TWI557358B - 電子裝置及其電路模組 - Google Patents
電子裝置及其電路模組 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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Description
本發明有關於一種電子裝置及其電路模組。
如TWM448772所揭露之電子裝置及其電路模組包含一本體、至少一發光二極體以及一至少半透明之導光體。該發光二極體設於該本體且與該本體電性連接,該導光體係設於該本體並覆蓋該發光二極體,且該發光二極體之光源能穿透出該導光體。
然而,此類電子裝置及其電路模組於實際使用時,需要另外設置覆設於發光二極體之導光體,如此一來,整體裝置容易過厚、且製造成本較高。
因此,有必要提供一種新穎且具有進步性之電子裝置及其電路模組,以解決上述之問題。
本發明之主要目的在於提供一種電子裝置及其電路模組,可不用另外設置導光部,僅需利用基板本身結構以及於漆層另設有出射透光部,即可達到同樣之發亮效果,如此一來,可減少整體厚度並節省製造成本。
為達成上述目的,本發明提供一種電路模組。該電路模組包
括一本體及一PCI-E插排。該本體具有一基板部及一發光部,該基板部包括一基板及一第一漆層,該基板具有一透光部及一第一面,該第一漆層覆設於該第一面,該第一漆層設有一對應於該透光部之出射透光部,該發光部之光源可經該透光部後由該出射透光部而射至該電路模組之外部;該PCI-E插排設於該基板部。
為達成上述目的,本發明另提供一種電子裝置,包括上述之電路模組,另包括一殼部。該殼部蓋設於該電路模組之相對二側面且至少遮蔽該發光部,該殼部還設有一對應於該出射透光部之殼體透光部,由該出射透光部射出之光源可經由該殼體透光部而射至該電子裝置之外部。
1‧‧‧電路模組
10‧‧‧本體
20‧‧‧基板部
21‧‧‧第一漆層
210‧‧‧出射透光部
22‧‧‧第二漆層
220‧‧‧入射透光部
23‧‧‧基板
230‧‧‧透光部
231‧‧‧第一面
232‧‧‧第二面
233‧‧‧電子單元
30‧‧‧發光部
31‧‧‧發光二極體
40‧‧‧PCI-E插排
50‧‧‧殼部
51‧‧‧殼體透光部
52‧‧‧反射結構
100‧‧‧電子裝置
圖1為本發明一較佳實施例之立體圖。
圖2為本發明一較佳實施例之分解圖。
圖3為本發明一較佳實施例之電路模組後視圖。
圖4為本發明圖1之剖面圖。
以下僅以實施例說明本發明可能之實施態樣,然並非用以限制本發明所欲保護之範疇,合先敘明。
請參考圖1至4,其顯示本發明之一較佳實施例之電子裝置100及其電路模組1,該電路模組1包括一本體10及一PCI-E插排40。
該本體10具有一基板部20及一發光部30。該基板部20設有一電子單元233,該PCI-E插排40設於該基板部20,且該PCI-E插排40
與該電子單元233電性連接,更詳細地說,該發光部30亦電性連接該PCI-E插排40(當然亦可將發光部另外電性連接至例如主機板等其它外部電源)。於本實施例,該電子單元233可為繪圖處理模組、顯示處理模組或其它處理模組,使該電路模組1能當作繪圖卡、顯示卡或其它裝置使用。可理解的是,該PCI-E插排40不僅可以傳輸電力、亦可傳輸資料。
該基板部20包括一基板23及一第一漆層21。進一步說,該基板23具有一透光部230及一第一面231,該基板23係一體成型有該透光部230,該第一漆層21覆設於該第一面231,該第一漆層21設有一對應於該透光部230之出射透光部210,該發光部30之光源可經過該透光部230後由該出射透光部210而射至該電路模組1之外部。於本實施例,該基板23還具有一相異於該第一面231之第二面232,更明確地說,該第一面231係相對該第二面232,該基板部20包括一覆設於該第二面232之第二漆層22,該第二漆層22設有一對應於該透光部230之入射透光部220,該發光部30之光源可經由該入射透光部220而射至該透光部230。於其它實施例,亦可不用設置第二漆層及入射透光部,同樣可讓發光部之光源通過;抑或是,發光部之光源可不經由第二面入射而經由基板之其他區域(例如相異於第二面之其他側面)入射。
於本實施例,該第一漆層21及該第二漆層22即為一般電路板上之絕緣漆層,該入射透光部220及該出射透光部210係為不上漆之鏤空結構;於其它實施例,入射及出射透光部亦可為透光材料層,同樣可使光透過。進一步說,該出射透光部210係為透光圖文部(例如商標等圖文),從外部觀視時可較醒目與美觀(當然入射透光部亦可為對應於出射透光部
之圖文部)。
進一步說,該發光部30係設於該基板部20之一表面上,且該發光部30鄰設於該入射透光部220,該發光部30包括複數概沿該入射透光部220之輪廓而設於該基板部20之發光二極體31,可使從該出射透光部210透出之光線較明亮與均勻。於其它實施例,發光部亦可不設於基板部,只要發光部之光源可直接或間接入射至該透光部即可。
該電子裝置100除包括如上所述的電路模組1、還另包括一殼部50。
該殼部50蓋設於該電路模組1之相對二側面且至少遮蔽該發光部30,可防止該發光部30之光線過強而傷害人眼。該殼部50還設有一對應於該出射透光部210之殼體透光部51,由該出射透光部210射出之光源可經由該殼體透光部51而射至該電子裝置100之外部,可理解的是,該殼體透光部51可為鏤空結構或透光材料層,使光源可順利透出。
較佳地,該殼部50對應於該發光部30處設有一反射結構52,該反射結構52將部分該發光部30之光源反射至該透光部230,更明確地說,該反射結構52係為凹凸結構(當然亦可為平坦反光面),可使光源不規則地反射後均勻地射至該透光部230。於本實施例,該殼部50係為散熱殼部(例如金屬材質),可避免該電路模組1過熱。
綜上,本發明之電子裝置及其電路模組可不用另外設置導光部,僅需利用基板本身結構以及於漆層另設有出射透光部,即可達到同樣之發亮效果,如此一來,可減少整體厚度並節省製造成本。
綜上所述,本發明之整體結構設計、實用性及效益上,確實
是完全符合產業上發展所需,且所揭露之結構發明亦是具有前所未有的創新構造,所以其具有「新穎性」應無疑慮,又本發明可較之習知結構更具功效之增進,因此亦具有「進步性」,其完全符合我國專利法有關發明專利之申請要件的規定,乃依法提起專利申請,並敬請 鈞局早日審查,並給予肯定。
10‧‧‧本體
22‧‧‧第二漆層
220‧‧‧入射透光部
30‧‧‧發光部
31‧‧‧發光二極體
Claims (10)
- 一種電路模組,包括:一本體,具有一基板部及一設於該基板部之一表面上的發光部,該基板部包括一基板及一第一漆層,該基板為一電路板,該基板具有一透光部及一第一面,該基板係一體成型有該透光部,該第一漆層覆設於該第一面,該第一漆層設有一對應於該透光部之出射透光部,該發光部之光源可經過該透光部後由該出射透光部而射至該電路模組之外部;一PCI-E插排,設於該基板部。
- 如請求項1所述的電路模組,其中該基板還具有一相異於該第一面之第二面,該基板部還包括一覆設於該第二面之第二漆層,該第二漆層設有一對應於該透光部之入射透光部,該發光部之光源可經由該入射透光部而射至該透光部,該發光部係設於該基板部,且該發光部鄰設於該入射透光部。
- 如請求項2所述的電路模組,其中該發光部包括複數概沿該入射透光部之輪廓而設於該基板部之發光二極體。
- 如請求項1所述的電路模組,其中該出射透光部係為透光圖文部,且該出射透光部係為鏤空結構或透光材料層。
- 如請求項1所述的電路模組,其中該基板部還設有一電子單元,該電子單元與該PCI-E插排電性連接,該電子單元係為繪圖處理模組及顯示處理模組其中一者。
- 一種電子裝置,包括如請求項1至5任一項所述的電路模組,另包括:一殼部,蓋設於該電路模組之相對二側面且至少遮蔽該發光部,該殼部 還設有一對應於該出射透光部之殼體透光部,由該出射透光部射出之光源可經由該殼體透光部而射至該電子裝置之外部。
- 如請求項6所述的電子裝置,其中該殼部對應於該發光部處設有一反射結構,該反射結構將部分該發光部之光源反射至該透光部。
- 如請求項7所述的電子裝置,其中該反射結構係為凹凸結構。
- 如請求項6所述的電子裝置,其中該殼體透光部係為鏤空結構或透光材料層。
- 如請求項6所述的電子裝置,其中該殼部係為散熱殼部。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104136193A TWI557358B (zh) | 2015-11-03 | 2015-11-03 | 電子裝置及其電路模組 |
GB1613351.4A GB2544139A (en) | 2015-11-03 | 2016-08-03 | Electronic device and circuit module thereof |
DE102016116565.4A DE102016116565A1 (de) | 2015-11-03 | 2016-09-05 | Elektronische Vorrichtung und deren Schaltungsmodul |
NL1042101A NL1042101B1 (en) | 2015-11-03 | 2016-10-14 | Electronic device and circuit module thereof |
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TW104136193A TWI557358B (zh) | 2015-11-03 | 2015-11-03 | 電子裝置及其電路模組 |
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TW201608169A TW201608169A (zh) | 2016-03-01 |
TWI557358B true TWI557358B (zh) | 2016-11-11 |
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TW104136193A TWI557358B (zh) | 2015-11-03 | 2015-11-03 | 電子裝置及其電路模組 |
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DE (1) | DE102016116565A1 (zh) |
GB (1) | GB2544139A (zh) |
NL (1) | NL1042101B1 (zh) |
TW (1) | TWI557358B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI652002B (zh) * | 2018-01-30 | 2019-02-21 | 技嘉科技股份有限公司 | 導光散熱模組及電子裝置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM429955U (en) * | 2012-01-20 | 2012-05-21 | Zhen-Rong Guo | Light-emitting nameplate |
TW201326977A (zh) * | 2011-12-20 | 2013-07-01 | Global Lighting Technologies | 發光裝置及其製造方法 |
TWM508053U (zh) * | 2015-05-12 | 2015-09-01 | Avexir Technologies Corp | 電路模組 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10253420A1 (de) * | 2002-11-15 | 2004-06-03 | Honeywell B.V. | Leiterplatte mit Anzeigeelement |
US7498521B2 (en) * | 2005-06-30 | 2009-03-03 | Intel Corporation | Method and apparatus for marking a printed circuit board |
DE102010012064A1 (de) * | 2010-03-19 | 2011-09-22 | R. Stahl Schaltgeräte GmbH | LED-Anordnung mit lichtdurchlässiger Leiterplatte |
CN204667882U (zh) * | 2015-05-14 | 2015-09-23 | 宇帷国际股份有限公司 | 固态硬盘 |
CN204629173U (zh) * | 2015-05-21 | 2015-09-09 | 宇帷国际股份有限公司 | 电路模组 |
TWI541821B (zh) * | 2015-11-03 | 2016-07-11 | 宇帷國際股份有限公司 | 電子裝置及其動態隨機存取記憶體 |
CN205124038U (zh) * | 2015-11-11 | 2016-03-30 | 宇帷国际股份有限公司 | 电子装置及其电路模组 |
CN205122185U (zh) * | 2015-11-11 | 2016-03-30 | 宇帷国际股份有限公司 | 电子装置及其动态随机存取记忆体 |
-
2015
- 2015-11-03 TW TW104136193A patent/TWI557358B/zh not_active IP Right Cessation
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2016
- 2016-08-03 GB GB1613351.4A patent/GB2544139A/en not_active Withdrawn
- 2016-09-05 DE DE102016116565.4A patent/DE102016116565A1/de not_active Withdrawn
- 2016-10-14 NL NL1042101A patent/NL1042101B1/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201326977A (zh) * | 2011-12-20 | 2013-07-01 | Global Lighting Technologies | 發光裝置及其製造方法 |
TWM429955U (en) * | 2012-01-20 | 2012-05-21 | Zhen-Rong Guo | Light-emitting nameplate |
TWM508053U (zh) * | 2015-05-12 | 2015-09-01 | Avexir Technologies Corp | 電路模組 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI652002B (zh) * | 2018-01-30 | 2019-02-21 | 技嘉科技股份有限公司 | 導光散熱模組及電子裝置 |
Also Published As
Publication number | Publication date |
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GB201613351D0 (en) | 2016-09-14 |
NL1042101A (en) | 2017-05-23 |
TW201608169A (zh) | 2016-03-01 |
DE102016116565A1 (de) | 2017-05-04 |
NL1042101B1 (en) | 2017-12-13 |
GB2544139A (en) | 2017-05-10 |
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