TWI556655B - Headset earplug body structure - Google Patents

Headset earplug body structure Download PDF

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Publication number
TWI556655B
TWI556655B TW101102503A TW101102503A TWI556655B TW I556655 B TWI556655 B TW I556655B TW 101102503 A TW101102503 A TW 101102503A TW 101102503 A TW101102503 A TW 101102503A TW I556655 B TWI556655 B TW I556655B
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Taiwan
Prior art keywords
ring groove
earplug
improved structure
sound
earphone according
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TW101102503A
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TW201309048A (zh
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Cheng-Hong Huang
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Priority to KR2020120005247U priority patent/KR20130004666U/ko
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/65Housing parts, e.g. shells, tips or moulds, or their manufacture
    • H04R25/652Ear tips; Ear moulds
    • H04R25/656Non-customized, universal ear tips, i.e. ear tips which are not specifically adapted to the size or shape of the ear or ear canal

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Headphones And Earphones (AREA)

Description

耳機之耳塞墊體改良結構
本發明係有關一種耳機之耳塞墊體改良結構,尤指耳塞墊體上設有緩衝部,使配載時易於扭轉變形貼合耳道,減少壓迫感增進配載舒適,並避免產生空隙以提高收聽品質。
按,耳塞式耳機結構體積小,發聲器可直接置入耳孔中,讓使用者可在不干擾旁人的狀況下聆聽電子聲音,具有輕便小巧、方便攜帶的實用性,已成為MP3隨身聽、行動電話、個人數位助理(PDA)或筆記型電腦...等相關電子產品的必要配件;參閱第12圖所示,習知的耳塞式耳機結構,主要包括一耳機本體1及一耳塞墊體2所組成,在耳機本體1的側邊向外延伸一導音管11;而該耳塞墊體2係呈水母形,為軟膠材質套在導音管11頸部及凸環111上結合;藉由軟膠材質的耳塞墊體2可供適度變形塞緊於外耳道3以方便配載。
如眾所周知,每個人對音聲的感受並不相同,而且耳朵、耳道結構的形狀、尺寸、大小都有所差異,而現有習知耳塞式耳機結構因為耳塞墊體在緩衝功能及角度調整設計上未及完善,故一般應用時常會使外耳道倍感壓迫,而當於較大耳朵配載時,其耳塞與外耳道又没辦法真正緊密容易產生空隙,導致低音外漏音質變差之外,同時也容易造成耳機鬆脫掉落,是其主要缺點。
有鑑於上述習知耳機結構之缺憾,發明人乃積極研發,而提供一種耳機之耳塞墊體改良結構,係包括:一中空管體,係含出音端及入音端,該管體套接在耳機導音管上;一外罩體,呈圓弧傘狀延設於管體出音端,以供塞入外耳道,以及;一緩衝部,係設在管體之出音端;藉此,以緩衝部之有效設計,使配載時易於扭轉變形,可適合各種不同耳道大小形狀,增進配載舒適減少外耳道的壓迫感,又不會產生空隙以提高收聽品質。
為更進一步介紹本發明之組成、特徵及功效,茲藉由下述具體之實施例,配合所附之圖做一詳細說明,如第1、2圖所示係本發明之一種耳機之耳塞墊體2改良結構,係為一呈水母形之軟膠材質耳塞墊體2,其係包括:一中空管體21,係含入音端211及出音端212,於中空管體21之入音端211中設有一內卡圈213;一外罩體22,係由中空管體21之出音端212頂端向後延設一呈罩狀之彈性體,其外罩體22可為圓弧狀或傘狀,以及;一緩衝部23,係在中空管體21之出音端212設一外環槽231者,且外環槽231緩衝高度a介於1.0~2.0mm。
藉由上述構件組合而成之耳塞墊體2,其高度可介於6~8mm。於實施時,如第3~5圖所示,其耳塞墊體2係套接在一流線顆粒狀之耳機本體1,而耳機本體1側邊向外延伸設一段導音管11,且導音管11具有一凸環111可套接於入音端211之內卡圈213。當耳塞墊體2配載於耳朵時,如第4、5圖所示,因整個耳塞墊體2高度介於6~10mm中,並具外環槽231的緩衝高度a係為1.0~2.0mm(如第2圖所示),再加上外罩體22設計上是含蓋了整個中空管體21,故彎曲效果若以360度來表示的話,其緩衝部23於應用受力時藉由兩邊波浪曲張效果,有效的彎曲角度θ就可介於0~40度之間,使耳塞墊體2配載時易於扭轉變形,產生出緩衝與彎曲效果,可鬆緊適合各種不同外耳道3大小形狀,增進配載舒適,減少外耳道3的壓迫感,同時又能緊密配載不易產生空隙以提高收聽品質。
其次,請再參考第6~8圖所示,係本發明之一種耳機之耳塞墊體2改良結構之另一實施例,其緩衝部23係呈一短截波浪圈狀設在中空管體21之出音端212並與入音端211相臨,其係包括相臨之內環槽232與外環槽231,而內環槽232則可為一第一內環槽2321或第二內環槽2322,或由第一內環槽2321及第二內環槽2322組成,其外環槽231之緩衝高度a則介於0.5.0~1.5mm,且外環槽231之內徑小於中空管體21之內徑,以形成一較大之外環槽231寬度,藉由緩衝部23係由至少一相對之兩相臨之內環槽232(第一內環槽2321及第二內環槽2322)與外環槽231所構成,並使外環槽231形成一較大之寬度,而外環槽231之緩衝高度a則介於0.5.0~1.5mm,則耳塞墊體2配載時更易於扭轉變形,而產生出有效的彎曲角度θ就可介於0~40度之間,以形成較佳之緩衝與彎曲效果,更可鬆緊適合各種不同外耳道3大小形狀,增減外耳道3的壓迫感並提高收聽品質。
再參閱第9~10圖所示,係本發明耳塞墊體2另一結構,係包括:一中空管體21,係含略呈內凹階層狀之入音端211及出音端212,其中空管體21於入音端211係略呈外擴錐狀體21a,並於中空管體21之入音端211中設有一內卡圈213;一外罩體22,係由中空管體21之出音端212頂端延設一厚度向中空管體21底端側漸縮及呈罩狀之彈性體,其外罩體22可為圓弧狀或傘狀,以及;一緩衝部23,係在中空管體21之出音端212側(略於外擴錐狀體21a其外擴起始處)設一外環槽231。
於實施時,係如第10、11圖所示,先將耳塞墊體2藉由內卡圈213套接在耳機本體1其導音管11之凸環111,以將耳機本體1藉由耳塞墊體2配載於耳朵其外耳道3(如第11圖所示);本發明係由耳塞墊體2外罩體22受壓時之彎曲效果貼合於耳朵,其中緩衝部23於中空管體21受力時,藉由曲張效果,有效的彎曲壓縮使耳塞墊體2於使用時易於扭轉變形,產生出緩衝與彎曲效果,而可鬆緊調整適合各種不同外耳道3大小形狀,且中空管體21其外擴錐狀體21a係可進一步頂壓外罩體22,增加耳塞墊體2定位性,並由耳塞墊體2之變化增進配載舒適,減少外耳道3的壓迫感。
上列詳細說明係針對本發明之可行實施例之具體說明,惟該實施例並非用以限制本發明之專利範圍,凡未脫離本發明技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。
綜上所述,本案不但在空間型態上確屬創新,並能較習用物品增進上述多項功效,應已充分符合新穎性及進步性之法定發明專利要件,爰依法提出申請,懇請 貴局核准本件發明專利申請案,以勵發明,至感德便。
1...耳機本體
11...導音管
111...凸環
2...耳塞墊體
21...中空管體
212...出音端
21a...外擴錐狀體
213...內卡圈
211...入音端
23...緩衝部
22...外罩體
232...內環槽
231...外環槽
3...外耳道
2321...第一內環槽
2322...第二內環槽
a...緩衝高度
θ...彎曲角度
第1圖、係本發明之立體圖。
第2圖、係本發明之剖視圖。
第3圖、係本發明之作動圖之一。
第4圖、係本發明之作動圖之二。
第5圖、係本發明之作動圖之三。
第6圖、係本發明之另一結構(二)立體圖。
第7圖、係本發明之另一結構(二)實施例及作動圖之一。
第8圖、係本發明之另一結構(二)實施例及作動圖之二。
第9圖、係本發明之另一結構(三)立體圖。
第10圖、係本發明之另一結構(三)剖視圖。
第11圖、係本發明之另一結構(三)實施例圖。
第12圖、係習知耳機之剖視圖。
2...耳塞墊體
22...外罩體
21...中空管體
23...緩衝部
211...入音端
231...外環槽
212...出音端
213...內卡圈
a...緩衝高度

Claims (8)

  1. 一種耳機之耳塞墊體改良結構,其係包括:一中空管體,係含入音端及出音端;一外罩體,係由該管體之出音端頂端外側向後延設一呈罩狀之彈性體,其含蓋了該管體,且該外罩體厚度係由該中空管體頂端逐漸向底端側漸縮;以及一緩衝部,係設在中空管體之出音端,該緩衝部係由相臨之內環槽與外環槽形成,該內環槽係包括第一內環槽與第二內環槽,且該外環槽係位於第一內環槽與第二內環槽間,而該外環槽之內徑係小於中空管體之內徑。
  2. 如申請專利範圍第1項所述耳機之耳塞墊體改良結構,其中該緩衝部可彎曲角度介於0~40度之間。
  3. 如申請專利範圍第1項所述耳機之耳塞墊體改良結構,其中該外環槽寬度係介於0.5~1.5mm。
  4. 如申請專利範圍第1項所述耳機之耳塞墊體改良結構,其中該耳塞墊體高度係介於6~10mm。
  5. 如申請專利範圍第1項所述耳機之耳塞墊體改良結構,其中該外罩體係呈圓弧狀或傘形狀。
  6. 如申請專利範圍第1項所述耳機之耳塞墊體改良結構,其 中該管體之入音端設有一內卡圈。
  7. 如申請專利範圍第1項所述耳機之耳塞墊體改良結構,其中該中空管體於入音端係略呈外擴錐狀體。
  8. 如申請專利範圍第1項所述耳機之耳塞墊體改良結構,其中該緩衝部係位於中空管體其外擴錐狀體其外擴起始處。
TW101102503A 2011-08-05 2012-01-20 Headset earplug body structure TWI556655B (zh)

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TW101102503A TWI556655B (zh) 2011-08-05 2012-01-20 Headset earplug body structure
KR2020120005247U KR20130004666U (ko) 2011-08-05 2012-06-19 구조가 개선된 이어폰의 귀마개 탄성부재

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TW100128000 2011-08-05
TW101102503A TWI556655B (zh) 2011-08-05 2012-01-20 Headset earplug body structure

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TWI556655B true TWI556655B (zh) 2016-11-01

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US (1) US8348011B1 (zh)
JP (1) JP5669708B2 (zh)
KR (1) KR20130004666U (zh)
CN (2) CN202261704U (zh)
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CN102077606A (zh) * 2008-06-25 2011-05-25 星精密株式会社 耳塞以及插入型耳机
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TWI751906B (zh) * 2021-02-09 2022-01-01 香港商吉承貿易有限公司 耳塞套

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CN102917291B (zh) 2016-12-14
TW201309048A (zh) 2013-02-16

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