TWI558503B - 薄板狀工件之研磨方法及雙頭平面磨床 - Google Patents

薄板狀工件之研磨方法及雙頭平面磨床 Download PDF

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Publication number
TWI558503B
TWI558503B TW101108994A TW101108994A TWI558503B TW I558503 B TWI558503 B TW I558503B TW 101108994 A TW101108994 A TW 101108994A TW 101108994 A TW101108994 A TW 101108994A TW I558503 B TWI558503 B TW I558503B
Authority
TW
Taiwan
Prior art keywords
grinding
workpiece
polishing
accuracy
static pressure
Prior art date
Application number
TW101108994A
Other languages
English (en)
Chinese (zh)
Other versions
TW201249597A (en
Inventor
芝中篤志
Original Assignee
光洋機械工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 光洋機械工業股份有限公司 filed Critical 光洋機械工業股份有限公司
Publication of TW201249597A publication Critical patent/TW201249597A/zh
Application granted granted Critical
Publication of TWI558503B publication Critical patent/TWI558503B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/06—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent requiring comparison of the workpiece with standard gauging plugs, rings or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW101108994A 2011-03-18 2012-03-16 薄板狀工件之研磨方法及雙頭平面磨床 TWI558503B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011060520 2011-03-18
JP2011243137A JP5891010B2 (ja) 2011-03-18 2011-11-07 薄板状ワークの研削方法及び両頭平面研削盤

Publications (2)

Publication Number Publication Date
TW201249597A TW201249597A (en) 2012-12-16
TWI558503B true TWI558503B (zh) 2016-11-21

Family

ID=46757087

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101108994A TWI558503B (zh) 2011-03-18 2012-03-16 薄板狀工件之研磨方法及雙頭平面磨床

Country Status (4)

Country Link
JP (1) JP5891010B2 (enExample)
KR (1) KR101891344B1 (enExample)
DE (1) DE102012204089A1 (enExample)
TW (1) TWI558503B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104511814A (zh) * 2014-12-20 2015-04-15 重庆尹氏天润套装门有限公司 具有双面打磨的木板加工台
JP6285375B2 (ja) * 2015-02-17 2018-02-28 光洋機械工業株式会社 両頭平面研削装置
CN107984360A (zh) * 2017-11-20 2018-05-04 长沙市凤英机械科技有限公司 一种h型钢多面打磨除锈装置
CN108687644A (zh) * 2018-03-29 2018-10-23 芜湖凌梦电子商务有限公司 一种方便使用的平板电脑生产设备的抛光销
CN108747667B (zh) * 2018-05-07 2019-10-25 徐州恒林木业有限公司 一种bmc注塑模具板材表面去毛刺装置
CN110181383A (zh) * 2019-06-06 2019-08-30 扬州好管家科技信息咨询有限公司 一种升降式自控自吸型水泵模具加工用的高效性抛光装置
CN110539237B (zh) * 2019-09-30 2021-06-04 南通海润机床有限公司 一种磨床用可升降的双砂轮结构
CN110883661A (zh) * 2019-12-04 2020-03-17 浙江中慧厨房设备有限公司 一种用于钢板的双面抛光机
CN110860998B (zh) * 2019-12-09 2025-05-27 中环领先(徐州)半导体材料有限公司 双面减薄的装置和方法
CN111390678A (zh) * 2020-04-24 2020-07-10 山西潞安太阳能科技有限责任公司 一种硅片打磨机及其使用方法
JP7588494B2 (ja) * 2020-11-04 2024-11-22 株式会社ディスコ 被加工物の研削方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003236748A (ja) * 2002-02-14 2003-08-26 Sumitomo Heavy Ind Ltd 研削装置
JP2005342851A (ja) * 2004-06-03 2005-12-15 Sumitomo Heavy Ind Ltd 両面加工装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4524547A (en) * 1983-09-06 1985-06-25 Litton Industrial Products, Inc. Automatic double disc grinder control cycle
JP2005238444A (ja) * 1999-05-07 2005-09-08 Shin Etsu Handotai Co Ltd 両面同時研削方法および両面同時研削盤並びに両面同時ラップ方法および両面同時ラップ盤
JP2003071713A (ja) 2001-08-29 2003-03-12 Nippei Toyama Corp 研削装置及びウェーハの厚さ管理方法
JP2004058175A (ja) * 2002-07-25 2004-02-26 Sumitomo Heavy Ind Ltd 両頭研削装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003236748A (ja) * 2002-02-14 2003-08-26 Sumitomo Heavy Ind Ltd 研削装置
JP2005342851A (ja) * 2004-06-03 2005-12-15 Sumitomo Heavy Ind Ltd 両面加工装置

Also Published As

Publication number Publication date
KR20120106576A (ko) 2012-09-26
KR101891344B1 (ko) 2018-08-24
JP2012210697A (ja) 2012-11-01
DE102012204089A1 (de) 2012-09-20
TW201249597A (en) 2012-12-16
JP5891010B2 (ja) 2016-03-22

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