WO2020000893A1

WO2020000893A1 - Production process for sensing film and production method for touch screen

Info

Publication number: WO2020000893A1
Application number: PCT/CN2018/118226
Authority: WO
Inventors: 刘天保
Original assignee: 广州视源电子科技股份有限公司; 广州视睿电子科技有限公司
Priority date: 2018-06-27
Filing date: 2018-11-29
Publication date: 2020-01-02
Also published as: CN108845699A

Abstract

The present application provides a production process for a sensing film and a production method for a touch screen. The production process comprises: step S1, providing a substrate, and providing a photoresist layer on the substrate; step S2, patterning the photoresist layer by using a mask group, the mask group comprising a plurality of masks stacked in sequence, and the projection of the shading portion of one of at least two masks on the other mask overlapping a part of the light-transmissive portion of the other mask; step S3, removing the material of a part of the substrate that is not masked by the photoresist layer to form a conductive grid; or providing a conductive material on the surface of the exposed substrate to form a conductive grid; and step S4, removing the patterned photoresist layer. According to the production process, a new auxiliary mask needs to be provided, and with respect to re-provision of a mask by which a conductive grid having a particular size can be formed one time, the process is simpler, and achieves lower costs and higher efficiency.

Description

Manufacturing process of induction film and manufacturing method of touch screen

Technical field

The present application relates to the field of touch screens, and in particular, to a manufacturing process of a sensing film and a manufacturing method of a touch screen.

Background technique

At present, the manufacturing method of the metal grid in the sensing film of the touch screen mainly includes a yellow light method, an imprint method, a silk screen method, and a printing method.

Among them, the yellow light method is mainly applied to the production of metal grids of pure metals such as copper, nickel, and silver. The advantages of this method are: the performance and appearance of the produced metal grid are the best; the disadvantage is that the photomask cannot be used universally. Each metal grid with a different size design needs a corresponding photomask. However, the photomask production cycle is long and expensive, which is not conducive to production transfer and production line equipment utilization. This method is limited to the high cost of photomask opening, which hinders the promotion.

The embossing method is mainly applied to the production of metal grids with mixed conductive materials such as silver paste. The advantages of this method are: the performance and appearance of the metal grid obtained are the best; the disadvantage is that the embossing mold cannot be used universally, and it requires Dedicated design for mold opening is expensive, and the mold manufacturing cycle is long, which affects manufacturing efficiency, case opening schedule, and timeliness. This method is limited to the cost of mold opening, which leads to hindered promotion.

The screen printing method is mainly used in the production of metal grids with mixed conductive materials such as silver paste, and the printing method is mainly used in the production of metal grids with mixed conductive materials and enameled wires. The disadvantages of these two methods are: the wire diameter is rough, the effect is inferior, and the appearance is hidden. It is limited to low-end applications in a small part of the market and cannot be applied to high-end mainstream applications.

In summary, the current best-performing metal grid production methods are better in the yellow light process category and the embossing category. Among them, the yellow light method category has the best effect and is the most mainstream in the market, but the development cost of the photomask is extremely expensive.

The above information disclosed in the background section is only used to enhance the understanding of the background technology of the technology described herein. Therefore, the background technology may contain certain information that has not been formed in the country for those skilled in the art. Known prior art.

Summary of the invention

The main purpose of the present application is to provide a manufacturing process of a sensing film and a manufacturing method of a touch screen, so as to solve the problem that the yellow light method needs to separately develop expensive photomasks for metal grids of different sizes in the prior art.

In order to achieve the above object, according to an aspect of the present application, a manufacturing process of an induction film is provided. The above induction film includes a conductive grid. The manufacturing process includes step S1, providing a substrate, and providing a photoresist layer on the substrate. Step S2, using a photomask group to pattern the photoresist layer, the photomask group includes a plurality of photomasks stacked in sequence, and at least one of the photomasks has a light-shielding part of the photomask in the other The projection on the photomask overlaps a part of the light-transmitting part of another photomask; step S3, removing a part of the material of the substrate that is not masked by the photoresist layer to form the conductive grid; or on the exposed substrate A conductive material is disposed on the surface to form the above-mentioned conductive grid; step S4, removing the patterned photoresist layer.

Further, the photomask group includes two photomasks, which are a first photomask and a second photomask, respectively.

Further, the first photomask includes a first light-shielding portion and a plurality of first light-transmitting portions, and the plurality of first light-transmitting portions are sequentially spaced apart. The second photomask includes a second light-shielding portion and a second light-transmitting portion. In step S2, the projection of the second light-shielding portion on the first mask and a portion of the plurality of first light-transmitting portions overlap each other.

Further, a plurality of the first light transmitting portions are arranged at the same interval.

Further, there are a plurality of the second light-shielding sections, and the plurality of the second light-shielding sections are arranged at intervals. The projection of each of the second light-shielding sections on the first mask and a part of the plurality of first light-transmitting sections are both. overlapping.

Further, the step S2 includes: sequentially covering the first photomask and the second photomask on a surface of the photoresist layer far from the substrate; and exposing the photoresist layer provided with the photomask group. ; Developing the photoresist layer after exposure, so that the photoresist layer below the first light-shielding portion and the corresponding area below the second light-shielding portion is removed, or below each of the first light-transmitting portions and the first The photoresist layer in the corresponding area under the two light-transmitting portions is removed, so that part of the substrate is exposed, and the patterned photoresist layer is formed.

Further, the photoresist layer is a negative photoresist layer, and the substrate includes a conductive layer. In the step S2, the photoresist layer under the first light shielding portion and the corresponding area under the second light shielding portion are removed. In the step S3, the material of the conductive layer that is not masked by the photoresist layer is removed, and the remaining material of the conductive layer forms a plurality of the conductive grids.

Further, the photoresist layer is a positive photoresist layer. In the step S2, the photoresist layer under each of the first light transmitting portion and the corresponding area under the second light transmitting portion is removed, and In step S3, a conductive material is provided on the bare substrate to form a plurality of the conductive grids.

Further, the base further includes a substrate, the conductive layer is disposed on a surface of the substrate, and the photoresist layer is disposed on a surface of the conductive layer remote from the substrate.

Further, in the step S2, the first photomask is disposed near the photoresist layer.

Further, in the above step S3, a frame lead region including a plurality of frame leads is also formed while the conductive grid is formed.

According to another aspect of the present application, a method for manufacturing a touch screen is provided, including a manufacturing process of a sensing film, and the manufacturing process of the sensing film is any one of the manufacturing processes described above.

Applying the technical solution of the present application, in the above-mentioned manufacturing process of the induction film including a conductive grid, multiple photomasks are used to pattern the photoresist layer at the same time, that is, the superposition of the patterns of multiple photomasks corresponds to the photoresist The pattern of the layer. One of the multiple photomasks is a universal photomask, which can be applied in the process of making conductive grids of different sizes, and the remaining photomasks are auxiliary photomasks. In the process of making conductive grids of different sizes and designs, it is necessary to develop a new auxiliary photomask and a universal photomask to obtain a conductive grid of a predetermined size and design. Compared to re-developing a photomask that can form a conductive grid with a specific size at one time, the process of developing a new auxiliary photomask is simpler, its cost is lower, and its efficiency is higher. In addition, in the actual manufacturing process, a high-precision photomask can be selected as a general-purpose photomask. In this way, the pattern size of the auxiliary photomask is large and simple, and it is more simple and efficient to develop it.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings that form a part of the present application are used to provide further understanding of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

FIG. 1 is a schematic structural diagram of a first photomask according to the present application;

FIG. 2 is a structural view of a second photomask used in conjunction with the first photomask of FIG. 1; FIG.

FIG. 3 illustrates a superimposed pattern formed on the first photomask of FIG. 1 by being projected with the second photomask of FIG. 2; FIG.

4 to 8 are schematic structural diagrams during a manufacturing process of an induction film in an embodiment of the present application;

9 to 12 are schematic structural diagrams of a manufacturing process of an induction film in another embodiment of the present application; and

FIG. 13 is a schematic diagram showing a partial structure of an induction film of the present application.

The above drawings include the following reference signs:

10, substrate; 20, photoresist layer; 30, first photomask; 40, second photomask; 11, substrate; 12, conductive layer; 21, photoresistive portion; 31, first light-shielding portion; 32, first A light transmitting portion; 41, a second light shielding portion; 42, a second light transmitting portion; 50, a conductive grid; 60, a frame lead region; 101, a predetermined light shielding portion; 102, a predetermined light transmitting portion.

detailed description

It should be noted that the following detailed descriptions are all exemplary and are intended to provide further explanation of the present application. Unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It should be noted that the terminology used herein is only for describing specific embodiments and is not intended to limit the exemplary embodiments according to the present application. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise, and it should also be understood that when the terms "including" and / or "including" are used in this specification, they indicate There are features, steps, operations, devices, components, and / or combinations thereof.

It will be understood that when an element such as a layer, film, region, or substrate is described as being "on" another element, it can be directly on the other element or intervening elements may also be present. Moreover, in the description and in the claims, when an element is described as being “connected” to another element, the element may be “directly connected” to the other element or “connected” to the other element through a third element.

As described in the background technology, in the prior art, the yellow light method needs to separately develop corresponding photomasks for metal grids of different sizes. The photomasks have finer patterns, higher development costs, and lower development efficiency. Technical problem, this application proposes a manufacturing process of a sensing film and a manufacturing method of a touch screen.

In a typical embodiment of the present application, a manufacturing process of an induction film is provided. The induction film includes a conductive grid. The manufacturing process includes:

In step S1, a substrate 10 is provided, and a photoresist layer 20 is disposed on the substrate 10 to form the structure shown in FIG. 4.

In step S2, the photoresist layer 20 is patterned by using a photomask group, so that a part of the photoresist layer 20 is removed, and a plurality of photoresist portions 21 are formed at intervals, as shown in FIG. 6 or FIG. 10 Nudity. The photomask group includes a plurality of photomasks that are sequentially stacked, and a projection of a light-shielding portion of one photomask of the at least two photomasks on the other photomask and a portion of the light-transmitting portion of the other photomask. Overlapping, as shown in Fig. 5 or Fig. 9, both figures show a photomask group including two photomasks, one of which is a first photomask 30 and the other is a second photomask 40. From these two figures, it can be seen that the projection of the light-shielding portion of the second mask 40 on the first mask 30 overlaps with a part of the light-transmitting portion of the first mask 30. In this way, it is equivalent to the second light The pattern on the cover 40 can be adjusted to the pattern on the first photomask 30, so as to obtain a pattern corresponding to a predetermined pattern of the photoresist layer. It should be noted that "correspondence" herein may represent a predetermined pattern of the photoresist layer The pattern superimposed on the two photomasks is the same or complementary.

Step S3. This step is a step of forming a conductive mesh. This step may have two implementations. One solution is to remove the material of the substrate 10 that is not covered by the photoresist layer 20 to form the conductive mesh 50. As shown in FIG. 7, in this solution, the photoresist layer 20 must be disposed on the conductive layer 12, that is, the substrate 10 includes the conductive layer 12, or a conductive layer is disposed on the substrate before the photoresist layer 20 is disposed. ; Another solution is to provide a conductive material on the exposed surface of the substrate 10 to form the conductive grid 50 as shown in FIG. 11.

In step S4, the patterned photoresist layer 20 is removed to form a sensing film including a conductive mesh 50, as shown in FIG. 8 or 12.

In the above-mentioned manufacturing process of the induction film including the conductive grid, multiple photomasks are used to pattern the photoresist layer simultaneously, that is, the superposition of the patterns of multiple photomasks corresponds to the pattern of the photoresist layer, and multiple light One of the masks is a full-size universal mask (the process supports the largest size), which can be used in the process of making conductive grids of different sizes, and the remaining masks are auxiliary masks. In the process of making conductive grids of different sizes and designs, it is necessary to develop a new auxiliary photomask and a universal photomask to obtain a conductive grid of a predetermined size and design. Compared to re-developing a photomask that can form a conductive grid with a specific size at one time, the process of developing a new auxiliary photomask is simpler, its cost is lower, and its efficiency is higher. In addition, in the actual manufacturing process, a high-precision photomask can be selected as a general-purpose photomask. In this way, the pattern size of the auxiliary photomask is large and simple, and it is more simple and efficient to develop it.

For conductive grids of different lengths, that is, for patterns of conductive channels of different sizes, a universal photomask and an auxiliary photomask can be used to achieve the width of the conductive mesh through the general photomask, and because of the conductive mesh The width of the grid is generally small, so the pattern of the universal photomask is more precise, that is, more precise. The length of the conductive grid (different sizes of the pattern of the conductive channel) only needs to change the width and / or length of the auxiliary photomask. As the pattern of the conductive channel is larger, the size of the pattern of the auxiliary photomask is relatively large. Therefore, compared to the redevelop of a photomask that can form a specific size and more precise conductive grid at one time, the development of an auxiliary photomask Simpler, cheaper and more efficient.

For conductive grids of different widths, a universal reticle and an auxiliary reticle can be used. The width of the conductive grid corresponding to the universal reticle is moderate. You can increase or decrease the conductivity by adjusting the width of the auxiliary reticle. The width of the grid, because the width of the pattern of the auxiliary mask and the width of the pattern of the general mask are superimposed to obtain the width of the final conductive grid. Therefore, it is relatively developed to develop a conductive grid of a specific size and a more precise one-time width. For photomasks, developing an auxiliary photomask is simpler, its cost is lower, and its efficiency is higher.

For conductive grids of different widths and lengths, one universal photomask and two auxiliary photomasks can be used. The two auxiliary photomasks have different patterns. Among them, the pattern of one auxiliary photomask is used to adjust the conductive mesh. The width of the grid and the pattern of another auxiliary photomask are used to adjust the length of the conductive grid. When the width and length of the conductive grid to be produced are different, two simple auxiliary photomasks can be re-developed. Compared to developing a photomask that can form a specific size and more precise conductive grid at one time, the process is simpler, the cost is lower, and the efficiency is higher.

In a specific embodiment of the present application, the photomask group includes two photomasks, which are a first photomask 30 and a second photomask 40, as shown in FIG. 5. The number of photomasks of such a photomask group is small, which makes the implementation process of the production process of the induction film relatively simple and efficient. At the same time, only one photomask needs to be re-developed in this photomask group, which makes the cost of the production of the photoinduction film low .

As shown in FIG. 1, in an embodiment, the first photomask 30 is a universal photomask. The first photomask 30 includes a first light-shielding portion 31 and a plurality of first light-transmitting portions 32. The light-transmitting portions 32 are arranged at intervals. The width of the plurality of first light-transmitting portions 32 corresponds to the width of the conductive grid 50 formed last. As shown in FIG. 2, the second photomask 40 includes a second light-shielding portion 41 and a second照明部 42。 The light transmitting portion 42. In step S2, the pattern of the photomask obtained by projecting the second photomask 40 onto the first photomask 30 is shown in FIG. 3, and as shown in FIG. 3, in the step S2, the second light-shielding portion 41 A projection on a mask 30 overlaps a part of the plurality of first light transmitting portions 32, and the overlapping portion is equivalent to cutting the first light transmitting portion, so that a photoresist portion with a small length can be formed, and further formed A conductive grid of a predetermined length.

Of course, the patterns of the first photomask and the second photomask of the present application are not limited to the above schemes, for example, they may be opposite to the above schemes, for example, the first light-shielding portion and the first light-transmitting portion in the first photomask The light parts are interchangeable, that is, the first light shielding part in FIG. 1 becomes the first light transmitting part, and the first light transmitting part becomes the first light transmitting part; the second light shielding part and the second light transmitting part in the second mask It is also interchangeable, that is, the second light-shielding portion in FIG. 2 becomes a second light-transmitting portion, and the second light-transmitting portion becomes a second light-shielding portion. If the photomask group of this scheme and the photomask group of the upper scheme want to form a photoresist layer with the same pattern, the positive and negative of the photoresist used by these two schemes need to be opposite. Of course, it can also be two photomasks with other patterns. Those skilled in the art can select the first photomask and the second photomask with appropriate patterns according to the actual situation, which will not be repeated here.

In an embodiment of the present application, as shown in FIG. 1, a plurality of the first light transmitting portions 32 are arranged at the same interval. Such a first photomask 30 (universal photomask) can be better applied in the manufacturing process of multiple conductive grids and has good compatibility.

As shown in FIG. 2, there are a plurality of the second light-shielding portions 41, and the plurality of the second light-shielding portions 41 are arranged at intervals. The projection of each of the second light-shielding portions 41 on the first mask 30 and the plurality of first A part of a light-transmitting portion 32 is overlapped, as shown in FIG. 3, which is equivalent to cutting a plurality of first light-transmitting portions 32 into a plurality of sections, so that a plurality of small-length photoresistive portions can be formed, which is called predetermined light transmission. The portion 102 is a predetermined light-shielding portion 101 and further forms a plurality of conductive meshes with a predetermined length.

In another embodiment of the present application, the step S2 includes: sequentially covering the first photomask 30 and the second photomask 40 on the surface of the photoresist layer 20 remote from the substrate 10 to form FIG. 5 or The structure shown in FIG. 9; exposing the photoresist layer 20 covered with the photomask group; developing the photoresist layer 20 after exposure, so that the first light-shielding portion 31 is below and the second light-shielding portion The photoresist layer 20 in the corresponding area below 41 is removed, as shown in FIG. 6; or the photoresist layer 20 in the corresponding area below each of the first light transmitting portion 32 and the second light transmitting portion 42 is removed. As shown in FIG. 10, a part of the substrate 10 is exposed to form a patterned photoresist layer 20.

It should be noted that in the above method, in this step of removing a part of the photoresist layer, specifically whether to remove the photoresist layer below the light shielding portion or the photoresist layer below the light transmitting portion depends on the photoresist in the photoresist layer. Positive and negative, when the photoresist is a positive photoresist, that is, the photoresist layer is a positive photoresist layer, in this step, the corresponding photoresist is removed from the area under the two light transmitting parts. When the photoresist is Negative photoresist, that is, when the photoresist layer is a negative photoresist layer, this size is relatively small, and the photoresist in the area under the two light-shielding portions is removed accordingly. In the actual operation process, a positive photoresist or a negative photoresist can be selected to form a photoresist layer according to the pattern of the photomask and a specific manufacturing process.

In a specific embodiment, the photoresist layer 20 is a negative photoresist layer, the substrate 10 includes a conductive layer 12, and in the above step S2, the lower portion of the first light shielding portion 31 and the lower portion of the second light shielding portion 41 correspond to each other. The photoresist layer 20 in the region is all removed. As shown in FIG. 6, in the above step S3, the material of the conductive layer 12 that is not masked by the photoresist layer 20 is removed, and the remaining material of the conductive layer 12 forms a plurality of materials such as The conductive mesh 50 shown in FIG. 7. The performance of the induction film produced by this solution is better and the yield of the induction film is higher.

Of course, if you want to replace the negative photoresist with the positive photoresist in the above scheme, you need to change the pattern of the photomask group at the same time, and you can exchange the light-shielding part and the light-transmitting part of each photomask. This scheme may not have a higher yield than the above scheme.

In another specific embodiment, the photoresist layer 20 is a positive photoresist layer. In the step S2, the light in the corresponding area below the first light-transmitting portion 32 and below the second light-transmitting portion 42 is The resist layers 20 are all removed, as shown in FIG. 10, and in the above step S3, a conductive material is disposed on the bare substrate 10, as shown in FIG. 11, to form a plurality of conductive grids 50.

Similarly, if you want to replace the positive photoresistor with the negative photoresistor in the previous solution, you need to change the pattern of the photomask group at the same time, and you can replace the light-shielding part and the light-transmitting part of each photomask. This scheme may not have a higher yield than the above scheme.

There are many methods for setting a conductive material in the above step S3. Those skilled in the art may choose a suitable method to set a conductive material according to the actual situation to form a conductive grid. For example, a chemical vapor deposition method, a physical vapor deposition method, a magnetron sputtering method, or a plating method may be used to set the conductive material.

It should be noted that when a conductive material is provided by electroplating, since the conductive material can only be plated on the conductive material, the above-mentioned substrate of the present application needs to include a conductive base layer or be provided on the substrate before the photoresist layer is provided. A conductive base layer (the photoresist layer is disposed on the conductive base layer) to ensure the formation of a conductive grid. In addition, in order to facilitate the subsequent application of the sensing film, the conductive base layer may be removed.

In order to facilitate the production of the process and ensure that the conductive grid has good performance, in an embodiment of the present application, the substrate 10 further includes a substrate 11, and the conductive layer 12 is disposed on a surface of the substrate 11. The resist layer 20 is disposed on a surface of the conductive layer 12 remote from the substrate 11.

The above substrate may be formed of any available insulating material. Specifically, the material of the substrate may be selected from insulating materials such as ordinary glass, PET, PE, or PB. Those skilled in the art may select a suitable material for forming according to actual conditions. Substrate.

The conductive grid of the present application may be a grid formed of any conductive material, and those skilled in the art may select a suitable conductive material to form the conductive grid of the present application according to actual conditions.

As light passes through the substrate of the photomask during the exposure, it will have a refractive effect, which will affect the size of the photoresist layer pattern. The smaller the distance between the photomask and the photoresist layer, the more the size effect caused by the corresponding refractive effect. small. In the above embodiment, the first photomask is a universal photomask, and the size of the pattern thereon is small. The size of the pattern of the formed photoresist layer is slightly different from this size, which will lead to more serious consequences. Try to make the corresponding size of the finally formed pattern close to the corresponding size of the pattern on the first photomask. In a specific embodiment, as shown in FIG. 5 and FIG. 9, the first photomask 30 is close to the photoresist layer. 20, that is, closer to the photoresist layer 20 than the second photomask 40.

In order to simplify the process steps and improve the production efficiency of the induction film, in an embodiment of the present application, in the above step S3, the conductive grid 50 is formed and a frame lead region 60 including a plurality of frame leads is also formed, such as As shown in FIG. 13, that is to say, the superposition of the patterns of the photomask group can not only form the conductive grid of the sensing area in the sensing film, but also form the frame leads of the frame lead area 60 in the sensing film. High, the grid needs to be dense enough.

Of course, the frame lead in the induction film may not be formed at the same time as the conductive grid. For example, a silver paste may be printed in a post-process and then laser-processed. Flexible design of the area of the line and the bonding area, so that the sensing film achieves great flexibility and versatility.

In another exemplary embodiment of the present application, a manufacturing method of a touch screen is provided. The manufacturing method includes a manufacturing process of a sensing film, and the manufacturing process of the conductive grid is any of the manufacturing processes described above.

Since the manufacturing method includes the above-mentioned manufacturing process of the induction film, the cost is low and the efficiency is high.

In order to enable those skilled in the art to understand the technical solution of the present application more clearly, the technical solution of the present application will be described below with reference to specific embodiments.

Example 1

The manufacturing process of the induction film includes:

In step S1, a substrate 10 is provided. The substrate 10 includes a substrate and a conductive layer 12 disposed on the substrate 11. A photoresist layer 20 is disposed on the substrate 10 to form the structure shown in FIG. 4. The photoresist layer is A negative photoresist layer formed by a negative photoresist.

In step S2, the photoresist layer 20 is patterned by using a photomask group, so that part of the photoresist layer 20 is removed, and a plurality of photoresist portions 21 are formed at intervals, so that part of the substrate 10 is exposed, as shown in FIG.

Specifically, the first photomask 30 and the second photomask 40 are sequentially covered on the surface of the photoresist layer 20 remote from the substrate 10 to form the structure shown in FIG. 5. As shown in FIG. 1, The first photomask 30 includes a first light-shielding portion 31 and a plurality of first light-transmitting portions 32 arranged at the same interval. The widths of the plurality of first light-transmitting portions 32 correspond to the width of the conductive grid that is finally formed, such as As shown in FIG. 2, the second photomask 40 includes a plurality of second light-shielding portions 41 and a plurality of second light-transmitting portions 42. After the two photomasks are fixed, each of the second light-shielding portions 41 is exposed to the first light. The projection on the cover 30 overlaps a part of the plurality of first light transmitting portions 32 described above;

Exposing the photoresist layer 20 provided with the photomask group; developing the photoresist layer 20 after exposure, so that the light in the corresponding areas below the first light-shielding portion 31 and below the second light-shielding portion 41 The resist layer 20 is removed, as shown in FIG. 6, so that a part of the substrate 10 is exposed to form the patterned photoresist layer 20.

In step S3, the material of the conductive layer 12 that is not masked by the photoresist layer 20 is removed, and the remaining material of the conductive layer 12 forms a plurality of the conductive grids 50 as shown in FIG.

In step S4, the patterned photoresist layer 20 is removed to form a sensing film including a conductive grid, as shown in FIG. 8.

Example 2

The manufacturing process of the induction film includes:

In step S1, a substrate 10 is provided, and a photoresist layer 20 is provided on the substrate 10. As shown in FIG. 9, the photoresist layer is a positive photoresist layer formed by a positive photoresist.

In step S2, the photoresist layer 20 is patterned by using a photomask group, so that a part of the photoresist layer 20 is removed, and a plurality of photoresist sections 21 are formed at intervals, so that a part of the substrate 10 is exposed, as shown in FIG.

Specifically, the first photomask 30 and the second photomask 40 are sequentially covered on the surface of the photoresist layer 20 remote from the substrate 10 to form the structure shown in FIG. 9. As shown in FIG. 1, The above-mentioned first photomask 30 includes a first light-shielding portion 31 and a plurality of first light-transmitting portions 32 arranged at the same interval. The width of the plurality of first light-transmitting portions corresponds to the width of the conductive grid that is finally formed. As shown in FIG. 2, the second photomask 40 includes a plurality of second light-shielding portions 41 and a plurality of second light-transmitting portions 42. After fixing the two photomasks, each of the second light-shielding portions 41 is in the first photomask. The projection on 30 overlaps a part of the plurality of first light transmitting portions 32;

Expose the photoresist layer 20 provided with the photomask group; develop the photoresist layer 20 after exposure so that the corresponding areas under the first light transmitting portion 32 and below the second light transmitting portion 42 are exposed. The photoresist layer 20 is removed, as shown in FIG. 10, so that a part of the substrate 10 is exposed to form the patterned photoresist layer 20.

In step S3, a conductive material is provided on the bare substrate 10, as shown in FIG. 11, a plurality of the above-mentioned conductive grids 50 are formed, and the conductive grid 50 of FIG. 11 is formed.

In step S4, the patterned photoresist layer 20 is removed to form a sensing film including a conductive grid, as shown in FIG. 12.

When making conductive grids with different lengths, it is only necessary to redevelop the second photomask to cut the photoresist layer at different positions to form conductive grids with different lengths.

The manufacturing process greatly saves the cost of developing the photomask, improves the specification compatibility of the photomask, and the manufactured sensing film has better performance and higher yield.

From the above description, it can be seen that the foregoing embodiments of the present application achieve the following technical effects:

1) In the manufacturing process of the induction film including the conductive grid of the present application, a plurality of photomasks are used to pattern the photoresist layer simultaneously, that is, the superposition of the patterns of multiple photomasks corresponds to the pattern of the photoresist layer One of the multiple photomasks is a universal photomask, which can be used in the process of making conductive grids of different sizes, and the remaining photomasks are auxiliary photomasks. In the process of making conductive grids of different sizes and designs, it is necessary to develop a new auxiliary photomask and a universal photomask to obtain a conductive grid of a predetermined size and design. Compared to re-developing a photomask that can form a conductive grid with a specific size at one time, the process of developing a new auxiliary photomask is simpler, its cost is lower, and its efficiency is higher. In addition, in the actual manufacturing process, a high-precision photomask can be selected as a general-purpose photomask. In this way, the pattern size of the auxiliary photomask is large and simple, and it is more simple and efficient to develop it.

2) The manufacturing method of the sensing film of the present application includes the manufacturing method of the sensing film described above, which has lower cost and higher efficiency.

The above description is only a preferred embodiment of the present application, and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, or improvement made within the spirit and principle of this application shall be included in the protection scope of this application.

Claims

A manufacturing process of an induction film, which comprises a conductive grid (50), characterized in that the manufacturing process includes:

Step S1, providing a substrate (10), and providing a photoresist layer (20) on the substrate (10);

Step S2, patterning the photoresist layer (20) by using a photomask group, the photomask group including a plurality of photomasks stacked in sequence, and at least one of the photomasks of the photomask. The projection of the light-shielding part on another said photomask overlaps a part of the light-transmitting part of another said photomask;

Step S3: removing the material of the substrate (10) that is not masked by the photoresist layer (20) to form the conductive grid (50); or setting a conductive layer on the surface of the bare substrate (10) Material to form the conductive grid (50); and

Step S4, removing the patterned photoresist layer (20).
The manufacturing process according to claim 1, wherein the photomask group comprises two photomasks, respectively a first photomask (30) and a second photomask (40).
The manufacturing process according to claim 2, characterized in that the first photomask (30) comprises a first light shielding portion (31) and a plurality of first light transmitting portions (32), and a plurality of the first The light-transmitting portions (32) are arranged at intervals. The second mask (40) includes a second light-shielding portion (41) and a second light-transmitting portion (42). In the step S2, the second light-shielding portion (41) The projection on the first mask (30) overlaps a part of the plurality of first light transmitting portions (32).
The manufacturing process according to claim 3, wherein a plurality of the first light transmitting portions (32) are arranged at the same interval.
The manufacturing process according to claim 3, wherein there are a plurality of the second light shielding portions (41), and a plurality of the second light shielding portions (41) are arranged at intervals, and each of the second light shielding portions (41) 41) The projection on the first mask (30) overlaps a part of the plurality of first light transmitting portions (32).
The manufacturing process according to claim 3, wherein the step S2 comprises:

The first photomask (30) and the second photomask (40) are sequentially covered on a surface of the photoresist layer (20) remote from the substrate (10);

Exposing the photoresist layer (20) provided with the photomask group; and

Developing the exposed photoresist layer (20) so that the photoresist layer (20) under the first light shielding portion (31) and the corresponding area under the second light shielding portion (41) are both The photoresist layer (20) under each of the first light transmitting portions (32) and the corresponding areas under the second light transmitting portions (42) are removed, so that part of the substrate (10 ) Exposed to form the patterned photoresist layer (20).
The manufacturing process according to claim 6, wherein the photoresist layer (20) is a negative photoresist layer, and the substrate (10) includes a conductive layer (12), and in step S2, all The photoresist layer (20) under the first light-shielding portion (31) and the corresponding area under the second light-shielding portion (41) are both removed. In step S3, the photoresist layer without the photoresist layer ( 20) The material of the conductive layer (12) that is masked, and the remaining material of the conductive layer (12) forms a plurality of the conductive grids (50).
The manufacturing process according to claim 6, wherein the photoresist layer (20) is a positive photoresist layer, and in the step S2, under each of the first light-transmitting portions (32) and at The photoresist layer (20) in the corresponding area below the second light transmitting portion (42) is removed, and in step S3, a conductive material is provided on the bare substrate (10) to form a plurality of The conductive grid (50).
The manufacturing process according to claim 7, wherein the base (10) further comprises a substrate (11), the conductive layer (12) is disposed on a surface of the substrate (11), and A photoresist layer (20) is disposed on a surface of the conductive layer (12) remote from the substrate (11).
The manufacturing process according to claim 2, characterized in that, in the step S2, the first photomask (30) is disposed near the photoresist layer (20).
The manufacturing process according to claim 1, wherein in the step S3, a frame lead region (60) including a plurality of frame leads is formed at the same time as the conductive grid (50) is formed.
A method for manufacturing a touch screen includes a manufacturing process of a sensing film, wherein the manufacturing process of the sensing film is the manufacturing process according to any one of claims 1 to 11.