NL1042102B1 - Electronic device and circuit module thereof - Google Patents

Electronic device and circuit module thereof Download PDF

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Publication number
NL1042102B1
NL1042102B1 NL1042102A NL1042102A NL1042102B1 NL 1042102 B1 NL1042102 B1 NL 1042102B1 NL 1042102 A NL1042102 A NL 1042102A NL 1042102 A NL1042102 A NL 1042102A NL 1042102 B1 NL1042102 B1 NL 1042102B1
Authority
NL
Netherlands
Prior art keywords
light
transmittable
circuit module
substrate
coating layer
Prior art date
Application number
NL1042102A
Other versions
NL1042102A (en
Inventor
Cheng Han-Hung
Kuo Chi-Fen
Original Assignee
Avexir Tech Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avexir Tech Corporation filed Critical Avexir Tech Corporation
Publication of NL1042102A publication Critical patent/NL1042102A/en
Application granted granted Critical
Publication of NL1042102B1 publication Critical patent/NL1042102B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F23/00—Advertising on or in specific articles, e.g. ashtrays, letter-boxes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/18—Edge-illuminated signs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

An electronic device and a circuit module thereof are provided. The circuit module includes a main body, a light-emitting portion and a PCI-E insert row, the main body has a substrate and a first coating layer, the substrate has a light-transmittable portion and a first face, the first coating layer is coated on the first face, the first coating layer has an emergent light-transmittable portion corresponding to the light-transmittable portion. The light-emitting portion is buried in the substrate. The PCI-E insert row is disposed on the substrate. The electronic device includes the circuit module mentioned above and further includes a shell portion. The shell portion is covered on two opposite lateral faces of the circuit module, and the shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion.

Description

ref.: P 2016 NL 021
TITLE: ELECTRONIC DEVICE AND CIRCUIT MODULE THEREOF
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to an electronic device and a circuit module thereof.
Description of the Prior Art
An electronic device and a circuit module thereof as disclosed in TWM448772 includes a main body, at least one light-emitting diode and at least one translucent light-guiding body. The light-emitting diode is disposed in the main body and electrically connected with the main body, the light-guiding body is disposed on the main body and covers the light-emitting diode, and light from the light-emitting diode can penetrate through the light-guiding body.
However, when this type of the circuit module is in actual practice, the light-guiding body needs to be further covered on the light-emitting diode; therefore, the circuit module is too thick, and the manufacturing cost is higher.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.
SUMMARY OF THE INVENTION
The major object of the present invention is to provide an electronic device and a circuit module thereof, wherein light is emitted through a light-emitting portion embedded in a substrate and an emergent light-transmittable portion of a coating layer without a light-guiding portion which needs to be further disposed. Therefore, a thickness of the present invention decreases, and a manufacturing cost of the present invention is lower.
To achieve the above and other objects, a circuit module is provided, including a main body, a light-emitting portion and a PCI-E insert row. The main body includes a substrate and a first coating layer, the substrate has a light-transmittable portion and a first face, the first coating layer is coated on the first face, the first coating layer has an emergent light-transmittable portion corresponding to the light-transmittable portion. The light-emitting portion is embedded in the substrate, and light from the light-emitting portion can be projected to the light-transmittable portion and projected through the emergent light-transmittable portion to an exterior of the circuit module. The PCI-E insert row is disposed on the substrate.
To achieve the above and other objects, an electronic device is further provided, including the circuit module mentioned above, and further including a shell portion. The shell portion is covered on two opposite lateral faces of the circuit module. The shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion, and light projected from the emergent light-transmittable portion can be projected through the second light-transmittable portion to an exterior of the electronic device.
The present invention will become more obvious from the following description when taken in connection with the accompanying drawings, which show, for purpose of illustrations only, the preferred embodiments) in accordance with the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a perspective view of a preferred embodiment of the present invention;
Fig. 2 is a breakdown view of the preferred embodiment of the present invention;
Fig. 3 is a partially-enlarged view of the preferred embodiment of the present invention; and
Fig. 4 is a cross-sectional view of the present invention, taken along line A-A in Fig. 1.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention will be clearer from the following description when viewed together with the accompanying drawings, which show, for purpose of illustrations only, the preferred embodiment in accordance with the present invention.
Please refer to Figs. 1 to 4 for an electronic device 100 and a circuit module 1 thereof of a preferred embodiment of the present invention. The circuit module 1 includes a main body 20, a light-emitting portion 30 and a PCI-E insert row 40.
The main body 20 includes a substrate 23 and a first coating layer 21. Specifically, the substrate 23 has a light-transmittable portion 230 and a first face 231, the first coating layer 21 is coated on the first face 231, the first coating layer 21 is formed with an emergent light-transmittable portion 210 corresponding to the light-transmittable portion 230. In this embodiment, the first coating layer 21 at least shields a part of the light-emitting portion 30. Specifically, the first coating layer 21 shields the light-emitting portion 30 thoroughly, the light from the light-emitting portion 30 is guided (refracted or reflected) through the light-transmittable portion 230 and transmitted to the emergent light-transmittable portion 210 so that the light projected is softer. In other embodiments, the light-emitting portion may be not shielded by the first coating layer and be arranged facing the emergent light-transmittable portion; or, the light-emitting portion is partially shielded.
The light-emitting portion 30 is embedded in the substrate 23, and the light from the light-emitting portion 30 can be projected to the light-transmittable portion 230 and projected through the emergent light-transmittable portion 210 to an exterior of the circuit module 1. It is to be noted that the substrate 23 is a translucent board of a normal printed circuit board. In other embodiments, the light-transmittable portion may be a layer made of a light-transmittable material, and other parts of the substrate may be a layer made of a light-nontransmittable material so that a light-emitting face of the light-emitting portion (which may be partially embedded in the layer made of the light-nontransmittable material) faces the light-transmittable portion directly to emit light; or, the light-transmittable portion is a hollow-out structure, and the light-emitting face of the light-emitting portion is exposed through the hollow-out structure.
The substrate 23 is provided with an electronic unit 233, and the electronic unit 233 is electrically connected with the PCI-E insert row 40. The electronic unit 233 may be a graphic processing module, a display processing module or other processing modules so that the circuit module 1 can serve as a graphic card, a display card or other devices. The PCI-E insert row 40 is disposed on the substrate 23, and the PCI-E insert row 40 is electrically connected with the electronic unit 233. More specifically, the light-emitting portion 30 is also electrically connected with the PCI-E insert row 40 (of course, the light-emitting portion may be further electrically connected with other exterior powers such as a mother board). It is understandable that the PCI-E insert row 40 can transmit not only electricity but also data.
In this embodiment, the substrate 23 further has a second face 232 opposite to the first face 231, the main body 20 includes a second coating layer 22 coated on the second face 232, and the second coating layer 22 at least shields a part of the light-emitting portion 30 (the second coating layer may also not shield the light-emitting portion and allow the light to penetrate directly).
In this embodiment, the first coating layer 21 and the second coating layer 22 are insulting coating layers of a normal circuit board. The emergent light-transmittable portion 210 is a hollow-out structure which is not coated. In other embodiments, the emergent light-transmittable portion may be a layer made of a light-transmittable material. Specifically, the emergent light-transmittable portion 210 is a light-transmittable pattern portion (for example, a trademark) so that the present invention is more appealing when being viewed from outside.
Specifically, the light-emitting portion 30 includes a plurality of light-emitting diodes 31 which are embedded in the substrate 23 along a contour of the emergent light-transmittable portion 210 so that light projected from the emergent light-transmittable portion 210 is brighter and more even.
The electronic device 100 includes the circuit module 1 mentioned above and further includes a shell portion 50.
The shell portion 50 is covered on two opposite lateral faces of the circuit module 1. The shell portion 50 further has a second light-transmittable portion 51 corresponding to the emergent light-transmittable portion 210, and the light projected from the emergent light-transmittable portion 210 can be projected through the second light-transmittable portion 51 to an exterior of the electronic device 100. It is understandable that the second light-transmittable portion 51 may be a hollow-out structure or a layer made of a light-transmittable material.
In this embodiment, the shell portion 50 is a heat-dissipating shell portion (the shell portion may made of, for example, a metal) to prevent the circuit module 1 from overheating.
Given the above, the electronic device and the circuit module thereof, wherein light is emitted through the light-emitting portion embedded in the substrate and the emergent light-transmittable portion of the coating layer without a light-guiding portion which needs to be further disposed. Therefore, a thickness of the present invention decreases, and a manufacturing cost of the present invention is lower.
While we have shown and described various embodiments in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims (10)

1. A circuit module, including: a main body, including a substrate and a first coating layer, the substrate having a light-transmittable portion and a first face, the first coating layer being coated on the first face, the first coating layer being formed with an emergent light-transmittable portion corresponding to the light-transmittable portion; a light-emitting portion, embedded in the substrate, light from the light-emitting portion being projectable to the light-transmittable portion and projectable through the emergent light-transmittable portion to an exterior of the circuit module; a PCI-E insert row, disposed on the substrate.
2. The circuit module of claim 1, wherein the first coating layer at least shields a part of the light-emitting portion.
3. The circuit module of claim 1, wherein the substrate further has a second face opposite to the first face, the main body further includes a second coating layer coated on the second face, and the second coating layer at least shields a part of the light-emitting portion.
4. The circuit module of claim 1, wherein the light-emitting portion includes a plurality of light-emitting diodes which are embedded in the substrate along a contour of the emergent light-transmittable portion.
5. The circuit module of claim 4, wherein the emergent light-transmittable portion is a light-transmittable pattern portion.
6. The circuit module of claim 1, wherein the emergent light-transmittable portion is a hollow-out structure or a layer made of a light-transmittable material.
7. A circuit module of claim 1, wherein the substrate is provided with an electronic unit, the electronic unit is electronically connected with the PCI-E insert row, and the electronic unit is either a graphic processing module or a display processing module.
8. An electronic device, including the circuit module of claim 1, further including: a shell portion, covered on two opposite lateral faces of the circuit module, the shell portion having a second light-transmittable portion corresponding to the emergent light-transmittable portion, and light projected from the emergent light-transmittable portion being projectable through the second light-transmittable portion to an exterior of the electronic device.
9. The electronic device of claim 8, wherein the second light-transmittable portion is a hollow-out structure or a layer made of a light-transmittable material.
10. The electronic device of claim 8, wherein the shell portion is a heat-dissipating shell portion.
NL1042102A 2015-11-03 2016-10-14 Electronic device and circuit module thereof NL1042102B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104136194A TWI557359B (en) 2015-11-03 2015-11-03 Electronic device and circuit module thereof

Publications (2)

Publication Number Publication Date
NL1042102A NL1042102A (en) 2017-05-23
NL1042102B1 true NL1042102B1 (en) 2017-12-13

Family

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Family Applications (1)

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DE (1) DE102016116535A1 (en)
GB (1) GB2544142A (en)
NL (1) NL1042102B1 (en)
TW (1) TWI557359B (en)

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Publication number Priority date Publication date Assignee Title
CN106996542A (en) * 2015-10-23 2017-08-01 照明科学集团公司 Illuminator and correlation technique for the emphasis regions of layer

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CN204629173U (en) * 2015-05-21 2015-09-09 宇帷国际股份有限公司 Circuit module
TWI545583B (en) * 2015-11-03 2016-08-11 宇帷國際股份有限公司 Electronic device and dynamic random access memory thereof
CN205122186U (en) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 Electron device and developments random access memory body thereof
CN205122137U (en) * 2015-11-11 2016-03-30 宇帷国际股份有限公司 Electronic device and circuit module thereof

Also Published As

Publication number Publication date
GB201613365D0 (en) 2016-09-14
GB2544142A (en) 2017-05-10
NL1042102A (en) 2017-05-23
DE102016116535A1 (en) 2017-05-04
TWI557359B (en) 2016-11-11
TW201608170A (en) 2016-03-01

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Effective date: 20191101