TWI557610B - And a method of manufacturing a conductive substrate of a touch device - Google Patents

Description

Method for manufacturing conductive substrate of touch device

The present invention relates to the manufacture of a conductive substrate, and more particularly to a method of manufacturing a conductive substrate of a touch panel.

The US Patent No. 8383329 discloses a pattern exposure method, a conductive film manufacturing method, and a conductive film, wherein a method of manufacturing a conductive film requires a photomask to form a specific conductive pattern. In other words, the corresponding mask must be redesigned for different conductive patterns in order to obtain a corresponding pattern after exposure, and thus, the manufacturing cost will be increased.

In addition, as the overall selling price of the touch panel is reduced, how to manufacture the conductive path of the low visibility conductive substrate by a relatively low cost method is also an important requirement in the industry.

In view of the above, the manufacturing method of the conductive substrate of the touch device of the present invention provides a process that does not require a photomask, and can reduce the visibility of the conductive path of the conductive substrate to meet current industry demands.

To achieve the above object, a method of manufacturing a conductive substrate of a touch device of the present invention includes the following steps: First, a transparent substrate is provided. The transparent substrate has a front surface, a back surface and a plurality of first channels, each of the first channels being recessed from the front side to the back side of the transparent substrate. Next, the first channel of the transparent substrate is filled with a material bonded to the transparent substrate and is a photosensitive and electrically conductive composite. Finally, the transparent substrate and the material are fully exposed, and the materials in the first channels are respectively converted into a first conductive path, and the color of the first conductive path is black.

As such, the method of manufacturing the conductive substrate of the touch device of the present invention can provide a conductive substrate with a low visibility conductive path, and the entire manufacturing process does not require a photomask at all to reduce the manufacturing cost.

The detailed structure and manufacturing method of the conductive substrate of the touch device provided by the present invention will be described in detail in the following embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited by the scope of the invention.

10‧‧‧Electrical substrate

11‧‧‧Transparent substrate

111‧‧‧ positive

113‧‧‧Back

115‧‧‧ channel

13‧‧‧ conductive path

15‧‧‧Blank area

30‧‧‧Transparent substrate

31‧‧‧Resin

41‧‧‧ stage

43‧‧‧Molding

431‧‧‧ pattern

45‧‧‧Light source

50‧‧‧Transparent substrate

51‧‧‧ channel

53‧‧‧ positive

55‧‧‧Electrical path

57‧‧‧Back

60‧‧‧Materials

61‧‧‧ Coating equipment

70‧‧‧Exposure equipment

71‧‧‧Exposure light

80‧‧‧Transparent substrate

80a‧‧‧ positive

80b‧‧‧back

81‧‧‧First channel

83‧‧‧Second channel

85‧‧‧First conductive path

87‧‧‧Second conductive path

Fig. 1 is a schematic view showing the structure of a conductive substrate according to a first preferred embodiment of the present invention.

Fig. 2 is a cross-sectional view taken along line 2-2 of Fig. 1.

3 to 5 are schematic views showing a method of manufacturing a transparent substrate of the conductive substrate of the present invention.

Figure 6 is a schematic view of the transparent substrate coating material in Figure 5.

Figure 7 is a schematic view of the scraping of excess material on a transparent substrate in Figure 6.

Figure 8 is a schematic illustration of the full exposure of the front side and material of the transparent substrate of Figure 7.

Figure 9 is a schematic view showing the fabrication of a conductive substrate by the manufacturing method of the present invention.

Fig. 10 is a schematic view showing the overall exposure of the back surface of the transparent substrate in Fig. 7.

Figure 11 is a schematic view showing the structure of a conductive substrate of a second preferred embodiment of the present invention.

Hereinafter, the effects of the structure of the conductive substrate of the present invention and the method of manufacturing the same will be described with reference to the preferred embodiments of the drawings. However, the structure, size, and appearance of the conductive substrate in each of the drawings are merely illustrative of the technical features of the present invention, and are not intended to limit the present invention.

As shown in FIGS. 1 and 2, the conductive substrate 10 of the first preferred embodiment of the present invention is used for touch sensing of a touch device, and the conductive substrate 10 may be a flexible and inflexible structure. The conductive substrate 10 includes a transparent substrate 11 and a plurality of conductive paths 13 . The material of the transparent substrate 11 may be a transparent material such as glass, acryl, photocurable resin or thermosetting resin or a transparent film.

The conductive paths 13 are formed on the transparent substrate 11.

The transparent substrate 11 has a front surface 111, a back surface 113, and a plurality of channels 115. Each of the channels 115 is recessed from the front surface 111 of the transparent substrate 11 toward the back surface 113. The channel 115 does not penetrate the front surface 111 and the back surface 113 of the transparent substrate 11. The conductive circuits The diameters 13 are located in the channels 111, respectively, and are in contact with the groove walls of the channels 111, that is, in combination with the transparent substrate 11. The plurality of blank regions 15 are respectively disposed between the conductive paths 13 , and the blank regions 15 are the front surfaces 111 of the transparent substrate 10 .

In order to make it difficult for the human eye to recognize the conductive path 13 of the conductive substrate 10, the conductive path 13 may be selected to be blackened (as shown in FIG. 2), and thus, the conductive path 13 is blackened as described above. Therefore, when visible light illuminates the blackened surface, the visible light does not reflect, so that the human eye cannot easily recognize the conductive path 13 of the conductive substrate 10 from the screen appearance of the touch device.

Next, a method of manufacturing the conductive substrate of the present invention will be described. The manufacturing method includes the following steps. First, as shown in FIG. 3, a transparent substrate 30 is provided, which is placed on a stage 41 of an imprint apparatus, and a resin is coated on the transparent substrate 30. 31, such as a photocurable resin. The stamping apparatus further has a stamper 43 having a pattern 431. Then, the resin 31 is pressed by the stamper 43, as shown in Fig. 4, and then the light is generated by the light source 45 to cure the resin 31 to form a pattern corresponding to the stamper on the transparent substrate 30. Thus, the transparent of the present invention The substrate 50 is formed as shown in Fig. 5, and the pattern of the transparent substrate 50 is composed of the grooves 51. In this embodiment, the photocurable resin is also transparent after being cured.

Although in this embodiment, the manner in which the channels 51 are formed is formed by compression molding, in practice, the channels 51 can also be formed by etching or transfer, and thus, not by compression molding. Limited. Further, the resin 31 may also be a thermosetting resin, and therefore it is not limited to the photocurable resin.

Next, as shown in FIG. 6, the channel 51 of the transparent substrate 50 is filled with a material 60 which is bonded to the transparent substrate 50. Among them, the material 60 is a composite material of photosensitive and conductive materials, for example, a composite material in which silver halide (for example, silver bromide particles, silver chlorobromide particles, silver iodide particles, and the like) and a transparent glue liquid (for example, a photocurable resin) are mixed.

The material 60 is preferably applied to the front surface 53 of the transparent substrate 50 and the channel 51 by coating, that is, the material 60 can be applied to the front surface 53 of the transparent substrate 50 by the coating device 61. Thus the material 60 will naturally flow into the channel 51, Next, as shown in FIG. 7, the material 60 of the front side 53 of the transparent substrate 50 is removed, leaving only the material 60 located within the channel 51. The method of removal is optional, but not limited by scraping.

Finally, as shown in FIG. 8, the transparent substrate 50 and the material 60 are fully exposed by an exposure device 70, and the material 60 in the channels 51 is converted into a conductive path 55, as shown in FIG. And the material 60 will change from transparent to black, that is, the color of the conductive path 55 is black. In this embodiment, since the exposure apparatus 70 is exposed to the front surface 53 of the transparent substrate 50, silver bromide is taken as an example, and the bromide ions of the material 70 irradiated by the exposure light 71 are oxidized and The oxidized electrons are transferred to the silver ions, and the silver ions are reduced to opaque silver atoms, which are then treated by the developer to cause the silver atoms to be reduced to metallic silver, as shown in FIG. At this time, the color of the metallic silver is black, that is, the conductive path 55 has become black.

Then, it is treated by a fixing solution to remove excess silver halide. However, in this embodiment, since the conductive path 55 is generally not excessively silver halide after the developer treatment in the present invention, the procedure of the fixing solution processing can be omitted. Among them, the developer and the fixing solution may be alkaline or acidic liquids.

In addition, as shown in Figure 10. The exposure apparatus 70 can also perform full exposure of the back surface 57 of the transparent substrate 50. Since the transparent substrate 50 is transparent, the exposure light 71 can penetrate the transparent substrate 50 to expose the material 60, and thus The exposed material 60 undergoes the aforementioned conversion to change the color of the converted conductive path 55 to black metallic silver.

As shown in Fig. 11, the present invention has a manufacturing method of a second preferred embodiment in addition to the manufacturing method of the first preferred embodiment described above. The manufacturing method of the second preferred embodiment is substantially the same as that of the first preferred embodiment. The main difference is that in the second preferred embodiment, the manufacturing method is to apply resin to both sides of the transparent substrate, and then apply pressure. The printing apparatus is separately processed so that the manufactured transparent substrate 80 has a plurality of first channels 81 and a plurality of second channels 83, and the first channels 81 are recessed from the front surface 80a of the transparent substrate 80 toward the back surface 80b. The second channel 83 is recessed from the back surface 80b of the transparent substrate 80 in the direction of the front surface 80a. Then, the first channel 81 and the second channel 83 are filled with materials, respectively. The material in the first and second channels 81, 83 is converted into first and second conductive paths 85, 87 by full exposure of the material by exposure apparatus and by developer treatment. As such, the colors of the first and second conductive paths 85, 87 are also black. As such, the conductive substrate of the present invention can have conductive paths of X and Y axes (ie, the first conductive path 85 and the second conductive path 87) and has low visibility characteristics.

Although the first and second channels 81, 83 of the transparent substrate 80 in FIG. 11 are symmetrical, in practice, the first and second channels 81, 83 may also be asymmetrical, so that the transparent base The arrangement of the first and second channels 81, 83 of the material 80 is not limited to the pair.

Since the transparent substrate has a channel arrangement, the method for manufacturing the conductive substrate of the touch device of the present invention does not require a photomask when performing an exposure operation, and a full exposure method can be used, thus, in the process. It can reduce the cost of the mask. Further, when the conductive pattern of the conductive substrate is to be changed, it is only necessary to change the design of the channel of the transparent substrate without changing the design of the corresponding mask.

Finally, it is emphasized that the structures disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention. Other equivalent materials, structural alternatives or variations should also be claimed. Covered.

10‧‧‧Electrical substrate

11‧‧‧Transparent substrate

111‧‧‧ positive

113‧‧‧Back

115‧‧‧ channel

13‧‧‧ conductive path

15‧‧‧Blank area

Claims (7)

A method for manufacturing a conductive substrate of a touch device includes the steps of: providing a transparent substrate having a front surface, a back surface, and a plurality of first channels, each of the first channels being oriented from a front surface of the transparent substrate Recessed in the back direction; filling the first channel of the transparent substrate with a material bonded to the transparent substrate and being a photosensitive and electrically conductive composite material; and exposing the transparent substrate and the material to full exposure, The materials in the first channels are respectively converted into a first conductive path, and the colors of the first conductive paths are black. The method of manufacturing a conductive substrate of a touch device according to claim 1, wherein the front surface of the transparent substrate is exposed by an exposure device. The method of manufacturing a conductive substrate of a touch device according to claim 1, wherein the back surface of the transparent substrate is exposed by an exposure device. The method of manufacturing a conductive substrate of a touch device according to claim 1, wherein the material is coated on a front surface of the transparent substrate and the first channel, and then the transparent substrate is removed. Positive material. The method for manufacturing a conductive substrate of a touch device according to claim 1, wherein the materials in the first channels are respectively converted into the first conductive paths by a developing solution. The method of manufacturing a conductive substrate of a touch device according to claim 1, wherein the transparent substrate further includes a plurality of second channels, each of the second channels being oriented from a back surface of the transparent substrate The manufacturing method further includes filling the second channel of the transparent substrate with the material, and performing comprehensive exposure on the transparent substrate and the material, so that the materials in the second channels are respectively Turning into a second conductive path, and the colors of the second conductive paths are black. The method of manufacturing a conductive substrate of a touch device according to claim 6, wherein The materials in the first channel and the second channels are respectively converted into the first conductive path and the second conductive path are processed by a developing solution.