TW201419108A - Method for forming transparent conductive pattern, method for manufacturing touch panel, and conductive transfer film - Google Patents

Abstract

The present invention discloses a method for forming a transparent conductive pattern, a method for manufacturing a touch panel, and a conductive transfer film. A film that is formed by sequentially laminating an electrical resistance layer that is sensitized by exposure and a conductive layer made of a transparent conductive material is adhered to a surface of a substrate in such a way that the electrical resistance layer is located at one side of the substrate. A photo mask is used to expose the substrate to which the film that is formed by sequentially laminating the electrical resistance layer and the conductive layer is adhered. After the exposure, an adhesive film is attached to the conductive layer. By peeling off the adhesive layer, the electrical resistance layer and the conductive layer in an area blocked by the photo mask are removed together with the adhesive film so that a transparent conductive pattern resulting from the remaining conductive film is formed.

Description

Method for forming transparent conductive pattern, method for manufacturing touch panel, and conductive transfer film

The present invention relates to a method of forming a transparent conductive pattern, a method of manufacturing a touch panel, and an electrically conductive transfer film.

The touch screen is an input device that can directly input to the display, and is generally disposed in front of the display for use. It can be directly input by using visual information obtained by the display, and is used for various purposes.

As such a touch panel, there are well-known resistive and capacitive types. The resistive touch panel is configured such that the upper conductive substrate and the lower electrode substrate are formed such that the transparent conductive films are disposed to face each other, and the transparent conductive films are brought into contact with each other by applying a force at a point of the upper electrode substrate. Position detection of the position where the force is applied can be performed.

Moreover, the capacitive type detects the change in the electrostatic capacitance of the transparent electrode of the touch screen by a finger approaching the touch screen to perform position detection.

However, in general, a touch panel is provided on a display device such as a liquid crystal display, and thus a high light transmittance is required. Therefore, a transparent conductive film such as ITO (Indium Tin Oxide) is widely used. Further, in a capacitive touch panel or the like, it is necessary to form a pattern of a transparent conductive film having a predetermined shape.

As a method of forming a pattern of a usual transparent conductive film, a method of coating will be described with reference to Fig. 1 .

First, as shown in FIG. 1(a), on a transparent substrate 910 such as glass or transparent film. A transparent conductive film 911 is formed on the surface by sputtering, vacuum evaporation, or the like. Further, a transparent substrate with a transparent conductive film in which the transparent conductive film 911 is formed on the surface of the transparent substrate 910 may be prepared in advance.

Then, as shown in FIG. 1(b), a photoresist 920 is applied on the surface on which the transparent conductive film 911 is formed.

Then, as shown in Fig. 1(c), a photomask 921 having an opening portion 921a is used in the exposure region, and ultraviolet light is irradiated by the exposure device to perform exposure.

Then, as shown in Fig. 1(d), the resistance pattern 920a is formed by performing development. Specifically, after exposure by the exposure apparatus, development is performed by immersing the developer (first wet process), and then rinsing with pure water and drying to form a resistance pattern 920a.

Then, as shown in Fig. 1(e), the transparent conductive film 911 in the region where the resistance pattern 920a is not formed is removed by wet etching. Specifically, after the resistance pattern 920a is formed on the transparent conductive film 911, the transparent conductive film 911 which does not form the region of the resistance pattern 920a is removed by wet etching using an acid such as ferric chloride (second Wet process), rinse with pure water and let it dry. According to this, the pattern 911a of the transparent conductive film is formed.

Then, as shown in Fig. 1 (f), the electric resistance pattern 920a (third wet process) is removed by an organic solvent or the like.

Moreover, as a method of forming a pattern of another transparent conductive film, a method of using a film resistor will be described based on FIG. 2 .

First, as shown in FIG. 2(a), first, a transparent conductive film 911 is formed on the surface of a transparent substrate 910 such as glass or a transparent film by sputtering or vacuum evaporation. Further, a transparent substrate with a transparent conductive film in which the transparent conductive film 911 is formed on the surface of the transparent substrate 910 in advance may be prepared.

Then, as shown in Fig. 2(b), a film resistor 930 is adhered to the surface on which the transparent conductive film 911 is formed.

Then, as shown in FIG. 2(c), the photomask 921 having the opening portion 921a is used in the exposed region, and the exposure is performed by irradiating ultraviolet light with an exposure device.

Then, as shown in Fig. 2(d), the resist pattern 930a is formed by performing development. Specifically, after exposure by an exposure apparatus, it is immersed in a developing solution for development (first wet process), rinsed with pure water, and dried to form a resistance pattern 930a.

Then, as shown in Fig. 2(e), the transparent conductive film 911 in the region where the resistance pattern 930a is not formed is removed by wet etching. Specifically, after the resistance pattern 930a is formed on the transparent conductive film 911, the transparent conductive film 911 in the region where the resistance pattern 930a is not formed is removed by wet etching using an acid such as ferric chloride (second time) Wet process), rinse with pure water and let it dry. According to this, the pattern 911a of the transparent conductive film is formed.

Then, as shown in Fig. 2(f), the resistance pattern 930a is removed by an organic solvent or the like (third wet process).

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Publication No. Hei 10-148950

Patent Document 2: Japanese Laid-Open Patent Publication No. Hei 6-67428

Patent Document 3: JP-A-2001-133992

Patent Document 4: JP-A-2003-15286

Patent Document 5: JP-A-2010-146283

However, in the method shown in FIG. 1 and the method shown in FIG. 2, in order to form the pattern 911a of the transparent conductive film, it is necessary to perform the wet process three times, which is complicated and time consuming, and therefore causes a cost increase. Further, since such a wet process is carried out using a liquid such as an acid, an alkali or an organic solvent, a considerable amount of equipment is required. In particular, when the transparent substrate 910 is a large substrate, the size of the device is inevitably increased. Also, in wet etching or In the process of development or the like, in particular, when the transparent substrate 910 is a large substrate, uneven etching or development unevenness is likely to occur, resulting in a low yield.

The present invention has been made to solve the above problems, and an object of the invention is to provide a method for forming a transparent conductive pattern which is easy to form a pattern of a transparent conductive film having a desired shape, a method for producing a touch panel, and a conductive transfer film.

According to an aspect of the present invention, a film laminated in this order by a resistive layer which is photosensitive by exposure and a conductive layer formed of a transparent conductive material is adhered to the substrate in such a manner that the resistive layer is located on one side of the substrate. Forming a substrate with a film formed by laminating the resistive layer and the conductive layer in sequence by a photomask; after the exposing, attaching an adhesive film to the conductive layer; An adhesive film, together with the adhesive film, removes the resistive layer and the conductive layer in a region shielded by the photomask, and a transparent conductive pattern is formed by the remaining conductive film.

Further, according to another aspect of an aspect of the present invention, a resistive layer which is photosensitive by exposure, a conductive layer formed of a transparent conductive material, and a separation film are sequentially laminated to form the resistive layer on the substrate. Adhesively adhering to the surface of the substrate; exposing the substrate to which the film of the resistive layer, the conductive layer and the separation film are sequentially laminated by a photomask; by peeling off the separation film, The separation film together removes the resistance layer and the conductive layer in a region shielded by the reticle, and a transparent conductive pattern is formed from the remaining conductive film.

Further, according to another aspect of the present embodiment, a resistive layer which is photosensitive by exposure, a conductive layer formed of a transparent conductive material, and a separation film are sequentially laminated so that the resistive layer is on the substrate 1. Adhering to the surface of the substrate; forming a light-shielding layer on the separation film; exposing from the surface formed by the light-shielding layer; removing the separation film and removing the light-shielding layer together with the separation film The resistive layer and the conductive layer in the region form a transparent conductive pattern from the remaining conductive film.

Moreover, according to another aspect of the embodiment, the resistor is exposed by exposure a layer, a conductive layer formed of a transparent conductive material, and a film in which the separation film is laminated in this order, a light-shielding light-shielding layer is formed on the separation film; the resistive layer, the conductive layer, and the separation film are sequentially arranged Laminating the film so that the resistive layer is adhered to the surface of the substrate on the side of the substrate; exposing from the surface formed by the light shielding layer; removing the separation film and removing the separation film together with the separation film The resistive layer and the conductive layer in the region of the light shielding layer form a transparent conductive pattern from the remaining conductive film.

Further, according to another aspect of the present embodiment, a resistive layer which is photosensitive by exposure, a conductive layer formed of a transparent conductive material, and a separation film are sequentially laminated, and the resistive layer is adhered to the conductive type on the substrate. In the transfer film, the bonding strength between the resistive layer and the substrate before exposure is lower than the bonding strength between the separation film and the conductive layer, and the bonding strength between the resistive layer and the substrate after exposure is greater than the separation film The bonding strength with the conductive layer is high.

According to the present invention, it is possible to provide a method of forming a transparent conductive pattern, a method of manufacturing a touch panel, and a conductive transfer film which are easy and low-cost to form a pattern of a transparent conductive film of a desired shape.

10‧‧‧First substrate

11‧‧‧Rhombus pattern (formed by a transparent conductive film)

20‧‧‧second substrate

30‧‧‧Double-sided tape

40‧‧‧ Anisotropic Conductive Film (ACF)

41‧‧‧Flexible Substrate (FPC)

110‧‧‧Conductive transfer film

111‧‧‧ Conductive layer

111a‧‧‧ Conductive layer

112‧‧‧resistance layer

112a‧‧‧resistance layer

113‧‧‧one separation membrane

114‧‧‧The other side of the separation membrane

115‧‧‧Composite layer

117‧‧‧film

121‧‧‧Photomask

121a‧‧‧ openings

130‧‧‧Lighting layer

1(a)-(f) are process diagrams illustrating the manufacturing method of the prior touch panel (1)

2(a)-(f) are process diagrams illustrating the manufacturing method of the prior touch panel (2)

3 is an explanatory diagram of the structure of the touch screen of the embodiment (1)

4 is an explanatory diagram of the structure of the touch screen of the embodiment (2)

5(a)-(f) are process diagrams illustrating a method of manufacturing a touch panel of the first embodiment.

Fig. 6 (a) and (b) are explanatory diagrams of the conductive type transfer film (1)

Figure 7 is an explanatory diagram of a conductive type transfer film (2)

8(a)-(e) are process diagrams illustrating a method of manufacturing a touch panel of a second embodiment;

9(a)-(f) are process diagrams illustrating a method of manufacturing a touch panel of a third embodiment.

10(a) and 10(b) are explanatory diagrams showing a method of manufacturing a touch panel according to a third embodiment.

11(a)-(f) are process diagrams illustrating a method of manufacturing a touch panel of a fourth embodiment.

Figure 12 is an explanatory view showing a method of manufacturing the touch panel of the fourth embodiment

Then, the aspect in which the present invention is carried out will be described. The same components are denoted by the same reference numerals, and their description will be omitted.

[First embodiment]

(touch screen)

Next, a touch panel manufactured according to the method of manufacturing a touch panel of the present embodiment will be described.

As shown in FIG. 3 and FIG. 4, the touch panel manufactured by the method for manufacturing a touch panel according to the present embodiment has a first substrate 10, a second substrate 20, and a double-sided tape 30 that bonds the first substrate 10 and the second substrate 20. . The first substrate 10 and the second substrate 20 are made of glass or a transparent resin material, and are transparent substrates that transmit light.

On the surface of the first substrate 10, a diamond pattern 11 formed by a transparent conductive film and connected in a Y-axis direction, and a silver wiring 12 connected to the diamond pattern 11 are formed. Further, on the surface of the second substrate 20, a diamond pattern 21 continuous in the X-axis direction formed of a transparent conductive film, and a silver wiring 22 connected to the diamond pattern 21 are formed. The faces of the first substrate 10 and the second substrate 20 and the diamond-shaped pattern 11 on which the first substrate 10 is formed and the surface of the diamond-shaped pattern 21 on which the second substrate 20 is formed are oriented in the same direction, and are bonded by the double-sided tape 30, and by each The anisotropic conductive film (ACF: 40) is connected to a flexible printed circuit (FPC) 41. At this time, the wiring of the flexible substrate 41 and the wiring 12 formed on the first substrate 10 and the wiring formed on the second substrate 20 are electrically connected by the anisotropic conductive film 40.

(Manufacturing method of touch screen)

Next, a method of manufacturing the touch panel of the present embodiment will be described. This embodiment A method of manufacturing a touch panel is a method of forming a pattern of a transparent conductive film of a desired shape. As a method of manufacturing the touch panel of the present embodiment, a case where the diamond pattern 11 made of a transparent conductive film is formed on the first substrate 10 will be described with reference to FIG. Further, the case where the diamond pattern 21 made of a transparent conductive film is formed on the second substrate 20 can also be produced by the same method.

First, as shown in FIG. 5(a), the first substrate 10 of the transparent substrate is prepared.

Then, as shown in FIG. 5(b), the other separation film 114 is peeled off from the transfer-type conductive film 110 to be described later, and is adhered to the surface of the first substrate 10. As shown in FIG. 6(a), the transfer-type conductive film 110 has a conductive layer 111 for forming a transparent conductive film, a resistance layer 112, a separation film 113 provided on one side of the conductive layer 111, and a resistor. The other separation membrane 114 of the layer 112 is wound into a roll shape, for example, as shown in Fig. 6(b). The conductive layer 111 is made of a light-transmitting conductive material, specifically, a metal nanowire such as a silver nanowire, a carbon nanotube, an ITO, or the like, and has a sheet resistance (surface resistivity) of 200 Ω/□ or less. Material formation. The one separation membrane 113 and the other separation membrane 114 are formed of a film of polyethylene or polyester fiber.

As the polymerizable monomer, the resistive layer 112 can be a compound having a carbon double bond reaction in a monomer molecule such as an acrylate, a methacrylate or an ethylenically unsaturated carboxylic acid. Specifically, styrene, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, iron hydroxyethyl acrylate, methyl methacrylate, phenoxy acrylate Polyolefin, phenoxy polyolefin methyl acrylate, acrylate, phenoxypropylopenoate-2-hydroxy-3-, 2 propylene methoxyethyl phthalate, 2-propene Ethoxyethyl 2-hydroxyethyl ester, 2-methylpropenyloxyethyl-2-hydroxypropyl phthalate, methyl phthalate, methyl methacrylate, acrylic acid B Ester acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate i-propyl acrylate, methyl methacrylate I-propyl methacrylate, n-butyl acrylate, butyl methacrylate Ester, tert-butyl acrylate, tert-butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, and the like. Alternatively, these monomers may be mixed with water-soluble polymers such as Bollywood vinyl alcohol, polyvinyl butyral, cellulose, hydroxymethyl cellulose, cyanoethyl cellulose, and cyanoethyl amylopectin. . Further, the multifunctional monomer is polymerized, for example, with pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate or the like. As a photopolymerization initiator, a benzophenone compound such as 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 3,3' is mixed. - dimethyl-4-methoxybenzophenone, azobisisobutyronitrile as an azo compound, or the like is preferred. The characteristics of these compositions are such that they are dissolved by contact with a developing solution (such as an alkaline aqueous solution such as a sodium carbonate solution), and when a UV light is irradiated, a polymerizable monomer or the like is reacted, polymerized and hardened, and dissolved in a developing solution.

Specifically, after the other separation film 114 of the conductive transfer film 110 is peeled off, the resistive layer 112 is adhered to the first substrate 10, and then the conductive film is transferred by peeling off one of the separation films 113. The resistive layer 112 and the conductive layer 111 of the printing film 110 are adhered to the surface of the first substrate 10 in a state of being laminated in this order.

Then, as shown in FIG. 5(c), the photomask 121 having the opening 121a in the exposed region is exposed to ultraviolet light (UV light) by an exposure device. Thereby, the resistance layer 112 of the region irradiated with the ultraviolet light is photosensitive and hardened.

Then, as shown in FIG. 5(d), a film 117 having an adhesive surface on the conductive layer 111 is adhered.

Then, as shown in Fig. 5(e), the peeling surface has an adhesive film 117. At this time, since the resistive layer 112 of the region irradiated with the ultraviolet light is photosensitive and hardened, it is firmly adhered to the first substrate 10, and the resistive layer 112 has no photosensitive region, that is, the resistive layer 112 and the conductive region of the region not irradiated with ultraviolet light. Layer 111 is peeled off together with film 117.

Accordingly, as shown in FIG. 5(f), a hardened resistive layer 112a and a conductive layer 111a over the resistive layer 122a are left on the surface of the first substrate 10, and the conductive layer 111a is used to form a diamond. Shape pattern 11.

Further, as described above, the diamond pattern 21 can be formed by the same method for the second substrate 20, and the touch panel of this embodiment can be produced by bonding the first substrate 10 and the second substrate 20.

Further, in addition to the structure shown in FIG. 6(a), the conductive type transfer film 110 may have a structure in which an integrated layer 115 having an integral layer such as a conductive layer and a resistance layer is used as shown in FIG. In the conductive type transfer film 110, one of the separation films 113 is provided on one surface of the composite layer 115, and the other separation film 114 is provided on the other surface.

In the method of manufacturing the touch panel of the present embodiment, the pattern of the transparent conductive film such as the diamond pattern 11 on the first substrate 10 and the diamond pattern 21 on the second substrate 20 can be formed without a wet process. Therefore, the manufacturing process can be simplified, and high-priced manufacturing equipment is not required. According to this, it is possible to produce a transparent conductive pattern at a high cost and at a low cost, and it is possible to manufacture a touch panel at low cost and high yield.

[Second embodiment]

Then, the second embodiment will be described with reference to FIG. The present embodiment is a method of forming a pattern of a transparent conductive film of a desired shape, which is a manufacturing method different from that of the first embodiment.

First, as shown in FIG. 8(a), a first substrate 10 as a transparent substrate is prepared.

Then, as shown in FIG. 8(b), the other separation film 114 is peeled off from the transfer-type conductive film 110, and is pasted on the surface of the first substrate 10. The transfer type conductive film 110 is the same as that used in the first embodiment. Specifically, after the other separation film 114 on the conductive type transfer film 110 is peeled off, the resistance layer 112 is adhered to the first substrate 10. As a result, a laminated body in which the resistive layer 112, the conductive layer 111, and the one of the separation films 113 on the conductive type transfer film 110 are laminated in this order is adhered to the surface of the first substrate 10.

Then, as shown in FIG. 8(c), the photomask 121 having the opening 121a in the exposed region is used, and exposure is performed by irradiating ultraviolet light (UV light) by the exposure device. According to this, by the ultraviolet The resistive layer 112 in the region irradiated with light is photosensitive and hardened.

Then, as shown in FIG. 8(d), one of the separation membranes 113 is peeled off. At this time, since the resistive layer 112 in the region irradiated with the ultraviolet light is hardened by light, it is firmly adhered to the first substrate 10, and the resistive layer 112 is not exposed to light, that is, the resistive layer 112 of the region not irradiated with ultraviolet light and The conductive layer 111 is peeled off together with one of the separation films 113.

Accordingly, as shown in FIG. 8(f), a hardened resistive layer 112a and a conductive layer 111a over the resistive layer 122a are left on the surface of the first substrate 10, and a diamond pattern 11 is formed by the conductive layer 111a. .

Further, the content other than the foregoing is the same as that of the first embodiment.

[Third embodiment]

Next, a third embodiment will be described based on Fig. 9 . The present embodiment is a method of forming a pattern of a transparent conductive film of a desired shape, which is a method of manufacturing a touch panel different from the first and second embodiments.

First, as shown in FIG. 9(a), a first substrate 10 as a transparent substrate is prepared.

Then, as shown in FIG. 9(b), the other separation film 114 is peeled off from the transfer-type conductive film 110 and adhered to the surface of the first substrate 10. The transfer type conductive film 110 can be the same as that used in the first embodiment. Specifically, after the other separation film 114 of the conductive type transfer film 110 is peeled off, the resistance layer 112 is adhered to the first substrate 10. As a result, a laminated body in which the resistive layer 112, the conductive layer 111, and the one of the separation films 113 on the conductive type transfer film 110 are laminated in this order can be adhered to the surface of the first substrate 10.

Then, as shown in FIG. 9(c), the light shielding layer 130 is formed on one of the separation films 113 and on the region where the diamond pattern 11 is formed. As shown in FIG. 10(a), the light shielding layer 130 may be formed by inkjet or the like, or the light shielding layer 130 may be formed by screen printing as shown in FIG. 10(b). The light shielding layer 130 is formed of a light-shielding light-shielding paint or the like, and is formed of a green material or a metal material that reflects light.

Then, as shown in FIG. 9(d), exposure is performed by irradiating ultraviolet light (UV light) by the exposure device. Light. Accordingly, the resistance layer 112 in the region where the light shielding layer 130 is not formed is photosensitive and hardened.

Then, as shown in Fig. 9(e), one of the separation membranes 113 is peeled off. At this time, since the resistive layer 112 of the region irradiated with the ultraviolet light is hardened by light, it is firmly adhered to the first substrate 10, and the resistive layer 112 has no photosensitive region, that is, the resistive region of the region not irradiated with ultraviolet light. The layer 112 and the conductive layer 111 are peeled off together with one of the separation films 113.

Accordingly, as shown in FIG. 9(f), the hardened resistive layer 112a and the conductive layer 111a on the upper surface of the resistive layer 122a are left on the surface of the first substrate 10, and the diamond pattern 11 is formed by the conductive layer 111a.

In addition, the content other than the above is the same as that of the second embodiment.

[Fourth embodiment]

Next, a fourth embodiment will be described based on Fig. 11 . The present embodiment is a method of forming a pattern of a transparent conductive film having a desired shape, and is a method of manufacturing a touch panel different from the first to third embodiments.

First, as shown in FIG. 11(a), a first substrate 10 as a transparent substrate is prepared.

Then, as shown in FIG. 11(b), a light shielding layer 130 is formed on the separation film 113 which is one of the conductive type transfer films 110, and on the region where the diamond pattern 11 is formed. Further, the conductive type transfer film 110 can be the same as the first embodiment. As shown in FIG. 10(a), the light shielding layer 130 may be formed by inkjet or the like, or the light shielding layer 130 may be formed by screen printing as shown in FIG. 10(b). Fig. 12 is an enlarged view showing the conductive type transfer film 110 in a state in which the light shielding layer 130 is formed on the surface according to this method.

Then, as shown in FIG. 11(c), the other separation film 114 is peeled off from the conductive type transfer film 110 and adhered to the surface of the first substrate 10. Specifically, after the other separation film 114 on the conductive type transfer film 110 is peeled off, the resistance layer 112 is adhered to the first substrate 10. As a result, a film formed by laminating the resistive layer 112, the conductive layer 111, and the one of the separation films 113 of the conductive transfer film 110 in this order is adhered to the surface of the first substrate 10.

Then, as shown in FIG. 11(d), ultraviolet light (UV light) is irradiated by the exposure device. exposure. Accordingly, the resistive layer 112 in the region where the light shielding layer 130 is not formed is photosensitive and hardened.

Then, as shown in Fig. 11(e), one of the separation membranes 113 is peeled off. At this time, since the resistive layer 112 in the region irradiated with the ultraviolet light is photosensitive and hardened, it is firmly adhered to the first substrate 10, and the resistive layer 112 has no photosensitive region, that is, the resistive layer 112 in the region where the ultraviolet light is not irradiated. The conductive layer 111 is peeled off together with one of the separation films 113.

Accordingly, as shown in FIG. 11(f), a hardened resistive layer 112a and a conductive layer 111a over the resistive layer 122a are left on the surface of the first substrate 10, and the conductive layer 111a forms a diamond pattern 11.

Further, the content other than the above is the same as that of the third embodiment.

The related aspects for carrying out the invention have been described above, but the foregoing does not limit the content of the invention.

10‧‧‧First substrate

11‧‧‧Rhombus pattern (formed by a transparent conductive film)

111‧‧‧ Conductive layer

111a‧‧‧ Conductive layer

112‧‧‧resistance layer

112a‧‧‧resistance layer

113‧‧‧one separation membrane

117‧‧‧film

121‧‧‧Photomask

121a‧‧‧ openings

Claims (10)

A method for forming a transparent conductive pattern, comprising: forming a film formed by sequentially laminating a resistive layer formed by exposure and a conductive layer formed of a transparent conductive material such that the resistive layer is located on one side of the substrate Adhering to the surface of the substrate; exposing a substrate to which a film of the resistive layer and the conductive layer is laminated in sequence is adhered by a photomask; after the exposing, an adhesive film is adhered to the conductive layer By peeling off the adhesive film, the resistive layer and the conductive layer in the region shielded by the mask are removed together with the adhesive film, and a transparent conductive pattern is formed from the conductive film remaining. A method for forming a transparent conductive pattern, comprising: forming a resistive layer which is photosensitive by exposure, a conductive layer formed of a transparent conductive material, and a separation film in order, so that the resistive layer is located on the substrate Adhering to the surface of the substrate on one side; exposing a substrate to which a film of the resistive layer, the conductive layer, and the separation film is laminated in order by a photomask; by peeling off the separation film, The separation film together removes the foregoing resistance layer and the aforementioned conductive layer in a region where the mask is shielded from light, and forms a transparent conductive pattern from the remaining conductive film. A method for forming a transparent conductive pattern, comprising: forming a resistive layer which is photosensitive by exposure, a conductive layer formed of a transparent conductive material, and a separation film in order, so that the resistive layer is located on the substrate Adhering to the surface of the substrate on one side; forming a light shielding layer for shielding light on the separation film; Exposing the surface formed by the light shielding layer; removing the foregoing separation film, removing the foregoing resistance layer and the conductive layer in a region where the light shielding layer is formed together with the separation film, and forming a transparent conductive pattern from the remaining conductive film . A method for forming a transparent conductive pattern, comprising: a film formed by laminating a resistive layer formed by exposure, a conductive layer formed of a transparent conductive material, and a separation film; a light-shielding layer that forms a light-shielding layer; a film formed by laminating the resistance layer, the conductive layer, and the separation film in this order so that the resistance layer is adhered to the surface of the substrate on the substrate side; The surface on which the layer is formed is exposed; by peeling off the separation film, the resistive layer and the conductive layer in the region where the light shielding layer is formed are removed together with the separation film, and a transparent conductive pattern is formed from the remaining conductive film. The method of forming a transparent conductive pattern according to any one of claims 1 to 4, wherein the exposure is ultraviolet light; and the resistance layer is formed of a material hardened by ultraviolet light. The method of forming a transparent conductive pattern according to any one of claims 1 to 5, wherein the conductive layer is formed of any one of metal nanowires, ITO, and carbon nanotubes. The method of forming a transparent conductive pattern according to any one of claims 1 to 6, wherein the conductive layer has a sheet resistance of 200 Ω/□ or less. The method of forming a transparent conductive pattern according to any one of claims 1 to 7, wherein the conductive layer and the resistive layer are formed of a composite layer in which a material forming the conductive layer and a material forming the resistive layer are mixed. A method of manufacturing a touch panel, characterized in that a transparent conductive pattern is formed by a method of forming a transparent conductive pattern according to any one of claims 1 to 8. A conductive type transfer film characterized in that a resistive layer which is photosensitive by exposure, a conductive layer formed of a transparent conductive material, and a separation film are laminated in this order, and the resistive layer is adhered to the substrate In the conductive type transfer film; the bonding strength between the resistive layer and the substrate before exposure is lower than the bonding strength between the separating film and the conductive layer; the bonding strength between the resistive layer and the substrate after exposure is higher than that described above The bonding strength between the separation film and the aforementioned conductive layer is high.