JP2012138018A - Touch panel and display device having touch panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a touch panel capable of expanding an active area and improving a yield at the time of re-adhering substrates, and a display device having the touch panel.SOLUTION: A touch panel 1 is obtained by connecting a touch panel sensor 2 with a flexible substrate 3. The touch panel sensor 2 includes: a first transparent substrate 16 having, on one face thereof, a first transparent electrode 19 with plural first sensor electrodes placed in parallel with one another at a predetermined interval and first extraction wiring 4 made of a metal material; a second transparent substrate 17 having, in a direction orthogonal to the first transparent electrode, a second transparent electrode 20 with plural second sensor electrodes placed in parallel with one another at a predetermined interval and plural second extraction wiring pieces 6 made of a metal material and a resin material; and an adhesion layer 18 adhering the first transparent substrate and the second transparent substrate. One face of the second transparent substrate 17 faces a face of the first transparent substrate 16 with the first transparent electrode 19 and the first extraction wiring 4 placed thereon, and the second transparent substrate 17 is laminated on the first transparent substrate 16 through the adhesion layer 18.

Description

  The present invention relates to a touch panel and a display device including the touch panel.

  In recent years, a touch panel has attracted attention as an input device that combines a display device and a coordinate detection device. Touch panels are often used for electronic devices that need to input more information in a limited space, such as mobile phones, portable music players, portable game machines, vending machines, ATMs, etc. By pressing the screen of these electronic devices with a finger or a pen, the electronic device can be operated and information can be input interactively with respect to the electronic device.

  The touch panel is classified into a resistance film method, a capacitance method, an infrared method, an ultrasonic method, an electromagnetic inductive coupling method, and the like according to an operation principle. Advantages and disadvantages of each type of touch panel, and use of the touch panel It is properly used according to the purpose. In recent years, among these methods, the capacitive touch panel is particularly advantageous because of its high transmittance and durability compared to other methods, and the ability to detect multiple points and perform complex operations. Attention has been paid.

  The capacitive touch panel includes a touch panel sensor that generates a detection signal by detecting a position touched by an external conductor based on a change in capacitance that occurs when an operator touches the external conductor such as a fingertip or a pen, and the touch panel. And a flexible substrate for outputting a detection signal generated by the sensor to an external circuit.

  The touch panel sensor is generally composed of a transparent base film and various electrodes provided on the surface of the base film. For example, Patent Document 1 discloses a capacitive touch panel including a touch panel sensor in which a transparent conductive film, a conductive film pattern layer, and a dielectric layer are stacked on a base film.

  The touch panel sensor has an active area that can be visually recognized by an operator and can be touched by an external conductor, and a frame area formed around the active area. In the active area, a first transparent electrode composed of a plurality of first sensor electrodes arranged in parallel at a predetermined interval, and a plurality of elements arranged in parallel at a predetermined interval in a direction orthogonal to the first transparent electrode A second transparent electrode composed of the second sensor electrode is provided. In the frame region, a first extraction wiring electrically connected to the first transparent electrode and a second extraction wiring electrically connected to the second transparent electrode are provided.

  As the touch panel, the first transparent substrate on which the first transparent electrode and the first extraction wiring are formed and the second transparent substrate on which the second transparent electrode and the second extraction wiring are formed are laminated. This is known from the past. In this touch panel, an adhesive layer is interposed between the first transparent substrate and the second transparent substrate, so that the first transparent substrate and the second transparent substrate can be securely adhered to each other. It is configured. In addition, the first transparent electrode and the second transparent electrode must have good visibility of an image or the like displayed on the display device when the touch panel is used for the display device. Often formed of a conductive material. On the other hand, the first extraction wiring and the second extraction wiring are generally formed by printing on a transparent substrate with ink having high conductivity.

JP 2006-23904 A

  In recent years, from the viewpoint of improving the design and operability of the touch panel, it is required to increase the active area without increasing the size of the touch panel itself. In order to meet such demands, various studies have been made on recent touch panels to expand the active area by reducing the area of the frame region.

  However, if the area of the frame region is reduced, the first extraction wiring or the second extraction wiring arranged in the frame region must be made finer, and the position accuracy of the installation location of each extraction wiring is further improved. I have to let it. On the other hand, when the extraction wiring is formed by a printing method such as screen printing, the extraction wiring is formed by applying conductive ink on the base film, so that the extraction wiring is thinned and the position accuracy of the installation location is improved. There is a problem that improvement is difficult. Moreover, the extraction wiring formed by the printing method has a problem that the thickness becomes 10 μm or more and the extraction wiring becomes thick.

  As a method for solving such a problem, there is a method of forming the first extraction wiring and the second extraction wiring by a subtractive method. In the subtractive method, a resist layer is applied to a conductive thin film formed by a method such as sputtering or plating, a resist pattern of a conductor to be left by pattern exposure and development is formed, and an unnecessary conductive thin film is formed by etching. In this method, the metal layer is formed by removing the resist layer. The metal pattern finally formed becomes the first extraction wiring or the second extraction wiring.

  When the first extraction wiring and the second extraction wiring are formed by the subtractive method, the extraction wiring can be thinned, and the position accuracy of the installation location of each extraction wiring can be increased. However, in the subtractive method, a metal conductive thin film is previously formed in other regions other than the region where the metal pattern is formed, and then the unnecessary metal thin film is removed by etching to form a desired metal pattern. Therefore, there is a problem that the amount of metal used increases. In addition, in the subtractive method, an expensive member such as a photomask is required, and a plurality of processes such as exposure and development are required to form a lead-out wiring. There is also a problem that it increases.

  In the touch panel, the position accuracy of the first transparent electrode and the position accuracy of the second transparent electrode are directly reflected in the accuracy of the coordinate detection position. In the case of a touch panel in which a touch panel sensor is formed by laminating a first transparent substrate and a second transparent substrate, the accuracy of bonding the first transparent substrate and the second transparent substrate is also detected by coordinates. This greatly reflects the accuracy of the position. Therefore, the touch panel formed by bonding the first transparent substrate and the second transparent substrate may be misaligned when the first transparent substrate and the second transparent substrate are bonded to each other. When the quality of either the transparent substrate or the second transparent substrate does not meet the predetermined standard, the first transparent substrate is peeled off from the second transparent substrate, and these transparent substrates are bonded again. Therefore, it has been necessary to maintain a predetermined positional accuracy (hereinafter referred to as “rework” to bond the first transparent substrate and the second transparent substrate again).

  However, the extraction wiring formed by various printing methods such as screen printing has lower adhesion to the transparent substrate than the extraction wiring formed by the subtractive method, and the first transparent substrate and the second transparent substrate. When peeling off, the extraction wiring was easy to peel off from the transparent substrate. Since the transparent substrate from which the extraction wiring is peeled off cannot be used as an electrode of the touch panel, there is a problem that the yield during reworking is poor.

  The present invention has been made to solve such a problem. A touch panel capable of expanding an active area and improving yield during rework, and a display device including the touch panel are provided. The purpose is to provide.

The present invention
(1) A touch panel in which a flexible substrate is bonded to a touch panel sensor that detects the position of an object in contact with a surface, wherein the touch panel sensor includes a plurality of first sensor electrodes arranged in parallel at a predetermined interval. A first transparent substrate on which one transparent electrode and a plurality of first extraction wirings including a metal material and electrically connected to the first sensor electrode are disposed, and orthogonal to the first sensor electrode A second transparent electrode having a plurality of second sensor electrodes arranged in parallel in a direction at predetermined intervals, and a plurality of second electrodes that include a metal material and a resin material and are electrically connected to the second sensor electrode. A second transparent substrate having a lead-out wiring disposed on one surface thereof, and an adhesive layer for bonding the first transparent substrate and the second transparent substrate, The other side surface and the first transparent substrate first The second transparent substrate is laminated on the first transparent substrate via the adhesive layer so that the surface on which the transparent electrode and the first extraction wiring are arranged is opposed. Touch panel,
(2) The touch panel sensor includes an active area capable of detecting contact of an object and a frame area formed around the active area, and the frame area is connected to the flexible substrate and the first area. A first frame region in which a part of the first extraction wiring and the second extraction wiring are arranged, and a second frame region in which a part of the first extraction wiring is arranged, and the second The touch panel according to (1), wherein the width of the frame region is formed to be narrower than the width of the first frame region,
(3) The first transparent electrode is also formed in the first transparent substrate at a location where the first extraction wiring is disposed, and the first extraction wiring is the first transparent electrode. And the touch panel according to the above (1) or (2),
(4) An adhesion layer that improves adhesion between the first extraction wiring and the first transparent electrode is formed between the first extraction wiring and the first transparent electrode. The touch panel according to any one of (1) to (3),
Is the gist.

  Moreover, the display device provided with the touch panel according to the present invention includes the touch panel according to any one of (1) to (4) above in a display unit.

  In the touch panel according to the present invention, since the second transparent substrate is laminated on the first transparent substrate having strong adhesion to the first extraction wiring, the first extraction wiring and the first transparent substrate at the time of reworking are stacked. Can be significantly reduced, and the yield during reworking can be improved. In the touch panel according to the present invention, the first lead-out wiring is formed of a material containing a metal material, and the second lead-out wiring is formed of a material containing a metal material and a resin material. However, the active area of the touch panel sensor can be further expanded.

It is an appearance perspective view showing appearance composition of a touch panel concerning the present invention. It is explanatory drawing showing the active area and frame area of the touch panel. It is a disassembled perspective view showing the structure of the touch panel sensor. It is the elements on larger scale which expanded the part shown with the code | symbol A in FIG. It is the elements on larger scale which expanded the part shown with the code | symbol B in FIG. It is sectional drawing of the AA 'line of FIG. It is sectional drawing of the BB 'line of FIG. It is explanatory drawing for demonstrating the method of forming a 1st extraction wiring in a 1st transparent substrate. It is explanatory drawing for demonstrating the method of forming the 2nd extraction wiring in the 2nd transparent substrate. It is explanatory drawing showing the structure at the time of laminating | stacking a 1st transparent substrate and a 2nd transparent substrate.

  A configuration of a touch panel according to the present invention will be described with reference to the drawings. In this specification, “front end side”, “rear end side”, “left side”, “right side”, “upper side”, and “lower side” indicate directions shown in FIG. In the present embodiment, “one surface of the second transparent substrate” means the upper surface of the second transparent substrate, and “the other surface of the second transparent substrate” means the second surface. This means the lower surface of the transparent substrate. Further, in this specification, the “object contact” state is not only a state in which the object is in direct contact but also a state in which the object is close to the extent that the touch panel sensor can detect that the object has touched. Shall also be included.

(Configuration of touch panel 1)
As shown in FIG. 1, the touch panel 1 according to the present embodiment includes a touch panel sensor 2 and a flexible substrate 3. The touch panel sensor 2 is for detecting the position of an object in contact with the surface, and is connected to the first extraction wiring 4 (hereinafter referred to as the first connection terminal 5) and the second extraction. A connection terminal (hereinafter referred to as a second connection terminal 7) connected to the wiring 6 is formed on the side portion of the touch panel sensor 2. The flexible substrate 3 is a flexible substrate having a pattern of electrode wiring and electrode terminals (not shown) formed on one surface. The electrode terminal of the flexible substrate 3 is electrically connected to the first connection terminal 5 and the second connection terminal 7 via an anisotropic conductive adhesive. For convenience of explanation, FIG. 1 shows the touch panel sensor 2 and the flexible substrate 3 separately. 1 is an adhesive layer provided on the touch panel sensor 2. The adhesive layer 8 is for bonding the touch panel sensor 2 and the cover glass when a cover glass (not shown) is installed on the touch panel sensor 2.

  The touch panel sensor 2 is a sensor member for detecting the position of an object in contact with the surface of a cover glass (not shown). As shown in FIG. 2, the touch panel sensor 2 is formed around an active area 11 that can be visually recognized by the operator and that can detect contact of an object such as a finger on the surface, and is normally Is divided into a frame region 12 that cannot be visually recognized by the operator. In the frame region 12, the flexible substrate 3 is joined and a part of the first extraction wiring 4, the first connection terminal 5, the second extraction wiring 6, and the second connection terminal 7 are arranged. It has the 1st frame area | region 13 and the 2nd frame area | region 14 by which at least one part of the 1st extraction wiring 4 is arrange | positioned.

  The first frame region 13 is formed to have a width W1, and the second frame region 14 is formed to have a width W2. The width W1 and the width W2 are formed so that the width W1 is wider than the width W2. This is because the first frame region 13 is also a region for joining the flexible substrate 3 to the touch panel sensor 2 and it is necessary to ensure a width necessary for joining the flexible substrate 3.

  In the present embodiment, the first frame region 13 is formed on the front end side of the active area 11 and the second frame region 14 is formed on the left and right end sides of the active area 11. The frame region 13 and the second frame region 14 are not limited to this position. For example, in FIG. 1, when the flexible substrate 3 is bonded to the right end side of the active area 11, the first frame region is on the right end side of the active area 11, and the second frame region is the active area 11. It becomes the front end side and the rear end side. For convenience of explanation, in FIG. 2, description of each extraction wiring and connection terminal formed on the first transparent substrate 16 and the second transparent substrate 17 is omitted.

  As shown in FIG. 3, the touch panel sensor 2 is configured so that the upper surface 16 a of the first transparent substrate 16 and the lower surface 17 a as the other surface of the second transparent substrate 17 are opposed to each other. A second transparent substrate 17 is laminated on the adhesive layer 18 thereon. The first transparent substrate 16 is a member formed of a light transmissive resin film. As shown in FIGS. 3 and 5, the first transparent electrode 19, the first extraction wiring 4 and the first extraction wiring 4 are formed on the upper surface 16a. The connection terminals 5 are arranged and formed. The second transparent substrate 17 is a member formed of a light transmissive resin film. As shown in FIGS. 3 and 4, the second transparent electrode 20, the second extraction wiring 6, and the second extraction substrate 6 are used. The connection terminal 7 is disposed and formed on the upper surface 17b as one surface. In the following, the light transmissive resin film constituting the first transparent substrate 16 is referred to as a first light transmissive resin film 30, and the light transmissive resin film constituting the second transparent substrate 17 is a second light transmissive resin film. The light transmissive resin film 35 is called.

  Examples of the first light-transmitting resin film 30 and the second light-transmitting resin film 35 used for the first transparent substrate 16 and the second transparent substrate 17 include acrylics such as polymethyl methacrylate, polyamide, polyacetal, poly Butylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, triacetyl cellulose, or syndiotactic polystyrene, polyphenylene sulfide, polyether ketone, polyether ether ketone, fluororesin, or polyether nitrile, polycarbonate, modified polyphenylene ether, poly Cyclohexene or polynorbornene resin, etc., or polysulfone, polyethersulfone, polysulfone, polyarylate, polyamideimide, polyether De, or film and the like made of thermoplastic polyimide.

  As shown in FIGS. 3 and 5, the first transparent electrode 19 has a plurality of first sensor electrodes 21 that are linearly formed in the left-right direction, and these first sensor electrodes 21 are predetermined. Are arranged in parallel in the active area 11 with an interval of. As shown in FIGS. 3 and 4, the second transparent electrode 20 has a plurality of second sensor electrodes 22 formed linearly in a direction orthogonal to the first sensor electrode 21. These second sensor electrodes 22 are arranged in parallel in the active area 11 at a predetermined interval. For this reason, the first transparent electrode 19 and the second transparent electrode 20 are arranged so as to be orthogonal to each other and positioned in a grid pattern in the active area 11. Both ends of the first transparent electrode 19 extend to the frame region 12, and each end portion is configured to be connected to the first transparent electrode terminal 23. Further, both ends of the second transparent electrode 20 extend to the frame region 12, and each end portion is configured to be connected to the second transparent electrode terminal 24. The first transparent electrode 19 and the second transparent electrode 20 have a capacitance between the object in contact with the surface and the first transparent electrode 19 when the operator touches the surface of the touch panel 1 with a finger or the like. It is possible to detect at which position in the active area 11 the object has come in contact with the change in the above and the change in the capacitance between the object and the second transparent electrode 20. In the present embodiment, the first sensor electrode 21 constituting the first transparent electrode 19 and the second sensor electrode constituting the second transparent electrode 20 are formed in a linear shape. The shapes of the first sensor electrode 21 and the second sensor electrode are not limited to this, and may be shapes other than linear shapes.

  The first extraction wiring 4 is a wiring for sending the detection signal generated by the first transparent electrode 19 to an external device via a flexible circuit formed on the flexible substrate 3. As shown in FIGS. 3 and 5, the first lead-out wiring 4 has an end on the front end side connected to a first connection terminal 5 for connecting to a flexible circuit, and an end on the rear end side is a first end. The transparent electrode terminal 23 is connected. In FIG. 5, the hatched portions are the first extraction wiring 4, the first connection terminal 5, and the first transparent electrode terminal 23.

  The first extraction wiring 4 is formed on both the left and right sides of the frame region 12 so as to straddle the first frame region 13 and the second frame region 14. Further, the first extraction wiring 4 is formed so as to be connected only to one of the terminals of the first transparent electrode terminal 23 provided on the left and right, and not to the terminal on the other end. Has been. For example, the first sensor electrode 21 on the rear end side is connected to the first extraction wiring 4 via the first transparent electrode terminal 23 formed on the left side. The first sensor electrode 21 adjacent to the distal end side is connected to the first extraction wiring 4 through a first transparent electrode terminal 23 formed on the right side.

  The 2nd extraction wiring 6 is for sending out the detection signal produced | generated by the 2nd transparent electrode 20 to an external apparatus via a flexible circuit. As shown in FIGS. 1, 3 and 4, the second lead-out wiring 6 has an end on the front end side connected to a second connection terminal 7 for connecting to a flexible circuit, and an end on the rear end side. Is formed so as to be connected to the second transparent electrode terminal 24. In FIG. 4, the second lead-out wiring 6, the second connection terminal 7, and the second transparent electrode terminal 24 are hatched.

  The second extraction wiring 6 is formed in the first frame region 13 formed on the front end side of the frame region 12. The second lead-out wiring 6 is connected only to the second transparent electrode terminal 24 provided on the front end side, and the second transparent electrode terminal 24 provided on the rear end side. It is formed so as not to be connected.

  The adhesive layer 18 is a layer for adhering the first transparent substrate 16 and the second transparent substrate 17 when the first transparent substrate 16 and the second transparent substrate 17 are laminated. As the adhesive layer 18, a conventionally known one can be appropriately selected as long as it has translucency. Specifically, examples of the resin composition forming the adhesive layer 18 include acrylic acid, alkyl acrylate, methacrylic acid, alkyl methacrylate, and natural rubber. The resin composition is preferably a light-transmitting adhesive capable of forming the adhesive layer 18 having an excellent visible light transmittance with a wavelength of 400 nm or more and 700 nm or less, and is mainly composed of alkyl acrylate. . Moreover, in order to maintain the insulation reliability between the electrodes which are contacting, it is preferable that a water absorption is low and it is acid free.

  6 is a cross-sectional view taken along the line AA ′ of FIG. 1, and FIG. 7 is a cross-sectional view taken along the line BB ′ of FIG. In FIG. 6, for convenience of explanation, the left and right ends and a part of the center are omitted. As shown in FIG. 6, the first transparent substrate 16 has a first undercoat layer 31, a first dielectric layer 32, and a first transparent conductive film on the upper surface of the first light transmissive resin film 30. A layer 33 and a first light-shielding conductive film layer 34 are stacked. The first undercoat layer 31 irradiates at least ultraviolet light after applying an undercoat layer forming solution in which a photocurable resin agent or an epoxy-based curing agent is dissolved, so that the applied resin agent or curing agent is removed. It is a thin film layer formed by curing, and is formed on the entire surface of the first light transmissive resin film 30. Examples of the photocurable resin agent used to form the first undercoat layer 31 include acrylic resins such as oxetane resins. Examples of the epoxy curing agent include bisphenol A type epoxy. Examples thereof include resins and bisphenol F type epoxy resins.

The first dielectric layer 32 is for improving the adhesion of the first transparent electrode 19 and making the first transparent electrode 19 inconspicuous. The first dielectric layer 32 is configured by forming a thin film of SiO ₂ on the first transparent substrate 16. By forming the first dielectric layer 32, the adhesion between the first light-transmissive resin film 30 and the first transparent conductive film layer 33 can be improved, and the first transparent conductive film can be improved. The first transparent electrode 19 formed by the layer 33 can be made inconspicuous, and the operator can operate the touch panel 1 without being aware of the presence of the first transparent electrode 19. In the present embodiment, a thin film of SiO ₂ is used as the first dielectric layer 32, but SiON or the like may be used.

  The first transparent conductive film layer 33 constitutes a first transparent electrode 19 composed of a plurality of first sensor electrodes 21, and a first transparent electrode terminal formed in the second frame region 14. 23, the first extraction wiring 4 and the first connection terminal 5, respectively. The first transparent electrode 19, the first transparent electrode terminal 23, the first extraction wiring 4 and the first connection terminal 5. It is formed on the first dielectric layer 32 so as to have a pattern corresponding to the shape of the connection terminal 5.

The first transparent conductive film layer 33 is formed of conductive oxide such as indium tin oxide (ITO), indium oxide, indium zinc oxide (IZO), tin oxide (SnO ₂ ), and zinc oxide (ZnO). Things. The first transparent conductive film layer 33 is obtained by forming a thin film of these conductive oxides on the first dielectric layer 32 by sputtering. The film thickness of the first transparent conductive film layer 33 thus obtained is preferably 15 nm to 50 nm from the viewpoint of ensuring the transparency of the thin film and from the viewpoint of film formability. Further, from the viewpoint of improving the adhesion between the first transparent conductive film layer 33 and the first light-shielding conductive film layer 34, the first transparent conductive film layer 33 is more preferably formed of indium tin oxide. preferable. The first transparent conductive film layer 33 may be formed of a film containing conductive fibers made of carbon nanotubes or metal nanowires, or a film containing metal nanowires and a conductive polymer.

  The first light-shielding conductive film layer 34 constitutes each of the first transparent electrode terminal 23, the first extraction wiring 4, and the first connection terminal 5. The first light-shielding conductive film layer 34 is formed on the first transparent conductive film layer 33 that constitutes the first transparent electrode terminal 23, the first extraction wiring 4, and the first connection terminal 5. Has been. The first light-shielding conductive film layer 34 is formed by performing an etching process on the light-shielding conductive thin film formed on the first transparent conductive film layer 33 using a vacuum process such as sputtering or vapor deposition. ing.

  The first light-shielding conductive film layer 34 is, for example, gold (Au) silver (Ag), copper (Cu), chromium (Cr), platinum (Pt), aluminum (Al), or any of these metals. It is formed of an alloy containing one or more kinds of metals, for example, APC (silver, palladium, copper alloy), MAM (molybdenum, aluminum, molybdenum alloy). Note that the first light-shielding conductive film layer 34 may be formed by laminating different metals among these metals, thereby improving the adhesion between the first light-shielding conductive film layer 34 and the first transparent conductive film layer 33. From the viewpoint of making it, it is more preferable to form it from an alloy of silver and palladium / copper.

  As shown in the cross section taken along line BB ′ in FIG. 4, the second transparent substrate 17 is formed on the portion where the second transparent conductive film layer 38 is formed and the cross section taken along line AA ′ in FIG. 1. As shown, there is a portion where the second transparent conductive film layer 38 is not formed. For example, in the portion shown in FIG. 4, the second transparent substrate 17 has the second undercoat layer 36, the second dielectric layer 37, and the second transparent on the upper surface of the second light transmissive resin film 35. A conductive film layer 38 and a second light shielding conductive film layer 39 are stacked. In addition, in the place located in FIG. 1, the second transparent substrate 17 is formed on the upper surface of the second light-transmitting resin film 35 on the second undercoat layer 36, the second dielectric layer 37, and the second dielectric layer 37. The light-shielding conductive film layer 39 is laminated, and the second transparent conductive film layer 38 is not formed. This is because the frame region 12 is not a place where the operator can visually recognize, and it is allowed to form the second light-shielding conductive film layer 39 made of a metal or an alloy, and the second light-shielding conductive film layer. This is because 39 can be easily formed. However, this is not to prohibit the formation of the second transparent conductive film layer 38 in the frame region 12, and the second transparent conductive film layer 38 is also formed in the frame region 12 as necessary. The second light-shielding conductive film layer 39 may be formed thereon.

  The second undercoat layer 36 irradiates at least ultraviolet light after applying an undercoat layer forming solution in which a photocurable resin agent or an epoxy curing agent is dissolved, so that the applied resin agent or curing agent is applied. It is a thin film layer formed by curing, and is formed on the entire surface of the second light transmissive resin film 35. Examples of the photocurable resin agent used to form the second undercoat layer 36 include acrylic resins such as oxetane resins. Examples of the epoxy curing agent include bisphenol A type epoxy. Examples thereof include resins and bisphenol F type epoxy resins. Further, the resin material or curing agent used when forming the second undercoat layer 36 is the same as that used when forming the first undercoat layer 31 on the first transparent substrate 16. However, a different one may be used.

The second dielectric layer 37 is configured by forming a thin film of SiO ₂ on the second undercoat layer 36. The second dielectric layer 37 improves the adhesion between the second transparent conductive film layer 38 or the second light-shielding conductive film layer 39 and the second light-transmitting resin film 35 and also transmits the second light transmission. In order to make the second transparent electrode 20 formed on the conductive resin film 35 inconspicuous, the operator can operate the touch panel 1 without being aware of the presence of the second transparent electrode 20. It is like that. In this embodiment, a thin film of SiO ₂ is used as the second dielectric layer 37, but SiON or the like may be used. In the present embodiment, a thin film made of the same material as the first dielectric layer 32 is formed as the second dielectric layer 37. However, the second dielectric layer 37 and the first dielectric layer 32 may be formed from a different material.

  The second transparent conductive film layer 38 constitutes the second transparent electrode 20 including the plurality of second sensor electrodes 22 and is formed in the first frame region 13 and the second frame region 14. The second transparent electrode terminal 24 is configured, and the second dielectric layer 37 is formed so as to form a pattern corresponding to the shape of the second transparent electrode 20 and the second transparent electrode terminal 24. Formed on top.

For forming the second transparent conductive film layer 38, conductive oxide such as indium tin oxide (ITO), indium oxide, indium zinc oxide (IZO), tin oxide (SnO ₂ ), zinc oxide (ZnO) is used. Things. The second transparent conductive film layer 38 is obtained by forming a thin film of these conductive oxides on the second dielectric layer 37 by sputtering. The film thickness of the second transparent conductive film layer 38 thus obtained is preferably 15 nm to 50 nm from the viewpoint of ensuring the transparency of the thin film and from the viewpoint of film formability. The second transparent conductive film layer 38 may be formed of a film containing conductive fibers made of carbon nanotubes or metal nanowires, or a film containing metal nanowires and a conductive polymer.

  The second light-shielding conductive film layer 39 constitutes the second extraction wiring 6, the second transparent electrode terminal 24 and the second connection terminal 7, and these second extraction wiring 6, second It forms on the 2nd transparent substrate 17 and the 2nd transparent conductive film layer 38 so that the pattern corresponding to the shape of the terminal 24 for transparent electrodes and the 2nd connection terminal 7 may be formed.

  The second light-shielding conductive film layer 39 is formed by applying a paste-like electrode material on the second dielectric layer 37 or the second transparent conductive film layer 38 by a screen printing method. The second light-shielding conductive film layer 39 is formed of a paste-like conductive material made of a metal material and a resin material. Examples of the metal material used include gold (Au), silver (Ag), copper (Cu), chromium (Cr), platinum (Pt), aluminum (Al), or any one of these metals. An alloy containing more than one kind of metal, for example, APC (silver, palladium, copper alloy), MAM (molybdenum, aluminum, molybdenum alloy), and the like can be given.

  Examples of the resin material include phenol resin, epoxy resin, unsaturated polyester, vinyl ester resin, diallyl phthalate resin, oligoester acrylate resin, xylene resin, bismaleide triazine resin, furan resin, urea resin, Examples include polyurethane, melamine resin, silicon resin, acrylic resin, oxetane resin, oxazine resin, polyamide, polyimide, acrylic resin, ketone resin, polystyrene, and polyester. In particular, since the second transparent substrate 17 is a film material and cannot be baked at a high temperature, the second light-shielding conductive film layer 39 is made of silver and an epoxy resin, an acrylic resin, a phenol resin, or a mixed resin thereof. It is preferable to use a paste-like conductive material. In addition, after forming an outer peripheral pattern by the screen printing method using the above paste, laser processing may be performed to pattern a fine portion, or an outer periphery pattern may be formed by a screen printing method using a photosensitive paste containing a metal material. After the pattern is formed, the fine portion may be patterned through a lithography process.

  As shown in FIGS. 1 and 3, in the touch panel 1 of the present embodiment, a first transparent substrate 16 and a second transparent substrate 17 are laminated via an adhesive layer 18. Further, the second transparent substrate 17 has cutouts 17c on both the left and right sides of the side where the second connection terminals 7 are formed, and the first cutout 17c is formed at the first cutout 17c. It arrange | positions so that the 1st connection terminal 5 formed in the transparent substrate 16 may be exposed. Accordingly, the first connection terminal 5 and the second connection terminal 7 are both disposed on the same side.

  Next, the step of forming the first transparent electrode 19 and the first extraction wiring 4 on the first transparent substrate 16 will be described with reference to FIG. First, after preparing the light transmissive resin film 30 to be the first transparent substrate 16 and sequentially laminating the first undercoat layer 31 and the first dielectric layer 32 on the light transmissive resin film, The first transparent conductive film layer 33 and the first light-shielding conductive film layer 34 are sequentially stacked by sputtering (FIG. 8A). Note that the first transparent conductive film layer 33 is a layer that becomes the first transparent electrode 19, and the first light-shielding conductive film layer 34 is the first extraction wiring 4, the first connection terminal 5, and the first transparent electrode. This is a layer that becomes the electrode terminal 23.

  Next, a photosensitive film layer 41 is formed on the first light-shielding conductive film layer 34. The photosensitive film layer 41 is formed by coating the first light-shielding conductive film layer 34 by various methods such as a bar coating method, a die coating method, a curtain coating method, and screen printing (FIG. 8B). Next, a photomask 42 is disposed on the photosensitive film layer 41. The photomask 42 is a glass member in which a pattern corresponding to the shapes of the first transparent electrode 19 and the first extraction wiring 4 is formed of a metal film (FIG. 8C).

  Next, the pattern formed on the photomask 42 is exposed to the photosensitive film layer 41. As the exposure apparatus used at the time of exposure, an apparatus corresponding to the photosensitive characteristics of the photosensitive film layer 41 can be used. For example, an ultraviolet exposure apparatus or an electron beam exposure apparatus can be used. After the exposure is completed, the photomask 42 is removed (FIG. 8D). In FIG. 8D, the portion indicated by reference numeral 43 is a portion where the photosensitive film layer is exposed by exposure. Next, the photosensitive film layer 41 is developed using a developer. As a developer for development, a potassium hydroxide solution, TMAH (tetramethylammonium hydroxide), or the like can be used, and a developer corresponding to the characteristics of the photosensitive film layer 41 can also be used. The photosensitive film layer 41 developed in this way is subjected to removal of the exposed portion, and the same pattern as that formed on the photomask 42 is patterned on the photosensitive film layer 41 (FIG. 8E).

  Next, the first light-shielding conductive film layer 34 and the first transparent conductive film layer 33 are etched. As the etching agent, an aqueous solution of iron chloride and a mixed liquid mainly composed of an aqueous solution of iron chloride can be used. A product according to the above can be used as appropriate. When the etching process of the first light-shielding conductive film layer 34 and the first transparent conductive film layer 33 is completed, the same pattern as the pattern formed on the photosensitive film layer 41 is the first light-shielding conductive film layer 34 and the first transparent conductive film layer 41. The conductive film layer 33 is patterned (FIG. 8F). After performing the etching process, the photosensitive film layer 41 is peeled off (FIG. 8G). The first transparent conductive film layer 33 patterned in this way becomes the first transparent electrode 19.

  Next, a photosensitive material is coated again on the first light-shielding conductive film layer 34 to form a photosensitive film layer 44 (FIG. 8H). Then, a photomask 45 is disposed on the photosensitive film layer 44. The photomask 45 is a glass member in which a pattern corresponding to the shape of the first extraction wiring 4 is formed of a metal film. (FIG. 8 (i)).

  Next, the pattern formed on the photomask 45 is exposed to the photosensitive film layer 44. As in the previous exposure, the exposure apparatus used at the time of exposure can be one corresponding to the photosensitive characteristics of the photosensitive film layer 44, for example, an ultraviolet exposure apparatus or an electron beam exposure apparatus. After the exposure is completed, the photomask 45 is removed (FIG. 8 (j)). In FIG. 8 (j), the portion denoted by reference numeral 46 is a portion where the photosensitive film layer 44 is exposed by exposure. Next, the photosensitive film layer 44 is developed using a developer. As a developer for development, a potassium hydroxide solution, TMAH (tetramethylammonium hydroxide), or the like can be used, and a developer corresponding to the characteristics of the photosensitive film layer 44 can also be used. The photosensitive film layer 44 thus developed is stripped of the exposed portion, and the same pattern as that formed on the photomask 45 is patterned on the photosensitive film layer 44 (FIG. 8 (k)).

  Next, the first light shielding conductive film layer 34 is etched. As the etchant, phosphonic acetic acid or the like can be used, and those according to the characteristics of the photosensitive film layer 44, the first light-shielding conductive film layer 34, and the first transparent conductive film layer 33 can be appropriately used. . When the etching process for the first light-shielding conductive film layer 34 is completed, the same pattern as that formed on the photosensitive film layer 44 is patterned on the first light-shielding conductive film layer 34 (FIG. 8L). After the etching process, the photosensitive film layer 44 is peeled off (FIG. 8 (m)). The first light-shielding conductive film layer 34 thus patterned becomes the first extraction wiring 4 and the like.

  Next, the step of forming the second extraction wiring 6 on the second transparent substrate 17 will be described with reference to FIG. First, a second light transmissive resin film 35 is prepared, a second undercoat layer 36 and a second dielectric layer 37 are sequentially laminated on the light transmissive resin film, and a second transparent conductive film is further formed. A thin film to be the layer 38 is sequentially laminated by a sputtering method. The second transparent conductive film layer 38 is a layer that becomes the second transparent electrode 20.

  Next, a photosensitive film layer 51 is formed on the second transparent conductive film layer 38. The photosensitive film layer 51 is formed by coating the second transparent conductive film layer 38 by various methods such as a bar coating method, a die coating method, a curtain coating method, and screen printing (FIG. 9A). Next, a photomask 52 is disposed on the photosensitive film layer 51. The photomask 52 is a glass member in which a pattern corresponding to the shape of the second transparent electrode 20 is formed of a metal film (FIG. 9B).

  Next, the pattern formed on the photomask 52 is exposed to the photosensitive film layer 51. As an exposure apparatus used at the time of exposure, an apparatus corresponding to the photosensitive characteristics of the photosensitive film layer can be used, and for example, an ultraviolet exposure apparatus or an electron beam exposure apparatus can be used. After the exposure is completed, the photomask 52 is removed (FIG. 9C). In FIG. 9C, the portion indicated by reference numeral 53 is a portion where the photosensitive film layer is exposed by exposure. Next, the photosensitive film layer 51 is developed using a developer. As a developer for development, a potassium hydroxide solution, TMAH (tetramethylammonium hydroxide), or the like can be used, and a developer corresponding to the characteristics of the photosensitive film layer 51 can also be used. The photosensitive film layer 51 developed in this manner is stripped of the exposed portion, and the same pattern as that formed on the photomask 52 is patterned on the photosensitive film layer 51 (FIG. 9D).

  Next, the second transparent conductive film layer 38 is etched. As the etching agent, an aqueous solution of iron chloride, a mixed solution containing an aqueous iron chloride solution as a main component, or the like can be used, and an appropriate one depending on the characteristics of the second transparent conductive film layer 38 can be used. When the etching process of the second transparent conductive film layer 38 is completed, the same pattern as that formed on the photosensitive film layer 51 is patterned on the second transparent conductive film layer 38 (FIG. 9E). After performing the etching process, the photosensitive film layer 51 is peeled off (FIG. 9F). The second transparent conductive film layer 38 thus patterned becomes the second transparent electrode 20.

  Next, by using a screen printing method, a paste-like conductive material is printed on the second transparent electrode 20 to form a second light-shielding conductive film layer 39 (FIG. 9G). The second light-shielding conductive film layer 39 printed in this way becomes the second extraction wiring 6 and the like.

  Next, the adhesive layer 18 is interposed on the first transparent substrate 16, and the lower surface of the second transparent substrate 17 is laminated and fixed on the first transparent substrate 16. In this way, the touch panel sensor 2 of the present embodiment is formed (FIG. 10A). In FIG. 10A, the example in which the second light-shielding conductive film layer 39 is formed on the second transparent conductive film layer 38 has been described, but depending on the location where the second extraction wiring 6 is formed. The second light-shielding conductive film layer 39 may be directly formed on the second transparent resin film 35 on which the second undercoat layer 36 and the second dielectric layer 37 are formed.

  As described above, the touch panel 1 of the present embodiment has the second transparent substrate 17 laminated on the first transparent substrate 16 having high adhesion to the first extraction wiring 4 via the adhesive layer 18. Yes. Therefore, in the touch panel 1 of the present embodiment, even if the first transparent substrate 16 and the second transparent substrate 17 are peeled off during rework, the first extraction wiring 4 may be peeled off from the first transparent substrate 16. And can be bonded to the second transparent substrate 17 again. Therefore, the touch panel 1 of the present embodiment can further improve the yield during rework.

  In the touch panel 1 according to the present embodiment, the first connection terminal 5 of the first extraction wiring 4 and the second connection terminal 7 of the second extraction wiring 6 are both provided on the side of the touch panel sensor 2. It has been. Therefore, the touch panel 1 according to the present embodiment only needs to be provided with the flexible substrate 3 in one place, and the frame area 12 in another place can be narrowed and the active area 11 can be enlarged.

  Furthermore, in the touch panel sensor 2 of the present embodiment, when the extraction wiring is installed in the second frame area that is narrowed, the first extraction wiring formed by the sputtering method is installed, and the second frame area The second extraction wiring formed by an inexpensive printing method can be installed in the first frame region in which a relatively wide area is secured as compared with the above. Therefore, the touch panel 1 of the present embodiment can further expand the active area 11 while keeping the manufacturing cost low.

  In the touch panel sensor 2 of the present embodiment, the first transparent electrode is also formed on the first transparent substrate at a position where the first extraction wiring is formed, and the first extraction wiring is formed as the first transparent wiring. By laminating with the electrodes, the adhesion between the first extraction wiring and the first transparent electrode can be further improved, and the yield during reworking can be further improved.

  In the present embodiment, the first transparent substrate 16 has an undercoat layer 31 and a dielectric layer 32, and the second transparent substrate 17 has an undercoat layer 36 and a dielectric layer 37. However, the transparent substrate may not have the undercoat layer and the dielectric layer. For example, as shown in FIG. 10B, the first transparent substrate 16 ′ is composed of the first light-transmissive resin film 30, the first transparent conductive film layer 33, and the first light-shielding conductive film layer 34. The second transparent substrate 17 ′ may be composed of the second light transmissive resin film 35, the second transparent conductive film layer 38, and the second light shielding conductive film layer 39. Further, as another aspect of the present embodiment, between the first light-shielding conductive film layer 34 and the first transparent conductive film layer 33, that is, between the first extraction wiring 4 and the first transparent electrode 19. The adhesion layer 61 may be laminated therebetween. For example, in another form of the present embodiment, as shown in FIG. 10C, the first transparent substrate 16 ″ is composed of the first light transmissive resin film 30, the undercoat layer 31, and the dielectric layer 32. The first transparent conductive film layer 33, the adhesion layer 61, and the first light shielding conductive film layer 34 may be included. By interposing the adhesion layer 61 between the first transparent conductive layer 33 and the first light-shielding conductive film layer 34, the adhesion between the first extraction wiring 4 and the first transparent electrode 19 is further improved. Thus, the first extraction wiring 4 does not peel off during rework, and can be reused more reliably. Note that, from the viewpoint of improving the adhesion between the first extraction wiring 4 and the first transparent electrode 19, the adhesion layer 61 is preferably formed from an alloy of molybdenum and niobium.

  The display device of the present invention can be provided using the touch panel of the present invention described above. The display device of the present invention is configured by providing the above-described touch panel in a display unit.

  As the display unit, a conventionally known display unit such as a liquid crystal display panel or an organic EL display panel may be used as appropriate, and the display unit is not limited to the above. In addition, examples of the display device including the display unit include a mobile phone, a portable music playback device, and a personal computer, but the display device can also be used for other display devices.

Example 1:
(Creation of the first transparent substrate 16)
First, a 150 μm thick PET film (Toray Lumirror T60) was prepared. Next, a solution obtained by dissolving a photocurable resin agent (Aronix M405, manufactured by Toagosei Co., Ltd.) and an epoxy-based curing agent (Irgacure 184, manufactured by Ciba Specialty Chemicals Co., Ltd.) in isobutyl alcohol was used as a bar coating method (Matsuo Sangyo Co., Ltd.). It was apply | coated to the whole surface of PET film by the product made from K303 multicoater. Then, using a Model LC-6B Benchtop Conveyor (manufactured by Fusion UV Systems Japan Co., Ltd.), an ultraviolet ray having a wavelength of 365 nm and an accumulated energy of 300 mJ is irradiated from the application surface of the solution. A 1 μm thick undercoat layer was formed.

Next, a first dielectric layer made of a thin film of SiO ₂ having a thickness of 30 nm was formed on one side of a PET film on which an undercoat layer was formed by a sputtering method (manufactured by ULVAC, Inc., contact sputtering ACS-4000). . Next, an ITO film having a thickness of 30 nm and an APC film having a thickness of 100 nm were sequentially formed on the first dielectric layer by a sputtering method. Thereafter, a positive resist having a thickness of 1.0 μm was formed by a curtain coating method using a positive photosensitive material (S1805 manufactured by Rohm & Haas).

  Next, a photomask in which a pattern of the first transparent electrode 19 and the first extraction wiring 4 is formed on a positive resist is arranged at a predetermined position, and a proxy aligner (MA5000 manufactured by Dainippon Kaken) is placed on the photomask. ) To irradiate ultraviolet rays having a wavelength of 365 nm and an accumulated energy of 300 mJ to expose the positive resist. Thereafter, the positive resist was developed with a KOH developer.

  Next, the APC film and the ITO film were etched using an iron chloride solution as an etchant, and the APC film and the ITO film were patterned. Thereafter, the positive resist was peeled off with an NaOH solution.

  Next, using a curtain coater (manufactured by Seritech Co., Ltd.), a positive photosensitive material (manufactured by AZ Material) was applied by the curtain coating method to form a positive resist having a thickness of 1.0 μm from the APC film. . Then, a photomask in which the pattern of the first extraction wiring 4 is formed on the positive resist is disposed at a predetermined position, and a wavelength of 365 nm is integrated from above the photomask by a proxy aligner (MA5000 manufactured by Dainippon Kaken). The positive resist was exposed by irradiating ultraviolet rays having an energy of 300 mJ. Thereafter, the positive resist was developed with a KOH developer.

  Next, the APC film was subjected to etching processing using phosphoric acid acetic acid in which phosphoric acid, nitric acid, acetic acid, and water were mixed at a ratio of 4: 1: 4: 4 as an etching agent, and the APC film was patterned. Thereafter, the positive resist was peeled off with an NaOH solution. As a result, a first transparent substrate 16 was obtained.

(Creation of the second transparent substrate 17)
First, a 150 μm thick PET film (Toray Lumirror T60) was prepared. Next, a solution obtained by dissolving a photocurable resin agent (Aronix M405 manufactured by Toagosei Co., Ltd.) and an epoxy type curing agent (Irgacure 184 manufactured by Ciba Specialty Chemicals Co., Ltd.) in isobutyl alcohol is used as an automatic coating machine (Matsuo Sangyo Co., Ltd.). It was applied to the entire surface of the PET film by a bar coating method using a company-made K303 multi-coater. Then, using a Model LC-6B Benchtop Conveyor (Fusion UV Systems Japan Co., Ltd.), UV light having a wavelength of 365 nm and an integrated energy of 300 mJ is irradiated from the coating surface of the solution, and the PET film has an under thickness of 1 μm. A coat layer was formed.

Next, a second dielectric layer made of a thin film of SiO ₂ having a thickness of 30 nm was formed on one side of the PET film on which the undercoat layer was formed by sputtering. Next, an ITO film having a thickness of 30 nm is formed on the second dielectric layer by a sputtering method, and then the thickness is determined by a curtain coating method using a positive photosensitive material (S1805 manufactured by Rohm & Haas). A 1.0 μm positive resist was formed.

  Next, a photomask in which the pattern of the second transparent electrode 20 is formed on the positive resist is arranged at a predetermined position, and a wavelength of 365 nm is integrated from above the photomask using a proxy aligner (MA5000, manufactured by Dainippon Kaken). The positive resist was exposed by irradiating ultraviolet rays having an energy of 300 mJ. Thereafter, the positive resist was developed with a KOH developer. Next, the ITO film was etched using an iron chloride solution as an etchant, and the ITO film was patterned. Thereafter, the positive resist was peeled off with an NaOH solution.

Next, a silver paste was patterned on the SiO ₂ film and a part of the ITO film by a screen printing method to form a pattern of the second extraction electrode. Then, it put in the PET film drying furnace, and it heated for 30 minutes in the atmosphere of temperature 150 degreeC, and baked the silver paste.
When the film thickness of the obtained silver paste was measured with a surface roughness / contour shape measuring instrument (SEF3500, manufactured by Kosaka Laboratory), it was 15 μm. As a result, a second transparent substrate 17 was obtained.

(Peel test)
A PET film (Toray Lumirror T60) is attached to one side of a double-sided adhesive tape (MHM-50, manufactured by Niei Engineering Co., Ltd.). Improved. Thereafter, the other surface of the double-sided pressure-sensitive adhesive tape bonded to the PET film was bonded onto the first transparent substrate 16. And the roller which applies a 2 kg load was reciprocated twice on the 1st transparent substrate 16, and the adhesiveness of the 1st transparent substrate 16 and PET film was improved. Thus, the sample of Example 1 was obtained.

  Ten samples of Example 1 were prepared, and the double-sided pressure-sensitive adhesive tape was peeled from the sample so that the adhesive layer formed of the double-sided pressure-sensitive adhesive tape was transferred to the PET film. At this time, if the light-shielding conductive film layer is transferred to the double-sided pressure-sensitive adhesive tape, it is judged that peeling has occurred during rework. If the light-shielding conductive film layer is not transferred to the double-sided pressure-sensitive adhesive tape, It was judged that no peeling occurred. The peel test was performed once for each sample, and a total of 10 tests were performed using all samples. As a result, in Example 1, no peeling of the light-shielding electrode was observed in all 10 sheets.

Comparative Example 1:
A sample of Comparative Example 1 was prepared in the same manner as in Example 1 except that the second transparent substrate 17 was bonded to the other surface of the double-sided pressure-sensitive adhesive tape.

  Ten samples of Comparative Example 1 were prepared, and the double-sided pressure-sensitive adhesive tape was peeled off from the sample in the same manner as in Example 1. The peel test was performed once for each sample, and a total of 10 tests were performed using all samples. As a result, in Comparative Example 1, a part of the light-shielding conductive film layer was transferred to the double-sided adhesive tape in two samples.

  From the above, it was confirmed that the sample of Example 1 was superior to the sample of Comparative Example 1 in adhesion between the extraction wiring and the transparent substrate, and the active area could be expanded.

DESCRIPTION OF SYMBOLS 1 Touch panel 2 Touch panel sensor 3 Flexible board 4 1st extraction wiring 5 1st connection terminal 6 2nd extraction wiring 7 2nd connection terminal 11 Active area 12 Frame area 13 1st frame area 14 2nd frame area 16 First transparent substrate 17 Second transparent substrate 18 Adhesive layer 19 First transparent electrode 20 Second transparent electrode 21 First sensor electrode 22 Second sensor electrode 23 First transparent electrode terminal 24 Second Transparent electrode terminal 61 Adhesion layer

Claims (5)

A touch panel in which a flexible substrate is bonded to a touch panel sensor that detects the position of an object in contact with the surface,
The touch panel sensor
A first transparent electrode in which a plurality of first sensor electrodes are arranged in parallel at a predetermined interval and a plurality of first extraction wirings that include a metal material and are electrically connected to the first sensor electrode are arranged. A first transparent substrate,
A second transparent electrode in which a plurality of second sensor electrodes are arranged in parallel at a predetermined interval in a direction orthogonal to the first sensor electrode; the second sensor electrode including a metal material and a resin material; A second transparent substrate in which a plurality of second extraction wirings to be electrically connected are arranged on one surface;
An adhesive layer that bonds the first transparent substrate and the second transparent substrate;
The other side surface of the second transparent substrate and the surface of the first transparent substrate on which the first transparent electrode and the first extraction wiring are arranged face each other through the adhesive layer. A touch panel, wherein the second transparent substrate is laminated on a first transparent substrate. The touch panel sensor has an active area capable of detecting contact of an object, and a frame area formed around the active area,
The frame region includes a first frame region where a part of the first extraction wiring and a second extraction wiring are arranged, and a part of the first extraction wiring, to which the flexible substrate is bonded. A second frame region to be
The touch panel according to claim 1, wherein a width of the second frame region is formed to be narrower than a width of the first frame region. The first transparent electrode is also formed at a location where the first extraction wiring is arranged on the first transparent substrate,
The touch panel according to claim 1, wherein the first lead-out wiring is disposed so as to be laminated with the first transparent electrode.   2. An adhesion layer for improving adhesion between the first extraction wiring and the first transparent electrode is formed between the first extraction wiring and the first transparent electrode. The touch panel in any one of -3.   A display device comprising the touch panel according to claim 1 in a display unit.

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