TWI562338B - Split gate non-volatile flash memory cell having metal-enhanced gates and method of making same - Google Patents
Split gate non-volatile flash memory cell having metal-enhanced gates and method of making sameInfo
- Publication number
- TWI562338B TWI562338B TW104139924A TW104139924A TWI562338B TW I562338 B TWI562338 B TW I562338B TW 104139924 A TW104139924 A TW 104139924A TW 104139924 A TW104139924 A TW 104139924A TW I562338 B TWI562338 B TW I562338B
- Authority
- TW
- Taiwan
- Prior art keywords
- gates
- enhanced
- metal
- memory cell
- flash memory
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
- H01L29/42328—Gate electrodes for transistors with a floating gate with at least one additional gate other than the floating gate and the control gate, e.g. program gate, erase gate or select gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
- H01L29/7885—Hot carrier injection from the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/589,656 US9276006B1 (en) | 2015-01-05 | 2015-01-05 | Split gate non-volatile flash memory cell having metal-enhanced gates and method of making same |
PCT/US2015/059443 WO2016111742A1 (en) | 2015-01-05 | 2015-11-06 | Split gate non-volatile flash memory cell having metal-enhanced gates and method of making same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201620117A TW201620117A (zh) | 2016-06-01 |
TWI562338B true TWI562338B (en) | 2016-12-11 |
Family
ID=54695835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104139924A TWI562338B (en) | 2015-01-05 | 2015-11-30 | Split gate non-volatile flash memory cell having metal-enhanced gates and method of making same |
Country Status (7)
Country | Link |
---|---|
US (1) | US9276006B1 (zh) |
EP (1) | EP3243219B1 (zh) |
JP (1) | JP6367491B2 (zh) |
KR (1) | KR20170093257A (zh) |
CN (1) | CN107210303A (zh) |
TW (1) | TWI562338B (zh) |
WO (1) | WO2016111742A1 (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9793281B2 (en) | 2015-07-21 | 2017-10-17 | Silicon Storage Technology, Inc. | Non-volatile split gate memory cells with integrated high K metal gate logic device and metal-free erase gate, and method of making same |
US9634019B1 (en) | 2015-10-01 | 2017-04-25 | Silicon Storage Technology, Inc. | Non-volatile split gate memory cells with integrated high K metal gate, and method of making same |
US9634020B1 (en) * | 2015-10-07 | 2017-04-25 | Silicon Storage Technology, Inc. | Method of making embedded memory device with silicon-on-insulator substrate |
US9673208B2 (en) | 2015-10-12 | 2017-06-06 | Silicon Storage Technology, Inc. | Method of forming memory array and logic devices |
US9634017B1 (en) * | 2015-12-04 | 2017-04-25 | Globalfoundries Inc. | Semiconductor structure including a nonvolatile memory cell and method for the formation thereof |
CN107305892B (zh) | 2016-04-20 | 2020-10-02 | 硅存储技术公司 | 使用两个多晶硅沉积步骤来形成三栅极非易失性闪存单元对的方法 |
CN107425003B (zh) * | 2016-05-18 | 2020-07-14 | 硅存储技术公司 | 制造分裂栅非易失性闪存单元的方法 |
US9929167B2 (en) | 2016-07-13 | 2018-03-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
US10943996B2 (en) * | 2016-11-29 | 2021-03-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of manufacturing semiconductor device including non-volatile memories and logic devices |
US10325918B2 (en) | 2016-11-29 | 2019-06-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
US10283512B2 (en) | 2016-11-29 | 2019-05-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
US9853039B1 (en) | 2016-12-13 | 2017-12-26 | Cypress Semiconductor Corporation | Split-gate flash cell formed on recessed substrate |
US10269815B2 (en) | 2017-04-27 | 2019-04-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
US10608090B2 (en) * | 2017-10-04 | 2020-03-31 | Silicon Storage Technology, Inc. | Method of manufacturing a split-gate flash memory cell with erase gate |
US10714634B2 (en) | 2017-12-05 | 2020-07-14 | Silicon Storage Technology, Inc. | Non-volatile split gate memory cells with integrated high K metal control gates and method of making same |
US10312247B1 (en) | 2018-03-22 | 2019-06-04 | Silicon Storage Technology, Inc. | Two transistor FinFET-based split gate non-volatile floating gate flash memory and method of fabrication |
US10468428B1 (en) * | 2018-04-19 | 2019-11-05 | Silicon Storage Technology, Inc. | Split gate non-volatile memory cells and logic devices with FinFET structure, and method of making same |
US10727240B2 (en) | 2018-07-05 | 2020-07-28 | Silicon Store Technology, Inc. | Split gate non-volatile memory cells with three-dimensional FinFET structure |
CN109103085A (zh) * | 2018-08-06 | 2018-12-28 | 上海华虹宏力半导体制造有限公司 | 闪存及其制造方法 |
US10797142B2 (en) | 2018-12-03 | 2020-10-06 | Silicon Storage Technology, Inc. | FinFET-based split gate non-volatile flash memory with extended source line FinFET, and method of fabrication |
US10937794B2 (en) | 2018-12-03 | 2021-03-02 | Silicon Storage Technology, Inc. | Split gate non-volatile memory cells with FinFET structure and HKMG memory and logic gates, and method of making same |
CN110797344B (zh) * | 2019-11-08 | 2022-10-21 | 武汉新芯集成电路制造有限公司 | 一种半导体器件的制造方法 |
US11362100B2 (en) | 2020-03-24 | 2022-06-14 | Silicon Storage Technology, Inc. | FinFET split gate non-volatile memory cells with enhanced floating gate to floating gate capacitive coupling |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6747310B2 (en) * | 2002-10-07 | 2004-06-08 | Actrans System Inc. | Flash memory cells with separated self-aligned select and erase gates, and process of fabrication |
US20060033152A1 (en) * | 2004-08-14 | 2006-02-16 | Samsung Electronics Co., Ltd. | Non-volatile memory device and method of fabricating the same |
US20100054043A1 (en) * | 2007-08-06 | 2010-03-04 | Silicon Storage Technology, Inc. | Split Gate Non-Volatile Flash Memory Cell Having a Floating Gate, Control Gate, Select Gate and an Erase Gate with an Overhang Over the Floating Gate, Array and Method of Manufacturing |
US20140008713A1 (en) * | 2012-07-06 | 2014-01-09 | Globalfoundries Singapore Pte. Ltd. | Method and apparatus for embedded nvm utilizing an rmg process |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US5242848A (en) | 1990-01-22 | 1993-09-07 | Silicon Storage Technology, Inc. | Self-aligned method of making a split gate single transistor non-volatile electrically alterable semiconductor memory device |
US8138524B2 (en) * | 2006-11-01 | 2012-03-20 | Silicon Storage Technology, Inc. | Self-aligned method of forming a semiconductor memory array of floating memory cells with source side erase, and a memory array made thereby |
US8008702B2 (en) * | 2008-02-20 | 2011-08-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-transistor non-volatile memory element |
US8883592B2 (en) * | 2011-08-05 | 2014-11-11 | Silicon Storage Technology, Inc. | Non-volatile memory cell having a high K dielectric and metal gate |
US8951864B2 (en) * | 2012-02-13 | 2015-02-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Split-gate device and method of fabricating the same |
US9129854B2 (en) | 2012-10-04 | 2015-09-08 | Sandisk Technologies Inc. | Full metal gate replacement process for NAND flash memory |
-
2015
- 2015-01-05 US US14/589,656 patent/US9276006B1/en active Active
- 2015-11-06 WO PCT/US2015/059443 patent/WO2016111742A1/en active Application Filing
- 2015-11-06 CN CN201580072475.4A patent/CN107210303A/zh active Pending
- 2015-11-06 KR KR1020177021606A patent/KR20170093257A/ko not_active Application Discontinuation
- 2015-11-06 EP EP15798284.4A patent/EP3243219B1/en active Active
- 2015-11-06 JP JP2017535794A patent/JP6367491B2/ja active Active
- 2015-11-30 TW TW104139924A patent/TWI562338B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6747310B2 (en) * | 2002-10-07 | 2004-06-08 | Actrans System Inc. | Flash memory cells with separated self-aligned select and erase gates, and process of fabrication |
US20060033152A1 (en) * | 2004-08-14 | 2006-02-16 | Samsung Electronics Co., Ltd. | Non-volatile memory device and method of fabricating the same |
US20100054043A1 (en) * | 2007-08-06 | 2010-03-04 | Silicon Storage Technology, Inc. | Split Gate Non-Volatile Flash Memory Cell Having a Floating Gate, Control Gate, Select Gate and an Erase Gate with an Overhang Over the Floating Gate, Array and Method of Manufacturing |
US20140008713A1 (en) * | 2012-07-06 | 2014-01-09 | Globalfoundries Singapore Pte. Ltd. | Method and apparatus for embedded nvm utilizing an rmg process |
Also Published As
Publication number | Publication date |
---|---|
KR20170093257A (ko) | 2017-08-14 |
TW201620117A (zh) | 2016-06-01 |
EP3243219A1 (en) | 2017-11-15 |
JP2018501662A (ja) | 2018-01-18 |
US9276006B1 (en) | 2016-03-01 |
EP3243219B1 (en) | 2019-06-26 |
CN107210303A (zh) | 2017-09-26 |
WO2016111742A1 (en) | 2016-07-14 |
JP6367491B2 (ja) | 2018-08-01 |
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