KR20090027779A - Pad for preparing touch panel, method of preparing touch panel using the same and touch panel thereby - Google Patents

Pad for preparing touch panel, method of preparing touch panel using the same and touch panel thereby Download PDF

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Publication number
KR20090027779A
KR20090027779A KR1020070092851A KR20070092851A KR20090027779A KR 20090027779 A KR20090027779 A KR 20090027779A KR 1020070092851 A KR1020070092851 A KR 1020070092851A KR 20070092851 A KR20070092851 A KR 20070092851A KR 20090027779 A KR20090027779 A KR 20090027779A
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KR
South Korea
Prior art keywords
touch panel
coating layer
layer
pad
conductive material
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Application number
KR1020070092851A
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Korean (ko)
Inventor
박준영
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한플렉스 주식회사
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Priority to KR1020070092851A priority Critical patent/KR20090027779A/en
Publication of KR20090027779A publication Critical patent/KR20090027779A/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Abstract

A pad for preparing a touch panel, a method of preparing the touch panel by using the same and the touch panel are provided to prevent bubbles on an adhesive surface during connection of adhesive layers by minimizing steps. An insulator layer(100) is made of an organic insulator or an inorganic insulator. A conductive material coating layer(200) is formed on an upper side of the insulator layer. A metal coating layer(300) is formed in an upper side of the conductive material coating layer. An organic insulator of the insulator layer is formed in 10 through 1000 micrometer. The inorganic insulator of the insulator layer is formed in 100 through 3000 micrometer. The conductive material coating layer is formed in 0.005 through 0.1 micrometer. The metal coating layer is formed in 0.01 through 10 micrometer.

Description

Pad for touch panel manufacturing, touch panel manufacturing method using the same and touch panel manufactured by the same {PAD FOR PREPARING TOUCH PANEL, METHOD OF PREPARING TOUCH PANEL USING THE SAME AND TOUCH PANEL THEREBY}

The present invention relates to a pad for manufacturing a touch panel, a method for manufacturing a touch panel using the same, and a touch panel manufactured by the same, which can be manufactured by a simpler process than a conventional silver paste process, thereby facilitating manufacturing and reducing manufacturing costs. In addition to the reduction, finer wire formation is possible, making it possible to manufacture a compact device.In particular, in the case of a capacitive touch panel, minimizing the level difference prevents defects such as bubbles in the mating surface when bonding the adhesive layer. The present invention relates to a touch panel manufacturing pad capable of implementing a touch panel having a high resolution, a touch panel manufacturing method using the same, and a touch panel manufactured thereby.

In the case of a pad used for manufacturing a general touch panel, it is made of glass coated with ITO (for resistive type) or insulating resin (for capacitive type). In general, silver paste is used for electrical connection.

However, in the case of conducting wire formation using the silver paste, the thickness of the conducting wire becomes thick because there is a limit in applying the silver paste thinly, and a step difference occurs in the up and down direction, and the width of the conducting wire in the planar direction becomes wide. Therefore, the durability of the touch panel is reduced, and the density of devices is decreased. In the case of the silver paste process, a process of curing the silver paste after applying it at a high temperature is needed. In order to prevent deformation of the panel in the process also requires an annealing process is a complicated process, there is a problem that the cost increases.

That is, in the case of the resistive film type, when the step height is large, the separation distance between the upper plate and the lower plate increases, thereby increasing the amount of warpage of the panel, thereby deteriorating durability, and generating a Newton ring. As shown in FIG. 1, the panel includes a screening part that is coupled to the upper surface of the touch pad upper housing 50 made of an upper dielectric (insulator) and the lower edge thereof to cover the silver paste electrode. 55) and a portion of the window that is to be touch-sensitive (a portion of the window that is not a screening portion) is coated with a transparent conductive material such as ITO on the upper portion of the dielectric film 10 made of PET bonded to the lower portion thereof. The conductive paste coating layer 20 and the silver paste electrode unit 30 coupled to the edge thereof to transmit the electrical signal to the controller. The lower panel portion and the adhesive layer (OCA) 40 for coupling the window portion (corresponding to the upper panel portion) and the lower panel portion are laminated and bonded as shown in the figure. The touch panel of the type is required to be transparent because the LCD is additionally coupled to the bottom thereof, and the screening unit may not be required because it is not required to be transparent in the case of a touch pad of a notebook. In the case of the conventional capacitive touch panel, since a silver paste is added to the upper portion of the ITO layer, a layer having a high step is formed on the PET as shown. Therefore, bubbles remain in the process of bonding the adhesive layer and the window portion, there is a problem that often causes a defect, there is a difficulty in manufacturing a thin device by increasing the overall height of the touch panel.

In addition, in forming the electrode, since the silver paste is used, there is a limit in finely decorating the electrode pattern, which makes it difficult to manufacture a touch panel having a high resolution.

In order to solve the problems as described above, the present invention can be manufactured in a simpler process than the conventional process to apply the silver paste, to facilitate the manufacturing, to reduce the manufacturing cost, it is possible to form a finer wire It is possible to manufacture a compact device, improve durability by minimizing step, and in particular, in case of capacitive touch panel, minimizing such step prevents defects such as bubbles in the mating surface when bonding the adhesive layer, and high resolution. An object of the present invention is to provide a touch panel manufacturing pad capable of implementing a touch panel having a touch panel, a touch panel manufacturing method using the same, and a touch panel manufactured by the same.

In order to achieve the above object, the present invention

An insulator layer made of an organic insulator or an inorganic insulator;

A conductive material coating layer formed on an upper surface of the insulator layer; And,

It provides a touch panel manufacturing pad comprising a metal coating layer formed on the upper surface of the conductive material coating layer.

In addition, the present invention

In the manufacturing method of the touch panel,

A first step of manufacturing a pad having a metal pattern by partially etching the metal coating layer on an upper surface of the pad for manufacturing the touch panel; And,

i) bonding an insulator layer composed of an adhesive layer and an insulating resin to the upper surface of the pad on which the pattern is formed, or ii) inverting the other pads having the pattern on the upper surface of the pad on which the pattern is formed to be spaced apart from each other vertically It provides a method of manufacturing a touch panel comprising the step.

Finally, the present invention

In the capacitive touch panel,

I) manufactured by the method for manufacturing a touch panel, the insulator layer having a thickness of 10 to 3000 μm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer with a thickness of 0.005 to 0.1 μm, and the conductive material A pad formed of a metal coating layer having a pattern formed on the top surface of the coating layer in a thickness of 0.01 to 10 μm;

An adhesive layer bonded to an upper surface of the pad; And,

A capacitive touch panel comprising a dielectric layer made of an insulating resin bonded to an upper surface of the adhesive layer;

Also

In the resistive touch panel,

Ii) an insulator layer manufactured by a method of manufacturing a touch panel and having a thickness of 10 to 3000 μm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer with a thickness of 0.005 to 0.1 μm, and the conductive material A lower surface pad formed on the top surface of the coating layer in a thickness of 0.01 to 10 μm and formed of a metal coating layer having a pattern;

A separation film layer bonded to the top edge of the pad; And,

It is bonded to the upper surface of the separation film layer, and is manufactured by the method of manufacturing the touch panel, the insulator layer having a thickness of 10 to 3000 ㎛, formed on the lower surface of the insulator layer with a thickness of 0.005 to 0.1 ㎛ pattern The formed conductive material coating layer, and a lower surface of the conductive material coating layer is formed to a thickness of 0.01 to 10 ㎛ provides a resistive touch panel comprising a top pad made of a metal coating layer pattern is formed.

According to the touch panel manufacturing pad of the present invention, the touch panel manufacturing method using the same and the touch panel manufactured by the same, the high temperature curing process and the annealing process can be omitted as compared to the process using the conventional silver paste, it is manufactured in a simpler process It is possible to facilitate the manufacturing, to reduce the manufacturing cost and to obtain the effect of reducing the defective rate according to the simplification of the process.

In addition, by patterning the metal layer through a photolithography method, it is possible to form finer conductors and to manufacture a compact device. Since wiring can be arranged at a narrow pitch, the display area can be minimized by minimizing the margin margin of the panel. It is possible to increase the durability by minimizing the step, and in particular in the case of capacitive touch panels, through the minimization of the step to prevent defects such as bubbles in the bonding surface when the adhesive layer is bonded, and the metal layer photolithography method Through the patterning through it is possible to implement a touch panel having a high resolution.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various modifications and changes made by those skilled in the art without departing from the spirit and scope of the present invention described in the claims below. Changes are also included within the scope of the invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to a pad for manufacturing a touch panel and includes an insulator layer 100 made of an organic insulator or an inorganic insulator, a conductive material coating layer 200 formed on an upper surface of the insulator layer 100, and the conductive material coating layer 200. It is configured to include a metal coating layer 300 is formed on the upper surface.

Specific embodiments thereof are as shown in FIGS. 2 to 4. That is, for example, in the case of a conventional touch panel, i) in the case of a capacitance method, in a dielectric film (organic insulator), for example in a PET film, and ii) in the case of a resistive method, in the case of a glass (inorganic insulator), When the material is supplied to the producer by coating a conductive material coating layer, for example, ITO, IZO or ATO on the upper surface, it is applied to the ITO film annealing, PR coating for pattern formation on the ITO layer, exposure, development, etching, strip, etc. Photolithography process, including a guide processing for holding a standard to form a silver paste pattern on the upper surface formed with the ITO pattern, silver paste printing based on the processed guide and a high temperature curing process for curing the silver paste Through the process to complete the lower panel as shown in Figure 1, in the case of the touch panel manufacturing pad of the present invention, the pad supplied in accordance with the present invention is The conductive material coating layer including ITO or the like on the upper surface of the insulator layer has a metal coating layer formed on the upper surface thereof, so that the above-described guide processing and silver paste, which have been performed when the conventional silver face is used, are cured. There is no need for a curing process or the like, and therefore, there is no need for an annealing process, which is a pretreatment step for preventing film deformation during the curing, and to form a pattern directly by each or a separate photolithography process for two layers of the upper surface. Since the process is completed, when using the touch panel manufacturing pad of the present invention, the process can be greatly shortened, and it can be seen that the number of equipment to be provided can be significantly reduced.

If the touch panel manufactured by using the touch panel manufactured by using this is used in combination with the LCD, the display panel such as the lower LCD should be seen, so that the dielectric film and the conductive material are made of a transparent material, and the metal coating layer is In the future etching process, it is located at the edge part and the outer part of the device, and only the connection line for transmitting electrical signals from the electrode and the wire to the outside should be left, and if it is not necessary to have a translucent like the touch panel of the notebook PC, the dielectric film and The conductive material may be made of an opaque material, and the metal coating layer may form various electrode patterns and connecting lines drawn out from the entire pad area in order to increase the sensitivity and accuracy of the touch panel in an etching process in the future. have.

Preferably, when the touch panel is used in combination with an LCD or the like, the insulator layer 100 is a transparent material as an organic insulator or an inorganic insulator, and the organic insulator is more preferably polyimide or polyethylene terephthalate (PET). Or a transparent or opaque organic insulator comprising polycarbonate (PC) or made of polyimide or polyethylene terephthalate (PET) or polycarbonate (PC), and the inorganic insulator is more preferably made of glass. In addition, the conductive material of the conductive material coating layer 200 is a transparent material, more preferably it is a transparent conductive material containing ITO or IZO or made of ITO or IZO in terms of excellent properties and ease of manufacture.

In addition, the metal coating layer 300 may correspond to a variety of known metals as the material, preferably copper or aluminum in consideration of ease of manufacture and electrical conductivity. In addition, various known methods may be applied to the formation of such a metal coating layer, and in order to be coated with a thin thickness, it is preferable that the coating is performed through deposition or sputtering including conventional vapor deposition. .

The pad for manufacturing a touch panel formed as described above is as shown in FIG. 2A and FIG. 3A, and specific examples thereof. The pad for manufacturing a touch panel is a touch panel through a manufacturing method described below. It is formed of a contact panel.

In addition, the insulator layer, the conductive material coating layer and the metal coating layer is made of 10 to 1000 ㎛ in the case of an organic insulator, in the case of an inorganic insulator for durability of the panel, ease of manufacturing during etching of each layer, minimizing the step Is made of 100 to 3000 ㎛, the conductive material coating layer is made of 0.005 to 0.1 ㎛, the metal coating layer is preferably made of 0.01 to 10 ㎛, as described above the metal coating layer 300 and the conductive material coating layer ( 200), in particular, in the case where the thickness of the ITO may be easily manufactured in the etching process, having a thickness in the above range reduces the process and facilitates manufacturing, and the thickness of the insulator layer 100 is within the above range. Durability can be secured. More preferably, the metal coating layer 300 has a thickness of 0.5 to 0.6 μm, and when the conductive material coating layer 200 is ITO, the thickness of the ITO layer is 0.01 to 0.02 μm. The thickness of the insulator layer 100 is 50 to 175 μm when the insulator layer is an organic insulator, which is suitable for easy assembly with the device and manufacturing of a compact size device.

The present invention also provides a method for manufacturing a touch panel including a resistive film type and a capacitive type using the touch panel manufacturing pad, which can be applied to both a touch panel having a light transmitting portion and a touch panel not having a light transmitting portion. In the method of manufacturing a touch panel, the first step of manufacturing a pad with a metal pattern by partially etching the metal coating layer on the upper surface of the pad for manufacturing the touch panel described above, i) On the upper surface of the pad on which the pattern is formed Bonding the adhesive layer 400 and the dielectric layer (combination of 500 or 500/550) made of an insulating resin, or ii) the other pad is formed on the upper surface of the pad formed with the pattern to be spaced apart from each other by bonding upside down It consists of two steps.

That is, the metal coating layer formed on the uppermost surface of the pad for manufacturing the touch panel of the present invention described above may be partially etched to leave only the patterns corresponding to the electrodes and the wires. This is as shown in the specific example in step (b) of FIG. 2 or (b) of FIG.

In addition, if necessary, the conductive material exposed to the surface may be further etched according to the etching of the metal coating layer to further form a pattern of the conductive material coating layer. Thus, after the first step process, the upper surface of the pad on which the metal pattern is formed is formed. The method may further include manufacturing a pad on which the conductive material coating layer is partially etched to form a metal pattern and a pattern of the conductive material coating layer. This is as shown in the specific example in step (c) of Figure 2 or (c) of FIG. This is not an essential process and may be omitted when the pattern formation of the conductive material coating layer is not required separately.

Separate etching of the metal coating layer and the conductive material coating layer may be performed in a variety of known manners, and specific examples thereof may include copper when the metal coating layer is ITO, and copper etching may be performed using NaOH aqueous solution. , ITO can be etched separately by etching through an aqueous solution of FeCl 3 . For this partial etching, a conventional photolithography method or other various partial etching methods may be applied, and the pattern formed here generally corresponds to the surface on which the touch panel is touched in the case of a conductive material coating layer. This is to form the shape of the conductive material coating layer to the surface, and in the case of the metal coating layer to form an electrode on top of the conductive material coating layer only in the edge portion of the case having a light transmitting portion (for example 2 to 4, the electrode shown in FIGS. 2 to 4 are broken in the longitudinal direction and formed into a plurality of electrodes). When the electrode does not have a light-transmitting part, a touch position may be detected on the upper surface of the conductive material coating layer. Patterns can be formed in the form.

As described above, in the case of the capacitive type, the pad having the pattern formed thereon is an insulator layer 500 or 500 made of an adhesive layer 400 and an insulating resin on the upper surface of the pad on which the pattern is formed. / 550) is performed. 2 and 4 illustrate the case of having a light transmitting unit, otherwise, the blocking unit (screening unit) 550 as shown in the drawing becomes unnecessary and can be combined in a form except for this.

In addition, in the case of a capacitive touch panel manufacturing panel having a light-transmitting part, as shown in the drawings, a method of manufacturing a capacitive touch panel, the dielectric as the pad for manufacturing the capacitive touch panel described above. The film is a transparent dielectric film comprising polyimide or polyethylene terephthalate (PET) or polycarbonate (PC), the conductive material is a transparent conductive material including ITO or IZO, and the metal coating layer is formed by deposition or sputtering A pattern is formed by partially etching the upper surface of the pad for manufacturing the capacitive touch panel as aluminum or copper.

In the case of manufacturing a resistive touch panel, as illustrated in FIG. 3, a second pad having the pattern formed on the upper surface of the pad on which the pattern is formed is turned upside down to be spaced apart from each other vertically. It can be prepared by performing the steps. The separation of the two pads formed with the opposite pattern may be configured to include a separation film layer at the edge as shown, or may be configured by arranging spacers in a space at a constant price.

In addition, the present invention provides a capacitive touch panel and a resistive touch panel manufactured by the manufacturing method as described above, which is manufactured by the manufacturing method of the touch panel as described above, the structure is first In the case of the capacitive touch panel, the capacitive touch panel is manufactured by the manufacturing method of the touch panel indicated by i) in the second step, and has an insulator layer 100 having a thickness of 10 to 3000 µm, and the insulator. A conductive material coating layer 200 having a pattern formed on the top surface of the layer 100 with a thickness of 0.005 to 0.1 μm, and a metal having a pattern formed on the top surface of the conductive material coating layer 200 with a thickness of 0.01 to 10 μm A pad made of a coating layer 300, an adhesive layer 400 bonded to an upper surface of the pad, and a dielectric layer 500 made of an insulating resin bonded to an upper surface of the adhesive layer 400. Is configured to include a combination 500/550). The conductive material coating layer 200 may be subjected to an etching step or may be omitted. In addition, preferably, the insulator layer 100 is made of 10 to 1000 μm in the case of an organic insulator, and of 100 to 3000 μm in the case of an inorganic insulator.

This is shown as a specific embodiment in Figure 4, the electrode in Figure 4 may be of integral length in the longitudinal direction, it can be composed of a plurality of electrodes separated into several. In the case shown in the drawing, a touch panel having a light transmitting portion is a schematic diagram in which the connection line from the electrode to the outside is omitted. Here, the conductive material (ITO) layer preferably has a structure slightly larger than the light transmitting portion of the insulator layer 500, the metal electrode may be disposed on the conductive material (ITO) layer as shown.

Through this, the blocking layer serves to shield the electrode and the lead wires connected to the electrodes (of course, the lead wires may be formed through partial etching of the metal coating layer). The blocking layer may be treated on the lower part of the insulator layer as shown, or may be treated on the upper part thereof.

Next, in the case of the resistive film method, in the resistive touch panel, the insulator layer 100 having a thickness of 10 to 3000 μm is manufactured by the manufacturing method of the touch panel indicated by ii) of the second step. A conductive material coating layer 200 having a pattern formed on the top surface of the insulator layer 100 with a thickness of 0.005 to 0.1 μm, and a pattern having a thickness of 0.01 to 10 μm formed on the top surface of the conductive material coating layer 200. A bottom pad made of the metal coating layer 300 formed thereon, the separation film layer 600 bonded to the top edge of the pad, and the second film bonded to the top surface of the separation film layer 600, and are represented by ii) of the second step. A conductive material coating layer 200 formed by a method of manufacturing a touch panel, having an insulator layer 100 having a thickness of 10 to 3000 μm, and having a thickness of 0.005 to 0.1 μm formed on a lower surface of the insulator layer 100. ), When the coating layer of the conductive material 200 is formed to a thickness of 0.01 to 10 ㎛ to be composed including a top pad made of a metal coating layer 300, the pattern is formed coming. The conductive material coating layer 200 may be subjected to an etching step or may be omitted. In addition, preferably, the insulator layer 100 is made of 10 to 1000 μm in the case of an organic insulator, and of 100 to 3000 μm in the case of an inorganic insulator.

A specific example of this may correspond to an assembly in which these are assembled in step (d) of FIG. 3.

1 is a schematic cross-sectional view of a conventional analog type capacitive touch panel.

2 is a view schematically showing an embodiment of the case of the capacitive touch panel of the touch panel manufacturing pad and a touch panel manufacturing method using the same of the present invention.

3 is a view schematically showing an embodiment of the case of the resistive touch panel of the touch panel manufacturing pad and a touch panel manufacturing method using the same of the present invention.

FIG. 4 is a schematic view showing an embodiment of the touch panel of the present invention shown in FIG. 2 from the front.

Explanation of symbols on the main parts of the drawings

10: dielectric film 20: ITO layer

30: silver paste electrode 40: adhesive layer (OCA)

50: touch pad top housing 55: screening unit

100: insulator layer 200: conductive material coating layer

300: metal coating layer 400: adhesive layer

500: dielectric layer (touch pad) 550: blocking layer

600: separation film layer

Claims (10)

An insulator layer made of an organic insulator or an inorganic insulator; A conductive material coating layer formed on an upper surface of the insulator layer; And, Pad for manufacturing a touch panel comprising a metal coating layer formed on the upper surface of the conductive material coating layer. The method of claim 1, The organic insulator or the inorganic insulator of the insulator layer is a transparent material, The conductive material of the conductive material coating layer is also a transparent material, The metal of the metal coating layer is copper or aluminum, The touch panel manufacturing pad is a touch panel manufacturing pad, characterized in that formed by the touch panel of the touch panel. The method of claim 1, The organic insulator is a transparent or opaque organic insulator made of polyimide or polyethylene terephthalate (PET) or polycarbonate (PC), the inorganic insulator is a transparent inorganic insulator made of glass, and the conductive material is a transparent made of ITO or IZO. The conductive material, the metal coating layer is a pad for manufacturing a touch panel, characterized in that the copper or aluminum formed by deposition or sputtering. The method of claim 1, The insulator layer is made of 10 to 1000 ㎛ in the case of an organic insulator, of 100 to 3000 ㎛ in the case of an inorganic insulator, The conductive material coating layer is made of 0.005 to 0.1 ㎛, The metal coating layer is a pad for manufacturing a touch panel, characterized in that consisting of 0.01 to 10 ㎛. In the manufacturing method of the touch panel, A first step of manufacturing a pad with a metal pattern by partially etching the metal coating layer on the upper surface of the pad for manufacturing the touch panel of any one of claims 1 to 4; And, i) bonding a dielectric layer made of an adhesive layer and an insulating resin to an upper surface of the pad on which the pattern is formed, or ii) inverting the other pads having the pattern on the upper surface of the pad on which the pattern is formed to be spaced apart from each other vertically Method of manufacturing a touch panel comprising a. The method of claim 5, Between the first and second steps And partially etching the conductive material coating layer on the upper surface of the pad on which the metal pattern is formed to manufacture a pad having a pattern of the metal pattern and the conductive material coating layer. In the capacitive touch panel, I) an insulator layer having a thickness of 10 to 500 μm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer having a thickness of 0.005 to 0.1 μm, and a pattern formed thereon; A pad formed on a top surface of the conductive material coating layer having a thickness of 0.01 to 10 μm and having a patterned metal coating layer; An adhesive layer bonded to an upper surface of the pad; And, Capacitive touch panel comprising a dielectric layer made of an insulating resin coupled to the upper surface of the adhesive layer. In the resistive touch panel, Ii) an insulator layer having a thickness of 10 to 500 μm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer having a thickness of 0.005 to 0.1 μm, and a pattern formed thereon; A bottom pad formed on the top surface of the conductive material coating layer with a thickness of 0.01 to 10 μm and formed of a metal coating layer having a pattern formed thereon; A separation film layer bonded to the top edge of the pad; And, Bonded to the upper surface of the separation film layer, is prepared by the method of manufacturing the touch panel ii) of claim 5, the insulator layer having a thickness of 10 to 500 ㎛, the thickness of 0.005 to 0.1 ㎛ on the lower surface of the insulator layer A resistive touch panel comprising a top surface pad formed of a conductive material coating layer having a pattern formed thereon and a metal coating layer having a pattern formed on the bottom surface of the conductive material coating layer having a thickness of 0.01 to 10 μm. In the capacitive touch panel, I) manufactured by the method of manufacturing a touch panel of claim 6, wherein the insulator layer has a thickness of 10 to 500 µm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer with a thickness of 0.005 to 0.1 µm, and the A pad formed on a top surface of the conductive material coating layer having a thickness of 0.01 to 10 μm and having a patterned metal coating layer; An adhesive layer bonded to an upper surface of the pad; And, Capacitive touch panel comprising a dielectric layer made of an insulating resin coupled to the upper surface of the adhesive layer. In the resistive touch panel, Ii) an insulator layer having a thickness of 10 to 500 μm, a conductive material coating layer having a pattern formed on the top surface of the insulator layer having a thickness of 0.005 to 0.1 μm, and a pattern formed by the method of claim 6 A bottom pad formed on the top surface of the conductive material coating layer with a thickness of 0.01 to 10 μm and formed of a metal coating layer having a pattern formed thereon; A separation film layer bonded to the top edge of the pad; And, It is bonded to the upper surface of the separation film layer, is prepared by the method of manufacturing the touch panel ii) of claim 6, formed with an insulator layer having a thickness of 10 to 500 ㎛, a thickness of 0.005 to 0.1 ㎛ on the lower surface of the insulator layer And a pattern pad having a conductive material coating layer formed on the bottom surface of the conductive material coating layer, and an upper surface pad formed of a metal coating layer having a pattern formed on the bottom surface of the conductive material coating layer.
KR1020070092851A 2007-09-13 2007-09-13 Pad for preparing touch panel, method of preparing touch panel using the same and touch panel thereby KR20090027779A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010117186A2 (en) * 2009-04-07 2010-10-14 Cho Han Yong Window panel integrated resistive touch sensor
WO2010120073A2 (en) * 2009-04-16 2010-10-21 Park Jun-Young Pad for a touch panel, method for manufacturing a touch panel using same, and touch panel manufactured by the method
WO2011149199A2 (en) * 2010-05-25 2011-12-01 전자부품연구원 Touch panel using a metal thin film, and method for manufacturing same
TWI393948B (en) * 2009-09-10 2013-04-21 Echem Solutions Corp Touch panel structure and manufacturing method thereof
KR101383649B1 (en) * 2011-02-17 2014-04-09 박준영 Method of Preparing Pad for Touch Panel
KR101467445B1 (en) * 2014-04-15 2014-12-02 룩씨스 주식회사 Method for manufacturing LCD window

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010117186A2 (en) * 2009-04-07 2010-10-14 Cho Han Yong Window panel integrated resistive touch sensor
WO2010117186A3 (en) * 2009-04-07 2011-01-20 Cho Han Yong Window panel integrated resistive touch sensor
WO2010120073A2 (en) * 2009-04-16 2010-10-21 Park Jun-Young Pad for a touch panel, method for manufacturing a touch panel using same, and touch panel manufactured by the method
WO2010120073A3 (en) * 2009-04-16 2011-01-20 Park Jun-Young Pad for a touch panel, method for manufacturing a touch panel using same, and touch panel manufactured by the method
KR101383673B1 (en) * 2009-04-16 2014-04-09 박준영 Pad for preparing touch panel, method of preparing touch panel using the same and touch panel thereby
TWI393948B (en) * 2009-09-10 2013-04-21 Echem Solutions Corp Touch panel structure and manufacturing method thereof
WO2011149199A2 (en) * 2010-05-25 2011-12-01 전자부품연구원 Touch panel using a metal thin film, and method for manufacturing same
WO2011149199A3 (en) * 2010-05-25 2012-01-19 전자부품연구원 Touch panel using a metal thin film, and method for manufacturing same
KR101383649B1 (en) * 2011-02-17 2014-04-09 박준영 Method of Preparing Pad for Touch Panel
KR101467445B1 (en) * 2014-04-15 2014-12-02 룩씨스 주식회사 Method for manufacturing LCD window

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