TWM519808U - Device having color resists pattern - Google Patents

Abstract

An device having color resists pattern is disclosed. The device includes a substrate, at least two color resist layers. The at least color resist layers formed on the curved and constructed a visible pattern.

Description

Device with colored photoresist pattern

This creation relates to a color resist, and more particularly to a device having a colored resist pattern.

At present, smart devices such as smart phones, smart watches, smart medical devices, etc., are equipped with large screens for users to watch the information on the screen. In addition to their powerful functions, these devices with large screens are gradually becoming personalized and beautiful, including appearance, shape and color. These must be achieved through an impressive shell design and manufacturing. At present, the curved shell shape is particularly attractive, and it has gradually become the future trend of smart devices.

At present, there are several methods for the patterning of the curved outer casing of the smart device: the first public method: transfer technology. Transfer to the curved surface of the target through the pre-made plan. The processing cost of such a method is low, but the processing speed is slow, the material cost is high, and the line resolution is poor. The second method: inkjet + laser engraving. The pigment is sprayed onto the curved surface of the target by an inkjet method, and the pattern is engraved by laser engraving. This method has high processing cost and slow processing speed, high equipment cost and high material cost. The advantage is that the line resolution is high, up to 20um (micron).

Of course, the technique of making a curved outer casing can also be used to planarize the outer casing. However, the patterning technology of the planarized casing is more, such as screen printing, and the line resolution is also low.

Therefore, how to develop a multi-practice with low processing cost, fast processing speed, low material cost, and high line resolution, and a method of producing a color pattern on a flat shell, a curved shell, or a three-dimensional shell at the same time The development direction that smart device manufacturers are hoping for.

In order to achieve the above object, the present invention provides a device with a color resist pattern and a manufacturing method thereof, which can solve the problems of slow processing speed, high material cost, and high line resolution of the conventional technology, and achieve low processing cost and processing. Comprehensive technical efficiency such as fast speed, low material cost and high line resolution.

The present invention provides a device having a color resist pattern, comprising: a substrate; at least two layers of color photoresist layers formed on the substrate; and wherein the at least two layers of color photoresist layers together form a pattern, The pattern is visible.

The above and other objects, features, and advantages of the present invention will become more apparent and understood.

10, 10-1‧‧‧ substrate

21, 22, 23 ‧ ‧ color photoresist layer

211, 221, 231‧‧‧ unexposed color photoresist layer

212, 222, 232‧‧‧ exposed color photoresist layer

30, 30-1‧‧‧ mask

31‧‧‧The Department of Patterns

32‧‧‧Non-pattern department

40‧‧‧ ultraviolet light

Step 101‧‧‧ sequentially forming a color photoresist composite layer of at least two layers of color photoresist layers on a substrate

Step 102‧‧‧ sequentially forming at least two color photoresist layers of a color photoresist layer on a substrate, each time forming a color photoresist layer, preheating, and forming a next color photoresist layer

Step 103‧‧‧ Preheat the color resistive composite layer

Step 105‧‧‧Exposing the exposure process with a mask having a predetermined pattern

Step 107‧‧‧Removing portions of the color resistive composite layer other than the pattern to form a color resist pattern

Step 109‧‧‧ Harden the color photoresist composite layer

Fig. 1A is an embodiment of a flow chart of a method for fabricating a color resist pattern of the present invention.

FIG. 1B is still another embodiment of a flow chart of a method for fabricating a color resist pattern of the present invention.

Fig. 2 is a top view of a mobile phone substrate produced by the method of forming a color resist pattern of the present invention.

The 3A-3G diagram is one of the physical production processes of the color resist pattern creation process of the present invention. A schematic diagram of a specific embodiment.

4A-4G is a schematic view showing another embodiment of the physical production flow of the creation process of the color resist pattern of the present invention.

Figure 5 is an electron micrograph cross-section of the color resist pattern of the present invention.

According to an embodiment of the present invention, the present invention provides a device with a color resist pattern and a manufacturing method thereof, and the method of forming a multi-layer color photoresist and performing one exposure to produce high resolution, low cost, high productivity. A shell pattern that can be made in a flat or curved surface.

Referring to FIG. 1A and FIG. 3A-3G, an embodiment of a flow chart of a color resist pattern of the present invention can be used to fabricate the cell phone substrate of FIG. 2, which includes the following main steps. :

Step 101: sequentially forming a color photoresist composite layer of at least two color photoresist layers on a substrate. The step of forming the color photoresist composite layer can be performed by spraying, and the spray method can make each layer of the color photoresist layer have better uniformity. Of course, the invention is not limited to the spraying method, and other methods such as inkjet and transfer. Printing, screen printing and other methods can also be used. The substrate may be a planar substrate, a curved substrate, or a three-dimensional substrate; in the material selection, the substrate may be a glass substrate or a plastic substrate or a ceramic substrate.

The embodiment of the third embodiment 3A-3G (the A-A cross-sectional view taken along the second drawing) is an embodiment of the embodiment in which the substrate 10 of the mobile phone having the pattern of the second drawing is produced step by step. The method for fabricating the color resist pattern of the present invention is described by using a curved substrate as an embodiment, and the special technique of the composite photoresist layer composed of the multilayer photoresist layer and the method of using one exposure is described. . The color of the color resist can be arbitrarily matched. For example, if you want the pattern to appear in white, you can use the first layer. It is white, the second layer is gray or black, and the third layer (the top layer) is a transparent color color resist. The simplest black color can be the first layer of black and the second layer of transparent color. Among them, the uppermost color photoresist layer can adopt a transparent color to prevent scratches and improve protection.

In other words, the color resists referred to in this creation refer to color resists of various colors, including white, red, orange, yellow, green, blue, enamel, purple, black, and transparent (colorless), which can be formed by colored photoresist. The color is chosen. And through the multi-layer color configuration, you can match the colors of various tones. In addition, the photoresist material can adopt a positive photoresist or a negative photoresist, and can achieve the technical effects required by the present invention. In addition, each of the color photoresist layers has a thickness of between 0.5 and 30 microns.

Please refer to FIG. 3A-3C for the step of forming a color photoresist composite layer in the flow of the method for fabricating the color resist pattern of the present invention. In this embodiment, a three-layer color resistive composite layer is formed, and color resist layers 21, 22, and 23 are formed on the substrate 10, respectively; the color resist layer 23 is the uppermost layer, and a color resist of a transparent color can be used.

Step 103: Preheating the color photoresist composite layer. The preheating process removes the solvent in the photoresist, reduces the fluidity of the color resistive composite layer, and improves uniformity, making it less susceptible to deformation. The temperature of the preheating program is between 70 and 120 degrees Celsius, and the temperature and time of the preheating are adjusted according to the characteristics of the material.

Step 105: Perform an exposure process with a photomask having a predetermined one of the patterns. This pattern is a pattern to be produced, for example, a screen frame pattern required for a smart device, which is an annular rectangle. If it is a surface, it is a circular rectangular surface. The line width of this pattern can be greater than 10 microns, in other words, the resolution can be up to 10 microns.

Please refer to the 3D-3E diagram synchronously. This embodiment uses a negative photoresist material as the photoresist material of the color photoresist layer. Therefore, the exposed portion is the portion where the color photoresist is left on the substrate. Minute. The ultraviolet light 40 is irradiated through the mask 30 having a predetermined pattern. Since the pattern portion 31 in the mask 30 is transparent, and the non-pattern portion 32 is opaque, the portion where the pattern is formed is exposed to form an exposed color. The photoresist layers 212, 222, and 232 and the unexposed color photoresist layers 211, 221, and 231; since the negative photoresist is used in the embodiment, the unexposed color photoresist layers 211, 221, and 231 are dissolved by the developer. Remove. If a positive photoresist material is used, the predetermined pattern of the mask 30 will be reversed, and the exposed color photoresist layer will in turn be dissolved by the developer and removed, as is well known to those skilled in the art. More details.

Step 107: Removing portions of the color photoresist composite layer other than the pattern to form a color photoresist pattern. This step is the aforementioned development, that is, the developer formulated for the photoresist of the color resist. The unexposed colored photoresist layers 211, 221, 231 can be removed by the treatment of the developer. The exposure and removal procedures are part of the yellow light process, which is well known in the semiconductor process and will not be described here. After the two programs are completed, the predetermined pattern desired by the present invention can be obtained. Through this step, the unexposed colored photoresist layers 211, 221, 231 can be removed, leaving only the exposed color photoresist layers 212, 222, 232, as shown in Figure 3F.

Step 109: Hardening the color photoresist composite layer. The low temperature baking method is used, and the temperature is between 100 and 180 degrees Celsius, which can harden the predetermined pattern. The baking time can be adjusted according to the actual conditions, and is adjusted according to the characteristics of the color photoresist layer, the thickness and the hardness required after hardening, and the like. The hardened colored photoresist layer has a hardness between 2H and 4H.

In the baking process of step 109, due to the structure of the multi-layer color photoresist layer used in the present invention, the color photoresist forms a fluidity during the baking process, and constitutes a special slope structure, so that the uppermost colored light Resist to contact the substrate. As shown in FIG. 3G, the exposed color photoresist layers 212, 222, and 232 all form an oblique shape due to the fluidity generated during the baking process. The slope structure, and all three are in contact with the substrate 10. This special structure is because the multi-layer color photoresist layer used in the present invention, produced by one-time exposure and one-time baking technology, is the second major feature of the invention.

The first major feature of this creation is that after forming a multi-layered color photoresist composite layer, an exposure process and a removal process are performed to produce the desired pattern, which can greatly reduce production time and cost. At the same time, the resolution can be improved because of the lithography process.

Next, referring to FIG. 1B, another embodiment of the flow chart of the method for fabricating the color resist pattern of the present invention can produce the cell phone substrate of FIG. 2, and compared with FIG. 1A, the present embodiment and the present embodiment can be found. The embodiment of FIG. 1A differs in step 102: sequentially forming a color photoresist composite layer of at least two layers of color photoresist layers on a substrate, and forming a color photoresist layer each time to perform preheating and then forming a lower layer. A layer of colored photoresist layer is formed before preheating, and so on. This step can reduce the fluidity of the color resistive composite layer after each layer of the color photoresist layer is formed, and improve the uniformity, making it less susceptible to deformation. The interface of each layer of color photoresist layer can be clearly separated.

Fig. 1A is an embodiment of single preheating, and Fig. 1B is an embodiment of multiple preheating. Both embodiments are used in the present invention, and have different effects to meet the needs of different customers.

Next, please refer to the embodiment of FIG. 4A-4G (the A-A cross-sectional view along the second drawing), and an embodiment of the embodiment in which the substrate 10 of the mobile phone having the pattern of FIG. 2 is produced in a stepwise manner. The method for fabricating the color resist pattern of the present invention is described by using a planar substrate as an example, and the special technique of the composite photoresist layer composed of the multilayer photoresist layer and the method of using one exposure is described. . Further, in this embodiment, the pattern of the second drawing which is desired in the present invention is produced by the contact type photomask 30-1, and a positive photoresist is used as the material of the color resistive composite layer.

Referring to FIG. 4D-4G, since the positive photoresist material is used, the pattern of the contact type photomask 30-1 is completely opposite to that of the 3D image, and the exposed color photoresist layers 212, 222, and 232 are located in the middle. The opposite case where the unexposed colored photoresist layers 211, 221, 231 are located at the edges. After the treatment of the developer, the central exposed color photoresist layers 212, 222, 232 will be removed by the development process, leaving the unexposed colored photoresist layers 211, 221, 231. Similarly, after baking, the slope structure of the unexposed colored photoresist layers 211, 221, and 231 of Fig. 4G is formed.

Next, please refer to FIG. 5, which is an electron micrograph cross-sectional view of the color resist pattern of the present invention, and it can be found that the exposed color photoresist layers 212, 222 form a significant slope at the edge portion, and The thicknesses of the exposed color photoresist layers 212 and 222 of the embodiment are 3.63 and 1.79 micrometers, respectively, which can greatly reduce the photoresist material used and reduce the material cost. This is the third major feature of the invention.

Therefore, using the method for forming a color resist pattern of the present invention, a device having a color resist pattern can be fabricated, comprising: a substrate; at least two layers of color photoresist layers formed on the substrate; and at least two The layered color photoresist layers together form a pattern, and the pattern is visible, that is, the pattern here is a pattern that is visually appealing. With the lithography process, the pattern of the present invention has a high resolution and a small amount of material. In addition, at the boundary of the pattern, at least two layers of the color photoresist layer (color resistive composite layer) constitute a slope and each layer of the color photoresist layer is connected to the substrate.

Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention should be encompassed by the present invention. Therefore, the scope of protection of this new type is subject to the definition of the scope of the patent application.

10-1‧‧‧Substrate

211, 221, 231‧‧‧ unexposed color photoresist layer

Claims (8)

A device having a color resist pattern comprising: a substrate; and at least two layers of color photoresist layers formed on the substrate; wherein the at least two layers of color photoresist layers together form a pattern, the pattern being visible. The device of claim 1, wherein the at least two layers of the color photoresist layer form a slope and each of the color photoresist layers is connected to the substrate. A device having a color resist pattern according to claim 1 or 2, wherein the substrate is a planar substrate or a three-dimensional substrate. A device having a color resist pattern as claimed in claim 1 or 2, wherein the color photoresist layer has a thickness of 0.5 to 30 μm. A device having a color resist pattern as claimed in claim 1 or 2, wherein the line width of the pattern is greater than 10 microns. The device of claim 1 or 2, wherein the uppermost layer of the at least two layers of the color photoresist layer is a transparent color. The device of claim 1 or 2, wherein the hardened at least two layers of the color photoresist layer have a hardness of between 2H and 4H. The device of claim 1 or 2, wherein the substrate is a glass substrate, a plastic substrate or a ceramic substrate.