KR101049891B1 - Pad for manufacturing touch panel and assembly to which PCB is bonded - Google Patents

Abstract

When the pad for manufacturing the touch panel and the printed circuit board are bonded, the metal of the lead wire may be prevented from being oxidized by being exposed to the air, and thus, the pad for manufacturing the touch panel, which may prevent the resistance value variation due to the oxidation of the metal lead wire, and the printing thereon An assembly in which a circuit board is coupled is provided. The pad for manufacturing a touch panel includes an insulator layer made of an organic insulator or an inorganic insulator; A conductive material coating layer formed on an upper surface of the insulator layer to form a touch region; Lead wires drawn from the conductive material coating layer to the edge of the insulator layer; An end of the insulator layer edge side of the lead wire is a metal lead wire layer formed in the inorganic or organic conductive material layer and an upper surface thereof spaced inward from the end of the insulator layer edge side; And an insulating film layer attached to an upper surface of the pad to cover the metal lead wire layer, wherein the lead wire is a double layer including an inorganic or organic conductive material layer and a metal lead wire layer except for the entirety of the lead wire.

Touch panel, metal, oxide

Description

Pad for manufacturing touch panel and assembly with printed circuit board {PAD FOR PREPARING TOUCH PANEL AND ASSEMBLY OF PCB WITH THE SAME}

The present invention relates to a pad for manufacturing a touch panel and an assembly in which a printed circuit board is coupled thereto, and the metal of the lead wire can be prevented from being exposed to air and oxidized when the pad for manufacturing a conventional touch panel and the printed circuit board are combined. Accordingly, the present invention relates to a pad for manufacturing a touch panel capable of preventing a change in resistance due to oxidation of a metal lead wire, and an assembly in which a printed circuit board is coupled thereto.

A general touch panel is manufactured by using a touch panel pad for manufacturing the pad. The pad generally has a structure in which a touch area and a lead wire for transmitting an electrical signal from the touch area to the outside are formed. The input signal obtained through the PCB transmits an electrical signal to an external circuit through a printed circuit board connected to the lead wire end of the pad, in particular, an FPCB.

In a specific example of the pad for manufacturing the touch panel, the portion corresponding to the touch area is generally transparent conductive oxide (TCO) or transparent such as indium tin oxide (ITO), indium zinc oxide (IZO), or the like in order to secure light transmittance. Transparent conductive materials such as conductive polymer materials are formed by coating on insulating resins such as glass or polyimide (PI), polyethylene terephthalate (PET), polyethylene (PE), and the like. In addition, the touch area is generally formed to have a predetermined pattern of the material layer such as ITO according to a certain purpose. For example, in the case of the resistive film method, such a pattern is used to partition the touch area, and in the case of the capacitive method, a complex repetitive pattern may be formed on the insulating resin in a constant pattern to obtain a coordinate value.

Next, a lead wire for connecting the touch area formed as described above and an external printed circuit board is mainly used as a metal wire such as copper, aluminum, or silver, and an end thereof connects a pad for manufacturing a touch panel with an external printed circuit board. It serves as a connection electrode.

Here, the ends of the lead wires must be electrically connected to the printed circuit board as described above, and thus have a structure that is essentially exposed to air, these metal lead wires. In particular, when the copper wiring is exposed to air for a long time, oxidation of the wiring occurs, causing a change in resistance value according to the usage time of the device, thereby affecting device operation. Therefore, the development of a touch panel manufacturing pad that can solve this problem is urgently needed.

In order to solve the above problems, an object of the present invention is to prevent the metal of the lead wire is exposed to air and oxidized when the pad and the printed circuit board bonding of the touch panel manufacturing, the resistance according to the oxidation of the metal lead wire The present invention provides a pad for manufacturing a touch panel capable of preventing a value change and an assembly in which a printed circuit board is coupled thereto.

In order to achieve the above object, the pad for manufacturing a touch panel according to the present invention, the insulator layer made of an organic insulator or an inorganic insulator; A conductive material coating layer formed on an upper surface of the insulator layer to form a touch area; Lead wires drawn from the conductive material coating layer to an edge of the insulator layer; An end portion of the lead wire on the edge side of the insulator layer may include an inorganic or organic conductive material layer and a metal lead wire layer formed on an upper surface thereof and spaced inward from an end of the edge edge of the insulator layer on an upper surface thereof; And an insulating film layer attached to an upper surface of the pad to cover the metal lead wire layer, wherein the lead wire is a double layer including the inorganic or organic conductive material layer and the metal lead wire layer except for the entirety of the lead wire. do.

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In addition, the assembly of the touch panel manufacturing pad and the printed circuit board according to the present invention, the touch panel manufacturing pad; And a printed circuit board electrically connected to an upper surface of the inorganic or organic conductive material layer or an upper surface of the metal layer for connecting the printed circuit board, which is opened at an end of the edge of the insulator layer of the lead wire of the pad for manufacturing the touch panel. The pad for manufacturing the touch panel, the insulator layer made of an organic insulator or an inorganic insulator; A conductive material coating layer formed on an upper surface of the insulator layer to form a touch area; Lead wires drawn from the conductive material coating layer to an edge of the insulator layer; An end portion of the lead wire on the edge side of the insulator layer may include an inorganic or organic conductive material layer and a metal lead wire layer formed on an upper surface thereof and spaced inward from an end of the edge edge of the insulator layer on an upper surface thereof; And an insulating film layer attached to an upper surface of the pad to cover the metal lead wire layer, wherein the lead wire is a double layer including the inorganic or organic conductive material layer and the metal lead wire layer except for an end thereof. do.

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According to the present invention, in order to prevent the metal of the lead wire from being exposed to the air and oxidized when the pad for the touch panel manufacturing pad and the printed circuit board are combined, an organic or inorganic conductive material having excellent corrosion resistance is applied thereto and the organic or inorganic It is possible to improve low conductivity and low toughness which are disadvantages of the conductive material. Accordingly, it is possible to prevent variations in resistance due to durability of the touch panel and oxidation of the metal lead wire.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
1 is a schematic partial plan view of a pad for manufacturing a touch panel according to an embodiment of the present invention and a left side view thereof (for two embodiments), and FIG. 2 is a pad and a printed circuit for manufacturing a touch panel according to an embodiment of the present invention. Figure is a schematic diagram showing the assembly process of the substrate.

Referring to FIG. 1, a pad for manufacturing a touch panel according to an exemplary embodiment of the present invention may include an insulator layer 10 formed of an organic insulator or an inorganic insulator, and a conductive material coating layer formed on an upper surface of the insulator layer 10 to form a touch area. And a lead wire 30 drawn from the conductive material coating layer 20 to the edge of the insulator layer 10, wherein the insulator layer 10 of the lead wire 30 is formed. The end of the edge side is made of an inorganic or organic conductive material layer 32 and a metal lead wire layer 34 formed spaced inward from the end of the edge side of the insulator layer 10 on the upper surface thereof, and on the upper surface of the pad It further comprises an insulating film layer 40 attached to cover the metal lead wire layer 34.

A specific embodiment thereof is as shown in FIG. 1. That is, the structure of a touch panel manufactured through a pad for manufacturing a touch panel is generally known through a plurality of patents filed by the present applicant, and thus the touch panel manufacturing pad applied to the manufacture of a touch panel is described in the above description. As described above, an insulator layer 10 made of an organic insulator or an inorganic insulator, a conductive material coating layer 20 formed on an upper surface of the insulator layer 10 to form a touch region, and the insulator layer from the conductive material coating layer 20 And a lead wire 30 drawn out to the edge of 10.

Here, the organic insulator or the inorganic insulator may be a resin or glass applied to various known pads for manufacturing touch panels, and preferably, when the touch panel is used in combination with an LCD, the insulator layer 10 may be used. Silver is a transparent material as an organic insulator or an inorganic insulator, and more preferably, the organic insulator comprises polyimide or polyethylene terephthalate (PET) or polycarbonate (PC) or polyimide or polyethylene terephthalate (PET) or polycarbonate ( It is a transparent or opaque organic insulator made of PC), and the inorganic insulator is more preferably made of glass in view of its characteristics.

In addition, the conductive material coating layer 20 may correspond to a variety of known organic or inorganic conductive materials applied to the pad for manufacturing a touch panel, preferably, they are advantageous when integrated with the display device made of a transparent material. More preferably, the organic conductive material corresponds to a conductive polymer, and the inorganic conductive material is preferably a transparent conductive material including indium tin oxide (ITO) or indium zinc oxide (IZO) or made of ITO or IZO. It is good in terms of excellent properties and ease of manufacture.

In addition, the lead wire 30, as shown in Figure 1, the end of the edge side of the insulator layer 10 of the lead wire 30 is an inorganic or organic conductive material layer 32 made of a material as described above And a metal lead wire layer 34 formed on the upper surface thereof and spaced inward from an end of the edge side of the insulator layer 10. Through this, the metal lead wire, which is vulnerable to the corrosion environment, is covered by the insulating film layer drawn in dotted line in FIG. 1 to avoid contact with air, and the electrical contact with the printed circuit board is applied to the inorganic or organic conductive material layer 32 resistant to oxidation. By that role.

As described above, the inorganic conductive material layer 32 is preferably a transparent conductive material made of ITO or IZO, and the metal lead wire layer 34 may correspond to various metals known as the material. Preferably it is copper or aluminum in consideration of the ease of manufacture and electrical conductivity. In addition, various known methods may be applied to the formation of such a metal coating layer, and in order to be coated with a thin thickness, the coating may be preferably performed through deposition or sputtering including conventional vapor deposition. Do.

In addition, the insulator layer, the transparent conductive material coating layer, and the metal coating layer may be 10 μm to 1000 μm in the case of an organic insulator for durability of a panel, ease of manufacture in forming patterns of each layer, and minimization of steps. In the case of the inorganic insulator, the conductive material coating layer 20 and the inorganic or organic conductive material layer 32 are made of 0.005 μm to 0.1 μm, and the metal lead wire layer 34 is formed of 100 μm to 3000 μm. ) Is preferably made of 0.01 μm to 10 μm.

Here, after forming the lead wire of the two-layer structure of an ITO layer and a copper layer spaced inward from the edge of the said insulator layer 10 edge side of the said metal lead wire layer, only a part of the edge thereof is copper, for example. This can be achieved by etching away the layer, which can be done in a similar way for other materials.

As shown in FIG. 1, an end of the lead wire having the shape may include an insulating film layer 40 attached to an upper surface of the pad to cover the metal lead wire layer 34 to prevent exposure of the metal lead wire to air. In addition, since the insulating film layer 40 is preferably transparent and is required for integration with the display device, it is preferable to configure it as an optical clear adhesive (OCA) film in terms of securing transparency and adhesiveness.

In addition, as shown in the left side view on the right side of FIG. 1, even though the end structure of the lead wire 30 is configured as described above, most of the lead wire portions existing under the insulating film layer may have the side surface (FIG. 1). As shown in a), the two-layer structure of the inorganic or organic conductive material layer and the metal lead wire layer may be continuously maintained.
In addition, as shown in the side surface (b) of FIG. 1, although it has a two-layer structure from the edge part to the inside of a predetermined part, it may have a one-layer structure which consists only of metal lead wire layers, such as copper, in further inner side. Each of these can be selectively applied according to the operating conditions of the device, so that the appropriate form can be selected or mixed and applied.
Preferably, as shown in side (a) of FIG. 1, the lead wire 30 is formed of the inorganic or organic conductive material layer 32 and the metal lead wire layer 34 entirely except for the ends thereof. The middle layer is advantageous in that the device does not interfere with the operation of the device even in the event of disconnection for each material while having a small cost increase.

In addition to the embodiments of the present invention, there is provided an assembly in which a printed circuit board is coupled to the above-described touch panel manufacturing pad, which includes a touch panel manufacturing pad as described above; And a printed circuit board 50 electrically connected to an upper surface of the inorganic or organic conductive material layer 32 which is opened at an end of the edge of the insulator layer of the lead wire 30 of the pad for manufacturing the touch panel. Is done.

Specific examples thereof are as shown in FIG. 2. That is, the electrode to be connected to the printed circuit board is connected to the upper surface of the inorganic or organic conductive material layer 32 which is open at the end of the insulator layer edge side of the lead wire 30 to form an assembly. As the connection method, techniques applied to PCB and pad connection such as FPCB (Flexible Printed Circuit Board) may be applied in the manufacture of a typical touch panel. A connection method for connecting them by applying a paste thereof may be applied. Through this, there is an advantage in that it is possible to prevent or prevent disconnection due to cracks that may occur for brittle inorganic materials such as ITO.

3 is a schematic partial plan view of a pad for manufacturing a touch panel according to another exemplary embodiment of the present invention, and FIG. 4 schematically illustrates an assembly process of a pad for manufacturing a touch panel and a printed circuit board according to another exemplary embodiment of the present invention. The figure shown.
3 and 4, the pad for manufacturing a touch panel according to another embodiment of the present invention is a printed circuit on all or part of the upper surface of the inorganic or organic conductive material layer is not covered with the insulating film layer at the end of the lead wire It can be comprised so that the board | substrate connection metal layer 36 may be further included. Preferably, the connecting metal layer 36 may be made of copper or silver. Through this, it is possible to overcome the brittleness of the inorganic conductive material, and the bonding of the pad and the printed circuit board can be applied as it is, welding or other conventionally applied bonding methods.

The pattern of the metal lead wire layer and the circuit board connection metal layer may be formed by, for example, forming a lead wire having a two-layer structure of an ITO layer and a copper layer, and then etching only a portion of the copper layer at the end thereof. This can be achieved by removing it, and in the case of other materials, this can be done in a similar manner. For this purpose, the material of the metal lead wire layer and the metal layer for circuit board connection is advantageous.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various modifications and changes made by those skilled in the art without departing from the spirit and scope of the present invention described in the claims below. Modifications are also included within the scope of the invention.

1 is a schematic partial plan view and a left side view thereof (for two embodiments) of a pad for manufacturing a touch panel according to an embodiment of the present invention.

2 is a view schematically illustrating a process of assembling a pad for manufacturing a touch panel and a printed circuit board according to an exemplary embodiment of the present invention.

3 is a schematic partial plan view of a pad for manufacturing a touch panel according to another embodiment of the present invention.

4 is a view schematically illustrating a process of assembling a pad for manufacturing a touch panel and a printed circuit board according to another exemplary embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10: insulator film 20: conductive material coating layer

30: lead wire 32: inorganic or organic conductive material layer

34: metal lead wire layer 36: metal layer for connecting a printed circuit board

40: insulating film layer 50: printed circuit board

Claims (5)

In the pad for manufacturing touch panels, An insulator layer made of an organic insulator or an inorganic insulator; A conductive material coating layer formed on an upper surface of the insulator layer to form a touch area; Lead wires drawn from the conductive material coating layer to an edge of the insulator layer; An end portion of the lead wire on the edge side of the insulator layer may include an inorganic or organic conductive material layer and a metal lead wire layer formed on an upper surface thereof and spaced inward from an end of the edge edge of the insulator layer on an upper surface thereof; And An insulating film layer attached to an upper surface of the pad to cover the metal lead wire layer ≪ / RTI > The lead wire is a touch panel manufacturing pad, characterized in that the entire remaining except the end is a double layer consisting of the inorganic or organic conductive material layer and the metal lead wire layer. The method of claim 1, The inorganic conductive material layer is a transparent conductive material made of ITO or IZO, the metal lead wire layer is a copper or aluminum layer formed by deposition or sputtering, the insulating film layer is characterized in that the OCA (Optical Clean Adhesive) film Pad for manufacturing touch panel. delete The method of claim 1, The pad for manufacturing a touch panel further comprising a metal layer for connecting a printed circuit board on all or part of the upper surface of the inorganic or organic conductive material layer is not covered with the insulating film layer of the lead wire end. An insulator layer made of an organic insulator or an inorganic insulator; A conductive material coating layer formed on an upper surface of the insulator layer to form a touch area; Lead wires drawn from the conductive material coating layer to an edge of the insulator layer; An end portion of the lead wire on the edge side of the insulator layer may include an inorganic or organic conductive material layer and a metal lead wire layer formed on an upper surface thereof and spaced inward from an end of the edge edge of the insulator layer on an upper surface thereof; And A pad for manufacturing a touch panel including an insulating film layer covering the metal lead wire layer; And The upper surface of the upper surface of the inorganic or organic conductive material layer or the upper surface of the inorganic or organic conductive material layer which is open at the end of the edge of the insulator layer of the lead wire of the pad for manufacturing the touch panel is electrically And a printed circuit board connected to each other, wherein the lead wire is a double layer formed of the inorganic or organic conductive material layer and the metal lead wire layer except for the entirety of the lead wire. Assembly.

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