TWI553430B - A focusing leveling device - Google Patents
A focusing leveling device Download PDFInfo
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- TWI553430B TWI553430B TW103146044A TW103146044A TWI553430B TW I553430 B TWI553430 B TW I553430B TW 103146044 A TW103146044 A TW 103146044A TW 103146044 A TW103146044 A TW 103146044A TW I553430 B TWI553430 B TW I553430B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7034—Leveling
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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Description
本發明係關於光刻領域,尤其係關於用於光刻機的帶有折光單元的自動調焦裝置。 The present invention relates to the field of lithography, and more particularly to an autofocus device with a refractive unit for a lithography machine.
目前的投影光刻系統中通常包括用以精確探測被測物體表面高度與傾斜的自動調焦調平分系統。圖1所示為現有的投影光刻機調焦調平系統原理圖。如圖1所示,該投影光刻機調焦調平系統包括投影物鏡19和分布於投影物鏡19光軸兩側的測量光路。測量光路包括沿光路依次排列的照明單元、投影單元、探測單元及中繼單元。照明單元由照明光源1、照明鏡組2及光纖(圖中未示出)組成;光源的出射光經照明鏡組2聚光之後,由光纖傳送至投影單元,為整個測量裝置提供照明光源。投影單元由投影狹縫3、投影前組透鏡組4、反射鏡組5及投影後組透鏡組6所組成;從照明單元出射的光通過投影狹縫後依次經過投影前組透鏡組4、反射鏡組5及投影後組透鏡組6,在被測物體7表面當前曝光區域內形成測量光斑。探測單元由探測前組透鏡組8、反射鏡組9、探測後組透鏡組10所組成;經過探測單元之後,進入中繼單元。中繼單元由中繼反射鏡11、中繼透鏡組12、探測器13、調焦控制器14、運算單元15所組成,經過中繼單元的光斑被探測器13接收,形成帶有被測物表面位置和傾斜資訊的光強信號。 Current projection lithography systems typically include an autofocus grading system for accurately detecting the surface height and tilt of the object being measured. FIG. 1 is a schematic diagram of a focus adjustment leveling system of a conventional projection lithography machine. As shown in FIG. 1, the projection aligner leveling system includes a projection objective 19 and measurement optical paths distributed on both sides of the optical axis of the projection objective 19. The measuring optical path includes a lighting unit, a projection unit, a detecting unit, and a relay unit that are sequentially arranged along the optical path. The illumination unit is composed of an illumination source 1, an illumination mirror 2 and an optical fiber (not shown); the emitted light of the light source is collected by the illumination mirror 2, and then transmitted by the optical fiber to the projection unit to provide an illumination source for the entire measurement device. The projection unit is composed of a projection slit 3, a pre-projection group lens group 4, a mirror group 5, and a post-projection lens group 6. The light emitted from the illumination unit passes through the projection slit and then passes through the pre-projection lens group 4 and reflects. The mirror group 5 and the post-projection group lens group 6 form a measurement spot in the current exposure region of the surface of the object 7 to be measured. The detecting unit is composed of the pre-detecting group lens group 8, the mirror group 9, and the post-detecting group lens group 10; after passing through the detecting unit, it enters the relay unit. The relay unit is composed of a relay mirror 11, a relay lens group 12, a detector 13, a focus controller 14, and an arithmetic unit 15, and the spot passing through the relay unit is received by the detector 13 to form a test object. Surface position and intensity information for tilt information.
美國專利US5414515的一個實施例的技術方案是設 計單一光路,產生多個測量光斑,在滿足一定測量視場範圍的需求下,採用對應的多個CCD,上述方案存在的不足之處在於:所用CCD數量較多,CCD對應的圖像採集卡及線纜也會較多,成本較高;另外,CCD數量多會造成空間限制比較吃緊,不能更好地為整機增加空間限制的自由度。 The technical solution of an embodiment of US Pat. No. 5,414,515 is to provide A single optical path is generated to generate a plurality of measurement spots, and corresponding CCDs are used under the requirement of satisfying a certain measurement field of view. The disadvantages of the above solutions are: the number of CCDs used is large, and the CCD corresponding image acquisition card There are also more cables and higher costs. In addition, the large number of CCDs will cause space constraints to be tighter, and it is not possible to better increase the freedom of space constraints for the whole machine.
中國專利CN101710291示出了一種帶平行光折光單 元透鏡的太陽能裝置,該裝置與本發明方案的不同在於應用上存在區別,CN101710291的技術方案著重於對光束進行能量的匯聚,並無像質的要求,而本發明用於成像位置的調整,且對成像解析度、畸變、焦深等像質均有要求,故兩者存在本質的差別。 Chinese patent CN101710291 shows a parallel light refraction list The solar device of the element lens is different from the solution of the present invention in that there is a difference in application. The technical solution of CN101710291 focuses on the energy gathering of the light beam, and there is no image quality requirement, and the present invention is used for the adjustment of the imaging position. And there are requirements for image resolution, distortion, depth of focus and other image quality, so there is an essential difference between the two.
本發明的目的是提出了一種投影光刻機調平調焦分系統的新結構:通過在光路中引入一種折光單元,以達到只需採用單一光路、單個線陣CCD就能滿足大視場、多點測量的系統需求,並且總體上降低了成本,減少了空間佔用率。 The object of the present invention is to propose a new structure of a leveling and focusing subsystem of a projection lithography machine: by introducing a refracting unit in the optical path, a large field of view can be satisfied by using only a single optical path and a single linear array CCD. The system requirements for multipoint measurement, and overall reduced costs, reducing space occupancy.
根據本發明的一種調焦調平裝置,包括:用於發出一光束的照明光源,以及沿上述光束的一傳輸路徑依次排列的照明鏡組、投影鏡組、被測物體、探測鏡組、折光單元、中繼鏡組及光電探測器,上述光電探測器用於將從上述中繼鏡組出射的攜帶有與上述被測物體表面的高度和傾斜度相關資訊的光束轉換為電信號後,傳遞給運算單元以及調焦調平控制器,上述運算單元根據接收到的上述電信號產生一控制信號提供給上述調焦調平控制器,從而由上述調焦調平控制器控制承載有上述被測物體的一工件台對上 述被測物體的高度和傾斜度進行調整;上述投影鏡組包括一投影狹縫,上述投影狹縫上具有多個不處於同一直線的標記,使得照明光源發出的光束依次經過照明鏡組、投影鏡組、被測物體及探測鏡組後生成與上述多個標記對應的多個不處於同一直線的子光束,上述折光單元被配置為使得上述多個子光束經上述折光單元後生成處於同一直線上的多個光斑。 A focusing leveling device according to the present invention includes: an illumination source for emitting a light beam, and an illumination mirror group, a projection mirror group, an object to be measured, a detection mirror group, and a refractive index which are sequentially arranged along a transmission path of the light beam a unit, a relay mirror group and a photodetector, wherein the photodetector is configured to convert a light beam that is emitted from the relay lens group and carries information related to the height and inclination of the surface of the object to be measured into an electrical signal, and then transmit the light beam to the electrical signal An arithmetic unit and a focus leveling controller, wherein the arithmetic unit generates a control signal according to the received electrical signal and supplies the control signal to the focus leveling controller, so that the focus leveling controller controls the hosted object to be measured One workpiece table The height and inclination of the measured object are adjusted; the projection mirror group includes a projection slit, and the projection slit has a plurality of marks not in the same straight line, so that the light beam emitted by the illumination source sequentially passes through the illumination mirror group and the projection a plurality of sub-beams not corresponding to the plurality of marks are generated by the mirror group, the object to be measured, and the detector group, and the refraction unit is configured to generate the plurality of sub-beams on the same line after passing through the refraction unit Multiple spots.
較佳為,上述投影狹縫上具有至少3個上述不處於同一直線的標記。 Preferably, the projection slit has at least three marks that are not in the same straight line.
較佳為,上述投影鏡組還包括一雙稜鏡組具有兩個稜鏡,上述投影狹縫夾在上述雙稜鏡組的兩個稜鏡中間。 Preferably, the projection mirror set further includes a double jaw group having two turns, and the projection slit is sandwiched between the two turns of the pair of turns.
較佳為,上述折光單元包括折光反射鏡組、折光透鏡組及折光稜鏡組。 Preferably, the refracting unit includes a refractive mirror group, a refractive lens group, and a refractive iridium group.
較佳為,上述折光反射鏡組由n-1塊折光反射鏡所組成,上述折光透鏡組由n塊折光透鏡所組成,上述折光稜鏡組由n-1塊折光稜鏡所組成,其中n為投影狹縫上不處於同一直線的標記的個數。 Preferably, the refractive mirror group is composed of n-1 refractive mirrors, and the refractive lens group is composed of n refractive lenses, and the refractive hologram group is composed of n-1 refractive indexes, wherein n The number of marks on the slit that are not in the same line.
較佳為,上述折光單元還包括平行平板,入射至折光單元的多個子光束中的中間子光束經過對應的折光透鏡後入射至上述平行平板,其他子光束均依次經過對應的折光反射鏡、折光透鏡和折光稜鏡後與該中間子光束一起入射至上述中繼透鏡組。 Preferably, the refracting unit further includes a parallel plate, and the intermediate sub-beams of the plurality of sub-beams incident on the refracting unit are incident on the parallel slab through the corresponding refracting lens, and the other sub-beams sequentially pass through the corresponding refracting mirror and the refracting lens. And the refracting ridge is incident on the relay lens group together with the intermediate sub-beam.
較佳為,上述光電探測器為單個線陣CCD。 Preferably, the photodetector is a single linear array CCD.
較佳為,上述折光單元包括兩塊楔板,上述兩塊楔板以長斜面相對的方式放置。 Preferably, the refracting unit comprises two wedge plates, and the two wedge plates are placed in a long inclined manner.
較佳為,上述兩塊楔板中的第一塊楔板的中部和下部 開有第一通孔,上述第一通孔的位置與入射至折光單元的多個子光束中位於中間和下方的子光束入射到第一塊楔板的位置對應,上述兩塊楔板中的第二塊楔板的中部和上部開有第二通孔,上述第二通孔的位置與入射至折光單元的多個子光束中位於中間和上方的子光束入射到第二塊楔板的位置對應。 Preferably, the middle and lower portions of the first of the two wedge plates are a first through hole is opened, and the position of the first through hole corresponds to a position where the sub-beams located in the middle and below of the plurality of sub-beams incident on the refractive unit are incident on the first wedge plate, and the first of the two wedge plates The middle portion and the upper portion of the two wedge plates are provided with a second through hole, and the position of the second through hole corresponds to a position at which the sub-beams located in the middle and above of the plurality of sub-beams incident on the refractive unit are incident on the second wedge plate.
較佳為,上述折光單元還包括平行平板,其放置位置 使得上述多個子光束中的中間子光束先經過上述第一塊楔板和第二塊楔板中部對應的第一和第二通孔,再入射至平行平板。 Preferably, the refracting unit further includes a parallel plate and a placement position thereof. The intermediate sub-beams of the plurality of sub-beams are first passed through the first and second through holes corresponding to the first wedge plate and the middle of the second wedge plate, and then incident on the parallel plate.
不同於現有的技術常見的兩種結構:第一種,設計多 光路,產生多個測量光斑,並且在較大測量視場的需求下,採用對應的多個線陣CCD;第二種,設計單一光路,產生多個測量光斑,並且在較大測量視場的需求下,採用單個面陣CCD。本發明在投影光刻機調平調焦分系統中,提出了一種新的結構:通過在光路中引入一種折光單元,通過折光單元的使用,本發明的調焦裝置只需採用單一光路、單個線陣CCD就能滿足大視場、多點測量的系統需求,總體上降低了成本,減少了空間佔用率。 Different from the two common structures of the existing technology: the first one, the design is more The optical path generates a plurality of measurement spots, and correspondingly multiple linear array CCDs are required under a larger measurement field of view; second, a single optical path is designed to generate a plurality of measurement spots, and in a larger measurement field of view Under the demand, a single area array CCD is used. The invention proposes a new structure in the leveling and focusing subsystem of the projection lithography machine: by introducing a refraction unit in the optical path, the focusing device of the invention only needs to adopt a single optical path and a single by using the refraction unit. The linear array CCD can meet the system requirements of large field of view and multi-point measurement, which reduces the overall cost and reduces the space occupancy.
關於本發明的優點與精神可以通過以下的發明詳述及所附圖式得到進一步的瞭解。 The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.
1、101、201、301‧‧‧照明光源 1, 101, 201, 301‧‧‧ illumination source
2、102、202、302‧‧‧照明鏡組 2, 102, 202, 302‧‧‧ lighting mirror set
3、103、203、303‧‧‧投影狹縫 3, 103, 203, 303‧‧ ‧ projection slit
4、105、205、305‧‧‧投影前組透鏡組 4, 105, 205, 305 ‧ ‧ front projection lens group
5、9‧‧‧反射鏡組 5, 9‧‧‧Mirror group
6、207、307‧‧‧投影後組透鏡組 6, 207, 307 ‧ ‧ projection group lens group
7、109、209、309‧‧‧被測物體 7, 109, 209, 309‧‧‧ Measured objects
8、111、211、311‧‧‧探測前組透鏡組 8, 111, 211, 311‧‧ ‧ pre-detection group lens group
10、113、213、313‧‧‧探測後組透鏡組 10, 113, 213, 313‧‧ ‧ post-detection group lens group
11‧‧‧中繼反射鏡 11‧‧‧Relay mirror
12、116、219、317‧‧‧中繼透鏡組 12, 116, 219, 317‧‧ ‧ relay lens group
13‧‧‧探測器 13‧‧‧Detector
14、118、221、319‧‧‧調焦控制器 14, 118, 221, 319‧ ‧ focus controller
15、119、222、320‧‧‧運算單元 15, 119, 222, 320‧‧‧ arithmetic unit
104、204、304‧‧‧雙稜鏡組 104, 204, 304‧ ‧ 稜鏡 double 稜鏡 group
106、206、306‧‧‧投影光圈 106, 206, 306‧‧ ‧ projection aperture
108、208、308‧‧‧投影反射鏡 108, 208, 308‧‧‧ projection mirror
110、210、310‧‧‧探測前組反射鏡 110, 210, 310‧‧ ‧ pre-detection group mirror
112、212、312‧‧‧探測光圈 112, 212, 312‧ ‧ detection aperture
114、214、314‧‧‧探測後組反射鏡 114, 214, 314‧‧ ‧ post-detection group mirror
115‧‧‧折光單元 115‧‧‧Refractive unit
117、220、318‧‧‧線陣CCD 117, 220, 318‧‧‧ linear array CCD
120、223、321‧‧‧控制工件台 120,223,321‧‧‧Control workpiece table
215(215a-215h)‧‧‧折光單元反射鏡組 215 (215a-215h)‧‧‧Refractive unit mirror group
216(216a-216e)‧‧‧折光單元透鏡組 216 (216a-216e) ‧ ‧ refracting unit lens unit
217、316‧‧‧平行平板 217, 316‧‧‧ parallel plates
218(218a-218d)‧‧‧折光單元稜鏡組 218 (218a-218d) ‧ ‧ Refracting unit 稜鏡
315‧‧‧楔板組 315‧‧‧Wedge plate group
315a、315b‧‧‧楔板 315a, 315b‧‧‧ wedge
A、B、C、D、E‧‧‧標記位置 A, B, C, D, E‧‧‧ mark location
圖1所示為投影光刻機調焦調平系統原理圖。 Figure 1 shows the schematic diagram of the focus adjustment system of the projection lithography machine.
圖2所示為本發明帶有折光單元的調焦調平系統原理圖。 2 is a schematic diagram of a focus leveling system with a refractive unit according to the present invention.
圖3所示為本發明帶有反射鏡組折光單元的調焦調平裝置原理圖。 FIG. 3 is a schematic diagram of a focusing and leveling device with a mirror group refraction unit according to the present invention.
圖4所示為本發明反射鏡組折光單元局部圖。 Figure 4 is a partial view of the mirror unit of the mirror assembly of the present invention.
圖5A所示為本發明一實施例投影狹縫示意圖。 FIG. 5A is a schematic view showing a projection slit according to an embodiment of the present invention.
圖5B所示為本發明一實施例光束經過折光單元前在像面上的光斑位置。 FIG. 5B is a view showing the position of a spot on the image plane before the light beam passes through the refractive unit according to an embodiment of the present invention.
圖5C所示為本發明一實施例光束經過折光單元後在像面上的光斑位置。 FIG. 5C shows the spot position on the image surface of the light beam after passing through the refractive unit according to an embodiment of the invention.
圖6A所示為本發明另一實施例投影狹縫示意圖。 FIG. 6A is a schematic view showing a projection slit according to another embodiment of the present invention.
圖6B所示為本發明另一實施例光束經過折光單元前在像面上的光斑位置。 Fig. 6B is a view showing the position of a spot on the image plane before the light beam passes through the refractive unit according to another embodiment of the present invention.
圖6C所示為本發明另一實施例光束經過折光單元後在像面上的光斑位置。 6C is a view showing a spot position on an image surface of a light beam passing through a refractive unit according to another embodiment of the present invention.
圖7所示為圖5C和圖6C中的光束在線陣CCD上的光斑位置示意圖。 Fig. 7 is a view showing the position of a spot on the line CCD of Figs. 5C and 6C.
圖8所示為本發明帶有楔板組折光單元的調焦調平裝置原理圖。 FIG. 8 is a schematic diagram of a focusing and leveling device with a wedge plate group refraction unit according to the present invention.
圖9所示為本發明楔板組折光單元局部圖。 Fig. 9 is a partial view showing the refractive unit of the wedge plate group of the present invention.
下面結合附圖詳細說明本發明的具體實施例。 Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
圖2所示為本發明一種投影光刻機帶有折光單元的調焦調平裝置。如圖所示,該裝置包括照明光源101、照明鏡組102、投影狹縫103、雙稜鏡組104、投影前組透鏡組105、投影光圈106、投影後組透鏡組107、投影反射鏡108、被測物體109、探測前組反射鏡110、 探測前組透鏡組111、探測光圈112、探測後組透鏡組113、探測後組反射鏡114、折光單元115、中繼透鏡組116、線陣CCD117、調焦控制器118、運算單元119;光束從照明光源101發出的光束經過照明鏡組102後投射到投影狹縫103上,投影狹縫夾在雙稜鏡組104的兩個稜鏡中間,由雙稜鏡組104出射的光束經過投影前組透鏡組105、投影光圈106及投影後組透鏡組107後,被投影反射鏡108反射至被測物體109上,經被測物體109反射後到達探測前組反射鏡110,再由探測前組反射鏡110反射至探測前組透鏡組111、探測光圈112及探測後組透鏡組113,到達探測後組反射鏡114後經過反射,通過折光單元115後,將光斑成像於同一線視場內,經過中繼透鏡組116後,被線陣CCD117所接收,線陣CCD117經過資訊光電轉換獲得與之相關的物體表面的高度資訊和傾斜資訊,由調焦控制器118送至運算單元119後,控制工件台120,從而對被測物體109的高度和傾斜進行相應的調整。 FIG. 2 shows a focusing and leveling device with a refractive unit of a projection lithography machine according to the present invention. As shown, the apparatus includes an illumination source 101, an illumination lens set 102, a projection slit 103, a double eye group 104, a pre-projection lens group 105, a projection aperture 106, a post-projection lens group 107, and a projection mirror 108. , the object to be measured 109, the pre-detection group mirror 110, Pre-detection group lens group 111, detection aperture 112, post-detection group lens group 113, post-detection group mirror 114, refraction unit 115, relay lens group 116, line array CCD 117, focus controller 118, arithmetic unit 119; The light beam emitted from the illumination source 101 passes through the illumination mirror group 102 and is projected onto the projection slit 103. The projection slit is sandwiched between the two turns of the double-twist group 104, and the light beam emitted by the double-twist group 104 passes through the projection. After the group lens group 105, the projection aperture 106 and the post-projection group lens group 107 are reflected by the projection mirror 108 onto the object to be measured 109, after being reflected by the object to be measured 109, it reaches the pre-detection group mirror 110, and then the pre-detection group The mirror 110 is reflected to the pre-detection group lens group 111, the detection aperture 112, and the post-detection group lens group 113. After reaching the post-detection group mirror 114, it is reflected, and after passing through the refraction unit 115, the spot is imaged in the same line of view. After passing through the relay lens group 116, it is received by the line array CCD 117, and the line array CCD 117 obtains the height information and the tilt information of the surface of the object related thereto by information photoelectric conversion, and is sent to the arithmetic unit 119 by the focus controller 118. Braking the workpiece table 120, so that the height and tilt of the object 109 is adjusted accordingly.
圖3為根據本發明第一實施例的一種投影式光刻機調 焦調平分系統帶有折光單元的調焦調平裝置原理圖,用於精確且高效地測量矽晶片(硅片;矽片)表面位置。如圖所示,上述裝置包括照明光源201、照明鏡組202、投影狹縫203、雙稜鏡組204、投影前組透鏡組205、投影光圈206、投影後組透鏡組207、投影反射鏡208、被測物體209、探測前組反射鏡210、探測前組透鏡組211、探測光圈212、探測後組透鏡組213、探測後組反射鏡214、折光單元反射鏡組215、折光單元透鏡組216、平行平板217、折光單元稜鏡組218、中繼透鏡組219、線陣CCD220、調焦控制器221以及運算單元222。 從照明光源201發出的光束經過照明鏡組202後投射到投影狹縫203 上,投影狹縫夾在雙稜鏡組204中間,由雙稜鏡組204出射的光束經過投影前組透鏡組205、投影光圈206及投影後組透鏡組207後,被投影反射鏡208反射至被測物體209上,經被測物體209反射後到達探測前組反射鏡210,再由探測前組反射鏡210反射至探測前組透鏡組211、探測光圈212及探測後組透鏡組213,到達探測後組反射鏡214後經過反射,分別至折光單元反射鏡組215(215a-215h),入射折光單元透鏡組216(216a-216e),中間光束經過平行平板217,邊緣光束均經過折光單元稜鏡組218(218a-218d),其中標記B對應215a、215b、216a和218a,標記A對應215c、215d、216b和218b,標記D對應215e、215f、216c和218c,標記E對應215g、215h、216d和218d,後與中間光束一起,經過中繼透鏡組219後,被線陣CCD220所接收,線陣CCD220經過資訊光電轉換獲得與之相關的物體表面的高度資訊和傾斜資訊,由調焦控制器221送至運算單元222後,控制工件台223,從而對被測物體209的高度和傾斜進行相應的調整。 本實施例中,雖然圖中顯示及描述為光束是沿水平方向入射,但是實際中並不限定為必須沿水平方向入射,折光單元反射鏡組215用於將各路光束分開,各路光束經過折光單元透鏡組216成像,再由折光單元稜鏡組218折光至中繼透鏡組219上,並最終在線陣CCD220上線狀排布。圖4所示為反射鏡折光單元局部圖。如圖所示,上述折光單元包括折光單元反射鏡組215、折光單元透鏡組216、平行平板217、折光單元稜鏡組218;光束經過折光單元反射鏡組215分別反射後,入射折光單元透鏡組216,其中中間一路光束經過平行平板217,邊緣四路光束均經過折光單元稜鏡組218後與中間光束一起,經過中繼透鏡組219後,被線陣CCD220所接收。 3 is a projection lithography machine according to a first embodiment of the present invention Focal bisector system A schematic diagram of a focusing and leveling device with a refractive unit for accurately and efficiently measuring the surface position of a silicon wafer (silicon wafer; germanium). As shown, the apparatus includes an illumination source 201, an illumination mirror set 202, a projection slit 203, a double eye group 204, a pre-projection lens group 205, a projection aperture 206, a post-projection lens group 207, and a projection mirror 208. The measured object 209, the pre-detection group mirror 210, the pre-detection group lens group 211, the detection aperture 212, the post-detection group lens group 213, the post-detection group mirror 214, the refractive unit mirror group 215, and the refractive unit lens group 216 The parallel plate 217, the refractive unit unit group 218, the relay lens group 219, the line array CCD 220, the focus controller 221, and the arithmetic unit 222. The light beam emitted from the illumination source 201 passes through the illumination mirror set 202 and is projected onto the projection slit 203. The projection slit is sandwiched between the double-twist group 204, and the light beam emitted by the double-twist group 204 passes through the front lens group 205, the projection aperture 206, and the rear lens group 207, and is reflected by the projection mirror 208. The measured object 209 is reflected by the measured object 209 and reaches the pre-detection group mirror 210, and then reflected by the pre-detection group mirror 210 to the pre-detection group lens group 211, the detection aperture 212, and the post-detection group lens group 213. After detecting, the group mirror 214 is reflected and respectively reflected to the refractive unit mirror group 215 (215a-215h), and the incident light unit lens group 216 (216a-216e) is passed. The intermediate beam passes through the parallel plate 217, and the edge beams pass through the refractive unit edge. Mirror group 218 (218a-218d), wherein mark B corresponds to 215a, 215b, 216a and 218a, mark A corresponds to 215c, 215d, 216b and 218b, mark D corresponds to 215e, 215f, 216c and 218c, and mark E corresponds to 215g, 215h, 216d and 218d, together with the intermediate beam, pass through the relay lens group 219, and are received by the line array CCD220, and the line array CCD220 obtains the height information and tilt information of the surface of the object related thereto by information photoelectric conversion, and is controlled by focusing. 221 After to the arithmetic unit 222, control of the workpiece stage 223, so that the height and tilt of the object 209 to be adjusted. In the present embodiment, although the figure is shown and described as the light beam is incident in the horizontal direction, in practice, it is not limited to being incident in the horizontal direction, and the refractive unit mirror group 215 is used to separate the respective light beams, and the respective light beams pass through. The refractive unit lens group 216 is imaged, and is further folded by the refractive unit unit group 218 onto the relay lens group 219, and finally linearly arranged on the line array CCD220. Figure 4 is a partial view of the mirror refractor unit. As shown in the figure, the refracting unit includes a refracting unit mirror group 215, a refracting unit lens group 216, a parallel flat plate 217, and a refracting unit 稜鏡 group 218; the light beam is reflected by the refracting unit mirror group 215, and is incident on the refracting unit lens group. 216, wherein the middle one beam passes through the parallel flat plate 217, and the four beams of the edge pass through the refractive unit 稜鏡 group 218 and then pass through the relay lens group 219 together with the intermediate beam, and are received by the line CCD 220.
圖5A和圖6A所示為兩種投影狹縫結構示意圖。投影 狹縫被傾斜置於雙稜鏡組件204中間,且狹縫上標記位置如圖中A、B、C、D、E所示。圖5B和圖6B分別對應光束在經過圖5A和圖6A所示的兩種投影狹縫結構對應的折光單元前,像面上光斑位置為A'、B'、C'、D'、E',光斑位置呈空間分布。圖5C和圖6C分別對應光束經過圖5A和圖6A所示的兩種投影狹縫結構對應的折光單元後,像面上光斑位置為A"、B"、C"、D"、E",光斑呈直線型排布;最終經過中繼透鏡組219,被線陣CCD220所接收,從而起到了將光斑分布從面視場分布轉換成線視場分布的作用。 5A and 6A are schematic views showing the structure of two kinds of projection slits. The projection slit is obliquely placed in the middle of the double jaw assembly 204, and the marked positions on the slit are as shown in Figs. A, B, C, D, and E. 5B and FIG. 6B respectively correspond to the light beam position corresponding to the two kinds of projection slit structures shown in FIG. 5A and FIG. 6A, and the spot positions on the image surface are A ' , B ' , C ' , D ' , E '. The spot position is spatially distributed. 5C and FIG. 6C respectively correspond to the light-receiving units corresponding to the two kinds of projection slit structures shown in FIG. 5A and FIG. 6A, and the position of the spot on the image surface is A " , B " , C " , D " , E " , The spot is arranged in a straight line; finally, it passes through the relay lens group 219 and is received by the line CCD 220, thereby functioning to convert the spot distribution from the field of view distribution to the line field distribution.
圖7所示為圖5C和圖6C中的光束在線陣CCD上光斑 位置示意圖。最終CCD上成像光斑為直線型排布的A'''、B'''、C'''、D'''、E'''。 Fig. 7 is a view showing the position of a spot on the line CCD of Figs. 5C and 6C. Finally, the imaging spot on the CCD is A''' , B''' , C''' , D''' , E''' in a straight line arrangement.
圖8所示為根據本發明第二實施例的一種投影式光刻機調焦調平分系統帶有楔板組折光單元的調焦調平裝置原理圖,用於精確且高效地測量矽晶片(硅片;矽片)表面位置。如圖所示,上述裝置包括照明光源301、照明鏡組302、投影狹縫303、雙稜鏡組304、投影前組透鏡組305、投影光圈306、投影後組透鏡組307、投影反射鏡308、被測物體309、探測前組反射鏡310、探測前組透鏡組311、探測光圈312、探測後組透鏡組313、探測後組反射鏡314、折光單元楔板組315、平行平板316、中繼透鏡組317、線陣CCD318、調焦控制器319、運算單元320。從照明光源301發出的光束經過照明鏡組302後投射到投影狹縫303上,投影狹縫夾在雙稜鏡組304中間,由 雙稜鏡組304出射的光束經過投影前組透鏡組305、投影光圈306及投影後組透鏡組307後,被投影反射鏡308反射至被測物體309上,經被測物體309反射後到達探測前組反射鏡310,再由探測前組反射鏡310反射至探測前組透鏡組311、探測光圈312及探測後組透鏡組313,後被探測後組反射鏡314反射後至折光單元楔板組315後,中間光束經過平行平板316,邊緣光束均經過楔板組315後與中間光束一起,經過中繼透鏡組317後,被線陣CCD318所接收,線陣CCD318經過資訊光電轉換獲得與之相關的物體表面的高度資訊和傾斜資訊,由調焦控制器319送至運算單元320後,控制工件台321,從而對被測物體309的高度和傾斜進行相應的調整。 8 is a schematic diagram of a focus leveling device with a wedge plate group refraction unit for a focus grading system of a projection lithography machine according to a second embodiment of the present invention, for accurately and efficiently measuring a bismuth wafer ( Silicon wafer; ruthenium) surface position. As shown, the above apparatus includes an illumination source 301, an illumination mirror 302, a projection slit 303, a double eye group 304, a pre-projection lens group 305, a projection aperture 306, a post-projection lens group 307, and a projection mirror 308. The measured object 309, the pre-detection group mirror 310, the pre-detection group lens group 311, the detection aperture 312, the post-detection group lens group 313, the post-detection group mirror 314, the refractive unit wedge plate group 315, the parallel plate 316, and the middle Following the lens group 317, the line CCD 318, the focus controller 319, and the arithmetic unit 320. The light beam emitted from the illumination source 301 passes through the illumination mirror 302 and is projected onto the projection slit 303, and the projection slit is sandwiched between the double-twist group 304. The beam emitted by the double-twist group 304 passes through the pre-projection lens group 305, the projection aperture 306, and the post-projection lens group 307, and is reflected by the projection mirror 308 onto the object to be measured 309, and is reflected by the object 309 to be detected. The front group mirror 310 is further reflected by the pre-detection group mirror 310 to the pre-detection group lens group 311, the detection aperture 312 and the post-detection group lens group 313, and then reflected by the detected group mirror 314 to the refractive unit wedge plate group. After 315, the intermediate beam passes through the parallel plate 316, and the edge beam passes through the wedge plate group 315 and passes through the intermediate beam, passes through the relay lens group 317, and is received by the line array CCD 318. The line array CCD 318 is obtained through information photoelectric conversion. The height information and the tilt information of the surface of the object are sent to the arithmetic unit 320 by the focus controller 319, and the workpiece stage 321 is controlled to adjust the height and tilt of the object 309 to be measured.
圖9所示為楔板組折光單元原理圖。如圖所示,上述折光單元包括平行平板316和折光單元楔板組315,楔板組315由兩塊楔板楔角相對放置而成;光束經過探測後組反射鏡314反射後,經過一對特殊的楔板組315成像於同一像面上。其中,315a的楔角方向與標記B、D同方向(即315a的楔角尖角朝上),315b的楔角方向與標記A、E同方向(即315b的楔角尖角朝下),其改變的角度滿足公式:δ=α(n-1),n為楔板的折射率,α為楔板的角度小於5度,光線儘量垂直或接近垂直入射至楔板並由中繼透鏡組317最終成像於線陣CCD318上,其中下兩路光束入射至第一塊楔板315a的對應位置處挖去兩個小孔,上兩路光束經315a偏折後入射至第二塊楔板315b對應位置處挖去兩個小孔,而中間光束入射至楔板315a和315b的對應位置處挖去上各一小孔,這些孔都為通孔,這樣經過通孔的光束不發生偏折,並且在中間光路上增加一塊平行平板316用以補償光程差,多路光束經過楔板組315折射後,使得光斑在經過楔板 組315後能在像面上分布方式從面視場排布轉變成線視場排布,並經過中繼透鏡組317後,最終被線陣CCD318所接收。 Figure 9 shows the schematic diagram of the wedge plate group refraction unit. As shown in the figure, the refractive unit comprises a parallel flat plate 316 and a refractive unit wedge plate group 315. The wedge plate group 315 is formed by two wedge plate wedge angles; the light beam is reflected by the detected group mirror 314, and then passes through a pair. A special wedge set 315 is imaged on the same image plane. Wherein, the wedge angle direction of 315a is the same direction as the marks B and D (ie, the sharp angle of the wedge angle of 315a faces upward), and the wedge angle direction of 315b is the same direction as the marks A and E (ie, the sharp angle of the wedge angle of 315b faces downward), The angle of change satisfies the formula: δ = α ( n -1), where n is the refractive index of the wedge plate, α is the angle of the wedge plate less than 5 degrees, and the light is incident as perpendicular or nearly perpendicular to the wedge plate and is terminated by the relay lens group 317 is finally imaged on the line CCD 318, wherein the lower two beams are incident on the corresponding position of the first wedge plate 315a to dig two small holes, and the upper two beams are deflected by 315a and then incident on the second wedge plate 315b. Two small holes are dug at the corresponding positions, and the intermediate beam is incident on the corresponding positions of the wedge plates 315a and 315b, and each of the small holes is dug, and the holes are all through holes, so that the light beam passing through the through holes is not deflected. And a parallel plate 316 is added on the intermediate optical path to compensate for the optical path difference, and the multiple beams are refracted by the wedge plate group 315, so that the spot can be arranged on the image surface after the wedge plate group 315 is distributed from the surface field of view. After being converted into a line field of view, and after passing through the relay lens group 317, it is finally received by the line array CCD 318.
本說明書中所述的只是本發明的較佳具體實施例,以上實施例僅用以說明本發明的技術方案而非對本發明的限制。凡本領域技術人員依本發明的構思通過邏輯分析、推理或者有限的實驗可以得到的技術方案,皆應在本發明的範圍之內。 The description of the present invention is only a preferred embodiment of the present invention, and the above embodiments are merely illustrative of the technical solutions of the present invention and are not intended to limit the present invention. Any technical solution that can be obtained by a person skilled in the art according to the concept of the present invention by logic analysis, reasoning or limited experimentation should be within the scope of the present invention.
201‧‧‧照明光源 201‧‧‧Light source
202‧‧‧照明鏡組 202‧‧‧Lighting mirror
203‧‧‧投影狹縫 203‧‧‧Projection slit
204‧‧‧雙稜鏡組 204‧‧‧Double Group
205‧‧‧投影前組透鏡組 205‧‧‧Pre-projection lens group
206‧‧‧投影光圈 206‧‧‧Projection aperture
207‧‧‧投影後組透鏡組 207‧‧‧Projected rear lens group
208‧‧‧投影反射鏡 208‧‧‧projection mirror
209‧‧‧被測物體 209‧‧‧Measured objects
210‧‧‧探測前組反射鏡 210‧‧‧Pre-detection group mirror
211‧‧‧探測前組透鏡組 211‧‧‧Pre-detection group lens group
212‧‧‧探測光圈 212‧‧‧Detection aperture
213‧‧‧探測後組透鏡組 213‧‧‧Detecting group lens group
214‧‧‧探測後組反射鏡 214‧‧‧post-detection group mirror
215a-215h‧‧‧折光單元反射鏡組 215a-215h‧‧‧Refractive unit mirror group
216a-216e‧‧‧折光單元透鏡組 216a-216e‧‧‧Refractive unit lens unit
217‧‧‧平行平板 217‧‧‧ parallel plates
218a-218d‧‧‧折光單元稜鏡組 218a-218d‧‧‧Refractive unit
219‧‧‧中繼透鏡組 219‧‧‧Relay lens group
220‧‧‧線陣CCD 220‧‧‧Line CCD
221‧‧‧調焦控制器 221‧‧‧ focus controller
222‧‧‧運算單元 222‧‧‧ arithmetic unit
223‧‧‧控制工件台 223‧‧‧Control workpiece table
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EP (1) | EP3091396B1 (en) |
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CN107450287B (en) * | 2016-05-31 | 2019-10-25 | 上海微电子装备(集团)股份有限公司 | Focusing and leveling measurement apparatus and method |
KR101987895B1 (en) * | 2017-02-02 | 2019-06-12 | 주식회사 투윈테크 | Test dummy for precision transfer position measurement using the semiconductor system or display system and precision transfer position measurement method using the test dummy |
CN108490742B (en) * | 2018-03-30 | 2020-09-29 | 武汉华星光电技术有限公司 | Exposure apparatus and exposure method |
CN111061128B (en) * | 2018-10-16 | 2021-09-10 | 上海微电子装备(集团)股份有限公司 | Focusing and leveling device, photoetching machine and focusing and leveling method |
CN109443210A (en) * | 2018-12-13 | 2019-03-08 | 苏州亿拓光电科技有限公司 | Optical position detection device and method |
IL301550A (en) * | 2020-10-01 | 2023-05-01 | Asml Netherlands Bv | Inspection apparatus and method |
CN112649435B (en) * | 2020-12-01 | 2023-07-07 | 上海御微半导体技术有限公司 | Focal plane measuring device and defect detection equipment |
CN112731773B (en) * | 2020-12-31 | 2024-04-16 | 中国科学院微电子研究所 | Electron beam exposure machine, focusing method and device |
CN114415325B (en) * | 2022-02-22 | 2023-11-03 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Focusing optical imaging system |
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TW201531820A (en) | 2015-08-16 |
KR101823616B1 (en) | 2018-01-30 |
US9857702B2 (en) | 2018-01-02 |
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US20160327875A1 (en) | 2016-11-10 |
CN104749901B (en) | 2017-08-29 |
EP3091396A4 (en) | 2017-02-22 |
JP6383794B2 (en) | 2018-08-29 |
SG11201605101PA (en) | 2016-07-28 |
JP2017503205A (en) | 2017-01-26 |
WO2015101196A1 (en) | 2015-07-09 |
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EP3091396B1 (en) | 2018-09-19 |
EP3091396A1 (en) | 2016-11-09 |
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