TWI567796B - Apparatus for and method of irradiating light - Google Patents

Description

Light irradiation device and light irradiation method

The present invention relates to a light irradiation device and a light irradiation method for irradiating a main surface of a substrate with a flash.

Conventionally, in the manufacturing steps of a flexible device, a flexible display, a flat panel display, an electronic device, a solar cell, a fuel cell, and a semiconductor, there is used a light irradiation device which is in the form of a sheet or a thin plate. The main surface of the substrate is irradiated with a flash to heat the substrate.

In the conventional light irradiation device, the light source of the flash and the processing chamber for accommodating the substrate are separated by a light-transmitting plate such as quartz glass. Further, the main surface of the substrate is irradiated with a flash light from the light source via the light-transmitting plate. For the purpose of providing the light-transmitting plate, in the event that the light source is broken, the debris is not scattered toward the substrate side; or the gas for cooling the light source is supplied only to the space on the light source side of the light-transmitting plate, thereby Improve cooling efficiency.

A conventional light irradiation device having such a light-transmitting plate is described, for example, in Patent Documents 1 and 2.

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2013-55141

Patent Document 2: Japanese Patent Laid-Open Publication No. 2001-217198

However, if the light-transmitting plate is interposed between the light source and the substrate, the light source cannot be sufficiently brought close to the main surface of the substrate. Moreover, the amount of light of the flash is reduced by the reflection on the surface of the light-transmitting plate and the absorption of light into the light-transmitting plate. Thereby, the energy imparted to the main surface of the substrate is reduced.

Further, when a light-transmitting plate such as quartz glass is used, the manufacturing cost of the light irradiation device increases. In particular, in recent years, as the size of the substrate to be processed is increased, the area and thickness of the light-transmitting sheet are also increased, whereby the material cost of the light-transmitting sheet tends to increase. Moreover, in the prior structure, when the base material is enlarged, the processing chamber for accommodating the substrate also has to be enlarged. As a result, the amount of process gas used to fill the processing chamber increases. As a result, the operating cost of the light irradiation device also increases.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a light irradiation device and a light irradiation method capable of illuminating a main surface of a substrate without a light-transmitting plate such as quartz glass, and suppressing the flash. The volume of the space illuminated.

In order to solve the above problem, the first aspect of the present invention is a light irradiation device for irradiating a main surface of a substrate with a flash, comprising: a holding portion that holds the substrate; and a light irradiation portion that faces the base held by the holding portion The main surface of the material is irradiated with a flash; the frame receives the light irradiation portion in a single internal space, and has an opening on the substrate side; and the sealing member is disposed on a periphery of the opening of the frame; and The contact/separation mechanism relatively moves the base material and the sealing member so that the main surface of the base material comes into contact with and separates from the sealing member.

According to a second aspect of the invention, in the light-emitting device of the first aspect, the opening of the frame body is smaller than a main surface of the substrate, and the light irradiation device further includes a transfer mechanism that causes the substrate and the substrate The frame is relatively moved in a direction parallel to the main surface of the substrate.

According to a third aspect of the invention, the light irradiation device of the second aspect of the invention The fixing is fixed, and the conveying mechanism moves the substrate.

According to a fourth aspect of the invention, in the light-emitting device of the third aspect, the substrate is in the form of a sheet or a thin plate.

According to a fifth aspect of the invention, in the light irradiation device of the fourth aspect of the invention, the substrate is a flexible sheet-shaped substrate, and the transfer mechanism includes a delivery roller that is transported in a direction closer to the holding portion. The substrate is fed to the upstream side, and a winding roller that winds the substrate on the downstream side in the transport direction from the holding portion.

According to a sixth aspect of the invention, in the light irradiation device of the fifth aspect, the holding portion supports the substrate while applying tension to the substrate.

According to a seventh aspect of the invention, the light irradiation device of the sixth aspect, wherein the holding portion has a plurality of rollers supporting the substrate.

According to a eighth aspect of the invention, the light irradiation device of the fourth aspect, wherein the holding portion has a platform for supporting a substrate.

According to a ninth aspect of the invention, the light-irradiating device of the first aspect of the invention, wherein the holding portion is held substantially horizontally in a state in which a main surface of the base material faces downward, and the light-irradiating portion and the frame are It is disposed on the lower side of the substrate held by the holding portion.

According to a tenth aspect of the invention, the light irradiation device of the first aspect of the invention, further comprising: a gas supply unit that supplies a gas to the inside of the casing.

According to a tenth aspect of the invention, the light irradiation device of the tenth aspect, wherein the gas is an inert gas.

According to a twelfth aspect of the invention, the light irradiation device of the eleventh aspect, wherein the inert gas is nitrogen.

According to a thirteenth aspect of the invention, the light-irradiation device of the first aspect of the invention, further comprising the exhaust portion that discharges the gas in the casing.

The light irradiation device according to any one of the first to the thirteenth invention, wherein the substrate comprises a resin.

According to a fifteenth aspect of the invention, there is provided a method of irradiating a main surface of a substrate with a flash light, comprising: a) forming a single closed space by using a main surface of the substrate and a frame having an opening on a main surface side of the substrate; Step b) after the step a), the step of irradiating the main surface of the substrate with a light from the light irradiation portion disposed in the closed space; and c) the step of opening the closed space after the step b) .

According to a sixteenth aspect of the invention, in the light irradiation method of the first aspect, the opening of the frame body is smaller than a main surface of the base material, and the base material and the frame body are parallel to a main surface of the base material The above steps a), the above step b), and the above step c) are repeated while moving in the opposite direction.

The light irradiation method according to the fifteenth aspect of the invention, wherein in the step b), the gas is supplied from the light irradiation portion to the inside of the casing.

According to the first invention to the fourteenth aspect of the present invention, the substrate can be placed in a closed space formed by the main surface of the substrate, the frame, and the sealing member without interposing a light-transmitting plate such as quartz glass. The main surface illuminates the flash. Therefore, the energy loss of the flash can be suppressed, and the manufacturing cost of the light irradiation device can be suppressed. Moreover, the volume of the space illuminated by the flash can be suppressed.

In particular, according to the second invention of the present invention, it is possible to suppress the size of the frame and further improve the irradiation efficiency of the flash, and to irradiate the entire main surface of the substrate with a flash.

In particular, according to the third invention of the present invention, a mechanism for moving the casing is not required. Moreover, it is easy to connect a cable or a pipe to a frame.

In particular, according to the fifth invention of the present invention, the sheet-like substrate can be intermittently conveyed, and the main surface of the substrate is irradiated with a flash.

In particular, according to the sixth invention of the present invention, it is possible to more uniformly illuminate the main surface of the substrate by preventing the deflection of the substrate.

In particular, according to the ninth invention of the present invention, it is easy to pass through the opening from the upper portion of the casing. The maintenance work of the light irradiation unit is performed. Further, even if the light-irradiating portion is broken, it is possible to suppress scattering of the chips on the substrate side. Further, it is also possible to suppress adhesion of particles generated from the light-irradiating portion to the substrate.

In particular, according to the tenth invention of the present invention, the gas necessary for the irradiation treatment of the flash can be supplied to the internal space of the casing. In particular, since the gas for cooling the light-irradiating portion and the gas to be supplied to the vicinity of the main surface of the substrate can be supplied to a single casing, the amount of gas used can be reduced.

In particular, according to the eleventh invention of the present invention, it is possible to suppress oxidation of the substrate by irradiation with a flash.

Further, according to the fifteenth invention to the seventeenth aspect of the present invention, in the closed space formed by using the main surface of the base material and the frame body, the main surface of the base material can be applied without interposing the light-transmitting plate such as quartz glass Illuminate the flash. Therefore, the energy loss of the flash can be suppressed. Moreover, the volume of the space illuminated by the flash can be suppressed.

In particular, according to the sixteenth aspect of the present invention, the size of the frame can be suppressed, the irradiation efficiency of the flash can be further improved, and the entire main surface of the substrate can be irradiated with a flash.

In particular, according to the seventeenth invention of the present invention, the gas necessary for the irradiation treatment of the flash is supplied to the internal space of the casing. Since the gas for cooling the light-irradiating portion and the gas to be supplied to the vicinity of the main surface of the substrate can be supplied to a single closed space, the amount of gas used can be reduced.

1, 101‧‧‧Lighting device

9, 109‧‧‧ substrate

10, 110‧‧‧ substrate transport mechanism

11‧‧‧Send rolls

12‧‧‧Intermediate roller

13‧‧‧Winding roller

14, 114‧‧‧Transfer path

20, 120‧‧‧Lighting Department

21, 121‧‧‧ flash

22, 122‧‧‧ reflector

23, 123‧‧‧ cable

24, 124‧‧‧ power supply unit

30, 130‧‧ ‧ lamp room

31, 131‧‧‧ internal space

32, 132‧‧‧ openings

33, 133‧‧ vents

40, 140‧‧‧ Sealing members

50, 150 ‧ ‧ contact / separation mechanism

51‧‧‧ Pressing members

52, 152‧‧‧ Lifting mechanism

60, 160‧‧‧ Gas Supply Department

61,161‧‧‧ gas supply piping

62, 162‧‧ ‧ supply source

63, 163‧‧‧Opening and closing valve

64, 164‧‧‧ blown out

70, 170‧‧‧Exhaust Department

71, 171‧‧‧ exhaust piping

80, 180‧‧‧Control Department

81,181‧‧‧Operation Processing Department

82, 182‧‧‧ memory

83, 183‧‧‧ Memory Department

84, 184‧‧‧ computer program

91, 191‧‧ ‧ main face

111‧‧‧ platform

112‧‧‧ Platform moving mechanism

Fig. 1 is a view showing the configuration of a light irradiation device according to a first embodiment.

Fig. 2 is a view showing the configuration of a light irradiation device according to the first embodiment.

Fig. 3 is a flow chart showing the flow of light irradiation processing in the first embodiment.

Fig. 4 is a view showing the configuration of a light irradiation device according to a second embodiment.

Fig. 5 is a view showing the configuration of a light irradiation device according to a second embodiment.

Fig. 6 is a flow chart showing the flow of light irradiation processing in the second embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<1. First embodiment>

<1-1. About the configuration of the light irradiation device>

FIG. 1 and FIG. 2 are views showing a configuration of a light irradiation device 1 according to a first embodiment of the present invention. The light irradiation device 1 is a device that conveys a long sheet-like substrate 9 between a pair of rolls 11 and 13, and a main surface 91 facing the substrate 9 is irradiated with a flash. The substrate 9 to be irradiated with a flash includes, for example, PET (polyethylene terephthalate), PEN (polyethylene naphthalate), polyimide, and the like. Resin and flexible bending. As shown in FIG. 1 and FIG. 2, the light irradiation device 1 of the present embodiment includes a substrate transfer mechanism 10, a light irradiation unit 20, a lamp chamber 30, a sealing member 40, a contact/separation mechanism 50, a gas supply unit 60, and an exhaust gas. The unit 70 and the control unit 80.

The substrate transfer mechanism 10 is a mechanism for transporting the substrate 9 along its longitudinal direction. The substrate transfer mechanism 10 has a feed roller 11 , a pair of intermediate rollers 12 , and a take-up roller 13 . The delivery roller 11 is located on the upstream side of the pair of intermediate rollers 12 in the transport direction. The take-up roller 13 is located on the downstream side of the pair of intermediate rolls 12 in the transport direction. When the feed roller 11 and the take-up roller 13 are rotated, the base material 9 is fed from the feed roller 11 and conveyed horizontally along the transport path 14 defined by the pair of intermediate rollers 12, and then wound up. Roller 13 is taken up.

The pair of intermediate rolls 12 are rotated while being in contact with the substrate 9, whereby the substrate 9 is supported while supporting the substrate 9. In other words, in the present embodiment, the pair of intermediate rolls 12 are part of the substrate transfer mechanism 10 and serve as a holding portion for holding the substrate 9. The base material 9 is placed between the pair of intermediate rolls 12 and is conveyed substantially horizontally in a state in which the main surface 91 to be processed faces downward. That is, the substrate 9 is conveyed in a direction parallel to the main surface 91. Further, tension is applied to the substrate 9 by bringing the substrate 9 into contact with the pair of intermediate rolls 12. Thereby, the deflection of the substrate 9 can be prevented, and the main surface 91 of the substrate 9 can be uniformly irradiated with the flash during the irradiation treatment of the flash described below.

The light irradiation unit 20 is for irradiating the main surface 91 of the substrate 9 held by the pair of intermediate rolls 12 Flashing mechanism. The light irradiation unit 20 is disposed below the transport path 14 of the substrate 9 . The light irradiation unit 20 has a plurality of rod-shaped flash lamps 21 and reflectors 22. A plurality of flash lamps 21 are arranged on the same horizontal surface so as to be arranged in parallel with each other. Further, as shown conceptually in FIGS. 1 and 2, a plurality of flash lamps 21 are connected to the power supply device 24 via a cable 23. The plurality of flash lamps 21 emit a flash based on the voltage supplied from the power supply unit 24.

The reflector 22 is disposed so as to cover the entirety of the plurality of flash lamps 21 from the lower side. A portion of the flash emitted from the flash lamp 21 is directed toward the substrate 9 side. Further, the other portion of the flash emitted from the flash lamp 21 is reflected by the reflector 22 and is directed toward the substrate 9 side. Thereby, the amount of flashing light toward the side of the substrate 9 is increased, so that the main surface 91 of the substrate 9 is more efficiently illuminated by the flash.

The flash 21 can use, for example, a xenon flash. The xenon flash lamp has a rod-shaped glass tube (discharge tube) in which a helium gas is sealed, and an anode and a cathode connected to the capacitor are disposed at both ends thereof; and a trigger electrode is attached to the glass tube On the outer peripheral surface. Since the helium gas is an insulator in terms of electrical properties, even if a charge is stored in the capacitor, electricity does not flow into the glass tube under normal conditions. However, when a high voltage is applied to the trigger electrode to destroy the insulation, the electricity stored in the capacitor instantaneously flows into the glass tube by the discharge between the electrodes at both ends, thereby exciting the atoms or molecules of the helium gas at that time. Let out the light. In the xenon flash lamp, since the electrostatic energy stored in the capacitor in advance is converted into an extremely short light pulse of 0.1 millisecond to 100 milliseconds, extremely strong light can be irradiated compared to the continuously lit lamp.

Further, a flash lamp of other rare gas such as krypton may be used instead of the xenon flash lamp.

The lamp chamber 30 is fixedly disposed below the transport path 14 of the substrate 9. The lamp chamber 30 has a single internal space 31 which is not divided by quartz glass or the like. Further, the light irradiation unit 20 is housed in the internal space 31 of the lamp chamber 30. Further, an opening portion 32 that opens upward is provided on an upper portion of the end portion of the lamp chamber 30 on the side of the base material 9 side. As shown in FIGS. 1 and 2, the opening portion 32 is small. The main surface 91 of the entire substrate 9 is used.

In the present embodiment, the positions of the lamp chamber 30 and the light irradiation unit 20 are fixed, and the substrate 9 is moved relative to the substrate 9. Therefore, there is no need for a drive mechanism for moving the lamp chamber 30. Further, when the cable 23 connecting the flash unit 21 and the power supply unit 24, or the following air supply pipe 61 or the following exhaust pipe 71 is attached to the lamp chamber 30, it is not necessary to consider the movement of the lamp chamber 30 in advance. degree.

Further, in the present embodiment, the lamp chamber 30 is disposed below the transport path 14 of the substrate 9, and the opening portion 32 is provided above the lamp chamber 30. Therefore, maintenance work such as replacement of the flasher 21 can be easily performed from the upper portion of the lamp chamber 30 via the opening portion 32. Further, even if the flash lamp 21 is broken, the chips do not scatter toward the substrate 9 side. Further, it is also possible to suppress adhesion of particles generated from the lamp chamber 30 or the light irradiation portion 20 to the surface of the substrate 9.

The sealing member 40 is an annular member that is provided at the periphery of the opening 32 of the lamp chamber 30. The sealing member 40 functions to contact the main surface 91 of the base material 9 to seal the gap between the lamp chamber 30 and the base material 9 when the contact/separation mechanism 50 is operated. Further, the sealing member 40 is formed of a material having high electrical insulation properties and functions as an insulating member. For the material of the sealing member 40, a resin such as PEEK (Polyetheretherketone) or ceramics can be used.

The contact/separation mechanism 50 is a mechanism for bringing the main surface 91 of the substrate 9 into contact with and separating from the sealing member 40. The contact/separation mechanism 50 has an annular pressing member 51 and an elevating mechanism 52 that moves the pressing member 51 up and down. The pressing member 51 is disposed on the upper side of the base material 9 and is located on the opposite side of the sealing member 40 with the base material 9 interposed therebetween. When the elevating mechanism 52 is operated, the pressing member 51 is moved to the first position (the position in FIG. 1 ) that is upward from the base material 9 and the second position in which the base material 9 is pressed to the lower side in contact with the base material 9 (Fig. Move between 2 and 2). The elevating mechanism 52 is realized by, for example, a mechanism or an air cylinder in which a motor and a ball screw are combined.

When the pressing member 51 is disposed at the first position, as shown in FIG. 1 , both the sealing member 40 and the pressing member 51 are separated from the base material 9 . Therefore, the substrate transfer mechanism 10 can be used to transport the substrate 9. On the other hand, when the pressing member 51 is disposed at the second position, as shown in FIG. 2 , the base material 9 is sandwiched between the pressing member 51 and the sealing member 40 , and the sealing member 40 is in close contact with the main surface 91 of the base material 9 . As a result, the internal space 31 of the lamp chamber 30 becomes a closed space that is blocked from the outside.

The gas supply unit 60 is a mechanism for supplying nitrogen gas (N ₂ ) as a processing gas to the internal space 31 of the lamp chamber 30. The gas supply unit 60 has an air supply pipe 61 and a nitrogen gas supply source 62. The upstream side of the gas supply pipe 61 is connected to the nitrogen gas supply source 62. The end of the downstream side of the air supply pipe 61 is connected to the air outlet 64 provided in the reflector 22. Further, an opening and closing valve 63 is inserted in the middle of the path of the air supply pipe 61. Therefore, when the opening and closing valve 63 is opened, nitrogen gas is supplied from the nitrogen gas supply source 62 to the air outlet 64 through the air supply pipe 61. Then, as indicated by a broken line in Fig. 2, nitrogen gas is blown from the air outlet 64 to the internal space 31 of the lamp chamber 30.

Here, the temperature of the nitrogen gas supplied from the gas supply unit 60 is lower than the temperature of the flash lamp 21 heated by the irradiation of the flash. Therefore, the plurality of flash lamps 21 can be cooled by the nitrogen blown from the air outlet 64. Further, a gas layer of an inert gas, that is, nitrogen gas, is formed between the plurality of flash lamps 21 and the main surface 91 of the substrate 9 by nitrogen gas blown from the air outlet 64. Thereby, the substrate 9 is suppressed from being oxidized with the irradiation of the flash. That is, in the light irradiation device 1, the nitrogen gas supplied into the lamp chamber 30 functions to cool the flash lamp 21 and prevent oxidation of the substrate 9. Further, in this manner, the amount of nitrogen gas used is reduced by supplying only nitrogen gas to the internal space 31 of the lamp chamber 30.

Further, the nitrogen gas supply source 62 may be a part of the light irradiation device 1, or may be a public device in a factory in which the light irradiation device 1 is provided. Further, the gas supply unit 60 may supply other inert gas such as argon (Ar) or helium (He) instead of nitrogen. Further, the gas supply unit 60 may supply other various gases as the processing gas for the purpose of the irradiation treatment of the flash. For example, a reactive gas such as oxygen (O ₂ ), hydrogen (H ₂ ), or chlorine (Cl ₂ ) or clean dry air may be used as the processing gas.

The exhaust unit 70 is a mechanism for discharging gas from the internal space 31 of the lamp chamber 30 to the outside of the lamp chamber 30. The exhaust unit 70 has an exhaust pipe 71 connected to an exhaust port 33 provided in a side wall of the lamp chamber 30. If the sealing member 40 is in close contact with the main surface 91 of the substrate 9, one When the surface is supplied with nitrogen gas from the gas supply unit 60 and the gas is discharged toward the exhaust unit 70, the gas in the lamp chamber 30 is replaced with nitrogen.

The control unit 80 is a portion for controlling the operation of each part in the light irradiation device 1. As shown in FIG. 1 and FIG. 2, the control unit 80 of the present embodiment includes an arithmetic processing unit 81 such as a CPU (Central Processing Unit) and a RAM (Random Access Memory). It is constituted by a computer such as a memory 82 and a memory unit 83 such as a hard disk drive. The control unit 80 is electrically connected to the substrate transport mechanism 10, the power supply device 24, the elevating mechanism 52, and the opening and closing valve 63, respectively. The control unit 80 temporarily reads the computer program 84 stored in the storage unit 83 to the memory 82, and the arithmetic processing unit 81 performs arithmetic processing based on the computer program 84, thereby controlling the substrate transport mechanism 10 and the power supply device 24, The operation of the lifting mechanism 52 and the opening and closing valve 63. Thereby, the process of irradiating the substrate 9 with a flash is performed.

<1-2. About the irradiation treatment of the flash>

Next, a flow of a process in which the main surface 91 of the substrate 9 is irradiated with a flash by the light irradiation device 1 of the first embodiment will be described. Fig. 3 is a flow chart showing the flow of the processing. When the light irradiation device 1 performs the irradiation processing of the flash, first, the control unit 80 inputs an instruction to perform the processing. Upon receiving the command, the control unit 80 controls the operation of each part in the light irradiation device 1 based on the computer program 84. Thereby, the following actions are performed.

First, the light irradiation device 1 transports the substrate 9 by operating the substrate transfer mechanism 10 (step S1). A plurality of patterns are arranged on the main surface 91 of the substrate 9 at equal intervals, for example, along the conveyance direction. The substrate transfer mechanism 10 arranges a pattern to be irradiated with a flash by the substrate 9 to be placed above the light irradiation unit 20 . Further, in this step S1, the pressing member 51 is disposed at the first position (the position of FIG. 1). Therefore, the base material 9 is conveyed along the conveyance path 14 without contacting any of the sealing member 40 and the pressing member 51.

If the desired pattern is disposed above the light irradiation portion 20, the light irradiation device 1 stops the base. The operation of the material conveying mechanism 10. Then, the elevating mechanism 52 is operated to lower the pressing member 51 to the second position (the position of FIG. 2) (step S2). As a result, the substrate 9 is sandwiched between the pressing member 51 and the sealing member 40, and the sealing member 40 is in close contact with the main surface 91 of the substrate 9. As a result, the internal space 31 of the lamp chamber 30 becomes a closed space that is blocked from the outside. That is, a single closed space is formed by the main surface 91 of the substrate 9, the lamp chamber 30, and the sealing member 40.

Next, the light irradiation device 1 opens the opening and closing valve 63. Thereby, nitrogen gas is supplied from the nitrogen gas supply source 62 to the air outlet 64 through the air supply pipe 61. Then, nitrogen gas is blown from the air outlet 64 to the internal space 31 of the lamp chamber 30. Further, the gas in the lamp chamber 30 is discharged to the outside through the exhaust pipe 71. As a result, at least the gas in the vicinity of the main surface 91 of the substrate 9 in the lamp chamber 30 is replaced with nitrogen gas (step S3).

Then, while supplying nitrogen gas into the lamp chamber 30 continuously, a voltage is applied from the power source device 24 to the plurality of flash lamps 21. Thereby, the flash 21 from the lamp chamber 30 emits a flash for a very short time. The flash light emitted from the flash lamp 21 is irradiated to the main surface 91 of the substrate 9 directly or by reflection by the reflector 22 (step S4). As a result, the main surface 91 of the substrate 9 is heated.

At this time, a gas layer of an inert gas, that is, nitrogen gas, is formed in the vicinity of the main surface 91 of the substrate 9. Therefore, the main surface 91 is suppressed from being oxidized as the temperature of the substrate 9 is raised. Further, nitrogen gas from the air outlet 64 is blown to each of the flash lamps 21. Thereby, the temperature of the flash lamp 21 is suppressed from rising as the flash is emitted. Further, after the flash for a very short time, the flash lamps 21 are also cooled by blowing nitrogen gas to the respective flash lamps 21.

After the irradiation of the flash, if the specific time elapses, the light irradiation device 1 closes the opening and closing valve 63. Thereby, the supply of nitrogen gas into the lamp chamber 30 is stopped (step S5). Then, the elevating mechanism 52 is operated to raise the pressing member 51 to the first position (the position in FIG. 1) (step S6). As a result, the sealing member 40 is separated from the main surface 91 of the substrate 9, and the internal space 31 of the lamp chamber 30 is opened.

Thereafter, the control unit 80 determines whether or not the main surface 91 of the substrate 9 has a pattern to be irradiated under the flash (step S7). Moreover, in the case where there is a pattern under the irradiation target (in step) When the step S7 is Yes (YES), the process returns to the step S1, and the substrate 9 is conveyed to arrange the pattern above the light irradiation unit 20. As described above, the light irradiation device 1 moves the substrate 9 and the lamp chamber 30 relatively while repeating the steps S1 to S7, and sequentially irradiates the entire main surface 91 of the substrate 9 with the flash.

Finally, if there is no pattern to be irradiated (NO in step S7), the light irradiation treatment on the substrate 9 is ended.

As described above, in the light irradiation device 1, the light irradiation portion 20 in the lamp chamber 30 can illuminate the main surface 91 of the substrate 9 without interposing a light-transmitting plate such as quartz glass. Therefore, a plurality of flash lamps 21 can be brought close to the main surface 91 of the substrate 9 as compared with the case of using a light-transmitting plate. Further, since there is no reflection or absorption of the flash light by the light-transmitting plate, the main surface 91 of the substrate 9 can be efficiently irradiated with a flash. Moreover, the manufacturing cost of the light irradiation device 1 can be suppressed by omitting the light-transmitting plate.

Further, in the light irradiation device 1, flash irradiation is performed in a closed space formed by the main surface 91 of the substrate 9, the lamp chamber 30, and the sealing member 40. That is, the processing space for illuminating the flash is formed by the main surface 91 of the substrate 9. Therefore, it is not necessary to prepare a large chamber for accommodating the entire substrate 9. Therefore, even when the substrate 9 is large, the volume of the processing space can be suppressed. Further, as long as the volume of the processing space can be suppressed, the amount of the processing gas (for example, nitrogen gas) supplied into the processing space can be suppressed. As a result, the running cost of the light irradiation device 1 can be reduced.

<2. Second embodiment>

<2-1. About the configuration of the light irradiation device>

Next, a second embodiment of the present invention will be described. 4 and 5 are views showing the configuration of the light irradiation device 101 of the second embodiment. The light irradiation device 101 is a device that conveys a thin plate-shaped substrate 109 while being held on the stage 111, and irradiates the main surface 191 of the substrate 109 with a flash. The substrate 109 to be an object to be illuminated by the flash is, for example, a rectangular glass substrate for a flat panel display. As shown in FIG. 4 and FIG. 5, the light of this embodiment The irradiation device 101 includes a substrate transfer mechanism 110, a light irradiation unit 120, a lamp chamber 130, a sealing member 140, a contact/separation mechanism 150, a gas supply unit 160, an exhaust unit 170, and a control unit 180.

The substrate transfer mechanism 110 is a mechanism for transporting the substrate 109 while being substantially horizontal. The substrate transfer mechanism 110 has a stage 111 that supports the substrate 109 and a stage moving mechanism 112 that moves the stage 111. The base material 109 is placed on the stage 111 substantially horizontally in a state in which the main surface 191 to be processed faces upward. That is, in the present embodiment, the stage 111 is a part of the substrate conveying mechanism 110 and serves as a holding portion for holding the substrate 9. The platform moving mechanism 112 transports the substrate 111 on the platform 111 and the platform 111 substantially horizontally along the transport path 114. That is, the base material 109 is conveyed in a direction parallel to the main surface 191. The platform moving mechanism 112 is realized by, for example, a mechanism in which a motor and a ball screw are combined or a mechanism using a linear motor.

The light irradiation unit 120 is a mechanism for irradiating the main surface 191 of the substrate 109 held on the stage 111 with a flash. The light irradiation unit 120 is disposed above the transport path 114 of the substrate 109. The light irradiation unit 120 has a plurality of rod-shaped flash lamps 121 and reflectors 122. A plurality of flash lamps 121 are arranged on the same horizontal surface so as to be arranged in parallel with each other. Further, as conceptually shown in FIGS. 4 and 5, a plurality of flash lamps 121 are connected to the power supply device 124 via a cable 123. A plurality of flash lamps 121 emit a flash based on the voltage supplied from the power supply unit 124.

The reflector 122 is disposed so as to cover the entirety of the plurality of flash lamps 121 from the upper side. A portion of the flash emitted from the flash lamp 121 is directed toward the side of the substrate 109. Further, the other portion of the flash emitted from the flash lamp 121 is reflected by the reflector 122 and is directed toward the substrate 109 side. Thereby, the amount of flash toward the side of the substrate 109 is increased, so that the main surface 191 of the substrate 109 is more efficiently illuminated by the flash.

As in the first embodiment, for example, a xenon flash lamp can be used for the flash 121. However, it is also possible to use a flash lamp of other rare gases such as helium instead of a xenon flash lamp.

The lamp chamber 130 is disposed above the transport path 114 of the substrate 109. Lamp compartment 130 has not borrowed A single internal space 131 divided by quartz glass or the like. Then, the light irradiation unit 120 is housed in the internal space 131 of the lamp chamber 130. Further, an opening portion 132 that opens downward is provided at an end portion of the lower portion, that is, the base portion 109 side of the lamp chamber 130. As shown in FIGS. 4 and 5, the opening 132 is smaller than the main surface 191 of the entire substrate 109.

The sealing member 140 is an annular member that is provided at the periphery of the opening 132 of the lamp chamber 130. The sealing member 140 functions to contact the main surface 191 of the base material 109 to seal the gap between the lamp chamber 130 and the base material 109 when the contact/separation mechanism 150 is operated. Further, the sealing member 40 is formed of a material having high electrical insulation properties and functions as an insulating member. For the material of the sealing member 140, a resin such as PEEK or a ceramic can be used.

The contact/separation mechanism 150 is a mechanism for bringing the main surface 191 of the substrate 109 into contact with and separating from the sealing member 140. The contact/separation mechanism 150 has an elevating mechanism 152 that moves the lamp chamber 130 up and down. When the elevating mechanism 152 is operated, the lamp chamber 130 moves up and down between the first position (the position in FIG. 4) and the second position (the position in FIG. 5) lower than the first position. The elevating mechanism 152 is realized by, for example, a mechanism or an air cylinder in which a motor and a ball screw are combined.

When the lamp chamber 130 is placed at the first position, the sealing member 140 is separated upward from the main surface 191 of the substrate 109 as shown in FIG. Therefore, the substrate 109 can be conveyed by the substrate transfer mechanism 110. On the other hand, when the lamp chamber 130 is placed at the second position, as shown in FIG. 5, the sealing member 140 is in close contact with the main surface 191 of the substrate 109. As a result, the internal space 131 of the lamp chamber 130 becomes a closed space that is blocked from the outside.

The gas supply unit 160 is a mechanism for supplying nitrogen gas (N ₂ ) as a processing gas to the internal space 131 of the lamp chamber 130. The gas supply unit 160 has an air supply pipe 161 and a nitrogen gas supply source 162. The upstream side of the gas supply pipe 161 is connected to the nitrogen supply source 162. The end of the downstream side of the air supply pipe 161 is connected to the air outlet 164 provided in the reflector 122. Further, an opening and closing valve 163 is inserted in the middle of the path of the air supply pipe 161. Therefore, when the opening and closing valve 163 is opened, nitrogen gas is supplied from the nitrogen gas supply source 162 to the air outlet 164 through the air supply pipe 161. Then, as indicated by a broken line in FIG. 5, nitrogen gas is blown from the air outlet 164 to the internal space 131 of the lamp chamber 130.

Here, the temperature of the nitrogen gas supplied from the gas supply unit 160 is lower than the temperature of the flash lamp 121 heated by the irradiation of the flash. Therefore, the plurality of flash lamps 21 can be cooled by the nitrogen blown from the air outlet 164. Further, a gas layer of an inert gas, that is, nitrogen gas, is formed between the plurality of flash lamps 121 and the main surface 191 of the substrate 109 by nitrogen gas blown from the air outlet 164. Thereby, the substrate 109 is suppressed from being oxidized by the irradiation of the flash. That is, in the light irradiation device 101, the nitrogen gas supplied into the lamp chamber 130 exhibits two effects of cooling the flash lamp 121 and preventing oxidation of the substrate 109. Further, in this manner, the amount of nitrogen gas used is reduced by supplying only nitrogen gas to the internal space 131 of the lamp chamber 130.

Further, the nitrogen supply source 162 may be a part of the light irradiation device 101 or a public device in the factory in which the light irradiation device 101 is disposed. Further, the gas supply unit 160 may supply other inert gas such as argon (Ar) or helium (He) instead of nitrogen. Further, the gas supply unit 160 may supply other various gases as the processing gas for the purpose of the flash irradiation treatment. For example, a reactive gas such as oxygen (O ₂ ), hydrogen (H ₂ ), or chlorine (Cl ₂ ) or clean dry air may be used as the processing gas.

The exhaust portion 170 is a mechanism for discharging gas from the internal space 131 of the lamp chamber 130 to the outside of the lamp chamber 130. The exhaust unit 170 has an exhaust pipe 171 connected to an exhaust port 133 provided in a side wall of the lamp chamber 130. When the sealing member 140 is in close contact with the main surface 191 of the base material 109, nitrogen gas is supplied from the gas supply unit 160, and when the gas is exhausted toward the exhaust unit 170, the gas in the lamp chamber 130 is replaced with nitrogen gas.

The control unit 180 is a portion for controlling the operation of each part in the light irradiation device 101. As shown in FIG. 4 and FIG. 5, the control unit 180 of the present embodiment is configured by a computer including an arithmetic processing unit 181 such as a CPU, a memory 182 such as a RAM, and a computer such as a memory unit 183 such as a hard disk drive. The control unit 180 is electrically connected to the platform moving mechanism 112, the power supply device 124, the elevating mechanism 152, and the opening and closing valve 163, respectively. The control unit 180 temporarily reads the computer program 184 stored in the storage unit 183 to the memory 182, and the arithmetic processing unit 181 The computer program 184 performs arithmetic processing to control the operations of the platform moving mechanism 112, the power source device 124, the elevating mechanism 152, and the opening and closing valve 163. Thereby, the substrate 109 is subjected to a flash irradiation treatment.

<2-2. About the irradiation treatment of the flash>

Next, a flow of a process when the main surface 191 of the substrate 109 is irradiated with a flash by the light irradiation device 101 of the second embodiment will be described. Fig. 6 is a flow chart showing the flow of the processing. When the light irradiation device 101 performs the flash irradiation process, first, the control unit 180 inputs an instruction to perform the processing. Upon receiving the command, the control unit 180 controls the operation of each part in the light irradiation device 101 based on the computer program 184. By doing this, the following actions are performed.

After the substrate 109 is placed on the surface of the stage 111, first, the light irradiation device 101 conveys the substrate 109 by operating the stage moving mechanism 112 (step S101). A plurality of patterns are arranged on the main surface 191 of the substrate 109 at equal intervals, for example, along the transport direction. The substrate transport mechanism 110 arranges a pattern to be irradiated with a flash to be disposed below the light irradiation unit 120 by transporting the substrate 109. Furthermore, in this step S101, the lamp chamber 130 is disposed at the first position (the position of FIG. 4). Therefore, the base material 109 is conveyed along the conveyance path 114 without coming into contact with the sealing member 140.

When the desired pattern is disposed below the light irradiation unit 120, the light irradiation device 101 stops the operation of the stage moving mechanism 112. Then, the elevating mechanism 152 is operated to lower the lamp chamber 130 to the second position (the position of FIG. 5) (step S102). In this way, the sealing member 140 is in close contact with the main surface 191 of the substrate 109. As a result, the internal space 131 of the lamp chamber 130 becomes a closed space that is blocked from the outside. That is, a single closed space is formed by the main surface 191 of the substrate 109, the lamp chamber 130, and the sealing member 140.

Next, the light irradiation device 101 opens the opening and closing valve 163. Thereby, nitrogen gas is supplied from the nitrogen gas supply source 162 to the air outlet 164 through the air supply pipe 161. Then, nitrogen gas is blown from the air outlet 164 to the internal space 131 of the lamp chamber 130. Moreover, the gas in the lamp chamber 130 passes through the row The gas pipe 171 is discharged to the outside. As a result, at least the gas in the vicinity of the main surface 191 of the substrate 109 in the lamp chamber 130 is replaced with nitrogen gas (step S103).

Then, while continuously supplying nitrogen gas into the lamp chamber 130, a voltage is applied from the power source device 124 to the plurality of flash lamps 121. Thereby, the flash 121 in the lamp chamber 130 is emitted for a very short time. The flash emitted from the flash lamp 121 is irradiated to the main surface 191 of the substrate 109 directly or by reflection from the reflector 122 (step S104). As a result, the main surface 191 of the substrate 109 is heated.

At this time, a gas layer of an inert gas, that is, nitrogen gas, is formed in the vicinity of the main surface 191 of the substrate 109. Therefore, the main surface 191 is suppressed from being oxidized as the temperature of the substrate 109 is raised. Further, nitrogen gas from the air outlet 164 is blown to each of the flash lamps 121. Thereby, the temperature of the flasher 121 is suppressed from rising as the exiting flash is emitted. Further, after the flash for a very short time, the flash lamps 121 are also cooled by blowing nitrogen gas to the respective flash lamps 121.

After the irradiation of the flash, the light irradiation device 101 closes the opening and closing valve 163 when a specific time elapses. Thereby, the supply of nitrogen gas into the lamp chamber 130 is stopped (step S105). Then, the elevating mechanism 152 is operated to raise the lamp chamber 130 to the first position (the position in FIG. 4) (step S106). As a result, the sealing member 140 is separated from the main surface 191 of the substrate 109, and the internal space 131 of the lamp chamber 130 is opened.

Thereafter, the control unit 180 determines whether or not the main surface 191 of the substrate 109 has a pattern to be irradiated under the flash (step S107). In the case where there is a pattern to be irradiated (in the case of Yes in step S107), the process returns to step S101, and the substrate 109 is conveyed to arrange the pattern below the light irradiation unit 120. As described above, the light irradiation device 101 moves the substrate 109 and the lamp chamber 130 relatively while repeating steps S101 to S107, and sequentially irradiates the entire main surface 191 of the substrate 109 with the flash.

Finally, if there is no pattern under the irradiation target (No in step S7), the light irradiation treatment on the substrate 109 is ended.

Thus, in the light irradiation device 101, the light irradiation portion 120 from the lamp chamber 130 is not The main surface 191 of the substrate 109 is irradiated with a flash light through a light transmissive plate such as quartz glass. Therefore, a plurality of flash lamps 121 can be brought close to the main surface 191 of the substrate 109 as compared with the case of using a light-transmitting plate. Further, since there is no reflection or absorption of the flash light caused by the light-transmitting plate, the main surface 191 of the substrate 109 can be efficiently irradiated with a flash. Moreover, the manufacturing cost of the light irradiation device 101 can be suppressed by omitting the light-transmitting plate.

Further, in the light irradiation device 101, flash irradiation is performed in a closed space formed by the main surface 191 of the substrate 109, the lamp chamber 130, and the sealing member 140. That is, the processing space for illuminating the flash is formed by the main surface 191 of the substrate 109. Therefore, it is not necessary to prepare a large chamber in which the entire substrate 109 is accommodated. Therefore, even when the substrate 109 is large, the volume of the processing space can be suppressed. Further, as long as the volume of the processing space can be suppressed, the amount of the processing gas (for example, nitrogen gas) supplied into the processing space can be suppressed. As a result, the running cost of the light irradiation device 101 can be reduced.

<3. Change example>

Although the embodiments of the present invention have been described above by way of examples, the present invention is not limited to the above embodiments.

In the above embodiment, the substrate is moved in only one direction, but the substrate may be moved in two or more directions to emit a flash. For example, the X drive shaft and the Y drive shaft may be provided in the platform moving mechanism of the second embodiment, and the stage may be moved two-dimensionally in the horizontal plane.

Further, in the above embodiment, the light irradiation portion and the lamp chamber are fixed in the horizontal direction, and the substrate is moved in the horizontal direction with respect to the lamp chamber, but the base material may be fixed in the horizontal direction. The light irradiation unit and the lamp chamber are moved in the horizontal direction with respect to the substrate. In other words, the transport mechanism of the present invention may be such that the light-irradiating portion and the lamp chamber and the substrate are relatively moved in a direction parallel to the main surface of the substrate.

Further, the respective elements appearing in the first embodiment, the second embodiment, and the modifications described above may be combined as appropriate within a range in which no contradiction occurs. For example, you can also be the first In the embodiment, the light-irradiating portion and the frame are disposed above the substrate as in the second embodiment, so that the main surface of the base material faces the upper side between the pair of intermediate rolls. The main surface of the substrate is irradiated with a flash from the light irradiation portion. Further, as in the first embodiment, the substrate can be transported by using a platform as in the second embodiment, and the platform itself can be moved up and down as shown in the second embodiment, whereby the main surface of the substrate can be moved up and down. The sealing member contacts and separates.

Further, the detailed configuration of each portion of the light irradiation device may be different from the respective drawings of the present invention. For example, the number of flashes provided in the light-irradiating portion may be different from the number of flashes shown in the respective figures of the present invention.

Further, in the first embodiment, the base material made of resin which can be flexibly bent is used as a processing target, and in the second embodiment, the base material made of hard glass is used as a processing target. However, the light irradiation device of the present invention may also treat a substrate including other materials such as metal as a treatment target. Further, examples of the use of the substrate include a flexible device, a flexible display, a flat panel display, an electronic device, a solar cell, a fuel cell, and a semiconductor.

1‧‧‧Lighting device

9‧‧‧Substrate

10‧‧‧Substrate transport mechanism

11‧‧‧Send rolls

12‧‧‧Intermediate roller

13‧‧‧Winding roller

14‧‧‧Transfer path

20‧‧‧Lighting Department

21‧‧‧Flash

22‧‧‧ reflector

23‧‧‧ cable

24‧‧‧Power supply unit

30‧‧‧Light room

31‧‧‧Internal space

32‧‧‧ openings

33‧‧‧Exhaust port

40‧‧‧ Sealing members

50‧‧‧Contact/Separation Mechanism

51‧‧‧ Pressing members

52‧‧‧ Lifting mechanism

60‧‧‧Gas Supply Department

61‧‧‧ gas supply piping

62‧‧‧Supply source

63‧‧‧Opening and closing valve

64‧‧‧Blowing out

70‧‧‧Exhaust department

71‧‧‧Exhaust piping

80‧‧‧Control Department

81‧‧‧Operation Processing Department

82‧‧‧ memory

83‧‧‧Memory Department

84‧‧‧ computer program

91‧‧‧Main face

Claims (17)

A light irradiation device that irradiates a main surface of a substrate with a flash, and includes: a holding portion that holds the substrate; and a light irradiation portion that illuminates a main surface of the substrate held by the holding portion; a housing that accommodates the light irradiation unit in a single internal space and has an opening on the substrate side; a sealing member that is provided on a periphery of the opening of the housing; and a contact/separation mechanism that The substrate and the sealing member are relatively moved such that the main surface of the substrate contacts and separates the sealing member; and when the main surface of the substrate contacts the sealing member, the substrate is The surface forms a single closed space with the frame; and the light irradiation unit disposed in the closed space irradiates the main surface of the substrate with a flash. The light irradiation device of claim 1, wherein the opening of the frame is smaller than a main surface of the substrate, and the light irradiation device further includes a transfer mechanism that causes the substrate and the frame to be The main faces of the material move relatively in parallel. The light irradiation device of claim 2, wherein the position of the frame is fixed, and the conveying mechanism moves the substrate. The light irradiation device of claim 3, wherein the substrate is in the form of a sheet or a thin plate. The light irradiation device of claim 4, wherein the substrate is a flexible sheet-shaped substrate, and the transfer mechanism has a delivery roller that is fed upstream of the holding portion in the transport direction. And a winding roller that winds the substrate on a downstream side of the holding portion in a conveying direction. The light irradiation device of claim 5, wherein the holding portion supports the substrate while applying tension to the substrate. The light irradiation device of claim 6, wherein the holding portion has a plurality of rollers supporting the substrate. The light irradiation device of claim 4, wherein the holding portion has a platform supporting the substrate. The light irradiation device according to claim 1, wherein the holding portion holds the substrate horizontally in a state in which a main surface of the substrate faces downward, and the light irradiation portion and the frame are disposed to be held by the holding The lower side of the above substrate. The light irradiation device of claim 1, further comprising a gas supply unit that supplies the gas to the inside of the casing. The light irradiation device of claim 10, wherein the gas is an inert gas. The light irradiation device of claim 11, wherein the inert gas is nitrogen. The light irradiation device of claim 1, further comprising an exhaust unit that discharges the gas in the casing. The light irradiation device according to any one of claims 1 to 13, wherein the substrate comprises a resin. A light irradiation method is a method of irradiating a main surface of a substrate with a flash light, and comprising the steps of: a) forming a single body using a main surface of the substrate and a frame having an opening on a main surface side of the substrate; a closed space; b) after the above step a), self-disposed on the light-irradiating portion of the enclosed space The main surface of the substrate is irradiated with a flash; and c) after the above step b), the closed space is opened. The light irradiation method of claim 15, wherein the opening of the frame body is smaller than a main surface of the base material, and the base material and the frame body are relatively moved in a direction parallel to a main surface of the base material, The above step a), the above step b), and the above step c) are repeated. The light irradiation method according to claim 15 or 16, wherein in the step b), a gas is supplied to the inside of the casing, and a flash is irradiated from the light irradiation portion.