GB2544142A - Electronic device and circuit module thereof - Google Patents

Electronic device and circuit module thereof Download PDF

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Publication number
GB2544142A
GB2544142A GB1613365.4A GB201613365A GB2544142A GB 2544142 A GB2544142 A GB 2544142A GB 201613365 A GB201613365 A GB 201613365A GB 2544142 A GB2544142 A GB 2544142A
Authority
GB
United Kingdom
Prior art keywords
light
portion
transmittable
circuit module
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB1613365.4A
Other versions
GB201613365D0 (en
Inventor
Cheng Han-Hung
Kuo Chi-Fen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avexir Technologies Corp
Original Assignee
Avexir Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to TW104136194A priority Critical patent/TWI557359B/en
Application filed by Avexir Technologies Corp filed Critical Avexir Technologies Corp
Publication of GB201613365D0 publication Critical patent/GB201613365D0/en
Publication of GB2544142A publication Critical patent/GB2544142A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 and H01L51/00, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 and H01L51/00, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F23/00Advertising on or in specific articles, e.g. ashtrays, letter-boxes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0203Containers; Encapsulations, e.g. encapsulation of photodiodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0232Optical elements or arrangements associated with the device
    • H05B47/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
    • H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/18Edge-illuminated signs
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns, inspection means or identification means
    • H05K1/0269Marks, test patterns, inspection means or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0108Transparent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09936Marks, inscriptions, etc. for information
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Abstract

Circuit module including a PCIe, (PCI Express) connector strip (40 fig 1) and a main body 20 comprising a substrate portion 23 and an embedded light-emitting portion (LEDs 30, 31 fig 4) electrically connected with the PCI-E strip 40. The substrate portion includes an associated electronic unit 233 (e.g graphics or display processing module). The LED light emitting portions (31 fig 4) are embedded in the substrate 23 which may be transparent or translucent acting as a light transmitting material. The first face of the board 20 has a first coating layer 21, and where the coating is absent it forms an emergent light-transmittable portion 230 (i.e optical window). Alternatively the window may also be formed from a hollow or cut-out in the board. A coating or light shield or reflector may also be formed on the second (opposite) face of the substrate 23, whilst the coating may be a normal insulation layer associated with board. The light emitting portion of the board may be either of transparent, translucent or light transmittable material. Alternatively the light transmittable portion may be a hollowed out of cutaway section of the substrate. Hence an emergent light-transmittable portion 210 corresponds to the light-transmittable portion allowing light to pas to the exterior. The electronic device forms a part of the circuit module comprising a shell portion which cover the two opposite lateral faces of the circuit module and at least shields the light-emitting portion, and the shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion. The shell portion may also function as a heat dissipating layer (heat sink). A second light emitting section 51 is associated with a cutaway or hollowed out or transparent/translucent section of the opposite face shell allowing light to escape to the exterior of the device. The LEDs and the board light transmittable portion may be formed in the profile of letters 230 forming for example an appealing optical logo or trade mark viewable from outside of the unit.

Description

ELECTRONIC DEVICE AND CIRCUIT MODULE THEREOF

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to an electronic device and a circuit module thereof.

Description of the Prior Art

An electronic device and a circuit module thereof as disclosed in TWM448772 includes a main body, at least one light-emitting diode and at least one translucent light-guiding body. The light-emitting diode is disposed in the main body and electrically connected with the main body, the light-guiding body is disposed on the main body and covers the light-emitting diode, and light from the light-emitting diode can penetrate through the light-guiding body.

However, when this type of the circuit module is in actual practice, the light-guiding body needs to be further covered on the light-emitting diode; therefore, the circuit module is too thick, and the manufacturing cost is higher.

The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.

SUMMARY OF THE INVENTION

The major object of the present invention is to provide an electronic device and a circuit module thereof, wherein light is emitted through a light-emitting portion embedded in a substrate and an emergent light-transmittable portion of a coating layer without a light-guiding portion which needs to be further disposed. Therefore, a thickness of the present invention decreases, and a manufacturing cost of the present invention is lower.

To achieve the above and other objects, a circuit module is provided, including a main body, a light-emitting portion and a PCI-E insert row. The main body includes a substrate and a first coating layer, the substrate has a light-transmittable portion and a first face, the first coating layer is coated on the first face, the first coating layer has an emergent light-transmittable portion corresponding to the light-transmittable portion. The light-emitting portion is embedded in the substrate, and light from the light-emitting portion can be projected to the light-transmittable portion and projected through the emergent light-transmittable portion to an exterior of the circuit module. The PCI-E insert row is disposed on the substrate.

To achieve the above and other objects, an electronic device is further provided, including the circuit module mentioned above, and further including a shell portion. The shell portion is covered on two opposite lateral faces of the circuit module. The shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion, and light projected from the emergent light-transmittable portion can be projected through the second light-transmittable portion to an exterior of the electronic device.

The present invention will become more obvious from the following description when taken in connection with the accompanying drawings, which show, for purpose of illustrations only, the preferred embodiment(s) in accordance with the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a perspective view of a preferred embodiment of the present invention;

Fig. 2 is a breakdown view of the preferred embodiment of the present invention;

Fig. 3 is a partially-enlarged view of the preferred embodiment of the present invention; and

Fig. 4 is a cross-sectional view of the present invention, taken along line A-AinFig. 1.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will be clearer from the following description when viewed together with the accompanying drawings, which show, for purpose of illustrations only, the preferred embodiment in accordance with the present invention.

Please refer to Figs. 1 to 4 for an electronic device 100 and a circuit module 1 thereof of a preferred embodiment of the present invention. The circuit module 1 includes a main body 20, a light-emitting portion 30 and a PCI-E insert row 40.

The main body 20 includes a substrate 23 and a first coating layer 21. Specifically, the substrate 23 has a light-transmittable portion 230 and a first face 231, the first coating layer 21 is coated on the first face 231, the first coating layer 21 is formed with an emergent light-transmittable portion 210 corresponding to the light-transmittable portion 230. In this embodiment, the first coating layer 21 at least shields a part of the light-emitting portion 30. Specifically, the first coating layer 21 shields the light-emitting portion 30 thoroughly, the light from the light-emitting portion 30 is guided (refracted or reflected) through the light-transmittable portion 230 and transmitted to the emergent light-transmittable portion 210 so that the light projected is softer. In other embodiments, the light-emitting portion may be not shielded by the first coating layer and be arranged facing the emergent light-transmittable portion; or, the light-emitting portion is partially shielded.

The light-emitting portion 30 is embedded in the substrate 23, and the light from the light-emitting portion 30 can be projected to the light-transmittable portion 230 and projected through the emergent light-transmittable portion 210 to an exterior of the circuit module 1. It is to be noted that the substrate 23 is a translucent board of a normal printed circuit board. In other embodiments, the light-transmittable portion may be a layer made of a light-transmittable material, and other parts of the substrate may be a layer made of a light-nontransmittable material so that a light-emitting face of the light-emitting portion (which may be partially embedded in the layer made of the light-nontransmittable material) faces the light-transmittable portion directly to emit light; or, the light-transmittable portion is a hollow-out structure, and the light-emitting face of the light-emitting portion is exposed through the hollow-out structure.

The substrate 23 is provided with an electronic unit 233, and the electronic unit 233 is electrically connected with the PCI-E insert row 40. The electronic unit 233 may be a graphic processing module, a display processing module or other processing modules so that the circuit module 1 can serve as a graphic card, a display card or other devices. The PCI-E insert row 40 is disposed on the substrate 23, and the PCI-E insert row 40 is electrically connected with the electronic unit 233. More specifically, the light-emitting portion 30 is also electrically connected with the PCI-E insert row 40 (of course, the light-emitting portion may be further electrically connected with other exterior powers such as a mother board). It is understandable that the PCI-E insert row 40 can transmit not only electricity but also data.

In this embodiment, the substrate 23 further has a second face 232 opposite to the first face 231, the main body 20 includes a second coating layer 22 coated on the second face 232, and the second coating layer 22 at least shields a part of the light-emitting portion 30 (the second coating layer may also not shield the light-emitting portion and allow the light to penetrate directly).

In this embodiment, the first coating layer 21 and the second coating layer 22 are insulting coating layers of a normal circuit board. The emergent light-transmittable portion 210 is a hollow-out structure which is not coated. In other embodiments, the emergent light-transmittable portion may be a layer made of a light-transmittable material. Specifically, the emergent light-transmittable portion 210 is a light-transmittable pattern portion (for example, a trademark) so that the present invention is more appealing when being viewed from outside.

Specifically, the light-emitting portion 30 includes a plurality of light-emitting diodes 31 which are embedded in the substrate 23 along a contour of the emergent light-transmittable portion 210 so that light projected from the emergent light-transmittable portion 210 is brighter and more even.

The electronic device 100 includes the circuit module 1 mentioned above and further includes a shell portion 50.

The shell portion 50 is covered on two opposite lateral faces of the circuit module 1. The shell portion 50 further has a second light-transmittable portion 51 corresponding to the emergent light-transmittable portion 210, and the light projected from the emergent light-transmittable portion 210 can be projected through the second light-transmittable portion 51 to an exterior of the electronic device 100. It is understandable that the second light-transmittable portion 51 may be a hollow-out structure or a layer made of a light-transmittable material.

In this embodiment, the shell portion 50 is a heat-dissipating shell portion (the shell portion may made of, for example, a metal) to prevent the circuit module 1 from overheating.

Given the above, the electronic device and the circuit module thereof, wherein light is emitted through the light-emitting portion embedded in the substrate and the emergent light-transmittable portion of the coating layer without a light-guiding portion which needs to be further disposed. Therefore, a thickness of the present invention decreases, and a manufacturing cost of the present invention is lower.

While we have shown and described various embodiments in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims (11)

WHAT IS CLAIMED IS:
1. A circuit module, including: a main body, including a substrate and a first coating layer, the substrate having a light-transmittable portion and a first face, the first coating layer being coated on the first face, the first coating layer being formed with an emergent light-transmittable portion corresponding to the light-transmittable portion; a light-emitting portion, embedded in the substrate, light from the light-emitting portion being projectable to the light-transmittable portion and projectable through the emergent light-transmittable portion to an exterior of the circuit module; a PCI-E insert row, disposed on the substrate.
2. The circuit module of claim 1, wherein the first coating layer at least shields a part of the light-emitting portion.
3. The circuit module of claim 1, wherein the substrate further has a second face opposite to the first face, the main body further includes a second coating layer coated on the second face, and the second coating layer at least shields a part of the light-emitting portion.
4. The circuit module of claim 1, wherein the light-emitting portion includes a plurality of light-emitting diodes which are embedded in the substrate along a contour of the emergent light-transmittable portion.
5. The circuit module of claim 4, wherein the emergent light-transmittable portion is a light-transmittable pattern portion.
6. The circuit module of claim 1, wherein the emergent light-transmittable portion is a hollow-out structure or a layer made of a light-transmittable material.
7. A circuit module of claim 1, wherein the substrate is provided with an electronic unit, the electronic unit is electronically connected with the PCI-E insert row, and the electronic unit is either a graphic processing module or a display processing module.
8. An electronic device, including the circuit module of claim 1, further including: a shell portion, covered on two opposite lateral faces of the circuit module, the shell portion having a second light-transmittable portion corresponding to the emergent light-transmittable portion, and light projected from the emergent light-transmittable portion being projectable through the second light-transmittable portion to an exterior of the electronic device.
9. The electronic device of claim 8, wherein the second light-transmittable portion is a hollow-out structure or a layer made of a light-transmittable material.
10. The electronic device of claim 8, wherein the shell portion is a heat-dissipating shell portion.
11. An electronic device and circuit module thereof substantially as hereinbefore described with reference to and as shown in the accompanying drawings.
GB1613365.4A 2015-11-03 2016-08-03 Electronic device and circuit module thereof Pending GB2544142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104136194A TWI557359B (en) 2015-11-03 2015-11-03 Electronic device and circuit module thereof

Publications (2)

Publication Number Publication Date
GB201613365D0 GB201613365D0 (en) 2016-09-14
GB2544142A true GB2544142A (en) 2017-05-10

Family

ID=56084717

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1613365.4A Pending GB2544142A (en) 2015-11-03 2016-08-03 Electronic device and circuit module thereof

Country Status (4)

Country Link
DE (1) DE102016116535A1 (en)
GB (1) GB2544142A (en)
NL (1) NL1042102B1 (en)
TW (1) TWI557359B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106996542A (en) * 2015-10-23 2017-08-01 照明科学集团公司 Illuminator and correlation technique for the emphasis regions of layer

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US7542302B1 (en) * 2008-07-14 2009-06-02 International Business Machines Corporation Minimizing thickness of deadfronted display assemblies
US20100172139A1 (en) * 2007-02-01 2010-07-08 Kraetzschmar Andreas Plate for Inscription
CN201570214U (en) * 2009-10-23 2010-09-01 惠州市德赛视听科技有限公司 Modularized mark light-emitting block
WO2013000560A1 (en) * 2011-06-27 2013-01-03 Entertainment Distribution Company GmbH Circuit arrangement body, in particular component board
CN204629173U (en) * 2015-05-21 2015-09-09 宇帷国际股份有限公司 Circuit module
CN204667882U (en) * 2015-05-14 2015-09-23 宇帷国际股份有限公司 Solid state hard disc
TW201606788A (en) * 2015-11-03 2016-02-16 宇帷國際股份有限公司 Electronic device and dynamic random access memory thereof
CN205122186U (en) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 Electron device and developments random access memory body thereof
CN205122137U (en) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 Electronic device and circuit module thereof

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US7498521B2 (en) * 2005-06-30 2009-03-03 Intel Corporation Method and apparatus for marking a printed circuit board
EP2128845A1 (en) * 2008-05-26 2009-12-02 C.R.F. Società Consortile per Azioni Transparent display device with conductive paths provided with an opaque coating
TWM429955U (en) * 2012-01-20 2012-05-21 Zhen-Rong Guo Light-emitting nameplate
TWM508053U (en) * 2015-05-12 2015-09-01 Avexir Technologies Corp Electric circuit module

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Publication number Priority date Publication date Assignee Title
US20100172139A1 (en) * 2007-02-01 2010-07-08 Kraetzschmar Andreas Plate for Inscription
EP1981147A1 (en) * 2007-04-11 2008-10-15 FELA Hitzinger GmbH Illumination unit with transparent substrate and substrate-mounted LED
US7542302B1 (en) * 2008-07-14 2009-06-02 International Business Machines Corporation Minimizing thickness of deadfronted display assemblies
CN201570214U (en) * 2009-10-23 2010-09-01 惠州市德赛视听科技有限公司 Modularized mark light-emitting block
WO2013000560A1 (en) * 2011-06-27 2013-01-03 Entertainment Distribution Company GmbH Circuit arrangement body, in particular component board
CN204667882U (en) * 2015-05-14 2015-09-23 宇帷国际股份有限公司 Solid state hard disc
CN204629173U (en) * 2015-05-21 2015-09-09 宇帷国际股份有限公司 Circuit module
TW201606788A (en) * 2015-11-03 2016-02-16 宇帷國際股份有限公司 Electronic device and dynamic random access memory thereof
CN205122186U (en) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 Electron device and developments random access memory body thereof
CN205122137U (en) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 Electronic device and circuit module thereof

Also Published As

Publication number Publication date
NL1042102B1 (en) 2017-12-13
TW201608170A (en) 2016-03-01
TWI557359B (en) 2016-11-11
DE102016116535A1 (en) 2017-05-04
NL1042102A (en) 2017-05-23
GB201613365D0 (en) 2016-09-14

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