TWI557359B - 電子裝置及其電路模組 - Google Patents

電子裝置及其電路模組 Download PDF

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Publication number
TWI557359B
TWI557359B TW104136194A TW104136194A TWI557359B TW I557359 B TWI557359 B TW I557359B TW 104136194 A TW104136194 A TW 104136194A TW 104136194 A TW104136194 A TW 104136194A TW I557359 B TWI557359 B TW I557359B
Authority
TW
Taiwan
Prior art keywords
light
circuit module
substrate
transmitting portion
lacquer layer
Prior art date
Application number
TW104136194A
Other languages
English (en)
Chinese (zh)
Other versions
TW201608170A (zh
Inventor
鄭翰鴻
郭繼汾
Original Assignee
宇帷國際股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宇帷國際股份有限公司 filed Critical 宇帷國際股份有限公司
Priority to TW104136194A priority Critical patent/TWI557359B/zh
Publication of TW201608170A publication Critical patent/TW201608170A/zh
Priority to GB1613365.4A priority patent/GB2544142A/en
Priority to DE102016116535.2A priority patent/DE102016116535A1/de
Priority to NL1042102A priority patent/NL1042102B1/en
Application granted granted Critical
Publication of TWI557359B publication Critical patent/TWI557359B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F23/00—Advertising on or in specific articles, e.g. ashtrays, letter-boxes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/18—Edge-illuminated signs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW104136194A 2015-11-03 2015-11-03 電子裝置及其電路模組 TWI557359B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW104136194A TWI557359B (zh) 2015-11-03 2015-11-03 電子裝置及其電路模組
GB1613365.4A GB2544142A (en) 2015-11-03 2016-08-03 Electronic device and circuit module thereof
DE102016116535.2A DE102016116535A1 (de) 2015-11-03 2016-09-05 Elektronische Vorrichtung und deren Schaltungsmodul
NL1042102A NL1042102B1 (en) 2015-11-03 2016-10-14 Electronic device and circuit module thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104136194A TWI557359B (zh) 2015-11-03 2015-11-03 電子裝置及其電路模組

Publications (2)

Publication Number Publication Date
TW201608170A TW201608170A (zh) 2016-03-01
TWI557359B true TWI557359B (zh) 2016-11-11

Family

ID=56084717

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104136194A TWI557359B (zh) 2015-11-03 2015-11-03 電子裝置及其電路模組

Country Status (4)

Country Link
DE (1) DE102016116535A1 (de)
GB (1) GB2544142A (de)
NL (1) NL1042102B1 (de)
TW (1) TWI557359B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106996542A (zh) * 2015-10-23 2017-08-01 照明科学集团公司 用于层的加重区域的照明系统及相关方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM429955U (en) * 2012-01-20 2012-05-21 Zhen-Rong Guo Light-emitting nameplate
TWM508053U (zh) * 2015-05-12 2015-09-01 Avexir Technologies Corp 電路模組

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7498521B2 (en) * 2005-06-30 2009-03-03 Intel Corporation Method and apparatus for marking a printed circuit board
EP2126943B1 (de) * 2007-02-01 2012-06-27 Siemens Aktiengesellschaft Schild zur beschriftung
DE102007017335C5 (de) * 2007-04-11 2017-04-27 FELA GmbH Beleuchtungseinheit mit einer transparenten Trägerplatte und daraufsitzender Leuchtdiode
EP2128845A1 (de) * 2008-05-26 2009-12-02 C.R.F. Società Consortile per Azioni Transparente Anzeigevorrichtung mit leitfähigen Pfaden mit opaker Beschichtung
US7542302B1 (en) * 2008-07-14 2009-06-02 International Business Machines Corporation Minimizing thickness of deadfronted display assemblies
CN201570214U (zh) * 2009-10-23 2010-09-01 惠州市德赛视听科技有限公司 一种模块化标志发光块
DE102011106251A1 (de) * 2011-06-27 2012-09-13 Entertainment Distribution Company GmbH Schaltungsanordnungskörper, insbesondere Bauteilplatine
CN204667882U (zh) * 2015-05-14 2015-09-23 宇帷国际股份有限公司 固态硬盘
CN204629173U (zh) * 2015-05-21 2015-09-09 宇帷国际股份有限公司 电路模组
TWI545583B (zh) * 2015-11-03 2016-08-11 宇帷國際股份有限公司 電子裝置及其動態隨機存取記憶體
CN205122137U (zh) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 电子装置及其电路模组
CN205122186U (zh) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 电子装置及其动态随机存取记忆体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM429955U (en) * 2012-01-20 2012-05-21 Zhen-Rong Guo Light-emitting nameplate
TWM508053U (zh) * 2015-05-12 2015-09-01 Avexir Technologies Corp 電路模組

Also Published As

Publication number Publication date
DE102016116535A1 (de) 2017-05-04
NL1042102A (en) 2017-05-23
GB2544142A (en) 2017-05-10
GB201613365D0 (en) 2016-09-14
TW201608170A (zh) 2016-03-01
NL1042102B1 (en) 2017-12-13

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