TWI561648B - Deposition mask and method for manufacturing same - Google Patents

Deposition mask and method for manufacturing same

Info

Publication number
TWI561648B
TWI561648B TW101146937A TW101146937A TWI561648B TW I561648 B TWI561648 B TW I561648B TW 101146937 A TW101146937 A TW 101146937A TW 101146937 A TW101146937 A TW 101146937A TW I561648 B TWI561648 B TW I561648B
Authority
TW
Taiwan
Prior art keywords
deposition mask
manufacturing same
manufacturing
same
mask
Prior art date
Application number
TW101146937A
Other languages
English (en)
Other versions
TW201343939A (zh
Inventor
Shigeto Sugimoto
Original Assignee
V Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by V Technology Co Ltd filed Critical V Technology Co Ltd
Publication of TW201343939A publication Critical patent/TW201343939A/zh
Application granted granted Critical
Publication of TWI561648B publication Critical patent/TWI561648B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW101146937A 2011-12-13 2012-12-12 Deposition mask and method for manufacturing same TWI561648B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011271856A JP5935179B2 (ja) 2011-12-13 2011-12-13 蒸着マスク及び蒸着マスクの製造方法

Publications (2)

Publication Number Publication Date
TW201343939A TW201343939A (zh) 2013-11-01
TWI561648B true TWI561648B (en) 2016-12-11

Family

ID=48612582

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101146937A TWI561648B (en) 2011-12-13 2012-12-12 Deposition mask and method for manufacturing same

Country Status (3)

Country Link
JP (1) JP5935179B2 (zh)
TW (1) TWI561648B (zh)
WO (1) WO2013089138A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105322101B (zh) 2012-01-12 2019-04-05 大日本印刷株式会社 蒸镀掩模及有机半导体元件的制造方法
JP5958824B2 (ja) * 2012-11-15 2016-08-02 株式会社ブイ・テクノロジー 蒸着マスクの製造方法
JP6035548B2 (ja) * 2013-04-11 2016-11-30 株式会社ブイ・テクノロジー 蒸着マスク
JP5780350B2 (ja) * 2013-11-14 2015-09-16 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
CN106536784B (zh) * 2014-06-06 2019-08-30 大日本印刷株式会社 蒸镀掩模及其前体、以及有机半导体元件的制造方法
KR102382753B1 (ko) * 2014-06-06 2022-04-08 다이니폰 인사츠 가부시키가이샤 증착 마스크, 프레임을 갖는 증착 마스크, 증착 마스크 준비체, 및 유기 반도체 소자의 제조 방법
CN104051676A (zh) * 2014-07-11 2014-09-17 华映视讯（吴江）有限公司 用于制造有机发光装置的屏蔽的制造方法
JP6424521B2 (ja) * 2014-09-03 2018-11-21 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
KR102205403B1 (ko) 2014-10-08 2021-01-21 삼성디스플레이 주식회사 증착용 마스크 포장 용기
US10384417B2 (en) 2015-01-20 2019-08-20 Sharp Kabushiki Kaisha Deposition mask and manufacturing method
CN108884555B (zh) 2015-12-25 2021-02-09 鸿海精密工业股份有限公司 蒸镀掩模、蒸镀掩模的制造方法及有机半导体元件的制造方法
JP6596106B2 (ja) 2016-01-26 2019-10-23 鴻海精密工業股▲ふん▼有限公司 蒸着マスクの製造方法及びその蒸着マスクを使った有機発光ダイオードの製造方法
CN109072401B (zh) * 2016-03-10 2021-05-11 鸿海精密工业股份有限公司 蒸镀掩膜、蒸镀装置、蒸镀方法及有机el显示装置的制造方法
CN113463029A (zh) * 2016-09-30 2021-10-01 大日本印刷株式会社 框架一体式的蒸镀掩模及其制备体和制造方法、蒸镀图案形成方法
WO2018179272A1 (ja) * 2017-03-30 2018-10-04 シャープ株式会社 Ｅｌ表示装置及びｅｌ表示装置の製造方法
JP6645534B2 (ja) * 2018-04-18 2020-02-14 大日本印刷株式会社 フレーム付き蒸着マスク
CN113224105B (zh) * 2021-07-08 2021-09-28 苏州芯聚半导体有限公司 彩色化制作方法、彩色基板及显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004190057A (ja) * 2002-12-09 2004-07-08 Nippon Filcon Co Ltd パターニングされたマスク被膜と支持体からなる積層構造の薄膜パターン形成用マスク及びその製造方法
JP2008121060A (ja) * 2006-11-10 2008-05-29 Mitsubishi Paper Mills Ltd 樹脂付き真空成膜用マスクの作製方法及び樹脂付き真空成膜用マスク

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07300664A (ja) * 1994-04-28 1995-11-14 Fujitsu Ltd メタルマスクの製造方法とその再生方法
JP4058149B2 (ja) * 1997-12-01 2008-03-05 キヤノンアネルバ株式会社 真空成膜装置のマスク位置合わせ方法
JP2003231964A (ja) * 2001-12-05 2003-08-19 Toray Ind Inc 蒸着マスクおよびその製造方法並びに有機電界発光装置およびその製造方法
JP4200290B2 (ja) * 2003-05-21 2008-12-24 パナソニック株式会社 マスクユニット

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004190057A (ja) * 2002-12-09 2004-07-08 Nippon Filcon Co Ltd パターニングされたマスク被膜と支持体からなる積層構造の薄膜パターン形成用マスク及びその製造方法
JP2008121060A (ja) * 2006-11-10 2008-05-29 Mitsubishi Paper Mills Ltd 樹脂付き真空成膜用マスクの作製方法及び樹脂付き真空成膜用マスク

Also Published As

Publication number Publication date
TW201343939A (zh) 2013-11-01
JP5935179B2 (ja) 2016-06-15
JP2013124372A (ja) 2013-06-24
WO2013089138A1 (ja) 2013-06-20

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MM4A Annulment or lapse of patent due to non-payment of fees