GB201613365D0 - Electronic device and circuit module thereof - Google Patents

Electronic device and circuit module thereof

Info

Publication number
GB201613365D0
GB201613365D0 GBGB1613365.4A GB201613365A GB201613365D0 GB 201613365 D0 GB201613365 D0 GB 201613365D0 GB 201613365 A GB201613365 A GB 201613365A GB 201613365 D0 GB201613365 D0 GB 201613365D0
Authority
GB
United Kingdom
Prior art keywords
electronic device
circuit module
module
circuit
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB1613365.4A
Other versions
GB2544142A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avexir Technologies Corp
Original Assignee
Avexir Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avexir Technologies Corp filed Critical Avexir Technologies Corp
Publication of GB201613365D0 publication Critical patent/GB201613365D0/en
Publication of GB2544142A publication Critical patent/GB2544142A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F23/00—Advertising on or in specific articles, e.g. ashtrays, letter-boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/18—Edge-illuminated signs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
GB1613365.4A 2015-11-03 2016-08-03 Electronic device and circuit module thereof Withdrawn GB2544142A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104136194A TWI557359B (en) 2015-11-03 2015-11-03 Electronic device and circuit module thereof

Publications (2)

Publication Number Publication Date
GB201613365D0 true GB201613365D0 (en) 2016-09-14
GB2544142A GB2544142A (en) 2017-05-10

Family

ID=56084717

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1613365.4A Withdrawn GB2544142A (en) 2015-11-03 2016-08-03 Electronic device and circuit module thereof

Country Status (4)

Country Link
DE (1) DE102016116535A1 (en)
GB (1) GB2544142A (en)
NL (1) NL1042102B1 (en)
TW (1) TWI557359B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106996542A (en) * 2015-10-23 2017-08-01 照明科学集团公司 Illuminator and correlation technique for the emphasis regions of layer

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7498521B2 (en) * 2005-06-30 2009-03-03 Intel Corporation Method and apparatus for marking a printed circuit board
EP2126943B1 (en) * 2007-02-01 2012-06-27 Siemens Aktiengesellschaft Plate for inscription
DE202007010458U1 (en) * 2007-04-11 2007-10-04 Fela Hilzinger Gmbh Leiterplattentechnik Lighting unit with a transparent support plate and light emitting diode
EP2128845A1 (en) * 2008-05-26 2009-12-02 C.R.F. Società Consortile per Azioni Transparent display device with conductive paths provided with an opaque coating
US7542302B1 (en) * 2008-07-14 2009-06-02 International Business Machines Corporation Minimizing thickness of deadfronted display assemblies
CN201570214U (en) * 2009-10-23 2010-09-01 惠州市德赛视听科技有限公司 Modularized mark light-emitting block
DE102011106251A1 (en) * 2011-06-27 2012-09-13 Entertainment Distribution Company GmbH Circuit arrangement body, in particular component board
TWM429955U (en) * 2012-01-20 2012-05-21 Zhen-Rong Guo Light-emitting nameplate
TWM508053U (en) * 2015-05-12 2015-09-01 Avexir Technologies Corp Electric circuit module
CN204667882U (en) * 2015-05-14 2015-09-23 宇帷国际股份有限公司 Solid state hard disc
CN204629173U (en) * 2015-05-21 2015-09-09 宇帷国际股份有限公司 Circuit module
TWI545583B (en) * 2015-11-03 2016-08-11 宇帷國際股份有限公司 Electronic device and dynamic random access memory thereof
CN205122137U (en) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 Electronic device and circuit module thereof
CN205122186U (en) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 Electron device and developments random access memory body thereof

Also Published As

Publication number Publication date
TW201608170A (en) 2016-03-01
DE102016116535A1 (en) 2017-05-04
GB2544142A (en) 2017-05-10
TWI557359B (en) 2016-11-11
NL1042102A (en) 2017-05-23
NL1042102B1 (en) 2017-12-13

Similar Documents

Publication Publication Date Title
IL276708A (en) Electronic vaping device and components thereof
ZA201907736B (en) Electronic device
EP3422529C0 (en) Electronic device
AU201714961S (en) Electronic device
IL251279A0 (en) Electronic vaping device and components thereof
IL251127A0 (en) Electronic vaping device and components thereof
EP3439492C0 (en) Electronic vaping device
GB2538522B (en) Electronic circuit and component construction
KR20180084629A (en) Camera module and electronic device
EP4009618C0 (en) Electronic device
HK1244351A1 (en) Electronic device
AU201716898S (en) Electronic device
HK1255708A1 (en) Electronic component housing apparatus and electronic device
SG10201607278TA (en) Semiconductor device and electronic device
HK1251352A1 (en) Electronic device
EP3267770A4 (en) Circuit board fixing device and electronic device comprising fixing device
ZA202001273B (en) Electronic device
EP3252810A4 (en) Circuit board and electronic device
EP3236495A4 (en) Circuit substrate and electronic device
ZA202002590B (en) Electronic device
HK1252139A1 (en) Electronic device
GB2546881B (en) Assembly and electronic device
TWI560618B (en) Fingerprint detection circuit and electronic device
GB201702481D0 (en) An electronic circuit
TWI562495B (en) Electronic device and motherboard thereof

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)