TWI560297B - Method to produce highly transparent hydrogenated carbon protective coating for transparent substrates - Google Patents
Method to produce highly transparent hydrogenated carbon protective coating for transparent substratesInfo
- Publication number
- TWI560297B TWI560297B TW102124269A TW102124269A TWI560297B TW I560297 B TWI560297 B TW I560297B TW 102124269 A TW102124269 A TW 102124269A TW 102124269 A TW102124269 A TW 102124269A TW I560297 B TWI560297 B TW I560297B
- Authority
- TW
- Taiwan
- Prior art keywords
- protective coating
- transparent
- carbon protective
- produce highly
- hydrogenated carbon
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0057—Reactive sputtering using reactive gases other than O2, H2O, N2, NH3 or CH4
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Surface Treatment Of Glass (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261668402P | 2012-07-05 | 2012-07-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201410902A TW201410902A (zh) | 2014-03-16 |
TWI560297B true TWI560297B (en) | 2016-12-01 |
Family
ID=49877682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102124269A TWI560297B (en) | 2012-07-05 | 2013-07-05 | Method to produce highly transparent hydrogenated carbon protective coating for transparent substrates |
Country Status (8)
Country | Link |
---|---|
US (2) | US9605340B2 (zh) |
JP (1) | JP6316287B2 (zh) |
KR (2) | KR20150030741A (zh) |
CN (1) | CN104603324B (zh) |
MY (1) | MY171465A (zh) |
SG (1) | SG11201500038PA (zh) |
TW (1) | TWI560297B (zh) |
WO (1) | WO2014008484A2 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI560297B (en) | 2012-07-05 | 2016-12-01 | Intevac Inc | Method to produce highly transparent hydrogenated carbon protective coating for transparent substrates |
CN106104311B (zh) * | 2014-03-13 | 2018-04-10 | 富士胶片株式会社 | 光学组件、红外线照相机及光学组件的制造方法 |
DE112015004470B4 (de) * | 2014-09-30 | 2018-08-23 | Fujifilm Corporation | Antireflexfilm, Linse und Abbildungsvorrichtung |
JP6155399B2 (ja) * | 2014-09-30 | 2017-06-28 | 富士フイルム株式会社 | 反射防止膜及びカルコゲナイドガラスレンズ並びに撮像装置 |
US11472590B2 (en) | 2016-05-05 | 2022-10-18 | The Coca-Cola Company | Containers and methods for improved mechanical strength |
CN107785488A (zh) * | 2016-08-25 | 2018-03-09 | 杭州纤纳光电科技有限公司 | 钙钛矿薄膜的低压化学沉积的设备及其使用方法和应用 |
CN107083536B (zh) * | 2017-04-24 | 2019-11-29 | 信利光电股份有限公司 | 一种类金刚石复合薄膜及其制备方法 |
CN107857471B (zh) * | 2017-11-28 | 2020-09-04 | 信利光电股份有限公司 | 一种渐变色玻璃的制作方法 |
CN108468029B (zh) * | 2018-02-12 | 2020-01-21 | 中国科学院国家天文台南京天文光学技术研究所 | 用于碳化硅光学镜面改性与面形提升的磁控溅射扫描方法 |
CN108330459A (zh) * | 2018-02-26 | 2018-07-27 | 温州职业技术学院 | 一种对称磁控溅射工艺及其类金刚石涂层的应用 |
US10494710B1 (en) | 2018-08-28 | 2019-12-03 | Yamaha Hatsudoki Kabushiki Kaisha | Film-forming method, production method for product with ceramic film, and product with ceramic film |
CN114302604B (zh) * | 2022-01-18 | 2024-03-15 | Oppo广东移动通信有限公司 | 盖板、其制备方法及电子设备 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201033387A (en) * | 2009-01-16 | 2010-09-16 | Applied Materials Inc | Charged particle beam PVD device, shielding device, coating chamber for coating substrates, and method of coating |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4690744A (en) | 1983-07-20 | 1987-09-01 | Konishiroku Photo Industry Co., Ltd. | Method of ion beam generation and an apparatus based on such method |
JPH01160815A (ja) | 1987-12-15 | 1989-06-23 | Osaka Shinku Kiki Seisakusho:Kk | カーボン薄膜のスパッタ形成方法 |
US5045165A (en) * | 1990-02-01 | 1991-09-03 | Komag, Inc. | Method for sputtering a hydrogen-doped carbon protective film on a magnetic disk |
GB9006073D0 (en) | 1990-03-17 | 1990-05-16 | D G Teer Coating Services Limi | Magnetron sputter ion plating |
US5135808A (en) | 1990-09-27 | 1992-08-04 | Diamonex, Incorporated | Abrasion wear resistant coated substrate product |
US5527596A (en) | 1990-09-27 | 1996-06-18 | Diamonex, Incorporated | Abrasion wear resistant coated substrate product |
US5268217A (en) * | 1990-09-27 | 1993-12-07 | Diamonex, Incorporated | Abrasion wear resistant coated substrate product |
US5286296A (en) * | 1991-01-10 | 1994-02-15 | Sony Corporation | Multi-chamber wafer process equipment having plural, physically communicating transfer means |
DE4237517A1 (de) | 1992-11-06 | 1994-05-11 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten |
US5415753A (en) | 1993-07-22 | 1995-05-16 | Materials Research Corporation | Stationary aperture plate for reactive sputter deposition |
JP3100837B2 (ja) | 1993-12-24 | 2000-10-23 | 松下電器産業株式会社 | スパッタリング装置 |
JPH07335553A (ja) | 1994-06-08 | 1995-12-22 | Tel Varian Ltd | 処理装置および処理方法 |
JPH0860355A (ja) | 1994-08-23 | 1996-03-05 | Tel Varian Ltd | 処理装置 |
TW366367B (en) * | 1995-01-26 | 1999-08-11 | Ibm | Sputter deposition of hydrogenated amorphous carbon film |
JPH1064902A (ja) * | 1996-07-12 | 1998-03-06 | Applied Materials Inc | アルミニウム材料の成膜方法及び成膜装置 |
US5830327A (en) | 1996-10-02 | 1998-11-03 | Intevac, Inc. | Methods and apparatus for sputtering with rotating magnet sputter sources |
US5858182A (en) * | 1997-03-20 | 1999-01-12 | Headway Technoloies, Inc. | Bilayer carbon overcoating for magnetic data storage disks and magnetic head/slider constructions |
JP3886209B2 (ja) | 1997-06-02 | 2007-02-28 | 貞夫 門倉 | 対向ターゲット式スパッタ装置 |
US5891311A (en) | 1997-06-25 | 1999-04-06 | Intevac, Inc. | Sputter coating system and method using substrate electrode |
US6572935B1 (en) | 1999-03-13 | 2003-06-03 | The Regents Of The University Of California | Optically transparent, scratch-resistant, diamond-like carbon coatings |
US6261693B1 (en) | 1999-05-03 | 2001-07-17 | Guardian Industries Corporation | Highly tetrahedral amorphous carbon coating on glass |
US6572738B1 (en) | 1999-05-25 | 2003-06-03 | Unaxis Balzers Aktiengesellschaft | Vacuum treatment system and process for manufacturing workpieces |
US6398929B1 (en) | 1999-10-08 | 2002-06-04 | Applied Materials, Inc. | Plasma reactor and shields generating self-ionized plasma for sputtering |
US6562715B1 (en) * | 2000-08-09 | 2003-05-13 | Applied Materials, Inc. | Barrier layer structure for copper metallization and method of forming the structure |
US6689253B1 (en) | 2001-06-15 | 2004-02-10 | Seagate Technology Llc | Facing target assembly and sputter deposition apparatus |
US6758949B2 (en) | 2002-09-10 | 2004-07-06 | Applied Materials, Inc. | Magnetically confined metal plasma sputter source with magnetic control of ion and neutral densities |
US6902646B2 (en) | 2003-08-14 | 2005-06-07 | Advanced Energy Industries, Inc. | Sensor array for measuring plasma characteristics in plasma processing environments |
CN1782123A (zh) | 2004-12-03 | 2006-06-07 | 馗鼎奈米科技股份有限公司 | 类金刚石碳膜及其制备方法 |
JP2007010798A (ja) * | 2005-06-28 | 2007-01-18 | Asahi Kasei Corp | 異方性散乱フィルム |
KR100918605B1 (ko) | 2005-07-19 | 2009-09-25 | 가부시키가이샤 알박 | 스퍼터링 장치 및 투명 도전막의 제조 방법 |
JP2007254831A (ja) * | 2006-03-24 | 2007-10-04 | Fujifilm Corp | 真空装置および固体検出器の製造装置ならびに固体検出器の製造方法 |
US20080014466A1 (en) | 2006-07-11 | 2008-01-17 | Ronghua Wei | Glass with scratch-resistant coating |
DE112008000252T5 (de) * | 2007-01-26 | 2009-12-17 | Osaka Vacuum, Ltd. | Sputter-Verfahren und Sputter-Vorrichtung |
US20080197015A1 (en) | 2007-02-16 | 2008-08-21 | Terry Bluck | Multiple-magnetron sputtering source with plasma confinement |
US20100072061A1 (en) | 2007-06-01 | 2010-03-25 | Yamaguchi University | Sputtering apparatus for forming thin film |
JP4631940B2 (ja) * | 2008-07-10 | 2011-02-16 | セイコーエプソン株式会社 | スパッタリング装置、及び液晶装置の製造装置 |
CN201261804Y (zh) * | 2008-09-05 | 2009-06-24 | 郭爱云 | 大面积抗反射导电膜连续磁控溅射镀膜生产线 |
US20100200393A1 (en) | 2009-02-09 | 2010-08-12 | Robert Chow | Sputter deposition method and system for fabricating thin film capacitors with optically transparent smooth surface metal oxide standoff layer |
US20100230274A1 (en) | 2009-03-12 | 2010-09-16 | Applied Materials, Inc. | Minimizing magnetron substrate interaction in large area sputter coating equipment |
CN101602273A (zh) | 2009-07-22 | 2009-12-16 | 天津南玻节能玻璃有限公司 | 一种类金刚石镀膜玻璃及其制备方法 |
US20120097525A1 (en) | 2010-10-26 | 2012-04-26 | Harkness Iv Samuel D | Method and apparatus to control ionic deposition |
US20140102888A1 (en) | 2010-12-17 | 2014-04-17 | Intevac, Inc. | Method and apparatus to produce high density overcoats |
US20120152726A1 (en) | 2010-12-17 | 2012-06-21 | Harkness Iv Samuel D | Method and apparatus to produce high density overcoats |
TWI560297B (en) | 2012-07-05 | 2016-12-01 | Intevac Inc | Method to produce highly transparent hydrogenated carbon protective coating for transparent substrates |
WO2015051277A2 (en) | 2013-10-04 | 2015-04-09 | Intevac, Inc. | Method and apparatus to produce high density overcoats |
-
2013
- 2013-07-05 TW TW102124269A patent/TWI560297B/zh active
- 2013-07-05 CN CN201380046056.4A patent/CN104603324B/zh not_active Expired - Fee Related
- 2013-07-05 US US13/935,993 patent/US9605340B2/en active Active - Reinstated
- 2013-07-05 SG SG11201500038PA patent/SG11201500038PA/en unknown
- 2013-07-05 JP JP2015520710A patent/JP6316287B2/ja active Active
- 2013-07-05 KR KR1020157001838A patent/KR20150030741A/ko active Application Filing
- 2013-07-05 KR KR1020217001983A patent/KR102292497B1/ko active IP Right Grant
- 2013-07-05 WO PCT/US2013/049467 patent/WO2014008484A2/en active Application Filing
- 2013-07-05 MY MYPI2015700023A patent/MY171465A/en unknown
-
2017
- 2017-02-14 US US15/432,815 patent/US9896758B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201033387A (en) * | 2009-01-16 | 2010-09-16 | Applied Materials Inc | Charged particle beam PVD device, shielding device, coating chamber for coating substrates, and method of coating |
Also Published As
Publication number | Publication date |
---|---|
KR20150030741A (ko) | 2015-03-20 |
US20170152592A1 (en) | 2017-06-01 |
CN104603324B (zh) | 2017-03-08 |
JP6316287B2 (ja) | 2018-04-25 |
KR20210010667A (ko) | 2021-01-27 |
JP2015528056A (ja) | 2015-09-24 |
WO2014008484A2 (en) | 2014-01-09 |
US20140008214A1 (en) | 2014-01-09 |
CN104603324A (zh) | 2015-05-06 |
MY171465A (en) | 2019-10-15 |
US9896758B2 (en) | 2018-02-20 |
TW201410902A (zh) | 2014-03-16 |
SG11201500038PA (en) | 2015-02-27 |
US9605340B2 (en) | 2017-03-28 |
WO2014008484A3 (en) | 2014-02-27 |
KR102292497B1 (ko) | 2021-08-20 |
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