08-25 2012-08-24 光学装置の、特にコンピュテーショナルカメラ用モジュールのウェハレベルの製作
JP2014526352A Active JP6282225B2 (ja) 2011-08-25 2012-08-24 前方焦点距離訂正を有する光学装置のウェハレベルの製作

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014526352A Active JP6282225B2 (ja) 2011-08-25 2012-08-24 前方焦点距離訂正を有する光学装置のウェハレベルの製作

Country Status (8)

Country Link
US (2) US20140307081A1 (OSRAM)
EP (2) EP2748854B1 (OSRAM)
JP (2) JP6223975B2 (OSRAM)
KR (2) KR102056501B1 (OSRAM)
CN (2) CN103890948B (OSRAM)
SG (4) SG2014008726A (OSRAM)
TW (3) TWI567956B (OSRAM)
WO (2) WO2013026174A2 (OSRAM)

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WO2015126328A1 (en) * 2014-02-18 2015-08-27 Heptagon Micro Optics Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
WO2015191001A1 (en) 2014-06-10 2015-12-17 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules including hybrid arrangements of beam shaping elements, and imaging devices incorporating the same
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
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US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
KR102329129B1 (ko) * 2015-05-12 2021-11-19 삼성전자주식회사 샘플값 보상을 위한 영상 부호화 방법과 그 장치, 및 샘플값 보상을 위한 영상 복호화 방법과 그 장치
WO2016191142A2 (en) * 2015-05-27 2016-12-01 Verily Life Sciences Llc Nanophotonic hyperspectral/lightfield superpixel imager
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WO2017023211A1 (en) * 2015-08-06 2017-02-09 Heptagon Micro Optics Pte. Ltd. Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
DE102015215833A1 (de) 2015-08-19 2017-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung mit Optiksubstrat
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KR20170073910A (ko) 2015-12-21 2017-06-29 에스케이하이닉스 주식회사 라이트 필드 이미징 장치 및 그 제조방법
DE102016200285A1 (de) * 2016-01-13 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung, Abbildungssystem und Verfahren zum Erfassen eines Objektbereichs
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Also Published As

Publication number Publication date
CN103890949B (zh) 2017-10-03
TW201316497A (zh) 2013-04-16
TW201724487A (zh) 2017-07-01
KR102056501B1 (ko) 2019-12-16
TWI620310B (zh) 2018-04-01
CN103890948A (zh) 2014-06-25
JP6282225B2 (ja) 2018-02-21
KR20140054280A (ko) 2014-05-08
US20140299587A1 (en) 2014-10-09
WO2013026174A3 (en) 2013-04-11
CN103890949A (zh) 2014-06-25
EP2748853B1 (en) 2023-10-11
EP2748854A1 (en) 2014-07-02
EP2748853A2 (en) 2014-07-02
TWI567956B (zh) 2017-01-21
WO2013026174A2 (en) 2013-02-28
TWI582969B (zh) 2017-05-11
KR101966480B1 (ko) 2019-04-05
TW201327790A (zh) 2013-07-01
SG2014008718A (en) 2014-04-28
US10444477B2 (en) 2019-10-15
WO2013026175A1 (en) 2013-02-28
CN103890948B (zh) 2017-12-01
US20140307081A1 (en) 2014-10-16
JP2014524597A (ja) 2014-09-22
SG10201606884TA (en) 2016-10-28
EP2748854B1 (en) 2021-06-02
JP2014526067A (ja) 2014-10-02
SG2014008726A (en) 2014-04-28
SG10201606882XA (en) 2016-10-28
KR20140068984A (ko) 2014-06-09

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