CN114489367A - Electronic device and manufacturing method thereof - Google Patents
Electronic device and manufacturing method thereof Download PDFInfo
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- CN114489367A CN114489367A CN202011268763.6A CN202011268763A CN114489367A CN 114489367 A CN114489367 A CN 114489367A CN 202011268763 A CN202011268763 A CN 202011268763A CN 114489367 A CN114489367 A CN 114489367A
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Classifications
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- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a touch panel and a manufacturing method of the touch panel, wherein the touch panel comprises a substrate, a first conducting layer, a first insulating layer and a second conducting layer. The first conductive layer is disposed on the substrate, the first insulating layer is disposed on the first conductive layer, and the second conductive layer is disposed on the first insulating layer and the substrate. The first conductive layer is located between the substrate and the first insulating layer, wherein at least a portion of the first conductive layer is located between the substrate and the second conductive layer, at least a portion of the first insulating layer is located between the first conductive layer and the second conductive layer, and one of the first conductive layer and the second conductive layer includes a conductive photoresist.
Description
Technical Field
The present invention relates to an electronic device and a method for manufacturing the same, and more particularly, to an electronic device and a method for manufacturing the same, which can simplify a manufacturing process and/or reduce a manufacturing cost.
Background
Electronic devices such as notebook computers (notebook computers), smart phones (smart phones), wearable devices, smart watches, and display screens for vehicles are widely used nowadays and become indispensable products. Due to the widespread use of electronic devices, the yield and cost of electronic devices are critical to their production process. Accordingly, there is a need for improved electronic devices and methods of manufacturing the same to improve the yield and/or reduce the manufacturing cost of the electronic devices.
Disclosure of Invention
The invention provides a touch panel and a manufacturing method thereof, which use conductive photoresist as a touch layer of the touch panel to simplify the manufacturing process of the touch panel and/or reduce the manufacturing cost of the touch panel.
In order to solve the above technical problems, the present invention provides a touch panel, which includes a substrate, a first conductive layer, a first insulating layer, and a second conductive layer. The first conductive layer is disposed on the substrate, the first insulating layer is disposed on the first conductive layer, and the second conductive layer is disposed on the first insulating layer and the substrate. The first conductive layer is located between the substrate and the first insulating layer, at least part of the first conductive layer is located between the substrate and the second conductive layer, at least part of the first insulating layer is located between the first conductive layer and the second conductive layer, and one of the first conductive layer and the second conductive layer comprises a conductive photoresist.
In order to solve the above technical problem, the present invention further provides a method for manufacturing a touch panel, including: forming a first insulating layer and a patterned first conductive layer on a substrate, wherein the first conductive layer is positioned between the substrate and the first insulating layer; and forming a patterned second conductive layer on the first insulating layer and the substrate such that at least a portion of the first insulating layer is located between the first conductive layer and the second conductive layer, wherein at least a portion of the first conductive layer is located between the substrate and the second conductive layer, and one of the first conductive layer and the second conductive layer comprises a conductive photoresist.
Compared with the conventional prior art, the touch panel and the manufacturing method thereof can simplify the steps of the patterning process to improve the manufacturing efficiency, and can omit the additional film formation and the additional etching process to reduce the use of materials and process equipment to reduce the manufacturing cost. In addition, if the second conductive layer includes a conductive photoresist, damage to a lower layer (e.g., the first conductive layer) during a patterning process of the second conductive layer can be reduced, thereby improving reliability of the touch panel.
Drawings
Fig. 1 is a schematic cross-sectional view of a touch panel according to a first embodiment of the invention.
FIG. 2 is a schematic diagram of a conductive photoresist layer according to an embodiment of the present invention.
Fig. 3 is a schematic top view of a first conductive layer and a second conductive layer according to an embodiment of the invention.
Fig. 4 is a schematic top view of a first conductive layer, a first insulating layer and a second conductive layer according to another embodiment of the invention.
Fig. 5 is a schematic sectional view taken along the sectional line a-a' of fig. 4.
Fig. 6 is a schematic sectional view taken along the line B-B' of fig. 4.
Fig. 7 is a flowchart illustrating a method for manufacturing a touch panel according to an embodiment of the invention.
Fig. 8 is a schematic cross-sectional view of a touch panel according to a second embodiment of the invention.
Fig. 9 to 12 are schematic cross-sectional views illustrating examples of the formation of the first conductive layer, the first insulating layer and the second conductive layer in the touch panel according to the second embodiment of the invention.
Fig. 13 is a schematic cross-sectional view of a touch panel according to a third embodiment of the invention.
Description of reference numerals: 100. 200, 300-touch panel; 110-a substrate; 120-a first conductive layer; 120 m-a first layer of conductive material; 122-a first repeat unit; 122 a-a sensing portion; 122 b-a connecting portion; 124-third repeat unit; 130-a first insulating layer; 132-insulating repeat units; 140-a second conductive layer; 142-a second repeat unit; 150-a second insulating layer; 210-a buffer layer; 310-a low reflection layer; CP1 — first pattern; CP2 — second pattern; CPi-insulating pattern; CPS-conductive particles; d1-first direction; d2-second direction; dn-normal direction; PRC-conductive photoresist layer; PRM-photoresist; ST1, ST 2-step; vo-gap.
Detailed Description
In order to make the present invention more comprehensible to those skilled in the art, preferred embodiments of the present invention are specifically described below, and the present invention will be described in detail with reference to the accompanying drawings. It is to be noted that the drawings are simplified and that only the elements and combinations of elements and components relevant to the present invention are shown to provide a clear description of the basic structure or method of operation of the invention, which may be more complex in terms of actual elements and arrangements. In addition, for convenience of description, the elements shown in the drawings are not necessarily drawn to scale, and the specific scale may be adjusted according to design requirements.
It is to be understood that the following embodiments are capable of other embodiments and that various changes, substitutions and alterations can be made to the features of the various embodiments described herein without departing from the spirit of the invention. Features of the various embodiments may be combined and matched as desired, without departing from the spirit or ambit of the invention.
The touch panel of the present invention can be any panel with a touch function, for example, the touch panel can be a touch sensing device or a touch display device. The touch sensing can be performed in any suitable manner, such as a capacitive sensing (e.g., self-capacitance or mutual-capacitance), but not limited thereto. It should be noted that the touch panel may have an active area and at least one inactive area located outside the active area, where the active area is at least used for touch sensing, and the inactive area is not used for touch sensing. In addition, the active area of the touch panel may have other functions, such as a screen display function, a fingerprint recognition function, or other suitable functions. It should be noted that the following description is only directed to devices, layers and structures located in the active region. For example, if the touch panel has a function of displaying an image, the active area may also be used to display the image, but the invention is not limited thereto. In addition, the touch panel and the active area may be respectively rectangular, polygonal, circular, a shape with curved sides, or other suitable shapes, but the invention is not limited thereto.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic cross-sectional view of a touch panel according to a first embodiment of the invention, and fig. 2 is a schematic view of a conductive photoresist layer according to an embodiment of the invention. As shown in fig. 1, the touch panel 100 of the present embodiment includes a substrate 110, a first conductive layer 120, a first insulating layer 130, and a second conductive layer 140. The substrate 110 of the present embodiment may include any suitable material, for example, the substrate 110 may be a rigid substrate or a flexible substrate, and may correspondingly include, for example, glass, plastic, quartz, sapphire, Polyimide (PI), polyethylene terephthalate (PET), epoxy (which may form an FR4 substrate), phenolic resin (bakelite), other suitable materials, or a combination thereof, depending on the type of the substrate 110, but not limited thereto.
As shown in fig. 1, the first conductive layer 120 is disposed on the substrate 110, the first insulating layer 130 is disposed on the first conductive layer 120, and the second conductive layer 140 is disposed on the first insulating layer 130 and the substrate 110, wherein the first conductive layer 120 and the second conductive layer 140 are used for touch sensing in an active region, and the first insulating layer 130 can be used for separating at least a portion of the first conductive layer 120 and at least a portion of the second conductive layer 140 from each other in a normal direction Dn of the substrate 110. In the present invention, the first conductive layer 120 and the second conductive layer 140 can be patterned films, so that the first conductive layer 120 is located between the substrate 110 and the first insulating layer 130, at least a portion of the first conductive layer 120 is located between the substrate 110 and the second conductive layer 140, and at least a portion of the first insulating layer 130 is located between the first conductive layer 120 and the second conductive layer 140. In addition, the first insulating layer 130 may be a complete continuous film layer and completely cover the active region, or the first insulating layer 130 may be a patterned film layer and only cover a portion of the active region, but not limited thereto.
The material of the first insulating layer 130 may include any suitable inorganic insulating material and/or organic insulating material, such as polyimide, silicon oxide, silicon nitride, non-conductive photoresist, other suitable materials, or a combination thereof, but is not limited thereto. The material of the first conductive layer 120 and the second conductive layer 140 can be any suitable conductive material, such as a metal (e.g., copper, silver, molybdenum, aluminum), a metal oxide (e.g., indium tin oxide), a conductive polymer, a conductive photoresist, graphene, other suitable conductive materials, or a combination thereof, but not limited thereto. In the present invention, the first conductive layer 120 and/or the second conductive layer 140 may include a conductive photoresist, that is, one of the first conductive layer 120 and the second conductive layer 140 includes a conductive photoresist, or both the first conductive layer 120 and the second conductive layer 140 include a conductive photoresist. For example, in the present embodiment, the first conductive layer 120 and the second conductive layer 140 both include a conductive photoresist, but not limited thereto.
The conductive photoresist is a conductive material that can be patterned by a developing process, and can be classified into a positive conductive photoresist and a negative conductive photoresist according to the reaction of the photoresist irradiation. The conductive photoresist may comprise a suitable material and may form a conductive photoresist layer PRC. It should be noted that the developing process of the present invention is a process for patterning a conductive photoresist and/or a non-conductive photoresist. For example, the film layer (e.g., the first conductive layer 120 and/or the second conductive layer 140) including the conductive photoresist may form a conductive photoresist layer PRC as shown in fig. 2, and the conductive photoresist may include conductive particles CPS and a non-conductive photoresist PRM, wherein the conductive particles CPS may be uniformly distributed in the conductive photoresist layer PRC and used for transmitting an electrical signal, and the non-conductive photoresist PRM is used for making the conductive photoresist have a property that can be patterned by a developing process. In addition, in some embodiments, the conductive photoresist may be cured by baking to form the conductive photoresist layer PRC, and since baking the conductive photoresist may cause evaporation of a portion of the material in the conductive photoresist, the density of the conductive particles CPS may be increased, thereby increasing the conductivity of the conductive photoresist layer PRC. It should be noted that the conductive photoresist layer PRC shown in fig. 2 is only an example, and the conductive photoresist layer PRC is not limited thereto.
In addition, the conductive photoresist may have a low reflection property and/or a extinction property, so as to reduce the reflection of external light (light originating from outside the touch panel 100) after the external light irradiates the conductive photoresist, thereby reducing the visibility of the conductive photoresist for a user. In some embodiments, the conductive photoresist may be black, gray, or other opaque colors with low reflective properties and/or extinction properties, but not limited thereto.
Since the first conductive layer 120 and the second conductive layer 140 are patterned films, the first conductive layer 120 and the second conductive layer 140 can sense a touch in an active region. The following description will exemplarily describe the patterns and the arrangement of the first conductive layer 120, the second conductive layer 140 and the first insulating layer 130 according to some embodiments, but the present invention is not limited thereto.
Referring to fig. 3 and fig. 1 at the same time, fig. 3 is a schematic top view of a first conductive layer and a second conductive layer according to an embodiment of the invention, where fig. 3 only shows a portion of the first conductive layer 120 and the second conductive layer 140. As shown in the embodiment of fig. 3, the first conductive layer 120 has a first pattern CP1 in the active area, the second conductive layer 140 has a second pattern CP2 in the active area, the first pattern CP1 and the second pattern CP2 are both grid patterns and do not completely overlap with each other in the normal direction Dn of the substrate 110, and the touch panel 100 can perform touch sensing in the active area through the first pattern CP1 and the second pattern CP 2. In the embodiment of fig. 3, the first pattern CP1 includes a plurality of first repeating units 122, the first repeating units 122 have the same shape and size as each other, the second pattern CP2 includes a plurality of second repeating units 142, and the second repeating units 142 have the same shape and size as each other, but not limited thereto. In fig. 3, the shape and size of the first repeating unit 122 are the same as those of the second repeating unit 142, but not limited thereto. The first repeating unit 122 and the second repeating unit 142 may be any suitable shape, such as a quadrangle, a hexagon, or other suitable polygons (the first repeating unit 122 and the second repeating unit 142 are both quadrangles in fig. 3), but not limited thereto. In addition, in the embodiment of fig. 3, the first insulating layer 130 may be a complete continuous film layer and completely covers the active region, but not limited thereto.
Referring to fig. 4 to fig. 6 and fig. 1, fig. 4 is a schematic top view illustrating a first conductive layer, a first insulating layer and a second conductive layer according to another embodiment of the present invention, fig. 5 is a schematic cross-sectional view taken along a section line a-a 'of fig. 4, and fig. 6 is a schematic cross-sectional view taken along a section line B-B' of fig. 4, wherein fig. 4 only illustrates a portion of the first conductive layer 120, the first insulating layer 130 and the second conductive layer 140. As shown in fig. 4 to 6, the first conductive layer 120 has a first pattern CP1 in the active area, the second conductive layer 140 has a second pattern CP2 in the active area, and the touch panel 100 can perform touch sensing in the active area through the first pattern CP1 and the second pattern CP 2. In fig. 4 to 6, the first pattern CP1 includes a plurality of first repeating units 122 and a plurality of third repeating units 124, the first repeating units 122 may extend in the first direction D1 and be arranged in the second direction D2, the third repeating units 124 may be disposed between two first repeating units 122, the first repeating units 122 may have the same shape and size as each other, the third repeating units 124 may have the same shape and size as each other, and the first repeating units 122 and the third repeating units 124 may not overlap and be spaced apart from each other in the normal direction Dn of the substrate 110; the second pattern CP2 includes a plurality of second repeating units 142, the second repeating units 142 connect two adjacent third repeating units 124, and the shapes and sizes of the second repeating units 142 are the same as each other, but not limited thereto. In detail, the first repeating unit 122 may include a plurality of sensing portions 122a and a plurality of connecting portions 122b, the connecting portions 122b connect two adjacent sensing portions 122a, and the shape and size of the sensing portions 122a may be the same as those of the third repeating unit 124, but not limited thereto. In the embodiments of fig. 4 to 6, the first insulating layer 130 may be a patterned film layer and have an insulating pattern CPi, the insulating pattern CPi includes a plurality of insulating repeating units 132, each insulating repeating unit 132 is disposed between the connecting portion 122b of the first repeating unit 122 and the second repeating unit 142 in the normal direction Dn of the substrate 110, and the second repeating unit 142 extends beyond the insulating repeating unit 132 and connects the third repeating unit 124, but not limited thereto. It should be noted that the shape and size of each repeating unit can be designed according to the requirement, and is not limited to the embodiments shown in fig. 4 to 6.
In addition, the touch panel 100 may further optionally include other film layers, such as an insulating layer, a protective layer, a passivation layer, an optical film layer (e.g., a polarizer, a low reflection layer), a dielectric layer, other suitable film layers, or a combination thereof. For example, in fig. 1, the touch panel 100 may further optionally include a second insulating layer 150 disposed on the second conductive layer 140 to protect the first conductive layer 120 and the second conductive layer 140, but not limited thereto. The material of the second insulating layer 150 may include any suitable inorganic insulating material and/or organic insulating material, such as polyimide, silicon oxide, silicon nitride, non-conductive photoresist, other suitable materials, or a combination thereof, but is not limited thereto. In the present embodiment, the material of the first insulating layer 130 may be the same as or different from the material of the second insulating layer 150. For example, if the touch panel 100 has a function of displaying images, the touch panel 100 may further include a film layer and/or a structure for displaying images, such as a pixel structure, a color conversion layer, a display medium layer, a polarizer, other suitable film layers, or a combination thereof.
Referring to fig. 7 and fig. 1 to 6 at the same time, fig. 7 is a flowchart illustrating a method for manufacturing a touch panel 100 according to an embodiment of the invention. It should be noted that the flowchart of the method for manufacturing the touch panel 100 shown in fig. 7 is exemplary, and the method for manufacturing the touch panel 100 of the present invention is not limited to the flowchart and the steps shown in fig. 7.
In step ST1 of fig. 7, a first insulating layer 130 and a patterned first conductive layer 120 are formed on a substrate 110, wherein the first conductive layer 120 is located between the substrate 110 and the first insulating layer 130. In detail, since the first conductive layer 120 and the second conductive layer 140 of the present embodiment both include the conductive photoresist, a continuous and complete conductive photoresist layer PRC may be formed on the substrate 110 as the first conductive layer 120, then, the first conductive layer 120 is exposed to light to irradiate a portion of the first conductive layer 120, and then, the first conductive layer 120 is patterned by a developing process to form the patterned first conductive layer 120. After the formation of the patterned first conductive layer 120 is completed, the first insulating layer 130 is formed on the patterned first conductive layer 120 (i.e., the first insulating layer 130 of the present embodiment is formed after the patterning of the first conductive layer 120). The first insulating layer 130 may be formed by a corresponding process according to a touch design or other requirements, wherein the first insulating layer 130 may be a complete continuous film layer and completely covers the active region, or the first insulating layer 130 may be a patterned film layer and only covers a portion of the active region, but not limited thereto. In some embodiments, the first insulating layer 130 may be patterned by performing a developing process (e.g., the material of the first insulating layer 130 is a non-conductive photoresist) or an etching process (e.g., the material of the first insulating layer 130 is not a non-conductive photoresist) on the first insulating layer 130 according to the material of the first insulating layer 130. It should be noted that the etching process of the present invention is a process for patterning a film layer without a photoresist material (e.g., without a conductive photoresist and a non-conductive photoresist).
In step ST2 of fig. 7, a patterned second conductive layer 140 is formed on the first insulating layer 130 and the substrate 110 such that at least a portion of the first insulating layer 130 is located between the first conductive layer 120 and the second conductive layer 140, wherein at least a portion of the first conductive layer 120 is located between the substrate 110 and the second conductive layer 140. In detail, since the first conductive layer 120 and the second conductive layer 140 of the present embodiment both include the conductive photoresist, a continuous and complete conductive photoresist layer PRC may be formed on the first insulating layer 130 and the substrate 110 as the second conductive layer 140, then, the second conductive layer 140 may be exposed to light to expose a portion of the second conductive layer 140, and then, the second conductive layer 140 may be patterned by a developing process to form the patterned second conductive layer 140.
In addition, other required layers, such as an insulating layer, a protective layer, a passivation layer, an optical layer (e.g., a polarizer, a low reflection layer), a dielectric layer, other suitable layers, or combinations thereof, may be optionally disposed on the touch panel 100. For example, as shown in fig. 1, after the patterned second conductive layer 140 is formed, a second insulating layer 150 may be formed on the second conductive layer 140, but not limited thereto. For example, if the touch panel 100 has a function of displaying images, a film and/or a structure for displaying images, such as a pixel structure, a color conversion layer, a display medium layer, a polarizer, other suitable films, or a combination thereof, may be formed in the touch panel 100 before, during, or after the above steps.
Compared with the traditional mode, the patterning process of the conducting layer can simplify the steps of the patterning process to improve the manufacturing efficiency, and can reduce the use of materials and process equipment in the patterning process to reduce the manufacturing cost. In detail, according to the present invention, when the conductive layer (the first conductive layer 120 and/or the second conductive layer 140) includes a conductive photoresist, the conductive layer including the conductive photoresist may be directly patterned through a developing process. In a conventional process for patterning a conductive layer by an etching process, a photoresist layer for defining a pattern of the conductive layer is additionally formed on the conductive layer, and after the photoresist layer is patterned by a developing process, the conductive layer is additionally etched, and an etching substance (e.g., an etching solution, an etching gas) used in the etching process is different from a developer used in the developing process. Therefore, compared with the conventional method, the patterning process of the conductive layer can simplify the steps of the patterning process to improve the manufacturing efficiency, and can omit the additional film formation and the additional etching process to reduce the use of materials and process equipment and reduce the manufacturing cost.
In addition, since the second conductive layer 140 of the present embodiment includes the conductive photoresist, and the conductive photoresist may have a low reflection property and/or a extinction property, it is not necessary to perform an additional blackening process on the second conductive layer 140, for example, to dispose a low reflection layer (or a blackening layer) on the second conductive layer 140. Therefore, the design of the second conductive layer 140 including the conductive photoresist can reduce the manufacturing steps of the touch panel 100 and reduce the material cost.
In addition, since the second conductive layer 140 of the present embodiment includes the conductive photoresist, when performing a developing process (i.e., a patterning process) of the second conductive layer 140, the developing process can reduce damage to a lower layer (e.g., the first conductive layer 120) compared to a conventional etching process. Accordingly, the design of the touch panel 100 and the manufacturing method of the touch panel 100 of the present embodiment can improve the reliability of the touch panel 100.
In some embodiments of the touch panel, the first conductive layer 120 includes a conductive photoresist, and the second conductive layer 140 includes other conductive materials, such as a metal (e.g., copper, silver, molybdenum, aluminum), a metal oxide (e.g., indium tin oxide), a conductive polymer, or graphene, but not limited thereto. In this case, the arrangement of such embodiments may be similar to that of fig. 1. It should be noted that, since the second conductive layer 140 is not a conductive photoresist, the second conductive layer 140 can be patterned by an etching process or other processes.
Referring to fig. 8, fig. 8 is a schematic cross-sectional view of a touch panel according to a second embodiment of the invention, wherein patterns and arrangements among the first conductive layer 120, the second conductive layer 140 and the first insulating layer 130 shown in fig. 8 may be the same as those shown in fig. 3, those shown in fig. 4 to 6, or other suitable patterns and arrangements. As shown in fig. 8, the difference between the present embodiment and the first embodiment is that the second conductive layer 140 of the touch panel 200 of the present embodiment includes a conductive photoresist, and the first conductive layer 120 does not include a conductive photoresist, but includes, for example, a metal (such as copper, silver, molybdenum, and aluminum), a metal oxide (such as indium tin oxide), a conductive polymer, graphene, other conductive materials, or a combination thereof. In order to improve the reliability of the first conductive layer 120 disposed on the substrate 110, the touch panel 200 may optionally include a buffer layer 210 disposed between the substrate 110 and the first conductive layer 120, wherein the buffer layer 210 may include any suitable material, such as ink, aluminum oxide, silicon oxide, or other suitable materials or combinations thereof, and the buffer layer 210 may be transparent or opaque, but the material of the buffer layer 210 is not limited thereto. The material of the first insulating layer 130 and the second insulating layer 150 (optionally) may include any suitable inorganic insulating material and/or organic insulating material. The first insulating layer 130 may be a complete continuous film layer to completely cover the active region, or the first insulating layer 130 may be a patterned film layer to cover only a portion of the active region, but not limited thereto.
In the method for manufacturing the touch panel 200, the first conductive layer 120 is patterned by an etching process since the first conductive layer 120 does not include a conductive photoresist, and the second conductive layer 140 is patterned by a developing process since the second conductive layer 140 includes a conductive photoresist. The formation of the first conductive layer 120, the first insulating layer 130 and the second conductive layer 140 will be described in detail below, but the formation is not limited thereto.
In some embodiments, the first insulating layer 130 may include a non-conductive photoresist layer instead of a non-conductive photoresist layer, and the first insulating layer 130 is used as an etching barrier layer for the first conductive layer 120 during the etching process. For example, referring to the embodiment of fig. 3 and fig. 9 to 12 simultaneously, fig. 9 to 12 are schematic cross-sectional views illustrating examples of the forming manners of the first conductive layer 120, the first insulating layer 130 and the second conductive layer 140 in the touch panel 200 according to the second embodiment of the invention, wherein fig. 11 and 12 respectively illustrate different forming results. As shown in fig. 3 and 9, in the step of forming the first insulating layer 130 and the patterned first conductive layer 120 on the substrate 110 (i.e., step ST1), first, a first conductive material layer 120m is formed on the substrate 110, the first conductive material layer 120m is a continuous film and completely covers the substrate 110, then, a first insulating layer 130 is formed on the first conductive material layer 120m, and the first insulating layer 130 is a continuous film and completely covers the substrate 110, and then, a developing process is performed on the first insulating layer 130 to pattern the first insulating layer 130 so as to obtain the structure shown in fig. 9. As shown in fig. 3 and 10, an etching process is performed on the first conductive material layer 120m to pattern the first conductive material layer 120m to form a patterned first conductive layer 120. The etching process performed on the first conductive material layer 120m may be any suitable process, such as wet etching, dry etching, other suitable processes, or a combination thereof. Thereafter, as shown in fig. 11 or 12, a patterned second conductive layer 140 is formed on the first insulating layer 130 and the substrate 110. In the present embodiment, since the first conductive layer 120, the second conductive layer 140 and the first insulating layer 130 are all patterned films, the lower surface of the first conductive layer 120 and the lower surface of the second conductive layer 140 can contact the same film (e.g., the upper surface of the substrate 110 or the upper surface of the buffer layer 210).
It is worth mentioning that the etching process performed on the first conductive material layer 120m may be an etching process (e.g., wet etching) that may cause an undercut (undercut) phenomenon. For example, in fig. 10, since the undercut phenomenon occurs in the etching process, a portion of the first conductive material layer 120m under the first insulating layer 130 is removed, such that the insulating repeating unit 132 of the first insulating layer 130 is similar to the first repeating unit 122 of the first conductive layer 120, i.e., the width of the first repeating unit 122 of the first conductive layer 120 is smaller than the width of the insulating repeating unit 132 of the first insulating layer 130. Also, if the thickness of the first conductive layer 120 is smaller than the particle diameter of the conductive particles CPS of the conductive photoresist of the second conductive layer 140 (for example, the thickness of the first conductive layer 120 is 0.12 μm, and the particle diameter of the conductive particles CPS is 0.2 μm), even though the undercut phenomenon may occur in the etching process, since the gap between the buffer layer 210 (or the substrate 110) and the first insulating layer 130 is smaller than the particle diameter of the conductive particles CPS, as shown in fig. 11 and 12, the conductive particles CPS of the second conductive layer 140 may not enter the gap between the buffer layer 210 (or the substrate 110) and the first insulating layer 130 and may not contact the first conductive layer 120, so that the second conductive layer 140 may not be directly electrically connected to the first conductive layer 120. Accordingly, in this case, even though the patterned second conductive layer 140 is directly formed on the first insulating layer 130 and the substrate 110, the second conductive layer 140 is not directly electrically connected to the first conductive layer 120. For example, in fig. 11, the second conductive layer 140 does not exist between the first insulating layer 130 and the substrate 110, and a gap Vo is generated between the first insulating layer 130 and the buffer layer 210 (or the substrate 110); in fig. 12, a portion of the non-conductive photoresist PRM in the conductive photoresist of the second conductive layer 140 may be located between the first insulating layer 130 and the buffer layer 210 (or the substrate 110), but the conductive particles CPS in the conductive photoresist of the second conductive layer 140 are not present between the first insulating layer 130 and the buffer layer 210 (or the substrate 110). In some embodiments, as shown in fig. 12, the non-conductive photoresist PRM in the conductive photoresist of the second conductive layer 140 may contact the first conductive layer 120, but the second conductive layer 140 is not directly electrically connected to the first conductive layer 120, but not limited thereto. In some embodiments (shown in the figures), the non-conductive photoresist PRM in the conductive photoresist of the second conductive layer 140 may be located between the first insulating layer 130 and the buffer layer 210 (or the substrate 110), but does not contact the first conductive layer 120, but is not limited thereto.
In addition, in some embodiments, the first insulating layer 130 may be disposed on the first conductive layer 120 after the patterning process (i.e., the etching process) of the first conductive layer 120 is performed, that is, the first insulating layer 130 does not serve as an etching stop layer for the first conductive layer 120 during the etching process. For example, in the step of forming the first insulating layer 130 and the patterned first conductive layer 120 on the substrate 110 (i.e., step ST1), first, a first conductive material layer 120m is formed on the substrate 110, the first conductive material layer 120m is a continuous film and completely covers the substrate 110, and then, an etching barrier layer (e.g., a non-conductive photoresist) is formed on the first conductive material layer 120m and is patterned by performing a developing process on the etching barrier layer. Thereafter, an etching process is performed on the first conductive material layer 120m to pattern the first conductive material layer 120m to form a patterned first conductive layer 120, and the etching stopper layer is removed after the etching process is completed. Then, the first insulating layer 130 and the patterned second conductive layer 140 are sequentially disposed on the substrate 110 and the patterned first conductive layer 120. In addition, other required layers, such as an insulating layer, a protective layer, a passivation layer, an optical layer (e.g., a polarizer, a low reflection layer), a dielectric layer, other suitable layers, or combinations thereof, may be optionally disposed on the touch panel 200.
Referring to fig. 13, fig. 13 is a schematic cross-sectional view of a touch panel according to a third embodiment of the invention, wherein the pattern and arrangement among the first conductive layer 120, the second conductive layer 140 and the first insulating layer 130 shown in fig. 13 can be the same as the arrangement shown in fig. 3, the arrangement shown in fig. 4 to 6, or other suitable arrangements. As shown in fig. 13, the difference between the present embodiment and the second embodiment is that the touch panel 300 of the present embodiment further includes a low reflection layer 310 (or a blackening layer or an extinction layer) disposed between the first conductive layer 120 and the first insulating layer 130 to reduce the possibility that the first conductive layer 120 reflects the external light. In the present embodiment, the low reflection layer 310 may be a patterned film layer, and the pattern of the low reflection layer 310 may be the same as or similar to the first pattern CP1 of the first conductive layer 120, but not limited thereto.
In the method for manufacturing the touch panel 300 of the present embodiment, the low reflection layer 310 is formed before the first insulating layer 130 is formed, and the first insulating layer 130 is formed after the patterning process of the first conductive layer 120. For example, a first conductive material layer 120m is formed on the substrate 110, the first conductive material layer 120m is a continuous film and completely covers the substrate 110, and a continuous and complete low reflection layer 310 is formed on the first conductive material layer 120 m. Then, an etch stopper layer (e.g., a non-conductive photoresist) is formed on the low reflection layer 310, and the etch stopper layer is patterned by a developing process. Then, an etching process is sequentially performed on the low reflection layer 310 and the first conductive material layer 120m to pattern the low reflection layer 310, and the first conductive material layer 120m is patterned to form the patterned first conductive layer 120, and the etching barrier layer is removed after the etching process is completed. Then, the first insulating layer 130 and the patterned second conductive layer 140 are sequentially disposed on the substrate 110 and the patterned first conductive layer 120. It should be noted that, in the touch panel 300 manufactured by the method, the pattern of the low reflection layer 310 may be the same as or similar to the first pattern CP1 of the first conductive layer 120, but the manufacturing method is not limited thereto. In another manufacturing method, the first conductive layer 120 and the low reflection layer 310 are patterned by different patterning processes, and the pattern of the low reflection layer 310 may be different from the first pattern CP1 of the first conductive layer 120, but not limited thereto. In another manufacturing method, the low reflection layer 310 may be a continuous and complete film layer, and the low reflection layer 310 may be formed after the patterning process of the first conductive layer 120, but not limited thereto. In addition, other required layers, such as an insulating layer, a protective layer, a passivation layer, an optical layer (e.g., a polarizer), a dielectric layer, other suitable layers, or combinations thereof, may be optionally disposed on the touch panel 300.
In summary, according to the touch panel and the manufacturing method thereof of the present invention, compared to the conventional prior art, the steps of the patterning process can be simplified to improve the manufacturing performance, and the additional film formation and the additional etching process can be omitted to reduce the use of materials and processing equipment and reduce the manufacturing cost. In addition, if the second conductive layer includes a conductive photoresist, damage to a lower layer (e.g., the first conductive layer) during a patterning process of the second conductive layer can be reduced, thereby improving reliability of the touch panel.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (17)
1. A touch panel, comprising:
a substrate;
the first conducting layer is arranged on the substrate;
a first insulating layer disposed on the first conductive layer; and
a second conductive layer disposed on the first insulating layer and the substrate,
wherein the first conductive layer is located between the substrate and the first insulating layer, at least a portion of the first conductive layer is located between the substrate and the second conductive layer, at least a portion of the first insulating layer is located between the first conductive layer and the second conductive layer, and one of the first conductive layer and the second conductive layer comprises a conductive photoresist.
2. The touch panel of claim 1, wherein the first conductive layer and the second conductive layer comprise the conductive photoresist.
3. The touch panel of claim 1, wherein the first conductive layer does not include the conductive photoresist and the second conductive layer includes the conductive photoresist.
4. The touch panel according to claim 1, wherein the first conductive layer and the first insulating layer are patterned films, the first conductive layer has a plurality of first repeating units, the first insulating layer has a plurality of insulating repeating units, and the insulating repeating units are similar to the first repeating units.
5. The touch panel of claim 4, wherein the width of the first repeating unit of the first conductive layer is less than the width of the insulating repeating unit of the first insulating layer.
6. The touch panel of claim 1, wherein the first insulating layer comprises a non-conductive photoresist and is used as an etch stop layer for the first conductive layer.
7. The touch panel of claim 1, wherein the conductive photoresist comprises conductive particles and a photoresist material.
8. The touch panel of claim 1, further comprising a second insulating layer disposed on the second conductive layer.
9. The touch panel of claim 1, further comprising a low reflection layer disposed between the first conductive layer and the first insulating layer.
10. The touch panel of claim 1, further comprising a buffer layer disposed between the substrate and the first conductive layer.
11. A method for manufacturing a touch panel includes the steps of:
forming a first insulating layer and a patterned first conductive layer on a substrate, wherein the first conductive layer is located between the substrate and the first insulating layer; and
forming a patterned second conductive layer over the first insulating layer and the substrate such that at least a portion of the first insulating layer is between the first conductive layer and the second conductive layer,
wherein at least a portion of the first conductive layer is between the substrate and the second conductive layer, and one of the first conductive layer and the second conductive layer comprises a conductive photoresist.
12. The method of manufacturing according to claim 11, wherein the first conductive layer and the second conductive layer each include the conductive photoresist, the first conductive layer and the second conductive layer are patterned by a developing process, and the first insulating layer is formed after patterning the first conductive layer.
13. The manufacturing method of claim 11, wherein the first conductive layer does not include the conductive photoresist, the first conductive layer is patterned by an etching process, the second conductive layer includes the conductive photoresist, and the second conductive layer is patterned by a developing process.
14. The method of manufacturing of claim 13, wherein forming the first insulating layer and the patterned first conductive layer on the substrate comprises:
forming a first conductive material layer on the substrate;
forming the first insulating layer on the first conductive material layer, wherein the first insulating layer is a non-conductive photoresist layer;
carrying out a developing process on the first insulating layer to pattern the first insulating layer; and
and carrying out the etching process on the first conductive material layer to pattern the first conductive material layer to form the patterned first conductive layer.
15. The method of claim 14, wherein an undercut phenomenon occurs in the etching process such that a width of the repeating unit of the first conductive layer is smaller than a width of the repeating unit of the first insulating layer.
16. The method of claim 11, wherein the conductive photoresist comprises conductive particles and a photoresist material.
17. The method of manufacturing of claim 11, comprising:
forming a low reflection layer before forming the first insulating layer,
wherein the low reflection layer is located between the first conductive layer and the first insulating layer.
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