TW201109773A - Structure of touch panel and its manufacturing method thereof - Google Patents

Structure of touch panel and its manufacturing method thereof Download PDF

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Publication number
TW201109773A
TW201109773A TW98130608A TW98130608A TW201109773A TW 201109773 A TW201109773 A TW 201109773A TW 98130608 A TW98130608 A TW 98130608A TW 98130608 A TW98130608 A TW 98130608A TW 201109773 A TW201109773 A TW 201109773A
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Taiwan
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touch panel
metal
filling
manufacturing
transparent conductive
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TW98130608A
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Chinese (zh)
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TWI393948B (en
Inventor
Yuan-Zhang Zhang
Kuang-Lung Kuo
Wei-Zhi Xu
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Echem Solutions Corp
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Publication of TWI393948B publication Critical patent/TWI393948B/en

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Abstract

The present invention discloses a structure of touch panel and its manufacturing method thereof. The touch panel comprises a translucent substrate. Wherein, the lower surface of the translucent substrate is disposed with a plurality of lower transparent conductive structures which are alternatively arranged, and the upper surface of the translucent substrate is disposed with a plurality of metal structures and upper transparent conductive structures which are alternatively arranged. The gaps between each of the metal structures are filled with fillers, wherein the thickness difference between the fillers and the metal structures is under the arithmetical ratio of 30%. The upper transparent conductive structures cover the metal structures to protect and prevent the metal structures from being exposed oxide or scratched to make sure the circuit is not short circuit.

Description

201109773 六、發明說明: 【發明所屬之技術領域】 本發明係有關觸控面板結構及其製造方法,旨在提供 -種可保護金屬結構而不會形成氧化,傷,,確保電路不、 會發生短路之觸控面板結構及其製造方&。 【先前技術】 觸控板(Wh Panel)通常被配置在手機、照相機、pDA #等電子產品的顯示幕前方使用’以便增進機具操控及訊號 輸入的便利性;而在各式觸控板種類中,由於電容式觸控 板具有性能穩定、使用壽命長等優點,因此逐漸被廣泛使 用在通訊產品(Communication)、電腦產品(c〇mputer)以及 消費類電子產品(Consumer)等方面;如所知者,習知電容 式觸控板的電容感測結構略係包括一 X轴感應層及一 Y轴 感應層,使X、Y軸感應層絕緣地設置該觸控板體之内,並 將X Y轴感應層分別接地並連接至一控制電路,運作時, 藉由使用者的手指或導體碰觸的瞬間產生一個電容效應, φ ,而可藉由電容值之變化確定手指或導體之位^由於電 谷式觸控板可用手指進行輸入,具有輸入操作的便利性, 而其7入操作不需經過觸壓,不會讓面板有承受反覆應 力、變形導致損害的缺點,所以產品性能穩定、使用壽命 長。 如第—圖所示為一種習有觸控面板之結構示意圖,該 觸控面板1係設有一透光基板11,該透光基板11上表面 設有複數間隔排列之上透明導電結構12 ’以作為X軸感應 層’而該透光基板11下表面設有複數間隔排列之下透明導 201109773 電結,13 ’以作為γ軸感應層,而各上选明導電結構u 並覆蓋有金屬結構14,而各金屬結構14係裸露在外,容 易形成氧化或被刮傷,使得電路無法正常傳遞而形成短 路,進而影響整觸控面板導通之結果。 故出現另種習有結構,如第二圖所示,係進一步於各 金屬結構】4上覆蓋有透明光阻〗5,雖該透明光阻15覆蓋 於各金屬結構14上可形成保護作用’可防止氧化及到傷之 情形’惟’製作透明光阻之步驟係於製作上透明導電結構 之彳^ ’而製作透明光阻需要較高之溫度(例如 150°C〜250°C),此製作溫度會影響上透明導電結構之特 陧,|易產生缺陷,進而影響整觸控面板之特性。 【發明内容】 ,有鑑於此,本發明旨在提供一種可保護金屬結構而不 會形成氧化或刮傷,確保電路不會發生短路之觸控面板結 構及其製造方法。201109773 VI. Description of the Invention: [Technical Field] The present invention relates to a touch panel structure and a method of manufacturing the same, and aims to provide a metal structure that can be protected without oxidizing, injuring, and ensuring that the circuit does not occur. Short-circuit touch panel structure and its manufacturer & [Prior Art] The touch panel (Wh Panel) is usually used in front of the display screen of electronic products such as mobile phones, cameras, and pDA # to improve the convenience of implement control and signal input; and in various types of touch panels. Because capacitive touch panels have the advantages of stable performance and long service life, they are gradually used in communication products, computer products (c〇mputer) and consumer electronics (Consumer); as known The capacitive sensing structure of the conventional capacitive touch panel includes an X-axis sensing layer and a Y-axis sensing layer, so that the X, Y-axis sensing layer is insulatedly disposed inside the touch panel body, and XY is The shaft sensing layers are respectively grounded and connected to a control circuit. When operating, a capacitive effect, φ, is generated by the moment the user touches the finger or the conductor, and the position of the finger or the conductor can be determined by the change of the capacitance value. The electric valley touch panel can be input by fingers, which has the convenience of input operation, and the 7-in operation does not need to be touched, and the panel does not suffer from repeated stress and deformation. Disadvantages, so the stable performance and long service life. FIG. 1 is a schematic view showing a structure of a touch panel. The touch panel 1 is provided with a transparent substrate 11 . The upper surface of the transparent substrate 11 is provided with a plurality of transparent conductive structures 12 ′. As the X-axis sensing layer', the lower surface of the transparent substrate 11 is provided with a plurality of transparent conductive guides 201109773, 13' as a γ-axis sensing layer, and each of the conductive structures u is selected and covered with a metal structure 14 The metal structures 14 are exposed to the outside, and are easily oxidized or scratched, so that the circuit cannot be normally transmitted to form a short circuit, thereby affecting the result of the entire touch panel being turned on. Therefore, another conventional structure appears. As shown in the second figure, the metal structure 4 is covered with a transparent photoresist, and although the transparent photoresist 15 covers the metal structures 14, a protective effect can be formed. It can prevent oxidation and damage. The only step of making a transparent photoresist is to make a transparent conductive structure. To make a transparent photoresist, a higher temperature (for example, 150 ° C to 250 ° C) is required. The manufacturing temperature will affect the characteristics of the transparent conductive structure, and it will easily cause defects, which will affect the characteristics of the entire touch panel. SUMMARY OF THE INVENTION In view of the above, the present invention is directed to a touch panel structure and a method of fabricating the same that can protect a metal structure without forming oxidation or scratches and ensuring that the circuit does not short-circuit.

’、、達上述目的,本發明之觸控面板係設有一透光基 二而该透光基板下表面設有複數間隔排列之下透明導電 =構,其中,該透光基板上表面設有複數間隔排列之金屬 二構上透明導電結構,各金屬結構間係設有填充結 透明ΐ電間之厚度差為±3〇%以内’而上 構來保構上,藉咖^ 化或簡,確保電路不會因此結構因外露而形成氧 【實施方式】 201109773 為能使貴審查委員清楚本發明之主要技術内容’以 及實施方式,茲配合圖式說明如下: 本發明之觸控面板2係設有一透光基板21,如第彡® 所示’該透光基板21設有上、下表面211、212,而該透 光基板下表面212設有複數間隔排列之下透明導電結構 22 ’該下透明導電結構22可以為銦錫氧化物(Indium Tin Oxide,ITO),該透光基板上表面211設有複數間隔排列之 金屬結構23以及上透明導電結構24,各金屬結構23間孫 φ 設有開口 25’各開口 25内係設有填充結構26(可以為透明 光阻),該填充結構26與金屬結構23間之厚度差為±30% 以内,如圖所示之實施例中,該填充結構26之厚度係與該 金屬結構23之厚度相同,而上透明導電結構24則覆蓋於 各金屬結構23上,該上透明導電結構24可以為銦錫氡化 物(Indium Tin Oxide, ΙΤ0)。 而本發明之觸控面板結構製造方法,其係至少包會下 列步驟: 籲步驟A、提供一透光基板21,如第四圖(A)所示; 步驟B、形成複數金屬結構23,藉由濺鍍方式於該透 光基板21 一表面211形成複數金屬結構23,而各金屬結 構23間並形成有開口 25,其中先利用濺鍍方式於該透光 基板表面形成〜金屬膜,再利用黃光製程形成複數金屬結 構; 步驟C、形成填充結構26 ’於各金屬結構23間之開口 25^形成有填充結構26,其中’先於透光基板21設置金 屬結構㈡之表面211塗佈設置填充表層27(可以為透明光 阻)如第四圖(B)所示,該填充表層27係填充於開口 25 201109773 ❿For the above purpose, the touch panel of the present invention is provided with a transparent substrate 2, and the lower surface of the transparent substrate is provided with a plurality of transparent conductive structures under the interval, wherein the upper surface of the transparent substrate is provided with a plurality of transparent conductive structures. The two-layered transparent conductive structure is arranged at intervals, and the thickness difference between the metal structures is filled with a transparent junction and the thickness difference is within ±3〇%, and the upper structure is constructed to ensure the structure, and the coffee is simplified or simplified. The circuit does not form oxygen due to exposure. [Embodiment] 201109773 In order to enable the reviewing committee to understand the main technical contents of the present invention and the embodiments, the following description is given with reference to the following: The touch panel 2 of the present invention is provided with a The light-transmissive substrate 21, as shown in FIG. 2, is provided with 'the upper and lower surfaces 211 and 212, and the lower surface 212 of the transparent substrate is provided with a plurality of transparent conductive structures 22'. The conductive structure 22 may be an indium tin oxide (ITO), and the upper surface 211 of the transparent substrate is provided with a plurality of metal structures 23 arranged at intervals and an upper transparent conductive structure 24, and each of the metal structures 23 is provided with a φ Each of the openings 25 of the opening 25' is provided with a filling structure 26 (which may be a transparent photoresist), and the difference in thickness between the filling structure 26 and the metal structure 23 is within ±30%. In the embodiment shown in the figure, the filling is performed. The thickness of the structure 26 is the same as the thickness of the metal structure 23, and the upper transparent conductive structure 24 covers the metal structures 23, and the upper transparent conductive structure 24 may be Indium Tin Oxide (ΙΤ0). The method for manufacturing the touch panel structure of the present invention comprises at least the following steps: Step A, providing a transparent substrate 21, as shown in the fourth figure (A); Step B, forming a plurality of metal structures 23, A plurality of metal structures 23 are formed on a surface 211 of the transparent substrate 21 by sputtering, and openings 25 are formed between the metal structures 23, wherein a metal film is first formed on the surface of the transparent substrate by sputtering, and then reused. The yellow light process forms a plurality of metal structures; step C, forming a filling structure 26' is formed in the opening 25 of each metal structure 23 with a filling structure 26, wherein the surface 211 of the metal structure (2) is disposed prior to the transparent substrate 21 Filling the surface layer 27 (which may be a transparent photoresist) as shown in the fourth figure (B), the filling surface layer 27 is filled in the opening 25 201109773 ❿

而上述形成填充結樽之 230°C為佳),製作時間1 以及覆蓋於金屬結構23表面;再進行背面曝光,於遷光 板21另側表面212進行曝光,如第四圖(c)所示,教轉基 各金屬結構23作為光罩’並使該填充表層2了形成有由 感光區域271以及未感光區域272 ;最後’可藉由 式移除各未感光區域272,各感光區域則形成填充妹 26,如第四圖(D)所示,且如圖所示之實施例t,讀嗔= 構26可高於該金屬結構23 ’且該填充結構26與金屬社結 23間之厚度差為±30%以内,該金屬結構23以及填充纟:構 26之厚度可以為1000A〜5000A, '" ^ 可 作溫度可控制為15〇t>25(TC (以 為30〜60分鐘(以30分鐘為佳); 步驟D、形成上透明導電結構24,如第四圖(E)所厂 於各金屬結構23上覆蓋有上透明導電結構24 ; $ 步驟E、形成下透明導電結構22,於該透光基板 表面212形成複數間隔排列之下透明導電結構22,知^侧 圖所示。 第三 本發明藉由上透明導電結構24來覆蓋保護該么屈 稱U,可防止該金屬結構23因外露而形成氧化或刮傷Q 確保電路不會因此而短路,進而確保觸控面板導通之鈇 果,且本發明填充結構(透明光阻)之製作步驟係於製作: ,月導電結構之前,故不會影響上透明導電結構之特性, 田然不谷易產生缺陷’而不會影響整觸控面板之特性。 上所述,本發明提供一種觸控面板結構及其製造方 圖’爰依法提呈發明專利之申請;惟,以上之實施說明及 二式所不,係本發明較佳實施例者,並非以此侷限本發明, 疋以,舉凡與本發明之構造、裝置、特徵等近似、雷同者, 201109773 均應屬本發明之創設目的及申請專利範圍之内。 【圖式簡單說明】 第一圖係為習有觸控面板之結構示意圖。 第一圖係為另種習有觸控面板之結構示意圖。 第三圖係為本發明中觸控面板之結構示意圖。 第四圖(A)〜(E)係為本發明中觸控面板之製造流程示意 • 【主要元件代表符號】 觸控面板1 透光基板11 上透明導電結構12 下透明導電結構13 金屬結構14 透明光阻15 觸控面板2 • 透光基板21 上表面211 下表面212 下透明導電結構22 金屬結構23 上透明導電結構24 開口 25 填充結構26 填充表層27 感光區域271 未感光區域272The above-mentioned formation of the filling crucible is preferably 230° C., the production time 1 and the surface of the metal structure 23 are formed; and the back surface exposure is performed, and the other side surface 212 of the light-removing plate 21 is exposed, as shown in the fourth figure (c). The base metal structure 23 is taught as a mask ′ and the filling surface layer 2 is formed with the photosensitive region 271 and the unsensitized region 272; finally, each of the unsensitized regions 272 can be removed by the method, and each photosensitive region is formed. Filling the sister 26, as shown in the fourth diagram (D), and as shown in the embodiment t, the read 嗔 = structure 26 can be higher than the metal structure 23 ' and the thickness of the filling structure 26 and the metal bond 23 The difference is within ±30%, the thickness of the metal structure 23 and the filling structure: the thickness of the structure 26 may be 1000A~5000A, and the temperature can be controlled to 15〇t>25 (TC (for 30~60 minutes) 30 minutes is preferred; Step D, forming a transparent conductive structure 24, as shown in the fourth figure (E), each metal structure 23 is covered with an upper transparent conductive structure 24; $ Step E, forming a lower transparent conductive structure 22, Forming a transparent conductive structure 22 under a plurality of spaced intervals on the transparent substrate surface 212, The third embodiment of the present invention protects the yoke U by the upper transparent conductive structure 24, which prevents the metal structure 23 from being oxidized or scratched due to exposure. Q ensures that the circuit is not short-circuited accordingly. Further, the effect of the touch panel being turned on is ensured, and the manufacturing process of the filling structure (transparent photoresist) of the present invention is performed before: the monthly conductive structure, so that the characteristics of the upper transparent conductive structure are not affected, and the field is not easily generated. The defect does not affect the characteristics of the entire touch panel. As described above, the present invention provides a touch panel structure and a manufacturing method thereof, and an application for presenting a patent for invention; however, the above implementation description and the second formula The present invention is not limited thereto, and the present invention is intended to be similar to the structure, device, features, etc. of the present invention, and 201109773 should be the creation purpose and patent application scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic diagram of the structure of a touch panel. The first figure is a schematic diagram of another structure with a touch panel. The schematic diagram of the structure of the touch panel. The fourth diagrams (A) to (E) are schematic diagrams of the manufacturing process of the touch panel of the present invention. [Main component representative symbol] The touch panel 1 is transparent on the transparent substrate 11 Transparent conductive structure 13 Metal structure 14 Transparent photoresist 15 Touch panel 2 • Transparent substrate 21 Upper surface 211 Lower surface 212 Lower transparent conductive structure 22 Metal structure 23 Upper transparent conductive structure 24 Opening 25 Filling structure 26 Filling surface layer 27 Photosensitive area 271 Unsensed area 272

Claims (1)

201109773 七、申請專利範圍: 1、一種觸控面板結構,該觸控面板係設有一透光基 板’而該透光基板下表面設有複數間隔拆列之下透明導電 結構;其特徵在於: 該透光基板上表面設有複數間隔排列之金屬結構以及 上透明導電結構’各金屬結構間係設有填充洁構’而上透 明導電結構則覆蓋於各金屬結構上。 ''°201109773 VII. Patent application scope: 1. A touch panel structure, the touch panel is provided with a transparent substrate', and the lower surface of the transparent substrate is provided with a plurality of transparent conductive structures under the interval; The upper surface of the transparent substrate is provided with a plurality of metal structures arranged at intervals, and the upper transparent conductive structure is provided with a filling and cleaning structure between the metal structures, and the upper transparent conductive structure covers the respective metal structures. ''° 2、如請求項1所述之觸控面板結構,該上、下透明導 電結構可以為銦錫氧化物(Indium Tin 〇xide,IT〇)。 、、3、如请求項1所述之觸控面板結構,該填充結構可以 為透明光阻。 背項3所述之觸控面板結構,該填充結構㈣ 屬=並藉由各金屬結構作為光軍,形成於“ 之厚缺構’該填充結相 與金構,鮮充結相 7、一種觸控面板結構之製造方 步驟: '’其係至少包含下歹 A、提供一透光基板; B形成複數金屬結辑,於該透 金屬結構’而各金屬結構間並形成基板一表面形成複數 c、形成填充結構,於各金屬結馗開口, 充結構; 間之開口處形成有填 D、形成上透明導電結構,於 屬結構上覆蓋有上透 201109773 明導電結構; E、形成下透明導電結構,於該透光基板另側表面形成 複數間隔排列之下透明導電結構。 8、 如碕求項7所述觸控面板結構之製造方法,該步驟 C進一步包含有下列少雜: C1、於透光基板設置金屬結構之表面設置填充表層, 該填充表層係填充於開口以及覆蓋於金屬結構表面; C2、進行背面曝光,於透光基板另側表面進行曝光, • 並藉由各金屬結構作為光罩,並使該填充表層形成有複數 感光區域以及未感光區域; C3、移除各未感光區域,各感光區域則形成填充結構。 9、 如請求項8所述觸控面板結構之製造方法,該步驟 C3中係藉由顯影方式將未感光區域移除。 1〇、如請求項7或8所述觸控面板結構之製造方法, 該步驟B中係先利用濺鍍方式於該透光基板表面形成一金 屬膜’再利用黃光製程形成複數金屬結構。 • 11、如請求項7或8所述觸控面板結構之製造方法, 該金屬結構以及填充結構之厚度可以為1000A〜5000A。 12、 如請求項7或8所述觸控面板結構之製造方法, 該步驟C中形成填充結構之製作溫度可控制為 15〇C〜25G<t ’製作時間可為30〜60分鐘。 13、 如請求項12所述觸控面板結構之製造方法,該製 作溫度係以23〇°c為佳。 14、 如请求項12所述觸控面板結構之製造方法,該製 作時間係以30分鐘為佳。 15、 如请求項7或8所述觸控面板結構之製造方法, 201109773 該步驟C中該填充結構與金屬結構間之厚度差為±30%以 内。2. The touch panel structure of claim 1, wherein the upper and lower transparent conductive structures are indium tin oxide (IT). 3. The touch panel structure of claim 1, wherein the filling structure is a transparent photoresist. In the touch panel structure described in the back item 3, the filling structure (4) is genus= and is formed by the metal structure as a light army, and is formed in the “thickness of the structure”, the filling phase and the gold structure, the fresh filling phase, and the The manufacturing step of the touch panel structure: ''the system includes at least the lower jaw A, providing a transparent substrate; B forming a plurality of metal junctions, and forming a plurality of surfaces between the metal structures and the metal structures c. forming a filling structure, forming openings in each metal crucible, filling the structure; forming a filled transparent structure at the opening between the openings, and forming a transparent conductive structure on the genus structure; and forming a transparent conductive structure; The transparent conductive structure is formed on the other side surface of the transparent substrate. The method of manufacturing the touch panel structure according to Item 7 further includes the following miscellaneous: C1, The transparent substrate is provided with a surface of the metal structure, and a filling surface layer is filled on the opening and covering the surface of the metal structure; C2, performing back exposure, on the other side of the transparent substrate The surface is exposed, and each metal structure is used as a mask, and the filling surface layer is formed with a plurality of photosensitive regions and an unsensitized region; C3, each unsensitized region is removed, and each photosensitive region forms a filling structure. The method for manufacturing a touch panel structure according to claim 8, wherein the non-photosensitive area is removed by a developing method in the step C3. The manufacturing method of the touch panel structure according to claim 7 or 8, the step In B, a metal film is formed on the surface of the light-transmissive substrate by sputtering. The yellow metal process is used to form a plurality of metal structures. 11. The method for manufacturing a touch panel structure according to claim 7 or 8, the metal The thickness of the structure and the filling structure may be 1000A to 5000A. 12. The manufacturing method of the touch panel structure according to claim 7 or 8, wherein the manufacturing temperature of the filling structure in the step C can be controlled to be 15〇C~25G<t The production time may be 30 to 60 minutes. 13. The manufacturing method of the touch panel structure according to claim 12, wherein the manufacturing temperature is preferably 23 〇 ° C. 14. The touch panel according to claim 12 The manufacturing method of the structure is preferably 30 minutes. 15. The manufacturing method of the touch panel structure according to claim 7 or 8, 201109773 The thickness difference between the filling structure and the metal structure in the step C is ± Within 30%.
TW98130608A 2009-09-10 2009-09-10 Touch panel structure and manufacturing method thereof TWI393948B (en)

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TWI557610B (en) * 2014-05-30 2016-11-11 And a method of manufacturing a conductive substrate of a touch device

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KR20090027779A (en) * 2007-09-13 2009-03-18 한플렉스 주식회사 Pad for preparing touch panel, method of preparing touch panel using the same and touch panel thereby
TWM344544U (en) * 2007-12-25 2008-11-11 Cando Corp Sensory structure of touch panel
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TWI557610B (en) * 2014-05-30 2016-11-11 And a method of manufacturing a conductive substrate of a touch device

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