TWI560225B - Underlayer composition for imprints and method for manufacturing pattern by using the same,cured object,laminate body,semiconductor device and method for manufacturing the same,and adhesive enhance agent for curable composition and substrate - Google Patents

Underlayer composition for imprints and method for manufacturing pattern by using the same,cured object,laminate body,semiconductor device and method for manufacturing the same,and adhesive enhance agent for curable composition and substrate

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Publication number
TWI560225B
TWI560225B TW102107348A TW102107348A TWI560225B TW I560225 B TWI560225 B TW I560225B TW 102107348 A TW102107348 A TW 102107348A TW 102107348 A TW102107348 A TW 102107348A TW I560225 B TWI560225 B TW I560225B
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TW
Taiwan
Prior art keywords
same
manufacturing
imprints
adhesive
substrate
Prior art date
Application number
TW102107348A
Other languages
English (en)
Other versions
TW201343745A (zh
Inventor
Akiko Hattori
Hirotaka Kitagawa
Yuichiro Enomoto
Tadashi Oomatsu
Original Assignee
Fujifilm Corp
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Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW201343745A publication Critical patent/TW201343745A/zh
Application granted granted Critical
Publication of TWI560225B publication Critical patent/TWI560225B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F122/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F122/10—Esters
    • C08F122/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F120/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F120/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F120/10—Esters
    • C08F120/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F120/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F120/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F120/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F120/10—Esters
    • C08F120/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F120/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/21—Urea; Derivatives thereof, e.g. biuret
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/02—Homopolymers or copolymers of esters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31935—Ester, halide or nitrile of addition polymer

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW102107348A 2012-03-29 2013-03-01 Underlayer composition for imprints and method for manufacturing pattern by using the same,cured object,laminate body,semiconductor device and method for manufacturing the same,and adhesive enhance agent for curable composition and substrate TWI560225B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012076018A JP5891090B2 (ja) 2012-03-29 2012-03-29 インプリント用下層膜組成物およびこれを用いたパターン形成方法

Publications (2)

Publication Number Publication Date
TW201343745A TW201343745A (zh) 2013-11-01
TWI560225B true TWI560225B (en) 2016-12-01

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TW102107348A TWI560225B (en) 2012-03-29 2013-03-01 Underlayer composition for imprints and method for manufacturing pattern by using the same,cured object,laminate body,semiconductor device and method for manufacturing the same,and adhesive enhance agent for curable composition and substrate

Country Status (5)

Country Link
US (1) US20150014819A1 (zh)
JP (1) JP5891090B2 (zh)
KR (1) KR20140146632A (zh)
TW (1) TWI560225B (zh)
WO (1) WO2013145829A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767033B (zh) * 2017-07-18 2022-06-11 日商富士軟片股份有限公司 容器、容器的製造方法及藥液收容體

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6632340B2 (ja) * 2015-01-30 2020-01-22 キヤノン株式会社 密着層形成組成物、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、インプリント用モールドの製造方法、およびデバイス部品
WO2016120944A1 (en) * 2015-01-30 2016-08-04 Canon Kabushiki Kaisha Adhesion layer-forming composition, method of manufacturing cured product pattern, method of manufacturing optical component, method of manufacturing circuit board, method of manufacturing imprinting mold, and device component
JPWO2016148095A1 (ja) * 2015-03-18 2018-03-22 富士フイルム株式会社 下層膜形成用樹脂組成物、インプリント形成用キット、積層体、パターン形成方法およびデバイスの製造方法
US10042253B2 (en) * 2016-01-11 2018-08-07 Samsung Display Co., Ltd. Photosensitive resin composition, film prepared by using the photosensitive resin composition, and organic light-emitting display device including the film
KR102700011B1 (ko) * 2016-01-11 2024-08-30 삼성디스플레이 주식회사 감광성 수지 조성물, 이로부터 제조된 막 및 상기 막을 포함하는 유기 발광 표시 장치
JP6983760B2 (ja) * 2016-04-08 2021-12-17 キヤノン株式会社 硬化物パターンの形成方法、加工基板の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法、インプリントモールドの製造方法、およびインプリント前処理コート用材料
JP7008627B2 (ja) * 2016-08-19 2022-02-10 大阪有機化学工業株式会社 易剥離膜形成用硬化性樹脂組成物及びその製造方法
WO2018033995A1 (ja) * 2016-08-19 2018-02-22 大阪有機化学工業株式会社 易剥離膜形成用硬化性樹脂組成物及びその製造方法
EP3524640B1 (en) * 2016-10-05 2021-12-08 Denka Company Limited Resin composition and membrane structure using same
JP7011386B2 (ja) * 2016-11-16 2022-01-26 キヤノン株式会社 密着層形成組成物および物品製造方法
JP6865047B2 (ja) 2017-01-27 2021-04-28 東京応化工業株式会社 インプリント用下層膜形成用組成物及びパターン形成方法
WO2018159575A1 (ja) * 2017-02-28 2018-09-07 富士フイルム株式会社 インプリント用密着膜形成用組成物、密着膜、積層体、硬化物パターンの製造方法および回路基板の製造方法
KR102393376B1 (ko) 2017-04-10 2022-05-03 삼성디스플레이 주식회사 감광성 수지 조성물 및 이를 포함한 패턴 형성용 조성물의 경화물을 포함하는 전자 장치
JP7112220B2 (ja) * 2017-05-12 2022-08-03 キヤノン株式会社 方法、装置、システム、および物品の製造方法
US11520226B2 (en) * 2017-05-12 2022-12-06 Canon Kabushiki Kaisha Imprint method, imprint apparatus, imprint system, and method of manufacturing article
WO2019031409A1 (ja) 2017-08-10 2019-02-14 キヤノン株式会社 パターン形成方法
JP7034696B2 (ja) 2017-12-14 2022-03-14 キヤノン株式会社 硬化物パターンの製造方法、加工基板の製造方法、回路基板の製造方法、電子部品の製造方法、およびインプリントモールドの製造方法
US10780682B2 (en) 2018-12-20 2020-09-22 Canon Kabushiki Kaisha Liquid adhesion composition, multi-layer structure and method of making said structure
JP7199510B2 (ja) * 2019-03-14 2023-01-05 富士フイルム株式会社 インプリント用の下層膜形成用組成物、下層膜形成用組成物の製造方法、キット、パターン製造方法、および半導体素子の製造方法
TW202136442A (zh) * 2020-02-20 2021-10-01 日商富士軟片股份有限公司 硬化性組成物、套組、中間層、積層體、壓印圖案的製造方法及元件的製造方法
JP7414680B2 (ja) 2020-09-17 2024-01-16 キオクシア株式会社 インプリント方法、インプリント装置、及び膜形成装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005350558A (ja) * 2004-06-10 2005-12-22 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、パターン形成方法、及び多孔質犠性膜
TW200848936A (en) * 2007-01-19 2008-12-16 Az Electronic Materials Usa Solvent mixtures for antireflective coating compositions for photoresists
JP2010245131A (ja) * 2009-04-01 2010-10-28 Jsr Corp パターン形成方法
JP2011180425A (ja) * 2010-03-02 2011-09-15 Jsr Corp レジスト下層膜形成用組成物及びパターン形成方法
TW201308017A (zh) * 2011-03-31 2013-02-16 Jsr Corp 光阻底層膜組成物及圖型形成方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3279940A (en) * 1963-05-13 1966-10-18 Gulf Oil Corp Polyethylene and polypropylene containers coated with a polyester resin
JP4303560B2 (ja) * 2003-10-31 2009-07-29 富士フイルム株式会社 染料含有硬化性組成物、並びに、カラーフィルターおよびその製造方法
JP4308687B2 (ja) * 2004-03-11 2009-08-05 富士フイルム株式会社 平版印刷版原版
EP1739485B1 (en) * 2004-04-15 2016-08-31 Mitsubishi Gas Chemical Company, Inc. Resist composition
US20060140902A1 (en) * 2004-12-23 2006-06-29 Kimberly-Clark Worldwide, Inc. Odor control substrates
JP5223679B2 (ja) * 2006-12-01 2013-06-26 日立化成株式会社 接着剤及びこれを用いた接続構造体
JP5548427B2 (ja) * 2009-10-30 2014-07-16 富士フイルム株式会社 組成物、レジスト膜、パターン形成方法、及びインクジェット記録方法
JP2012041521A (ja) * 2010-05-12 2012-03-01 Fujifilm Corp 光硬化性組成物およびそれを用いた硬化物の製造方法
JP5647829B2 (ja) * 2010-07-30 2015-01-07 Ａｇｃセイミケミカル株式会社 光硬化性組成物および表面に微細パターンを有する成形体の製造方法
JP5634799B2 (ja) * 2010-08-26 2014-12-03 株式会社ダイセル 微細パターン形成用放射線硬化性樹脂組成物、及び該組成物を用いた微細構造体の製造方法
DE102010061963A1 (de) * 2010-11-25 2012-05-31 Bayer Materialscience Aktiengesellschaft EL-Elemente enthaltend eine Pigmentschicht mit vernetzenden Systemen mit blockierten Isocyanat-Gruppen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005350558A (ja) * 2004-06-10 2005-12-22 Shin Etsu Chem Co Ltd 多孔質膜形成用組成物、パターン形成方法、及び多孔質犠性膜
TW200848936A (en) * 2007-01-19 2008-12-16 Az Electronic Materials Usa Solvent mixtures for antireflective coating compositions for photoresists
JP2010245131A (ja) * 2009-04-01 2010-10-28 Jsr Corp パターン形成方法
JP2011180425A (ja) * 2010-03-02 2011-09-15 Jsr Corp レジスト下層膜形成用組成物及びパターン形成方法
TW201308017A (zh) * 2011-03-31 2013-02-16 Jsr Corp 光阻底層膜組成物及圖型形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI767033B (zh) * 2017-07-18 2022-06-11 日商富士軟片股份有限公司 容器、容器的製造方法及藥液收容體

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US20150014819A1 (en) 2015-01-15

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