TWI563705B - Organic light emitting diodes - Google Patents
Organic light emitting diodesInfo
- Publication number
- TWI563705B TWI563705B TW103125403A TW103125403A TWI563705B TW I563705 B TWI563705 B TW I563705B TW 103125403 A TW103125403 A TW 103125403A TW 103125403 A TW103125403 A TW 103125403A TW I563705 B TWI563705 B TW I563705B
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- organic light
- emitting diodes
- diodes
- organic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Combinations Of Printed Boards (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130087523A KR101588928B1 (ko) | 2013-07-24 | 2013-07-24 | 유기 발광 소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201521257A TW201521257A (zh) | 2015-06-01 |
TWI563705B true TWI563705B (en) | 2016-12-21 |
Family
ID=52393556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103125403A TWI563705B (en) | 2013-07-24 | 2014-07-24 | Organic light emitting diodes |
Country Status (7)
Country | Link |
---|---|
US (1) | US9899627B2 (zh) |
EP (1) | EP3010059B1 (zh) |
JP (1) | JP6360891B2 (zh) |
KR (1) | KR101588928B1 (zh) |
CN (1) | CN105409027B (zh) |
TW (1) | TWI563705B (zh) |
WO (1) | WO2015012610A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6703544B2 (ja) | 2015-08-26 | 2020-06-03 | 株式会社カネカ | 面状発光装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09127540A (ja) * | 1995-11-06 | 1997-05-16 | Fujitsu Ltd | 液晶表示装置 |
US20020017859A1 (en) * | 2000-08-11 | 2002-02-14 | Nec Corporation | Flat panel display module and method of manufacturing the same |
CN101488516B (zh) * | 2008-01-18 | 2011-03-30 | 三星移动显示器株式会社 | 有机发光显示器 |
TW201207483A (en) * | 2010-02-01 | 2012-02-16 | Samsung Mobile Display Co Ltd | Flat panel display and mobile device using the same |
EP2421042A1 (en) * | 2010-08-20 | 2012-02-22 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and method of manufacturing the same |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0317627A (ja) * | 1989-06-15 | 1991-01-25 | Hitachi Ltd | 表示装置 |
KR100396869B1 (ko) * | 2001-02-27 | 2003-09-03 | 산양전기주식회사 | 연성인쇄회로기판의 접합방법 |
JP2005093890A (ja) | 2003-09-19 | 2005-04-07 | Seiko Epson Corp | 電気光学装置、電子機器及び電気光学装置の製造方法、 |
KR100601369B1 (ko) | 2003-11-27 | 2006-07-13 | 삼성에스디아이 주식회사 | 표시장치 |
JP4860530B2 (ja) * | 2006-04-04 | 2012-01-25 | コイズミ照明株式会社 | El光源体 |
CN101115356A (zh) * | 2006-07-28 | 2008-01-30 | 富士康(昆山)电脑接插件有限公司 | 柔性电路板及其焊接方法 |
JP2008078520A (ja) | 2006-09-25 | 2008-04-03 | Casio Comput Co Ltd | 配線基板の半田接合構造 |
KR20090072292A (ko) * | 2007-12-28 | 2009-07-02 | 엘지디스플레이 주식회사 | 액정표시장치 구동부 |
KR100907414B1 (ko) * | 2008-01-18 | 2009-07-10 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시장치 |
KR20090083238A (ko) | 2008-01-29 | 2009-08-03 | 엘지전자 주식회사 | 휴대 단말기 |
US7980863B1 (en) | 2008-02-14 | 2011-07-19 | Metrospec Technology, Llc | Printed circuit board flexible interconnect design |
KR101084241B1 (ko) | 2010-01-05 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
WO2011136262A1 (ja) | 2010-04-27 | 2011-11-03 | Lumiotec株式会社 | 有機el照明装置 |
JP2012248646A (ja) * | 2011-05-27 | 2012-12-13 | Nippon Mektron Ltd | フレキシブルプリント基板および照明装置 |
KR20130059871A (ko) * | 2011-11-29 | 2013-06-07 | 서울반도체 주식회사 | 발광모듈 |
-
2013
- 2013-07-24 KR KR1020130087523A patent/KR101588928B1/ko active IP Right Grant
-
2014
- 2014-07-24 CN CN201480042036.4A patent/CN105409027B/zh active Active
- 2014-07-24 JP JP2016525301A patent/JP6360891B2/ja active Active
- 2014-07-24 US US14/904,875 patent/US9899627B2/en active Active
- 2014-07-24 WO PCT/KR2014/006734 patent/WO2015012610A1/ko active Application Filing
- 2014-07-24 TW TW103125403A patent/TWI563705B/zh active
- 2014-07-24 EP EP14829349.1A patent/EP3010059B1/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09127540A (ja) * | 1995-11-06 | 1997-05-16 | Fujitsu Ltd | 液晶表示装置 |
US20020017859A1 (en) * | 2000-08-11 | 2002-02-14 | Nec Corporation | Flat panel display module and method of manufacturing the same |
CN101488516B (zh) * | 2008-01-18 | 2011-03-30 | 三星移动显示器株式会社 | 有机发光显示器 |
TW201207483A (en) * | 2010-02-01 | 2012-02-16 | Samsung Mobile Display Co Ltd | Flat panel display and mobile device using the same |
EP2421042A1 (en) * | 2010-08-20 | 2012-02-22 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JP6360891B2 (ja) | 2018-07-18 |
US20160172622A1 (en) | 2016-06-16 |
US9899627B2 (en) | 2018-02-20 |
TW201521257A (zh) | 2015-06-01 |
WO2015012610A1 (ko) | 2015-01-29 |
EP3010059A4 (en) | 2017-03-15 |
JP2016524305A (ja) | 2016-08-12 |
EP3010059A1 (en) | 2016-04-20 |
CN105409027B (zh) | 2017-08-25 |
KR20150012106A (ko) | 2015-02-03 |
CN105409027A (zh) | 2016-03-16 |
KR101588928B1 (ko) | 2016-01-26 |
EP3010059B1 (en) | 2020-11-11 |
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