WO2014076798A1

WO2014076798A1 - Method for forming transparent conductive pattern, method for fabricating touch panel, and conductive transfer film

Info

Publication number: WO2014076798A1
Application number: PCT/JP2012/079662
Authority: WO
Inventors: 岩田　英樹; 秋枝　真一郎; 武井　文雄
Original assignee: 富士通コンポーネント株式会社; 富士通株式会社
Priority date: 2012-11-15
Filing date: 2012-11-15
Publication date: 2014-05-22
Also published as: TW201419108A; TWI496063B

Abstract

The problems of the prior art are solved by providing a method for forming a transparent conductive pattern, the method being characterized by having: a step for affixing a film comprising a sequentially layered resist layer sensitized by exposure and conductive layer formed from a transparent conductive material to the surface of a substrate such that the resist layer is on the substrate side; a step for exposing the substrate having the affixed film comprising the sequentially layered resist layer and conductive layer via a photomask; a step for affixing an adhesive film on top of the conductive layer following the exposure; and a step for removing the conductive layer and the resist layer, together with the adhesive film, in the areas blocked by the photomask by peeling off the adhesive film to form a transparent conductive pattern resulting from the remaining conductive film.

Description

Transparent conductive pattern forming method, touch panel manufacturing method, and conductive transfer film

The present invention relates to a transparent conductive pattern forming method, a touch panel manufacturing method, and a conductive transfer film.

A touch panel is an input device that allows direct input to the display, and is often used by installing it on the front of the display. It can be directly input based on information visually captured by the display. Are used in various applications.

As such a touch panel, a resistance film method and a capacitance method are widely known. The resistive film type touch panel is installed so that each transparent conductive film is opposed to each other in the upper electrode substrate and the lower electrode substrate on which the transparent conductive film is formed, and each of the upper electrode substrates is applied with a force. The transparent conductive films are in contact with each other, and the position where the force is applied can be detected.

Also, the electrostatic capacity method detects the position by detecting a change in the electrostatic capacity of the transparent electrode of the touch panel when a finger or the like approaches the touch panel.

By the way, since a touch panel is generally installed on a display device such as a liquid crystal display, a high light transmittance is required. Therefore, a transparent conductive material such as ITO (IndiumInTin Oxide) is required. A membrane is used. In addition, in a capacitive touch panel or the like, it is necessary to form a transparent conductive film pattern having a predetermined shape.

As a general method for forming a transparent conductive film pattern, a method of applying a photoresist will be described with reference to FIG.

First, as shown in FIG. 1A, a transparent conductive film 911 is formed on the surface of a transparent substrate 910 such as glass or a transparent film by sputtering, vacuum evaporation, or the like. A transparent substrate with a transparent conductive film in which a transparent conductive film 911 is formed on the surface of the transparent substrate 910 in advance may be prepared.

Next, as shown in FIG. 1B, a photoresist 920 is applied on the surface on which the transparent conductive film 911 is formed.

Next, as shown in FIG. 1C, exposure is performed by irradiating with ultraviolet light by an exposure apparatus using a photomask 921 having an opening 921a in an exposed region.

Next, as shown in FIG. 1D, development is performed to form a resist pattern 920a. Specifically, after the exposure by the exposure apparatus, the resist pattern 920a is formed by immersing in a developer and developing (first wet process), and then rinsing with pure water and drying. To do.

Next, as shown in FIG. 1E, the transparent conductive film 911 in the region where the resist pattern 920a is not formed is removed by wet etching. Specifically, after forming the resist pattern 920a on the transparent conductive film 911, the transparent conductive film 911 in the region where the resist pattern 920a is not formed is removed by wet etching using an acid such as ferric chloride. (Second wet process) Rinse with pure water and dry. As a result, a transparent conductive film pattern 911a is formed.

Next, as shown in FIG. 1F, the resist pattern 920a is removed with an organic solvent or the like (third wet process).

Further, a method using a film resist as a method for forming another transparent conductive film pattern will be described with reference to FIG.

First, as shown in FIG. 2A, a transparent conductive film 911 is first formed on the surface of a transparent substrate 910 such as glass or a transparent film by sputtering, vacuum deposition, or the like. A transparent substrate with a transparent conductive film in which a transparent conductive film 911 is formed on the surface of the transparent substrate 910 in advance may be prepared.

Next, as shown in FIG. 2B, a film resist 930 is attached on the surface on which the transparent conductive film 911 is formed.

Next, as shown in FIG. 2C, exposure is performed by irradiating ultraviolet light with an exposure apparatus using a photomask 921 having an opening 921a in an exposed area.

Next, as shown in FIG. 2D, development is performed to form a resist pattern 930a. Specifically, after performing exposure by an exposure apparatus, the resist pattern 930a is formed by immersing in a developer and developing (first wet process), rinsing with pure water, and drying.

Next, as shown in FIG. 2E, the transparent conductive film 911 in the region where the resist pattern 930a is not formed is removed by wet etching. Specifically, after forming the resist pattern 930a on the transparent conductive film 911, the transparent conductive film 911 in the region where the resist pattern 930a is not formed is removed by wet etching using an acid such as ferric chloride. (Second wet process) Rinse with pure water and dry. As a result, a transparent conductive film pattern 911a is formed.

Next, as shown in FIG. 2F, the resist pattern 930a is removed with an organic solvent or the like (third wet process).

Japanese Patent Laid-Open No. 10-148950 JP-A-6-67428 Japanese Patent Laid-Open No. 2001-133990 JP 2003-15286 A JP 2010-146283 A

By the way, in the method shown in FIG. 1 and the method shown in FIG. 2, in order to form the transparent conductive film pattern 911a, it is necessary to perform three wet processes, the process is complicated, and time is required. It was a factor of cost increase. In addition, since such a wet process is performed using a liquid such as an acid, an alkali, or an organic solvent, considerable equipment is required. In particular, when the transparent substrate 910 is a large substrate, the equipment is installed. The increase in size cannot be avoided. Further, in the processes such as wet etching and development, particularly when the transparent substrate 910 is a large substrate, etching unevenness and development unevenness are likely to occur, resulting in a decrease in yield.

The present invention has been made in view of the above, and a transparent conductive pattern forming method, a touch panel manufacturing method, and a conductive transfer film, which can easily form a transparent conductive film pattern of a desired shape at low cost. Is intended to provide.

According to one aspect of the present embodiment, a film in which a resist layer that is exposed to light on a surface of a substrate and a conductive layer formed of a transparent conductive material are sequentially laminated on the surface of the substrate is formed on the substrate side. And a step of exposing a substrate on which a film in which the resist layer and the conductive layer are sequentially laminated is exposed through a photomask, and after the exposure, on the conductive layer. The step of attaching an adhesive film and the adhesive film are removed together with the adhesive film by removing the resist layer and the conductive layer in the region shielded by the photomask by peeling off the adhesive film. And a step of forming a transparent conductive pattern with a film.

Further, according to another aspect of the present embodiment, a film in which a resist layer that is exposed by exposure, a conductive layer formed of a transparent conductive material, and a separator film are sequentially laminated on the surface of the substrate. A step of attaching the resist layer so as to be on the substrate side, a step of exposing a substrate on which a film in which the resist layer, the conductive layer, and the separator film are sequentially laminated is attached via a photomask; And removing the resist layer and the conductive layer in the region shielded by the photomask together with the separator film by peeling off the separator film, and forming a transparent conductive pattern with the remaining conductive film. It is characterized by that.

Further, according to another aspect of the present embodiment, a film in which a resist layer that is exposed by exposure, a conductive layer formed of a transparent conductive material, and a separator film are sequentially laminated on the surface of the substrate. A step of attaching the resist layer to the substrate side, a step of forming a light-shielding layer that shields light on the separator film, a step of exposing from the surface on which the light-shielding layer is formed, Removing the resist layer and the conductive layer in the region where the light shielding layer is formed by peeling the separator film together with the separator film, and forming a transparent conductive pattern with the remaining conductive film. It is characterized by.

Further, according to another aspect of the present embodiment, in a film in which a resist layer that is exposed by exposure, a conductive layer formed of a transparent conductive material, and a separator film are sequentially laminated, A step of forming a light shielding layer for shielding light, and a film in which the resist layer, the conductive layer, and the separator film are sequentially laminated on the surface of the substrate so that the resist layer is on the substrate side. The step of attaching, the step of exposing from the surface on which the light shielding layer is formed, and the separator film are removed to remove the resist layer and the conductive layer in the region where the light shielding layer is formed together with the separator film And a step of forming a transparent conductive pattern with the remaining conductive film.

According to another aspect of the present embodiment, a resist layer that is exposed by exposure, a conductive layer formed of a transparent conductive material, and a separator film are sequentially laminated, and the resist layer is attached to a substrate. In the transfer type conductive film obtained, the adhesion strength between the resist layer and the substrate before exposure is lower than the adhesion strength between the separator film and the conductive layer, and the resist layer after exposure and the substrate are exposed to each other. The adhesion strength is higher than the adhesion strength between the separator film and the conductive layer.

According to the present invention, it is possible to provide a transparent conductive pattern forming method, a touch panel manufacturing method, and a conductive transfer film, which can easily form a transparent conductive film pattern of a desired shape at low cost.

Process diagram of conventional touch panel manufacturing method (1) Process diagram of conventional touch panel manufacturing method (2) Explanatory drawing of the structure of the touch panel in this Embodiment (1) Explanatory drawing of the structure of the touchscreen in this Embodiment (2) Process drawing of the manufacturing method of the touch panel in 1st Embodiment Illustration of transfer type conductive film (1) Illustration of transfer type conductive film (2) Process drawing of the manufacturing method of the touch panel in 2nd Embodiment Process drawing of the manufacturing method of the touch panel in 3rd Embodiment Explanatory drawing of the manufacturing method of the touch panel in 3rd Embodiment. Process drawing of the manufacturing method of the touch panel in 4th Embodiment Explanatory drawing of the manufacturing method of the touchscreen in 4th Embodiment.

DETAILED DESCRIPTION A mode for carrying out the present invention will be described below. In addition, about the same member etc., the same code | symbol is attached | subjected and description is abbreviate | omitted.

[First Embodiment]
(Touch panel)
A touch panel manufactured by the touch panel manufacturing method of the present embodiment will be described.

As shown in FIGS. 3 and 4, the touch panel manufactured by the touch panel manufacturing method in the present embodiment includes the first substrate 10, the second substrate 20, the first substrate 10, and the second substrate. And a double-sided tape 30 to which the substrate 20 is bonded. The first substrate 10 and the second substrate 20 are formed of glass or a transparent resin material, and are transparent substrates that transmit light.

On the surface of the first substrate 10, a diamond pattern 11 formed of a transparent conductive film and continuing in the Y-axis direction is formed, and further, a silver wiring 12 connected to the diamond pattern 11 is formed. . Further, a diamond pattern 21 formed in the X-axis direction and formed of a transparent conductive film is formed on the surface of the second substrate 20, and further, a silver wiring 22 connected to the diamond pattern 21 is formed. ing. The first substrate 10 and the second substrate 20 have the same orientation of the surface of the first substrate 10 on which the diamond pattern 11 is formed and the surface of the second substrate 20 on which the diamond pattern 21 is formed. In addition, a flexible printed circuit (FPC) 41 is connected via an anisotropic conductive film (ACF) 40. At this time, the wiring of the flexible substrate 41 and the wiring 12 formed on the first substrate 10 and the wiring formed on the second substrate 20 are electrically connected via the anisotropic conductive film 40. ing.

(Touch panel manufacturing method)
Next, the manufacturing method of the touch panel in this Embodiment is demonstrated. The touch panel manufacturing method in the present embodiment is a method of forming a transparent conductive film pattern having a desired shape. As a method for manufacturing a touch panel in the present embodiment, a case where a diamond pattern 11 made of a transparent conductive film is formed on the first substrate 10 will be described with reference to FIG. Note that the same method can be used to form the diamond pattern 21 made of a transparent conductive film on the second substrate 20.

First, as shown in FIG. 5A, a first substrate 10 which is a transparent substrate is prepared.

Next, as shown in FIG. 5B, the other separator film 114 is peeled off and pasted onto the surface of the first substrate 10 from a transfer type conductive film 110 described later. As shown in FIG. 6A, the transfer type conductive film 110 is a conductive layer 111 for forming a transparent conductive film, a resist layer 112, and one separator film provided on the conductive layer 111 side. 113 and the other separator film 114 provided on the resist layer 112, for example, is wound in a roll shape as shown in FIG. 6B. The conductive layer 111 is made of a conductive material that transmits light. Specifically, the conductive layer 111 is a material such as a metal nanowire such as a silver nanowire, a carbon nanotube, or ITO, and has a sheet resistance (surface resistivity). It is made of a material of 200Ω / □ or less. One separator film 113 and the other separator film 114 are formed of a film such as polyethylene or polyester.

In the resist layer 112, a substance having a reactive double bond of carbon in a monomer molecule such as an acrylic ester, a methacrylic ester, or an ethylenically unsaturated carboxylic acid is used as a polymerizable monomer. Specifically, styrene, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, phenoxy polyolefin acrylate, phenoxy polyolefin methacrylate, acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-acrylic. Leuoxyethyl phthalate, 2-acryloyloxyethyl-2-hydroxyethyl phthalate, 2-methacryloyloxyethyl-2-hydroxypropyl phthalate, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n- Propyl methacrylate, i-propyl acrylate, i-pro Methacrylate, n- butyl acrylate, n- butyl methacrylate, tert- butyl acrylate, tert- butyl methacrylate, 2-hydroxyethyl acrylate, and 2-hydroxyethyl methacrylate and the like. These monomers may be mixed with water-soluble polymers such as polyvinyl alcohol, polyvinyl butyral, cellulose, hydroxymethyl cellulose, cyanoethyl cellulose, cyanoethyl pullulan and the like. It can also be polymerized with polyfunctional polymerizable monomers such as pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexamethacrylate and the like. Further, as photopolymerization initiators, benzophenone compounds such as 4,4′-bis (dimethylamino) benzophenone, 4,4′-bis (diethylamino) benzophenone, 3,3′-dimethyl-4-methoxybenzophenone, It is preferable to mix azoisobisbutyronitrile, which is an azo compound. These compositions dissolve when they come into contact with a developer (alkaline aqueous solution such as an aqueous solution of sodium carbonate). However, when irradiated with UV light, the polymerizable monomer reacts to increase the molecular weight, so that the developer is cured. Has the property of not dissolving.

Specifically, after the other separator film 114 in such a conductive transfer film 110 is peeled off, the resist layer 112 is attached to the first substrate 10, and then the one separator film 113 is peeled off. A substrate in which the resist layer 112 and the conductive layer 111 in the conductive transfer film 110 are laminated in this order is attached to the surface of one substrate 10.

Next, as shown in FIG. 5C, exposure is performed by irradiating ultraviolet light (UV light) with an exposure apparatus using a photomask 121 having an opening 121a in an exposed area. As a result, the resist layer 112 in the region irradiated with ultraviolet light is exposed and cured.

Next, as shown in FIG. 5D, a film 117 having adhesiveness on the surface is pasted on the conductive layer 111.

Next, as shown in FIG. 5 (e), the film 117 having adhesiveness on the surface is peeled off. At this time, since the resist layer 112 in the region irradiated with ultraviolet light is exposed and hardened, the resist layer 112 is strongly attached to the first substrate 10, and the region where the resist layer 112 is not exposed, that is, the ultraviolet light. The resist layer 112 and the conductive layer 111 in the unirradiated region are peeled off together with the film 117.

Thereby, as shown in FIG. 5F, the hardened resist layer 112a and the conductive layer 111a on the resist layer 122a remain on the surface of the first substrate 10, and the conductive layer 111a allows the diamond pattern to be formed. 11 is formed.

As described above, the diamond pattern 21 can be formed on the second substrate 20 by the same method, and the first and

second substrates

10 and 20 are bonded together to form the present embodiment. The touch panel can be manufactured.

In addition to the conductive transfer film 110 shown in FIG. 6A, a conductive transfer film 110 having a composite layer 115 in which a conductive layer and a resist layer are integrally formed as shown in FIG. 7 may be used. Good. In this conductive transfer film 110, one separator film 113 is provided on one surface of the composite layer 115, and the other separator film 114 is provided on the other surface.

In the touch panel manufacturing method of the present embodiment, the transparent conductive film pattern such as the diamond pattern 11 on the first substrate 10 and the diamond pattern 21 on the second substrate 20 can be formed without going through a wet process. it can. Therefore, the manufacturing process can be simplified, and expensive manufacturing equipment is not required. Therefore, the transparent conductive pattern can be formed at a high yield and at a low cost, and further, a touch panel can be manufactured at a low cost and at a high yield.

[Second Embodiment]
Next, a second embodiment will be described with reference to FIG. The present embodiment is a method for forming a pattern of a transparent conductive film having a desired shape, and is a method for manufacturing a touch panel different from that of the first embodiment.

First, as shown in FIG. 8A, a first substrate 10 which is a transparent substrate is prepared.

Next, as shown in FIG. 8B, the other separator film 114 is peeled off from the transfer conductive film 110 and attached to the surface of the first substrate 10. The transfer type conductive film 110 is the same as that used in the first embodiment. Specifically, after the other separator film 114 in such a conductive transfer film 110 is peeled off, the resist layer 112 is attached to the first substrate 10. As a result, a layer in which the resist layer 112 in the conductive transfer film 110, the conductive layer 111, and one separator film 113 are laminated in this order is attached to the surface of the first substrate 10.

Next, as shown in FIG. 8C, exposure is performed by irradiating ultraviolet light (UV light) with an exposure apparatus using a photomask 121 having an opening 121a in an exposed area. As a result, the resist layer 112 in the region irradiated with ultraviolet light is exposed and cured.

Next, as shown in FIG. 8D, one separator film 113 is peeled off. At this time, since the resist layer 112 in the region irradiated with ultraviolet light is exposed and hardened, the resist layer 112 is strongly attached to the first substrate 10, and the region where the resist layer 112 is not exposed, that is, the ultraviolet light. The resist layer 112 and the conductive layer 111 in the unirradiated region are peeled off together with the one separator film 113.

As a result, as shown in FIG. 8 (f), the cured resist layer 112a and the conductive layer 111a on the resist layer 122a remain on the surface of the first substrate 10, and the conductive layer 111a causes a diamond pattern to be formed. 11 is formed.

The contents other than the above are the same as those in the first embodiment.

[Third Embodiment]
Next, a third embodiment will be described with reference to FIG. The present embodiment is a method of forming a pattern of a transparent conductive film having a desired shape, and is a touch panel manufacturing method different from the first and second embodiments.

First, as shown in FIG. 9A, a first substrate 10 which is a transparent substrate is prepared.

Next, as shown in FIG. 9B, the other separator film 114 is peeled off from the transfer conductive film 110 and attached to the surface of the first substrate 10. The transfer type conductive film 110 is the same as that used in the first embodiment. Specifically, after the other separator film 114 in such a conductive transfer film 110 is peeled off, the resist layer 112 is attached to the first substrate 10. Thereby, what laminated | stacked the resist layer 112 in the conductive transfer film 110, the conductive layer 111, and one separator film 113 in this order on the surface of the 1st board | substrate 10 can be affixed.

Next, as shown in FIG. 9 (c), a light shielding layer 130 is formed on the area on which the diamond pattern 11 is formed on one separator film 113. As shown in FIG. 10A, the light shielding layer 130 may be formed by ink jet or the like as shown in FIG. 10A. Also, as shown in FIG. 10B, the light shielding layer 130 may be formed by screen printing. 130 may be formed. The light shielding layer 130 is formed of a light shielding paint or the like that shields light, and is formed of a black material that becomes black or a metal material that reflects light.

Next, as shown in FIG. 9D, exposure is performed by irradiating with ultraviolet light (UV light) by an exposure apparatus. As a result, the resist layer 112 in the region where the light shielding layer 130 is not formed is exposed and cured.

Next, as shown in FIG. 9E, one separator film 113 is peeled off. At this time, since the resist layer 112 in the region irradiated with ultraviolet light is exposed and hardened, the resist layer 112 is strongly attached to the first substrate 10, and the region where the resist layer 112 is not exposed, that is, the ultraviolet light. The resist layer 112 and the conductive layer 111 in the unirradiated region are peeled off together with the one separator film 113.

As a result, as shown in FIG. 9F, the hardened resist layer 112a and the conductive layer 111a on the resist layer 122a remain on the surface of the first substrate 10, and the conductive layer 111a causes a diamond pattern to be formed. 11 is formed.

The contents other than the above are the same as in the second embodiment.

[Fourth Embodiment]
Next, a fourth embodiment will be described with reference to FIG. The present embodiment is a method for forming a pattern of a transparent conductive film having a desired shape, and is a method for manufacturing a touch panel different from the first to third embodiments.

First, as shown in FIG. 11A, a first substrate 10 which is a transparent substrate is prepared.

Next, as shown in FIG. 11 (b), a light shielding layer 130 is formed on one separator film 113 in the conductive transfer film 110 on the region where the diamond pattern 11 is formed. The transfer type conductive film 110 is the same as that used in the first embodiment. As shown in FIG. 10A, the light shielding layer 130 may be formed by ink jet or the like as shown in FIG. 10A. Also, as shown in FIG. 10B, the light shielding layer 130 may be formed by screen printing. 130 may be formed. FIG. 12 shows an enlarged view of the conductive transfer film 110 with the light shielding layer 130 formed on the surface in this way.

Next, as shown in FIG. 11 (c), the other separator film 114 is peeled off from the transfer conductive film 110 and attached to the surface of the first substrate 10. Specifically, after the other separator film 114 in the conductive transfer film 110 is peeled off, the resist layer 112 is attached to the first substrate 10. Thereby, what laminated | stacked the resist layer 112 in the conductive transfer film 110, the conductive layer 111, and one separator film 113 in this order on the surface of the 1st board | substrate 10 can be affixed.

Next, as shown in FIG. 11D, exposure is performed by irradiating with ultraviolet light (UV light) by an exposure apparatus. As a result, the resist layer 112 in the region where the light shielding layer 130 is not formed is exposed and cured.

Next, as shown in FIG. 11E, one separator film 113 is peeled off. At this time, since the resist layer 112 in the region irradiated with ultraviolet light is exposed and hardened, the resist layer 112 is strongly attached to the first substrate 10, and the region where the resist layer 112 is not exposed, that is, the ultraviolet light. The resist layer 112 and the conductive layer 111 in the unirradiated region are peeled off together with the one separator film 113.

As a result, as shown in FIG. 11 (f), the cured resist layer 112 a and the conductive layer 111 a on the resist layer 122 a remain on the surface of the first substrate 10. 11 is formed.

The contents other than the above are the same as those in the third embodiment.

As mentioned above, although the form which concerns on implementation of this invention was demonstrated, the said content does not limit the content of invention.

10 First substrate 11 Diamond pattern (formed by transparent conductive film)
20 Second substrate 11 Diamond pattern (formed by transparent conductive film)
30 Double-sided tape 40 Anisotropic conductive film (ACF)
41 Flexible substrate (FPC)
110 Transfer type conductive film 111 Conductive layer 112 Resist layer 113 One separator film 114 The other separator film 115 Composite layer 121 Photomask 121a Opening portion 130 Light shielding layer

Claims

A step of attaching a film in which a resist layer exposed by exposure and a conductive layer formed of a transparent conductive material are sequentially laminated on the surface of the substrate so that the resist layer is on the substrate side;
A step of exposing a substrate on which a film in which the resist layer and the conductive layer are sequentially laminated is pasted through a photomask;
After the exposure, a step of sticking an adhesive film on the conductive layer;
Removing the resist layer and the conductive layer in the region shielded by the photomask together with the adhesive film by peeling off the adhesive film, and forming a transparent conductive pattern with the remaining conductive film; ,
A method for forming a transparent conductive pattern, comprising:
Attaching a film in which a resist layer exposed by exposure, a conductive layer formed of a transparent conductive material, and a separator film are sequentially laminated on the surface of the substrate so that the resist layer is on the substrate side; ,
A step of exposing a substrate on which a film in which the resist layer, the conductive layer, and the separator film are sequentially laminated is attached via a photomask;
Removing the resist layer and the conductive layer in the region shielded by the photomask together with the separator film by peeling the separator film, and forming a transparent conductive pattern with the remaining conductive film;
A method for forming a transparent conductive pattern, comprising:
Attaching a film in which a resist layer exposed by exposure, a conductive layer formed of a transparent conductive material, and a separator film are sequentially laminated on the surface of the substrate so that the resist layer is on the substrate side; ,
Forming a light-shielding layer that shields light on the separator film;
Exposing from the surface on which the light shielding layer is formed;
Removing the resist layer and the conductive layer together with the separator film in a region where the light shielding layer is formed by peeling the separator film, and forming a transparent conductive pattern with the remaining conductive film;
A method for forming a transparent conductive pattern, comprising:
In the film in which a resist layer that is exposed by exposure, a conductive layer formed of a transparent conductive material, and a separator film are sequentially laminated, a step of forming a light shielding layer that blocks light on the separator film;
A step of attaching a film in which the resist layer, the conductive layer, and the separator film are sequentially laminated on the surface of the substrate so that the resist layer is on the substrate side;
Exposing from the surface on which the light shielding layer is formed;
Removing the resist layer and the conductive layer together with the separator film in a region where the light shielding layer is formed by peeling the separator film, and forming a transparent conductive pattern with the remaining conductive film;
A method for forming a transparent conductive pattern, comprising:
The exposure is ultraviolet light,
5. The method for forming a transparent conductive pattern according to claim 1, wherein the resist layer is made of a material that is cured by ultraviolet light.
The method for forming a transparent conductive pattern according to any one of claims 1 to 5, wherein the conductive layer is formed of any one of metal nanowires, ITO, and carbon nanotubes.
The method for forming a transparent conductive pattern according to any one of claims 1 to 6, wherein the conductive layer has a sheet resistance of 200 Ω / □ or less.
The conductive layer and the resist layer are formed of a composite layer in which a material forming the conductive layer and a material forming the resist layer are mixed. 8. The method for forming a transparent conductive pattern according to any one of 7 above.
A method for manufacturing a touch panel, comprising a step of forming a transparent conductive pattern by the method for forming a transparent conductive pattern according to claim 1.
In a transfer type conductive film in which a resist layer that is exposed by exposure, a conductive layer formed of a transparent conductive material, and a separator film are sequentially laminated, and the resist layer is attached to a substrate.
The adhesion strength between the resist layer and the substrate before exposure is lower than the adhesion strength between the separator film and the conductive layer,
A transfer-type conductive film, wherein the adhesion strength between the resist layer and the substrate after exposure is higher than the adhesion strength between the separator film and the conductive layer.