NL1042101A - Electronic device and circuit module thereof - Google Patents

Electronic device and circuit module thereof Download PDF

Info

Publication number
NL1042101A
NL1042101A NL1042101A NL1042101A NL1042101A NL 1042101 A NL1042101 A NL 1042101A NL 1042101 A NL1042101 A NL 1042101A NL 1042101 A NL1042101 A NL 1042101A NL 1042101 A NL1042101 A NL 1042101A
Authority
NL
Netherlands
Prior art keywords
light
portion
circuit module
transmitting portion
transmitting
Prior art date
Application number
NL1042101A
Other languages
Dutch (nl)
Other versions
NL1042101B1 (en
Inventor
Cheng Han-Hung
Kuo Chi-Fen
Original Assignee
Avexir Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to TW104136193A priority Critical patent/TWI557358B/en
Application filed by Avexir Tech Corp filed Critical Avexir Tech Corp
Publication of NL1042101A publication Critical patent/NL1042101A/en
Application granted granted Critical
Publication of NL1042101B1 publication Critical patent/NL1042101B1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns, inspection means or identification means
    • H05K1/0269Marks, test patterns, inspection means or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0108Transparent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09936Marks, inscriptions, etc. for information
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Abstract

A circuit module includes a main body and a PCI-E insert row, the main body has a substrate portion and a light-emitting portion, the substrate portion includes a board and a first coating layer, the board has a light-transmittable portion and a first face, the first coating layer is coated on the first face, the first coating layer has an emergent light-transmittable portion corresponding to the light-transmittable portion. The PCI-E insert row is disposed on the substrate portion. The electronic device includes the circuit module mentioned above and further includes a shell portion. The shell portion is covered on two opposite lateral faces of the circuit module and at least shields the light-emitting portion, and the shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion.

Description

TITLE: ELECTRONIC DEVICE AND CIRCUIT MODULE THEREOF

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to an electronic device and a circuit module thereof.

Description of the Prior Art

An electronic device and a circuit module thereof as disclosed in TWM448772 includes a main body, at least one light-emitting diode and at least one translucent light-guiding body. The light-emitting diode is disposed in the main body and electrically connected with the main body, the light-guiding body is disposed on the main body and covers the light-emitting diode, and light from the light-emitting diode can penetrate through the light-guiding body.

However, when this type of the electronic device and the circuit module thereof are in actual practice, the light-guiding body needs to be further covered on the light-emitting diode; therefore, the electronic device is too thick, and the manufacturing cost is higher.

The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.

SUMMARY OF THE INVENTION

The major object of the present invention is to provide an electronic device and a circuit module thereof, wherein light is emitted via a substrate and an emergent light-transmittable portion of a coating layer without a light-guiding portion which needs to be further disposed. Therefore, a thickness of the present invention decreases, and a manufacturing cost of the present invention is lower.

To achieve the above and other objects, a circuit module is provided, including a main body and a PCI-E insert row. The main body has a substrate portion and a light-emitting portion. The substrate portion includes a board and a first coating layer, the board has a light-transmittable portion and a first face, the first coating layer is coated on the first face, the first coating layer is formed with an emergent light-transmittable portion corresponding to the light-transmittable portion, light from the light-emitting portion can be projected through the light-transmittable portion and projected via the emergent light-transmittable portion to an exterior of the circuit module. The PCI-E insert row is disposed on the substrate portion.

To achieve the above and other objects, an electronic device is further provided, including the circuit module mentioned above, and further including a shell portion. The shell portion is covered on two opposite lateral faces of the circuit module and at least shields the light-emitting portion. The shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion, and light projected from the emergent light-transmittable portion can be projected through the second light-transmittable portion to an exterior of the electronic device.

The present invention will become more obvious from the following description when taken in connection with the accompanying drawings, which show, for purpose of illustrations only, the preferred embodiment(s) in accordance with the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a perspective view of a preferred embodiment of the present invention;

Fig. 2 is a breakdown view of the preferred embodiment of the present invention;

Fig. 3 is a rear view of a circuit module of the preferred embodiment of the present invention; and

Fig. 4 is a cross-sectional view of the present invention, taken along line A-A in Fig. 1.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will be clearer from the following description when viewed together with the accompanying drawings, which show, for purpose of illustrations only, the preferred embodiment in accordance with the present invention.

Please refer to Figs. 1 to 4 for an electronic device 100 and a circuit module 1 thereof of a preferred embodiment of the present invention. The circuit module 1 includes a main body 10 and a PCI-E insert row 40.

The main body 10 has a substrate portion 20 and a light-emitting portion 30. The substrate portion 20 is provided with an electronic unit 233, the PCI-E insert row 40 is disposed on the substrate portion 20, and the PCI-E insert row 40 is electrically connected with the electronic unit 233. More specifically, the light-emitting portion 30 is also electrically connected with the PCI-E insert row 40 (the light-emitting portion may be further electrically connected with other exterior powers such as a mother board). In this embodiment, the electronic unit 233 may be a graphic processing module, a display processing module or other processing modules so that the circuit module 1 can serve as a graphic card, a display card or other devices. It is understandable that the PCI-E insert row 40 can transmit not only electricity but also data.

The substrate portion 20 includes a board 23 and a first coating layer 21. Specifically, the board 23 has a light-transmittable portion 230 and a first face 231, the first coating layer 21 is coated on the first face 231, the first coating layer 21 is formed with an emergent light-transmittable portion 210 corresponding to the light-transmittable portion 230, and light from the light-emitting portion 30 can be projected through the light-transmittable portion 230 and projected via the emergent light-transmittable portion 210 to an exterior of the circuit module 1. In this embodiment, the board 23 further has a second face 232. More specifically, the first face 231 is opposite to the second face 232, the substrate portion 20 includes a second coating layer 22 coated on the second face 232, the second coating layer 22 is formed with an incident light-transmittable portion 220 corresponding to the light-transmittable portion 230, and the light from the light-emitting portion 30 can be projected through the incident light-transmittable portion 220 to the light-transmittable portion 230. In other embodiments, the light from the light-emitting portion can be transmitted without the second coating layer and the incident light-transmittable portion; or, the light from the light-emitting portion can enter through other regions (for example, other lateral faces other than the second face) of the board instead of the second face.

In this embodiment, the first coating layer 21 and the second coating layer 22 are insulating coating layers of a normal circuit board, and the incident light-transmittable portion 220 and the emergent light-transmittable portion 210 are hollow-out structures which are not coated. In other embodiments, the incident and emergent light-transmittable portions may be layers made of a light-transmittable material. Specifically, the emergent light-transmittable portion 210 is a light-transmittable pattern portion (for example, a trademark), and the present invention is more appealing when being viewed from outside (the incident light-transmittable portion may also be a pattern portion corresponding to the emergent light-transmittable portion).

Specifically, the light-emitting portion 30 is disposed on the substrate portion 20, and the light-emitting portion 30 is disposed neighboring to the incident light-transmittable portion 220. The light-emitting portion 30 includes a plurality of light-emitting diodes 31 which are disposed on the substrate portion 20 along a contour of the incident light-transmittable portion 220, so light from the emergent light-transmittable portion 210 is brighter and more even. In other embodiments, the light-emitting portion may be disposed not on the substrate portion as long as the light from the light-emitting portion can enter the light-transmittable portion directly or indirectly.

The electronic device 100 includes the circuit module 1 mentioned above and further includes a shell portion 50.

The shell portion 50 is covered on two opposite lateral faces of the circuit module 1 and at least shields the light-emitting portion 30 so as to prevent the light from the light-emitting portion 30 from being too harsh to human eyes. The shell portion 50 further has a second light-transmittable portion 51 corresponding to the emergent light-transmittable portion 210, and the light projected from the emergent light-transmittable portion 210 can be projected through the second light-transmittable portion 51 to an exterior of the electronic device 100. It is understandable that the second light-transmittable portion 51 may be a hollow-out structure or a layer made of a light-transmittable material.

Preferably, a reflection structure 52 is disposed on the shell portion 50 and corresponds to the light-emitting portion 30, and the reflection structure 52 reflects a part of the light from the light-emitting portion 30 to the light-transmittable portion 230. More specifically, the reflection structure 52 is a height-differentiated structure (of course, the reflection structure 52 may be a flat reflective surface) so that the light can be irregularly reflected and evenly projected to the light-transmittable portion 230. In this embodiment, the shell portion 50 is a heat-dissipating shell portion (the shell portion may made of, for example, a metal) to prevent the circuit module 1 from overheating.

Given the above, the electronic device and the circuit module thereof, wherein light is emitted via the substrate and the emergent light-transmittable portion of the coating layer without a light-guiding portion which needs to be further disposed. Therefore, a thickness of the present invention decreases, and a manufacturing cost of the present invention is lower.

While we have shown and described various embodiments in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims (10)

  1. A circuit module comprising: a main body having a substrate portion and a light emitting portion, the substrate portion comprising a card and a first coating layer, the card having a light transmitting portion and a first surface, the first coating layer being on the first surface coated, the first coating layer being formed with an emerging light-transmitting portion corresponding to the light-transmitting portion, wherein light from the light-transmitting portion is projectable through the light-transmitting portion and can be projected via the appearing light-transmitting portion to an exterior of the circuit module; a PCI-E insertion row that is placed on the substrate portion.
  2. The circuit module of claim 1, wherein the card further has a second plane, the substrate portion further comprising a second coating layer coated on the second plane, the second coating layer being formed with an incident light-transmitting portion corresponding to the light-transmitting portion wherein the light from the light-emitting portion is projectable through the incident light-transmitting portion to the light-transmitting portion, the light-emitting portion being placed on the substrate portion, and the light-emitting portion being disposed adjacent to the incident light-transmitting portion.
  3. The circuit module of claim 2, wherein the light emitting portion comprises a plurality of light emitting diodes that are disposed along the contour of the incident light transmitting portion on the substrate portion.
  4. The circuit module of claim 1, wherein the appearing light-transmitting portion is a light-transmitting pattern portion, and the appearing light-transmitting portion is a hollow structure or a layer made of a light-transmitting material.
  5. The circuit module of claim 1, wherein the substrate portion is further provided with an electronic unit, wherein the electronic unit is electronically connected to the PCI-E plug-in row, and the electronic unit is either a graphical processing module or a display processing module.
  6. The electronic device comprising the circuit module of claim 1, further comprising: an envelope portion that is covered on two opposite lateral faces of the circuit module and that at least shields the light emitting portion, the envelope portion further having a second light transmitting portion, the appearing light-transmitting portion corresponds, and wherein light projected from the appearing light-transmitting portion is projectable through the second light-transmitting portion to an exterior of the electronic device.
  7. The electronic device of claim 6, wherein a reflection structure is disposed on the envelope portion and corresponds to the light-emitting portion, and the reflection structure reflects a portion of the light from the light-emitting portion to the light-transmitting portion.
  8. The electronic device of claim 7, wherein the reflection structure is a height differentiated structure.
  9. The electronic device of claim 6, wherein the second light transmissive portion is a hollow structure or a layer made of a light transmissive material.
  10. The electronic device of claim 6, wherein the housing portion is a heat-dissipating housing portion.
NL1042101A 2015-11-03 2016-10-14 Electronic device and circuit module thereof NL1042101B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104136193A TWI557358B (en) 2015-11-03 2015-11-03 Electronic device and circuit module thereof

Publications (2)

Publication Number Publication Date
NL1042101A true NL1042101A (en) 2017-05-23
NL1042101B1 NL1042101B1 (en) 2017-12-13

Family

ID=56084716

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1042101A NL1042101B1 (en) 2015-11-03 2016-10-14 Electronic device and circuit module thereof

Country Status (4)

Country Link
DE (1) DE102016116565A1 (en)
GB (1) GB2544139A (en)
NL (1) NL1042101B1 (en)
TW (1) TWI557358B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI652002B (en) * 2018-01-30 2019-02-21 技嘉科技股份有限公司 The light guide module and the electronic device cooling

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1420383A2 (en) * 2002-11-15 2004-05-19 Honeywell B.V. Printed circuit board with display element
US20070002544A1 (en) * 2005-06-30 2007-01-04 Forbes Brian S Method and apparatus for marking a printed circuit board
CN204629173U (en) * 2015-05-21 2015-09-09 宇帷国际股份有限公司 Circuit module

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010012064A1 (en) * 2010-03-19 2011-09-22 R. Stahl Schaltgeräte GmbH LED arrangement used for e.g. signal transmitter, has LED arranged on circuit board, such that optical axis of LED is directed towards to circuit board
TW201326977A (en) * 2011-12-20 2013-07-01 Global Lighting Technologies Lighting emitting apparatus and manufacturing method thereof
TWM429955U (en) * 2012-01-20 2012-05-21 Zhen-Rong Guo Light-emitting nameplate
TWM508053U (en) * 2015-05-12 2015-09-01 Avexir Technologies Corp Electric circuit module
CN204667882U (en) * 2015-05-14 2015-09-23 宇帷国际股份有限公司 Solid state hard disc
TWI541821B (en) * 2015-11-03 2016-07-11 宇帷國際股份有限公司 Electronic device and dynamic random access memory thereof
CN205122185U (en) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 Electron device and developments random access memory body thereof
CN205124038U (en) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 Electronic device and circuit module thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1420383A2 (en) * 2002-11-15 2004-05-19 Honeywell B.V. Printed circuit board with display element
US20070002544A1 (en) * 2005-06-30 2007-01-04 Forbes Brian S Method and apparatus for marking a printed circuit board
CN204629173U (en) * 2015-05-21 2015-09-09 宇帷国际股份有限公司 Circuit module

Also Published As

Publication number Publication date
TWI557358B (en) 2016-11-11
DE102016116565A1 (en) 2017-05-04
GB201613351D0 (en) 2016-09-14
NL1042101B1 (en) 2017-12-13
TW201608169A (en) 2016-03-01
GB2544139A (en) 2017-05-10

Similar Documents

Publication Publication Date Title
US8643614B2 (en) Touch-sensitive device and touch-sensitive display device
US8564740B2 (en) Directional backlight with reduced crosstalk
KR20130022074A (en) Light emitting module and backlight unit having the same
CN1234038C (en) Lighting device and liquid crystal display
US20090262531A1 (en) Led light engine
US7614774B2 (en) LED and LED-applied backlight module
JP2007156228A (en) Led display unit
US8946620B2 (en) Proximity sensor device with internal channeling section
US20110291987A1 (en) Touch-sensitive device
US8643041B2 (en) Light emitting device package
JP2004273185A (en) Planar lighting device and liquid crystal display device having the same
JP2011044610A (en) Led lighting apparatus
EP2725881A1 (en) Chip on film and display device including the same
TWM482791U (en) Touch screen
TWI282870B (en) Backlight module and light guide plate thereof
TW200731520A (en) Semiconductor device
JP3172668U (en) Optical module
TW201430661A (en) Touch panel
JP2011159970A (en) Light emitting element package
US20160334559A1 (en) Circuit module
JP2007142780A (en) Decorative component for vehicle
US20120140464A1 (en) Flexible light source module
CN104332524B (en) Electronic installation, optical module and its manufacture method
US7622751B2 (en) Light-emitting diode
JP5983960B2 (en) Transparent conductive film