TWI567778B - 氣體分析裝置及氣體分析方法 - Google Patents
氣體分析裝置及氣體分析方法 Download PDFInfo
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- TWI567778B TWI567778B TW104128775A TW104128775A TWI567778B TW I567778 B TWI567778 B TW I567778B TW 104128775 A TW104128775 A TW 104128775A TW 104128775 A TW104128775 A TW 104128775A TW I567778 B TWI567778 B TW I567778B
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- Prior art keywords
- gas
- sample
- chamber
- analysis
- orifice
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- 238000004868 gas analysis Methods 0.000 title claims description 43
- 238000000034 method Methods 0.000 title claims description 27
- 239000007789 gas Substances 0.000 claims description 197
- 238000004458 analytical method Methods 0.000 claims description 109
- 238000005259 measurement Methods 0.000 claims description 31
- 230000008859 change Effects 0.000 claims description 23
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- 239000000203 mixture Substances 0.000 claims description 17
- 239000011888 foil Substances 0.000 claims description 13
- 238000005286 illumination Methods 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 43
- 229910052757 nitrogen Inorganic materials 0.000 description 19
- 238000004364 calculation method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000002123 temporal effect Effects 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
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- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000013022 venting Methods 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014209988 | 2014-10-14 | ||
| JP2015095974A JP6351540B2 (ja) | 2014-10-14 | 2015-05-08 | ガス分析装置およびガス分析方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201614712A TW201614712A (en) | 2016-04-16 |
| TWI567778B true TWI567778B (zh) | 2017-01-21 |
Family
ID=55956158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104128775A TWI567778B (zh) | 2014-10-14 | 2015-09-01 | 氣體分析裝置及氣體分析方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6351540B2 (https=) |
| TW (1) | TWI567778B (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6934239B2 (ja) * | 2017-02-27 | 2021-09-15 | 国立大学法人東京工業大学 | 高感度昇温脱離ガス分析装置 |
| JP6919630B2 (ja) * | 2018-07-30 | 2021-08-18 | 三菱電機株式会社 | ガス分析装置およびガス分析方法 |
| US12476122B2 (en) * | 2020-01-17 | 2025-11-18 | ATIK Co., Ltd. | System for stabilizing flow of gas introduced into sensor |
| US12469751B2 (en) * | 2021-06-03 | 2025-11-11 | Applied Materials, Inc. | Apparatus to detect and quantify radical concentration in semiconductor processing systems |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1865975A (zh) * | 2005-05-20 | 2006-11-22 | 株式会社日立制作所 | 气体监控装置 |
| JP4798007B2 (ja) * | 2007-01-24 | 2011-10-19 | 三菱電機株式会社 | ガス分析方法 |
| CN103196785A (zh) * | 2013-04-26 | 2013-07-10 | 张金川 | 气体快速测量分析仪及其测量方法 |
| CN103765186A (zh) * | 2011-08-19 | 2014-04-30 | 拜耳知识产权有限责任公司 | 用于在汽相中分析用的少量流体样品的微量取样系统 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60147645A (ja) * | 1984-01-13 | 1985-08-03 | Mitsubishi Electric Corp | 封入ガス分析装置 |
| JP3772751B2 (ja) * | 2002-01-29 | 2006-05-10 | ウシオ電機株式会社 | ランプ封入ガス分析装置 |
| JP5645771B2 (ja) * | 2011-08-04 | 2014-12-24 | 株式会社日立ハイテクノロジーズ | 質量分析装置 |
-
2015
- 2015-05-08 JP JP2015095974A patent/JP6351540B2/ja not_active Expired - Fee Related
- 2015-09-01 TW TW104128775A patent/TWI567778B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1865975A (zh) * | 2005-05-20 | 2006-11-22 | 株式会社日立制作所 | 气体监控装置 |
| JP4798007B2 (ja) * | 2007-01-24 | 2011-10-19 | 三菱電機株式会社 | ガス分析方法 |
| CN103765186A (zh) * | 2011-08-19 | 2014-04-30 | 拜耳知识产权有限责任公司 | 用于在汽相中分析用的少量流体样品的微量取样系统 |
| CN103196785A (zh) * | 2013-04-26 | 2013-07-10 | 张金川 | 气体快速测量分析仪及其测量方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201614712A (en) | 2016-04-16 |
| JP6351540B2 (ja) | 2018-07-04 |
| JP2016080679A (ja) | 2016-05-16 |
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| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |