TWI561554B - - Google Patents

Info

Publication number
TWI561554B
TWI561554B TW101134364A TW101134364A TWI561554B TW I561554 B TWI561554 B TW I561554B TW 101134364 A TW101134364 A TW 101134364A TW 101134364 A TW101134364 A TW 101134364A TW I561554 B TWI561554 B TW I561554B
Authority
TW
Taiwan
Application number
TW101134364A
Other versions
TW201313783A (zh
Inventor
Kil Nam Lee
Sung Won Kim
Original Assignee
Skckolon Pi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skckolon Pi Inc filed Critical Skckolon Pi Inc
Publication of TW201313783A publication Critical patent/TW201313783A/zh
Application granted granted Critical
Publication of TWI561554B publication Critical patent/TWI561554B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1021—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the catalyst used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW101134364A 2011-09-19 2012-09-19 黑色聚亞醯胺薄膜及其製造方法 TW201313783A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110094237A KR101156084B1 (ko) 2011-09-19 2011-09-19 블랙 폴리이미드 필름 및 그 제조방법

Publications (2)

Publication Number Publication Date
TW201313783A TW201313783A (zh) 2013-04-01
TWI561554B true TWI561554B (zh) 2016-12-11

Family

ID=46688935

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101134364A TW201313783A (zh) 2011-09-19 2012-09-19 黑色聚亞醯胺薄膜及其製造方法

Country Status (2)

Country Link
KR (1) KR101156084B1 (zh)
TW (1) TW201313783A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109135281A (zh) * 2018-08-24 2019-01-04 桂林电器科学研究院有限公司 一种低针孔发生率亚光黑色聚酰亚胺薄膜及其制备方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017159914A1 (ko) * 2016-03-18 2017-09-21 국도화학 주식회사 저광택 블랙 폴리이미드 전사 필름 및 그 제조방법
KR101908684B1 (ko) * 2017-05-30 2018-10-16 에스케이씨코오롱피아이 주식회사 초박막 블랙 폴리이미드 필름 및 그 제조방법
KR101906393B1 (ko) 2017-11-03 2018-10-11 에스케이씨코오롱피아이 주식회사 초박막 블랙 폴리이미드 필름 및 이의 제조방법
KR101906394B1 (ko) * 2017-11-10 2018-10-11 에스케이씨코오롱피아이 주식회사 초박막 블랙 폴리이미드 필름 및 이의 제조방법
KR102091572B1 (ko) * 2018-01-10 2020-03-20 에스케이씨코오롱피아이 주식회사 내염기성이 향상된 폴리이미드 필름 및 이의 제조방법
CN108892792B (zh) * 2018-04-13 2021-03-05 广东丹邦科技有限公司 一种黑色聚酰亚胺薄膜及其制备方法
CN108752626A (zh) * 2018-06-27 2018-11-06 桂林电器科学研究院有限公司 用于黑色聚酰亚胺薄膜的填料分散液及其制备方法
CN109135280B (zh) * 2018-08-24 2021-03-05 桂林电器科学研究院有限公司 一种低针孔发生率高绝缘亚光黑色聚酰亚胺薄膜及其制备方法
CN109280192B (zh) * 2018-08-24 2021-03-30 桂林电器科学研究院有限公司 一种黑色低亚光聚酰亚胺薄膜的制备方法
CN109161040B (zh) * 2018-08-24 2021-06-11 桂林电器科学研究院有限公司 一种低针孔发生率亚光黑色聚酰亚胺薄膜的制备方法
KR102270651B1 (ko) * 2018-11-30 2021-06-30 피아이첨단소재 주식회사 입경이 상이한 2 이상의 필러를 포함하는 폴리이미드 필름 및 이를 포함하는 전자장치
KR102270652B1 (ko) * 2018-11-30 2021-06-30 피아이첨단소재 주식회사 입경이 상이한 2 이상의 필러를 포함하는 폴리이미드 필름 및 이를 포함하는 전자장치
KR102164467B1 (ko) * 2018-11-30 2020-10-13 피아이첨단소재 주식회사 입경이 상이한 2 이상의 필러를 포함하는 폴리이미드 필름 및 이를 포함하는 전자장치
KR102164470B1 (ko) * 2018-11-30 2020-10-13 피아이첨단소재 주식회사 입경이 상이한 2 이상의 필러를 포함하는 폴리이미드 필름 및 이를 포함하는 전자장치
CN111430648B (zh) * 2020-05-08 2023-05-12 深圳市华之美科技有限公司 一种聚酰亚胺锂离子电池隔膜、制备方法及锂离子电池
WO2022245105A1 (ko) * 2021-05-17 2022-11-24 피아이첨단소재 주식회사 블랙 바나쉬 및 이를 포함하는 필름

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200844167A (en) * 2007-03-20 2008-11-16 Toray Industries Black resin composition, resin black matrices, color filter, and liquid crystal display device
KR101045823B1 (ko) * 2011-02-18 2011-07-04 에스케이씨코오롱피아이 주식회사 블랙 폴리이미드 필름

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002284994A (ja) * 2001-03-23 2002-10-03 Nitto Denko Corp ポリイミド樹脂組成物及び高制電性シームレスベルト
JP2004123774A (ja) * 2002-09-30 2004-04-22 Kanegafuchi Chem Ind Co Ltd ポリイミド樹脂組成物、ポリイミドフィルム、及びポリイミド管状物
JP5285578B2 (ja) * 2009-11-13 2013-09-11 株式会社カネカ 絶縁性ポリイミドフィルム、カバーレイフィルム及びフレキシブルプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200844167A (en) * 2007-03-20 2008-11-16 Toray Industries Black resin composition, resin black matrices, color filter, and liquid crystal display device
KR101045823B1 (ko) * 2011-02-18 2011-07-04 에스케이씨코오롱피아이 주식회사 블랙 폴리이미드 필름

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109135281A (zh) * 2018-08-24 2019-01-04 桂林电器科学研究院有限公司 一种低针孔发生率亚光黑色聚酰亚胺薄膜及其制备方法

Also Published As

Publication number Publication date
TW201313783A (zh) 2013-04-01
KR101156084B1 (ko) 2012-06-20

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