TWI555076B - 基板處理設備及方法 - Google Patents

基板處理設備及方法 Download PDF

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Publication number
TWI555076B
TWI555076B TW103140558A TW103140558A TWI555076B TW I555076 B TWI555076 B TW I555076B TW 103140558 A TW103140558 A TW 103140558A TW 103140558 A TW103140558 A TW 103140558A TW I555076 B TWI555076 B TW I555076B
Authority
TW
Taiwan
Prior art keywords
ring
substrate processing
processing apparatus
wafer
plasma
Prior art date
Application number
TW103140558A
Other languages
English (en)
Chinese (zh)
Other versions
TW201535498A (zh
Inventor
金泰勳
Original Assignee
Psk有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psk有限公司 filed Critical Psk有限公司
Publication of TW201535498A publication Critical patent/TW201535498A/zh
Application granted granted Critical
Publication of TWI555076B publication Critical patent/TWI555076B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76822—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc.
    • H01L21/76825—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc. by exposing the layer to particle radiation, e.g. ion implantation, irradiation with UV light or electrons etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
TW103140558A 2014-03-06 2014-11-21 基板處理設備及方法 TWI555076B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140026626A KR101594928B1 (ko) 2014-03-06 2014-03-06 기판 처리 장치 및 방법

Publications (2)

Publication Number Publication Date
TW201535498A TW201535498A (zh) 2015-09-16
TWI555076B true TWI555076B (zh) 2016-10-21

Family

ID=54033150

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103140558A TWI555076B (zh) 2014-03-06 2014-11-21 基板處理設備及方法

Country Status (3)

Country Link
KR (1) KR101594928B1 (ko)
CN (1) CN104900563A (ko)
TW (1) TWI555076B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102709229B1 (ko) 2015-12-07 2024-09-23 어플라이드 머티어리얼스, 인코포레이티드 병합형 커버 링
CN106935530B (zh) * 2015-12-31 2020-04-17 中微半导体设备(上海)股份有限公司 一种等离子体刻蚀光刻胶装置
CN113580557A (zh) * 2021-07-28 2021-11-02 沛顿科技（深圳）有限公司 一种tsv工艺中替代ncf的3d打印方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200805556A (en) * 2006-03-31 2008-01-16 Tokyo Electron Ltd Substrate placing stage and substrate processing apparatus
TW201334062A (zh) * 2011-11-09 2013-08-16 Tokyo Electron Ltd 基板載置系統、基板處理裝置、靜電夾具及基板冷卻方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001525997A (ja) * 1997-05-20 2001-12-11 東京エレクトロン株式会社 処理装置
US20070032081A1 (en) * 2005-08-08 2007-02-08 Jeremy Chang Edge ring assembly with dielectric spacer ring
JP4951536B2 (ja) * 2007-03-27 2012-06-13 東京エレクトロン株式会社 基板載置台及び基板処理装置
JP4858395B2 (ja) * 2007-10-12 2012-01-18 パナソニック株式会社 プラズマ処理装置
JP5291392B2 (ja) * 2008-06-18 2013-09-18 東京応化工業株式会社 支持板剥離装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200805556A (en) * 2006-03-31 2008-01-16 Tokyo Electron Ltd Substrate placing stage and substrate processing apparatus
TW201334062A (zh) * 2011-11-09 2013-08-16 Tokyo Electron Ltd 基板載置系統、基板處理裝置、靜電夾具及基板冷卻方法

Also Published As

Publication number Publication date
TW201535498A (zh) 2015-09-16
CN104900563A (zh) 2015-09-09
KR101594928B1 (ko) 2016-02-17
KR20150104813A (ko) 2015-09-16

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