TWI791302B - Touch panel and method of manufacturing the same - Google Patents

Abstract

A touch panel includes a thin-film substrate, a first conductive layer, and a second conductive layer. The thin-film substrate has a display region and a peripheral region defined thereon, has a first surface and a second surface opposite to each other, and has a thickness. The first conductive layer is disposed on the first surface and includes a plurality of first traces disposed in the peripheral region. The second conductive layer is disposed on the second surface and includes a plurality of second traces disposed in the peripheral region. The thin-film substrate has at least one groove at an interlaced region between one of the first traces and the second traces. The groove is in one of the first surface and the second surface and has a depth. The depth is between about 2.5 µm and about one-half of the thickness.

Description

Touch panel and manufacturing method thereof

The disclosure relates to a touch panel and a manufacturing method thereof.

With the diversified development of the touch module, it has been maturely applied in industrial electronics and consumer electronics products. It will become more and more common to combine various touch products used in medium and large-sized products.

One of the current mainstream capacitive touch technologies is Film Type. Thin-film touch panel is a touch layer (such as indium tin oxide (ITO)) made on two films, and the outer layer is protected by a cover such as glass, so it is also called GFF (Glass-Film-Film) structure. However, the touch display device using the aforementioned GFF structure requires a total of three Optical Clear Adhesive (OCA) layers, so there will be problems such as optical difference and high cost; in response to the rapid production needs of the next generation of ultra-thin film touch, How to introduce a rapid patterning process for ultra-thin film touch is more important.

Therefore, how to propose a touch panel and its manufacturing method that can solve the above-mentioned problems is one of the problems that the industry is eager to devote research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide a touch panel, a touch panel and a manufacturing method thereof that can solve the above problems.

In order to achieve the above object, according to an embodiment of the present disclosure, a touch panel includes a film substrate, a first conductor layer and a second conductor layer. The film substrate defines a display area and a peripheral area, and has opposite first and second surfaces, and a thickness. The first conductor layer is disposed on the first surface, and includes a plurality of first traces disposed on the peripheral area. The second conductor layer is disposed on the second surface, and includes a plurality of second traces disposed on the peripheral area. The film substrate has grooves in the intersection area between one of the first traces and the second traces. The groove is on one of the first surface and the second surface and has a depth. The depth is between about 2.5 µm and about one-half the thickness.

In one or more implementations of the present disclosure, the first trace includes a plurality of pin structures and a ground wire. The aforementioned ones in the first traces are ground wires.

In one or more embodiments of the present disclosure, the groove is located on the first surface and aligned with the edge of the ground line in a direction perpendicular to the first surface.

In one or more embodiments of the present disclosure, the groove and the ground line are staggered in a direction perpendicular to the first surface.

In one or more embodiments of the present disclosure, the first conductor layer further includes a first metal layer and a first electrode layer. The first electrode layer and the first metal layer are sequentially stacked on the first surface, and jointly form a first wiring in the peripheral area. The second conductor layer further includes a second metal layer and a second electrode layer. The second electrode layer and the second metal layer are sequentially stacked on the second surface, and jointly form a second wiring in the peripheral area.

In one or more embodiments of the present disclosure, the first electrode layer includes a plurality of first axial electrodes in the display area. The second electrode layer includes a plurality of second axial electrodes in the display area.

In one or more embodiments of the present disclosure, at least one of the first electrode layer and the second electrode layer is a silver nanowire electrode layer.

In one or more embodiments of the present disclosure, the trench is located on the first surface. There is a gap between two adjacent ones of the first traces. The trenches and gaps are aligned in a direction perpendicular to the first surface.

In one or more embodiments of the present disclosure, the trench is located on the second surface. There is a gap between two adjacent ones of the second traces. The trenches and gaps are aligned in a direction perpendicular to the second surface.

In one or more embodiments of the present disclosure, the trench is located on the second surface and is aligned with an edge of one of the second traces in a direction perpendicular to the second surface.

In one or more embodiments of the present disclosure, the thickness of the film substrate is between about 12.5 μm and about 125 μm.

In one or more embodiments of the present disclosure, the touch panel further includes a protection layer. The protection layer covers the first trace.

In one or more implementations of the present disclosure, the protection layer is frame-shaped and covers the side of the first wiring away from the film substrate and the inner edge of the first wiring.

In order to achieve the above object, according to an embodiment of the present disclosure, a method for manufacturing a touch panel includes: forming a first conductor layer on a first surface of a film substrate, wherein the film substrate has a thickness and defines a display area thereon and the peripheral area; and performing a laser etching process on the first conductor layer to form a plurality of first traces in the peripheral area, and to form at least one groove with a depth on the first surface, wherein the depth is between about 2.5 Between µm and about half the thickness.

In one or more embodiments of the present disclosure, the step of forming a first conductor layer on the first surface of the film substrate includes: forming a first electrode layer in the display area on the first surface of the film substrate; and A first metal layer is formed on the first electrode layer. The step of performing the laser etching process on the first conductor layer is to etch the first metal layer and the first electrode layer, so that the first metal layer and the first electrode layer jointly form a first wiring in the peripheral area.

In one or more embodiments of the present disclosure, the manufacturing method of the touch panel further includes: forming a second conductor layer on the second surface of the film substrate, wherein the first surface and the second surface are respectively located on the second surface of the film substrate. opposite sides; and performing laser etching process on the second conductor layer to form a plurality of second traces in the peripheral area.

In one or more embodiments of the present disclosure, the step of performing the laser etching process on the second conductor layer is later than the step of performing the laser etching process on the first conductor layer, which increases the resistance value of the first wiring. Within about 5%.

In one or more embodiments of the present disclosure, the step of performing the laser etching process on the first conductor layer is later than the step of performing the laser etching process on the second conductor layer, which increases the resistance of the second wiring. Within about 5%.

In one or more embodiments of the present disclosure, the step of forming the second conductor layer on the second surface of the film substrate includes: forming a second electrode layer in the display area on the second surface of the film substrate; and A second metal layer is formed on the second electrode layer. The step of performing the laser etching process on the second conductor layer is to etch the second metal layer and the second electrode layer, so that the second metal layer and the second electrode layer jointly form a second wiring in the peripheral area.

In one or more implementations of the present disclosure, the trench is located in an intersection area of the film substrate between one of the first traces and the second trace.

To sum up, in the touch panel of the present disclosure, the two conductor layers are respectively disposed on opposite surfaces of the film substrate, and electrodes and electrodes are formed in the display area and the peripheral area by double-sided laser etching, respectively. Traces. Therefore, compared with the conventional GFF structure, the touch panel of the present disclosure has one less Optical Clear Adhesive (OCA) layer and one substrate, thus saving cost. In addition, the present disclosure effectively utilizes laser etching to clean the wiring patterns in the peripheral area of the film substrate, so as to form wirings without short circuit between each other. At the same time, the present disclosure has excellent laser control technology so that even if the film substrate absorbs energy to form shallow grooves, the mechanical structure of the film substrate is not affected by controlling the relationship between the depth of the groove and the thickness of the film substrate. The depth control technology of the present disclosure depends on the laser process of the present disclosure being able to effectively control the mathematical relationship between the groove depth and the thickness of the substrate (ie, D<1/2T hereinafter), so as to ensure that the film substrate maintains a sufficient mechanical structure. Moreover, this disclosure teaches the technical idea of adjusting the groove depth according to the thickness of the film substrate, and provides a breakthrough in the mass production of the ultra-thin double-sided fast laser process.

The above description is only used to explain the problems to be solved by the present disclosure, the technical means to solve the problems, and the effects thereof, etc. The specific details of the present disclosure will be introduced in detail in the following implementation methods and related drawings.

The following will disclose multiple implementations of the present disclosure with diagrams, and for the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present disclosure. That is to say, in some embodiments of the present disclosure, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some well-known structures and components will be shown in a simple and schematic manner in the drawings.

Please refer to FIG. 1A , which is a schematic diagram illustrating an electronic device 100 according to an embodiment of the present disclosure. As shown in FIG. 1A , in this embodiment, the electronic device 100 includes a touch panel 200 and a display 300 . The touch panel 200 is disposed on the display 300 . The touch panel 200 includes a film substrate 210 , a first conductor layer 220 , a second conductor layer 230 , adhesive layers 241 , 242 , a light shielding layer 250 and a cover plate 260 . The film substrate 210 has a first surface 211 and a second surface 212 opposite to each other. The first conductive layer 220 is disposed on and contacts the first surface 211 . The second conductive layer 230 is disposed on and contacts the second surface 212 . The cover plate 260 is adhered to the side of the second conductor layer 230 away from the film substrate 210 via the adhesive layer 241 . The display 300 is adhered to the side of the first conductor layer 220 away from the film substrate 210 via the adhesive layer 242 . The light shielding layer 250 is disposed between the cover plate 260 and the second conductive layer 230 .

In some embodiments, the material of the film substrate 210 includes polyethylene terephthalate (PET), but the disclosure is not limited thereto.

In some embodiments, the material of the cover plate 260 includes glass, but the disclosure is not limited thereto.

In some embodiments, at least one of the adhesive layers 241 and 242 may be an optical clear adhesive (OCA) layer, but the present disclosure is not limited thereto.

With the aforementioned structural configuration, compared with the conventional GFF structure, the touch panel 200 of this embodiment can reduce one OCA layer and one substrate, thus saving cost. In addition, the present disclosure uses an ultra-thin film substrate 210 so that the overall thickness can be extremely thin.

Please refer to Figure 2 and Figure 3. FIG. 2 is a front view showing some elements of the touch panel 200 in FIG. 1A. FIG. 3 is a partially enlarged view showing the touch panel 200 in FIG. 2 . As shown in FIG. 1A to FIG. 3 , in this embodiment, a display area Z1 and a peripheral area Z2 are defined on the film substrate 210 . The first conductive layer 220 includes a first electrode layer 221 and a first metal layer 222 . The first electrode layer 221 is disposed in the display area Z1. The first electrode layer 221 and the first metal layer 222 are stacked on the first surface 211 in sequence, and jointly form a plurality of first traces TR1 in the peripheral zone Z2. The second conductor layer 230 includes a second electrode layer 231 and a second metal layer 232 . The second electrode layer 231 is disposed in the display area Z1. The second electrode layer 231 and the second metal layer 232 are stacked on the second surface 212 in sequence, and jointly form a plurality of second traces TR2 in the peripheral zone Z2. The light shielding layer 250 is located in the peripheral zone Z2 and configured to shield the first trace TR1 and the second trace TR2 from above.

In detail, the first electrode layer 221 includes a plurality of first axial electrodes 221a. The second electrode layer 231 includes a plurality of second axial electrodes 231a. The aforementioned “first axis” and “second axis” are, for example, two axes perpendicular to each other (eg, Y axis and X axis). In other words, the first axis electrodes 221a are conductive lines extending along the first axis and arranged at intervals. The second axial electrodes 231a are conductive lines extending along the second axis and arranged at intervals. In addition, the first trace TR1 includes a plurality of pin structures TR1a, and the second trace TR2 includes a plurality of pin structures TR2a. The pin structures TR1a and TR2a are located on the same side of the film substrate 210 and configured to connect with a flexible circuit board (not shown). In this way, the touch signal generated by the touch panel 200 can be transmitted from the first electrode layer 221 and the second electrode layer 231 to the flexible circuit board through the first trace TR1 and the second trace TR2 respectively.

In some embodiments, at least one of the first electrode layer 221 and the second electrode layer 231 may be a nano silver wire (silver nano wires, SNW; also known as AgNW) electrode layer, but this disclosure does not limit. The foregoing at least one of the first electrode layer 221 and the second electrode layer 231 may include a matrix and silver nanowires doped therein. The silver nanowires overlap each other in the matrix to form a conductive network. The matrix refers to the non-nano-silver wire material formed by coating, heating and drying the solution containing the nano-silver wire. The silver nanowires are scattered or embedded in the matrix, and partly protrude from the matrix. The matrix can protect the silver nanowires from external environment such as corrosion and abrasion. In some embodiments, the matrix is compressible.

Please refer to FIG. 1B , which is a schematic diagram illustrating an electronic device 100' according to an embodiment of the present disclosure. Compared with the embodiment shown in FIG. 1A, the electronic device 100' of this embodiment further includes a protective layer 270. The protective layer 270 covers the first trace TR1. Specifically, the protection layer 270 is frame-shaped, and covers the side of the first trace TR1 away from the film substrate 210 and the inner edge of the first trace TR1 . The first trace TR1 is separated from the adhesive layer 242 by the protection layer 270 . When the peripheral area of the display 300 is smaller than the peripheral area Z2 defined on the film substrate 210 , the first trace TR1 will be exposed to the outside of the display 300 and affect the ring-test effect, such as moisture and the like. Therefore, the first trace TR1 close to the display 300 needs to use the protection layer 270 to avoid the above problems.

Please refer to Figure 4A and Figure 4B. FIG. 4A is a partial cross-sectional view of the touch panel 200 along line 4A- 4A in FIG. 3 . FIG. 4B is a partial cross-sectional view of the touch panel 200 along line 4B-4B in FIG. 3 . As shown in FIG. 4A and FIG. 4B , in this embodiment, the film substrate 210 has a plurality of grooves 214 . The grooves 214 are distributed on the first surface 211 and the second surface 212 . It should be noted that the film substrate 210 has an interlaced region 213 between the first trace TR1 and the second trace TR2. For example, the aforementioned interlaced area 213 is the projection of the film substrate 210 by the first trace TR1 and the second trace TR2 in the direction A (ie, the vertical projection direction) perpendicular to the first surface 211 or the second surface 212 Overlapping and adjacent areas. The trench 214 is located at least in the interlaced region 213 .

As shown in FIG. 3 and FIG. 4A, in this embodiment, the first trace TR1 further includes at least one ground trace TR1'. One of the trenches 214 is located on the first surface 211 and aligned with the edge E1 of the ground line TR1' in a direction A perpendicular to the first surface 211. The trench 214 is offset from the ground line TR1' in the direction A perpendicular to the first surface 211. The trench 214 has a depth D. The depth D is between about 2.5 µm and about one-half the thickness T. As shown in FIG. 3, the aforesaid interlaced area 213 is the overlapping area and the adjacent area where the film substrate 210 is projected by the ground line TR1' and the second trace TR2 in the direction A perpendicular to the first surface 211 or the second surface 212. area.

As shown in FIG. 4B , in this embodiment, there is a gap G between two adjacent ones of the first traces TR1 . One of the trenches 214 is located on the first surface 211 and is aligned with the edge E1 of one of the first traces TR1 in a direction A perpendicular to the first surface 211 . The first electrode layer 221 has a through groove 221 b communicating between the trench 214 and the gap G. As shown in FIG. The depths D of the trenches 214 all meet the aforementioned size constraints.

Same or similar, there is a gap G between two adjacent ones of the second traces TR2. One of the trenches 214 is located on the second surface 212 and is aligned with the edge E2 of one of the second traces TR2 in a direction A perpendicular to the second surface 212 . The second electrode layer 231 has a through groove 231 b communicating between the trench 214 and the gap G. As shown in FIG. The depths D of the trenches 214 all meet the aforementioned size constraints.

In practical application, the touch panel 200 of this embodiment can respectively produce electrodes and wires in the display area Z1 and the peripheral area Z2 by double-sided laser etching. Moreover, in order to etch the first trace TR1 and the second trace TR2 (since the first trace TR1 is essentially formed by overlapping the first electrode layer 221 and the first metal layer 222, and the second trace TR2 is essentially The above is composed of the second electrode layer 231 and the second metal layer 232), the aforementioned laser etching uses strong energy to etch clean and at the same time forms the groove 214 on the film substrate 210 (caused by the absorption of laser energy) , so the manufacturing time can be effectively reduced.

It should be noted that the restriction that the depth D does not exceed one-half of the thickness T is to prevent the grooves 214 respectively located on the first surface 211 and the second surface 212 from being aligned in the direction A and causing the film substrate 210 to be mechanically unstable. Insufficient structural support creates cracking problems. The depth D control technology depends on the laser process of the present disclosure being able to effectively control the mathematical relationship between the depth D of the trench 214 and the thickness T of the substrate (ie D<1/2T), so as to ensure that the film substrate 210 maintains a sufficient mechanical structure. Moreover, this disclosure teaches the technical idea of adjusting the depth D of the trench 214 according to the thickness T of the film substrate 210 , and provides a breakthrough in mass production of the ultra-thin double-sided fast laser process.

With the aforementioned structural configuration, the touch panel 200 of this embodiment can use the groove 214 to effectively increase the difficulty of short circuit between the wires. Not only that, the groove 214 can also increase the flexibility of the film substrate 210, thereby increasing the service life.

In some embodiments, the thickness T of the film substrate 210 is between about 12.5 μm and about 125 μm, but the disclosure is not limited thereto.

Please refer to FIG. 5 , which is a flowchart illustrating a manufacturing method of a touch panel according to an embodiment of the present disclosure. The manufacturing method of this embodiment includes at least step S101 to step S104. The following will be described in conjunction with Figures 1A to 4B.

Step S101 : forming a first conductive layer 220 on the first surface 211 of the film substrate 210 , wherein the film substrate 210 has a thickness T and defines a display zone Z1 and a peripheral zone Z2 thereon.

Step S102 : forming a second conductor layer 230 on the second surface 212 of the film substrate 210 , wherein the first surface 211 and the second surface 212 are respectively located on opposite sides of the film substrate 210 .

Step S103: Perform a laser etching process on the first conductor layer 220 to form a plurality of first traces TR1 in the peripheral zone Z2, and form a trench 214 with a depth D on the first surface 211, wherein the depth D is between Between about 2.5 µm and about half of the thickness T.

In some embodiments, step S101 includes: forming a first electrode layer 221 in the display area Z1 on the first surface 211 of the film substrate 210 ; and forming a first metal layer 222 on the first electrode layer 221 . Moreover, step S103 is to etch the first metal layer 222 and the first electrode layer 221 , so that the first metal layer 222 and the first electrode layer 221 jointly form the first trace TR1 in the peripheral zone Z2 .

Step S104 : performing a laser etching process on the second conductor layer 230 to form a plurality of second traces TR2 in the peripheral zone Z2 .

In some embodiments, step S102 includes: forming a second electrode layer 231 in the display area Z1 on the second surface 212 of the film substrate 210 ; and forming a second metal layer 232 on the second electrode layer 231 . Moreover, step S104 is to etch the second metal layer 232 and the second electrode layer 231 , so that the second metal layer 232 and the second electrode layer 231 jointly form the second trace TR2 in the peripheral zone Z2 .

In this embodiment, step S104 is later than step S103, and step S104 increases the resistance value of the first conductive layer 220 within about 5%.

In other embodiments, step S103 is later than step S104, and step S103 increases the resistance value of the second conductive layer 230 within about 5%.

The following table is a table of various embodiments of manufacturing the touch panel 200 using different types of lasers. area Type of laser groove depth Resistance change rate result The first trace overlaps the second trace (perimeter area) IR nanosecond 0 gigantic unqualified IR picosecond ＞5 µm <5% qualified UV picosecond >10 µm <5% qualified The first trace does not overlap with the second trace (perimeter area) IR nanosecond 0 N/A qualified IR picosecond ＞5 µm N/A qualified UV picosecond >10 µm N/A qualified display area IR nanosecond 0 >5% unqualified IR picosecond ＞5 µm >5% unqualified UV picosecond 0 <5% qualified

It can be known from the above table that for different regions of the touch panel 200 , IR nanosecond laser, IR picosecond laser and ultraviolet picosecond laser can be flexibly selected for processing. Among them, the ultraviolet picosecond laser can be used in all areas of the touch panel 200 , so when used to manufacture the touch panel 200 , it is not necessary to change the laser head, thus reducing the manufacturing time.

From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the touch panel of the present disclosure, the two conductor layers are respectively arranged on the opposite two surfaces of the film substrate, and the two-sided laser Etching to make electrodes and wires in the display area and the peripheral area respectively. Therefore, compared with the conventional GFF structure, the touch panel of the present disclosure has one less OCA layer and one substrate, thus saving cost. In addition, the present disclosure effectively utilizes laser etching to clean the wiring patterns in the peripheral area of the film substrate, so as to form wirings without short circuit between each other. At the same time, the present disclosure has excellent laser control technology so that even if the film substrate absorbs energy to form shallow grooves, the mechanical structure of the film substrate is not affected by controlling the relationship between the depth of the groove and the thickness of the film substrate. The depth control technology of the present disclosure depends on the laser process of the present disclosure being able to effectively control the mathematical relationship between the groove depth and the thickness of the substrate (ie, D<1/2T above), so as to ensure that the film substrate maintains a sufficient mechanical structure. Moreover, this disclosure teaches the technical idea of adjusting the groove depth according to the thickness of the film substrate, and provides a breakthrough in the mass production of the ultra-thin double-sided fast laser process.

Although the present disclosure has been disclosed above in terms of implementation, it is not intended to limit this disclosure. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, the protection of this disclosure The scope shall be defined by the scope of the appended patent application.

100: Electronic device 200: touch panel 210: film substrate 211: first surface 212: second surface 213: Staggered area 214: Groove 220: the first conductor layer 221: the first electrode layer 221a: first axial electrode 222: The first metal layer 230: second conductor layer 231: second electrode layer 231a: second axial electrode 232: second metal layer 241, 242: adhesive layer 250: shading layer 260: cover plate 270: protective layer 300: display A: Direction D: Depth E1, E2: edge G: Gap T: Thickness TR1: the first trace TR1a, TR2a: pin structure TR1': ground wire TR2: the second trace Z1: display area Z2: Surrounding area

In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more comprehensible, the accompanying drawings are described as follows: FIG. 1A is a schematic diagram illustrating an electronic device according to an embodiment of the present disclosure. FIG. 1B is a schematic diagram illustrating an electronic device according to another embodiment of the present disclosure. FIG. 2 is a front view showing some components of the touch panel in FIG. 1A. FIG. 3 is a partially enlarged view showing the touch panel in FIG. 2 . FIG. 4A is a partial cross-sectional view of the touch panel in FIG. 3 along the line segment 4A-4A. FIG. 4B is a partial cross-sectional view of the touch panel in FIG. 3 along the line segment 4B-4B. FIG. 5 is a flow chart illustrating a manufacturing method of a touch panel according to an embodiment of the present disclosure.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

210: film substrate

211: first surface

212: second surface

213: Staggered area

214: Groove

221: the first electrode layer

222: The first metal layer

231: second electrode layer

232: second metal layer

A: Direction

D: Depth

E1: edge

T: Thickness

TR1': ground wire

TR2: the second trace

Claims (20)

A touch panel, comprising: a film substrate defining a display area and a peripheral area, and having a first surface and a second surface opposite, and a thickness; a first conductor layer, disposed on the first surface, and including a plurality of first traces disposed on the peripheral region; and A second conductor layer is arranged on the second surface, and includes a plurality of second traces arranged in the peripheral area; Wherein the film substrate has at least one groove in an intersection region between one of the first wirings and the second wirings, the groove is between the first surface and the second surface one, and have a depth, wherein the depth is between about 2.5 μm and about one-half the thickness. The touch panel according to claim 1, wherein the first wirings include a plurality of pin structures and a grounding line, and the one of the first wirings is the grounding line. The touch panel according to claim 2, wherein the groove is located on the first surface and is aligned with an edge of the ground line in a direction perpendicular to the first surface. The touch panel according to claim 3, wherein the groove and the ground line are staggered in the direction perpendicular to the first surface. The touch panel according to claim 1, wherein the first conductor layer further comprises a first metal layer and a first electrode layer, wherein the first electrode layer and the first metal layer are stacked on the On the first surface, the first wirings are jointly formed in the peripheral area, the second conductor layer further includes a second metal layer and a second electrode layer, wherein the second electrode layer and the second metal Layers are sequentially stacked on the second surface, and jointly form the second wirings in the peripheral area. The touch panel according to claim 5, wherein the first electrode layer includes a plurality of first axial electrodes in the display area, and the second electrode layer includes a plurality of second axial electrodes in the display area . The touch panel according to claim 5, wherein at least one of the first electrode layer and the second electrode layer is a silver nanowire electrode layer. The touch panel according to claim 1, wherein the groove is located on the first surface, there is a gap between two adjacent ones of the first traces, and the groove is perpendicular to the gap One direction of the first surface is aligned upwards. The touch panel as described in claim 1, wherein the groove is located on the second surface, there is a gap between two adjacent ones of the second traces, and the groove is perpendicular to the gap One direction of the second surface is aligned upwards. The touch panel according to claim 1, wherein the groove is located on the second surface and is aligned with an edge of one of the second traces in a direction perpendicular to the second surface. The touch panel according to claim 1, wherein the thickness of the film substrate is between about 12.5 μm and about 125 μm. The touch panel according to claim 1 further includes a protection layer covering the first wirings. The touch panel according to claim 12, wherein the protective layer is frame-shaped and covers a side of the first wirings away from the film substrate and an inner edge of the first wirings. A method of manufacturing a touch panel, comprising: forming a first conductor layer on a first surface of a film substrate, wherein the film substrate has a thickness and defines a display area and a peripheral area thereon; and performing a laser etching process on the first conductor layer to form a plurality of first traces in the peripheral region, and forming at least one groove with a depth on the first surface, wherein the depth is between about Between 2.5 µm and about one-half that thickness. The method for manufacturing a touch panel according to claim 14, wherein the step of forming the first conductor layer on the first surface of the film substrate comprises: forming a first electrode layer in the display area on the first surface of the film substrate; and forming a first metal layer on the first electrode layer, Wherein the step of performing the laser etching process on the first conductor layer is to etch the first metal layer and the first electrode layer, so that the first metal layer and the first electrode layer jointly form the first metal layer and the first electrode layer in the peripheral region. Some first traces. The manufacturing method of the touch panel as described in claim 14, further comprising: forming a second conductor layer on a second surface of the film substrate, wherein the first surface and the second surface are respectively located on opposite sides of the film substrate; and The laser etching process is performed on the second conductor layer to form a plurality of second traces in the peripheral area. The method for manufacturing a touch panel according to claim 16, wherein the step of performing the laser etching process on the second conductor layer is later than the step of performing the laser etching process on the first conductor layer, and The resistance of the first wires is increased within about 5%. The method for manufacturing a touch panel as claimed in claim 16, wherein the step of performing the laser etching process on the first conductor layer is later than the step of performing the laser etching process on the second conductor layer, and A resistance value of the second wires is increased within about 5%. The method for manufacturing a touch panel according to claim 16, wherein the step of forming the second conductor layer on the second surface of the film substrate comprises: forming a second electrode layer in the display area on the second surface of the film substrate; and forming a second metal layer on the second electrode layer, Wherein the step of performing the laser etching process on the second conductor layer is to etch the second metal layer and the second electrode layer, so that the second metal layer and the second electrode layer jointly form the second metal layer and the second electrode layer in the peripheral region. some second traces. The method for manufacturing a touch panel according to claim 16, wherein the groove is located in an intersecting area of the film substrate between one of the first wirings and the second wirings.

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