TW552464B - A method of measuring parameters relating to a lithography device - Google Patents

A method of measuring parameters relating to a lithography device Download PDF

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Publication number
TW552464B
TW552464B TW90121941A TW90121941A TW552464B TW 552464 B TW552464 B TW 552464B TW 90121941 A TW90121941 A TW 90121941A TW 90121941 A TW90121941 A TW 90121941A TW 552464 B TW552464 B TW 552464B
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diffraction
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patent application
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focus
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TW90121941A
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Chinese (zh)
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Michael Eugene Littau
Christopher J Raymond
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Accent Optical Tech Inc
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Abstract

The present invention provides methods for determination of parameters in lithographic devices and applications by diffraction signature difference analysis, including determination of center of focus in lithography devices and applications, such as for photoresist lithographic wafer processing.

Description

M2464 、發明說明(l) 太 相關申請案的交互參照 徵分析以確定焦點中心的月方6二斤=,名J「利用繞射特 美國專利申嘖安,^方法及裝置」的第60/230, 49 1號 兹以參照方式;入本案:有其利纟’該案的專利說明部份 灸明範圍(技術範圍) 方i Ξ: ί: 1 ί射特徵分析以確定光刻應用各參數的 焦點中心。&刻應用’例 光阻光刻晶圓處理的 技藝背景 為;著者的若干出版品及出版年份,另因 π;:;出版曰期报近,戶斤以相對於本發明並不視 句白用技藝〇於太女认#松,. Γϋ 解技蓺背景,X π & δχ等出版品的用意在於充分瞭 否二传據以解釋成允許該等出版品成為確定是 古勺專利的習用技藝。 〜 光刻在半導體、光學及相關產 光刻係用以製造丰遙"罢/ U各種有用的應用。 雷路,以万正Γ +導體裝置’例如在晶圓上所產生的積體 办門調制光而反顯不器,磁碟頭等。其中一種應用是透過 ίη;:光刻把光罩或光板的圖案透射到基板上的 型二或留下ΐ劑層顯影,該曝光的圖案被蚀刻掉(正 。然而,除了光阻更在阻劑層形成3D影像圖案 在光刻的尤其它形式的光t ®沁式中尤其疋半導體產業所用者,係採 552464M2464, Description of the invention (l) Cross reference sign analysis of too relevant applications to determine the center of the moon 6 pounds =, name J "Using diffraction special U.S. patent application method, method and device" 60 / 230, 49 No. 1 is hereby incorporated by reference; this case has its advantages: the patent description of this case part of the scope of moxibustion (technical scope) Fang i: ί: 1 ί radiographic analysis to determine the parameters of lithography applications Center of focus. & Engraving the application of the example of photoresistance lithography wafer processing technology background: the author's several publications and year of publication, and because of the recent publication of π ;: White use skills 〇 于 太 女 识 # 松 ,. Γϋ Solution background, X π & δχ and other publications are intended to suffice the second evidence to explain that these publications are allowed to be determined as ancient patent Custom skills. ~ Lithography in semiconductor, optics and related products Lithography is used to make Fengyao &U; various useful applications. Lei Lu uses Wanzheng Γ + conductor device ', for example, to generate light on a wafer to modulate the light and reverse the display device, disk head, etc. One application is through lithography: photolithography to transmit the pattern of a photomask or plate to a substrate on the substrate or develop a tincture layer, and the exposed pattern is etched away (positive. However, in addition to photoresist, it is more resistive. The 3D image pattern formed by the agent layer is particularly useful in the semiconductor industry in photolithography, especially in the form of light t ®, and is used in the semiconductor industry.

,準八子=二,機,该步進機通常包括縮影透鏡及照明燈 工^ 晶圓平卜光板平台,晶㈣和操作 種方法,亦κ 乂進機裝置可運用正型及負型光阻劑這兩 或二者。’、°用原始的步進—重複格式或步進-掃瞄格式, 曝光及焦點決定 層顯影之影像圖案 平均能量,而它是 影像,焦點決定調 成影系統焦面的位 將要顯影,例如採 的品質。曝光決定 以照明時間及強度 制的減低。焦點係 置來設定。 用光阻光刻而在阻劑 每單位面積之影像的 來設定。相對於清晰 以阻劑層表面相對於The quasi eight sons = two, machine, the stepper usually includes a miniature lens and a lighting lamp ^ wafer flat light plate platform, crystal and operation methods, also κ κ into the machine device can use positive and negative photoresistors Agent two or both. ', ° Using the original step-repeat format or step-scan format, the average energy of the image pattern developed by the exposure and focus determines the layer, and it is the image, the focus determines the position of the focal plane of the shadow system to be developed, such as Mining quality. The exposure is determined by reducing the lighting time and intensity. Focus system to set. Use photoresist lithography to set the image per unit area of the resist. Relative to clarity

改變阻劑層厚度,基板地勢,和步進機的焦點偏移 C oyus dnft),即可使曝光及焦點發生局部變化。因為 曝光及焦點可能出現各種變化,所以經由光刻產生的影像 圖案便需監視,以確定該等圖案是否在可接受的公差範圍 内。若以光刻製程來產生次微米線路時,焦點及曝光 制尤其重要。By changing the thickness of the resist layer, the topography of the substrate, and the focus offset of the stepper (Coyus dnft), the exposure and focus can be changed locally. Because exposure and focus can vary, image patterns generated by lithography need to be monitored to determine if they are within acceptable tolerances. Focus and exposure systems are especially important when sub-micron lines are produced by photolithography.

冒有人使用各種方法及裝置來確定步進機與類似光刻裝 置的焦點。掃瞄式電子顯微鏡(SEM)和類似裝置即被採用t 。然而,SEM方法雖能解析約〇· i微米的細節,但製程昂貴 ’需要高真空室,操作相當慢,且難以自動化。光學顯微 鏡亦可使用’但卻不具有次微米結構所需的解析力。其它 的方法包括開發特殊的目標及測試光罩,例如美國第 5, 712, 707號’第5,953,123號和第6,088,113號、專利所揭 示者。另外也知有一些重疊誤差(overlay error)法,例Various methods and devices have been used to determine the focus of steppers and similar lithographic devices. Scanning electron microscopes (SEMs) and similar devices are used. However, although the SEM method can resolve details of about 0.1 μm, the process is expensive ′ requires a high vacuum chamber, the operation is relatively slow, and it is difficult to automate. Optical microscopy can also use 'but does not have the resolution required for sub-micron structures. Other methods include the development of special targets and test masks, such as U.S. Nos. 5,712,707 '' 5,953,123 and 6,088,113, disclosed by patents. It is also known that there are some overlay error methods, for example

552464 五、發明說明(3) 如美國第5, 952, 1 32號專利所掘一土 因目標的性質而增加解析度,作丁然而,足些方法雖 鏡或類似的直接測量裝置。仍㊉使用SEM,光學顯微 ::有人使用各種散射計與相關的裝置與測量法 出楗电子和光電子半導體材料,電 光光學組件,和侧向尺寸在幾十& 田磨 r pi从甘〜u u 戍十微未到十分之一微米以下 犯圍的/、匕材料之微結構的特徵。舉例來說,Accent 〇一Pt^cal科技公司所製售,且在美國第5,7〇3 692號 =其:部份的CDS200散射計,即為—種全自動化的非破^ =界尺寸(⑻測量及剖面輪廓分析系統。這裝置能 解析低於丨奈米的臨界尺寸,同時確定剖面輪廓和執行層 厚估定。料當作照明光束人射角函數的—個單繞射級, 這裝置亦可監視其強度。另可用這方式來監視樣品的第 Oth或鏡面級以及較高繞射級的強度變化,而此舉則提供 在確定所照明之樣品目標性質上有用的資訊’該資訊也可 當作製程的一個間接監視器。已有人教示過許多用於散射 計分析的方法與裝置,包括美國第4, 71〇, 642號,第 5,1 64,790 號’第5,241,369 號’第 5,703,692 號,第 5,867,276 號,第 5,889,593 號,第5,912,741 號和第 6,1 0 0,9 8 5號專利所載的那些。 散射計與相關的裝置可使用各種不同的操作方法。其中 一種方法是使用一種已知的單波長源,而入射角㊀則在一 預定的連續範圍内變化。另一方法係使用若干雷射束源, 並可選擇性地各保持一個不同的入射角㊀。還有一方法是552464 V. Description of the invention (3) As disclosed in US Patent No. 5,952, 1 32, the resolution is increased due to the nature of the target. However, although some methods are mirrors or similar direct measurement devices. Still using SEM, optical microscopy :: Some people use various scatterometers and related devices and measurement methods to produce electron and optoelectronic semiconductor materials, electro-optical components, and lateral dimensions in the dozens & Tian Mo r pi from Gan ~ uu The characteristics of the microstructure of the siege material, which is less than ten micrometers and less than one tenth of a micrometer. For example, Accent 〇 Pt ^ cal technology company made and sold, and in the United States No. 5,703,692 = its: part of the CDS200 scatterometer, which is a fully automated non-breaking ^ = boundary size (⑻ Measurement and profile analysis system. This device can analyze critical dimensions below 丨 nanometers, determine the profile of the profile and perform layer thickness estimation at the same time. It is expected to be a single diffraction stage as a function of the illumination angle of the illumination beam. This device can also monitor its intensity. This method can also be used to monitor the Oth or specular level of the sample and the intensity change of higher diffraction levels, and this provides useful information in determining the nature of the target of the illuminated sample ' Information can also be used as an indirect monitor of the process. Many methods and devices for scatterometer analysis have been taught, including U.S. Nos. 4,71〇, 642, 5,164,790 'and 5,241,369. 'Those contained in patents 5,703,692, 5,867,276, 5,889,593, 5,912,741 and 6,10,9 8 5. The scatterometer and related devices can use a variety of different methods of operation. One of them Method is to use one A known single-wavelength source, and the incident angle ㊀ varies within a predetermined continuous range. Another method is to use several laser beam sources and optionally maintain a different incident angle ㊀. There is also a method Yes

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552464 五、發明說明(4) 休用入 射’而 利用光 偵知器 ’也知 產生偏 圍Φ内 相對於 置的任 本目標 射的寬 入射角 學器# 來偵知 有各種 振變化 調整, 該光源 一種, 的繞射 光譜光源, Θ則選擇性 和濾光片來 所得到之繞 利用光學器 的可變偏振 致使光源或 或其它輻射 或其組合或 特徵。 其中入射 地保持固 產生某個 射相位的 材和濾光 光源。另 其它輻射 源,使目 變換,即 光係從某個波長範圍照 定。另外,已知有各種 入射相位範圍,並以一 可變相位光組件。此外 片而使光可從S到P組件 外’入射角亦可在一範 源圍著目標區轉動,或 標區轉動。利用這些裝 可且已知會獲得某一樣552464 V. Description of the invention (4) The use of a light incident detector and the use of a light detector also knows that a wide incidence angle detector #, which produces a relative shot of any target within the enclosure Φ, is used to detect various vibration changes and adjustments. The light source has a diffraction spectrum light source, and Θ is selectively obtained by using a filter to obtain a light source or other radiation or a combination or characteristic thereof by using a variable polarization of the optical device. Where the incident ground is kept solid to produce a certain phase and filter light source. Other radiation sources change the purpose, that is, the light system is illuminated from a certain wavelength range. In addition, various incident phase ranges are known, and a variable phase optical module is used. In addition, the incident angle of the light from S to P module can also be rotated around the target area or the target area by a range of sources. Using these devices can and is known to get something

识除了散射計裝置外,尚有其它裝置及方法可利用一種能 =由繞射光柵而反射或透射的光式光源,並以一偵知器捕 木該光’據以確定第0 th級或較高繞射級的繞射特徵。除 了散射計外,該等其它裝置及方法還包括橢圓率測量儀和 反射計。另外也知若用其它輻射源,例如X光,亦可獲得 非光式繞射特徵。In addition to the scatterometer device, there are other devices and methods that can use an optical light source that can be reflected or transmitted by a diffraction grating, and capture the light with a detector to determine the 0th level or Diffraction characteristics of higher diffraction levels. In addition to scatterometers, these other devices and methods include ellipsometry and reflectometers. It is also known that non-optical diffraction characteristics can also be obtained if other radiation sources are used, such as X-rays.

本技藝已知有各種樣本目標。一種簡單和常用的目標即 為繞射光柵,其實質為一系列的周期性透鏡,典型的寬度 空間比約在1 ·· 1到1 : 3之間,但也知有其它的比。典型的 繞射光柵’例如1 ·· 3比者,具有1 〇 〇 nm的線寬和3 0 0 nm的 空間’總間距(寬加空間)則為4 0 〇 n m。寬與間距是光刻製 程之解析度的一個函數。因此,當光刻製程容許較小的寬 度和間距時’遠寬度和間距也同樣可縮減^任一可行的寬 度及間距均可使用繞射技術,包括比現今通常所用者小上Various sample targets are known in the art. A simple and commonly used target is a diffraction grating, which is essentially a series of periodic lenses with a typical width-to-space ratio between about 1 ·· 1 and 1: 3, but other ratios are known. A typical diffraction grating, for example, 1 ·· 3, has a line width of 100 nm and a space of 300 nm. The total pitch (width plus space) is 400 nm. Width and pitch are a function of the resolution of the lithographic process. Therefore, when the lithography process allows for smaller widths and spacings, ‘far widths and spacings can also be reduced ^ Diffraction techniques can be used for any feasible widths and spacings, including smaller than those commonly used today.

第7頁 552464 五、發明說明(5) 許多的那些。 繞射光柵通常係以一種已知 (干Λ粒Λ圍广本技藝已知可在單-晶圓上使:多 圖木,例如使用不同的聚焦設定或不同的曝光 胜另:也知若將從各種不同焦點之繞射光柵所獲;= =與產生有嶋資訊的一個理論模型的以:= 貢訊庫做比較,就可使用散射及繞射光栅來確徵 。以實際的繞射度量來比較該模$,據.: ,焦峨?所求出的⑶值,並使其結果與一抛:曲= 己然而,w方法需要相當的時間及電腦資源,私產 理論模型。 貝々始月匕產生 發明摘要說明 本發明提供一種用以測量光刻裝置相關各參數 其包括下列各步驟:提供一基板,該基板上設有利= 裝置而以光刻製程所形成的若干繞射光栅,該等繞射 包括若干分隔的元件;利用一輻射源式工具,對若 光栅中的至少三個測量繞射特徵;和確定該等繞射 間的差異,以確定光刻裝置的意欲參數。在這方法中1 板可包括一晶圓。 土 這方法可另包括使用光刻裝置而以已知的不同聚焦設定 來形成若干繞射光柵’和確定二個相鄰聚焦設定之繞射光 栅,其中該二繞射光柵之間的繞射特徵差低於其它二個 鄰聚焦設定的燒射光柵之間的繞射特徵差,因而參數即為Page 7 552464 V. Description of Invention (5) Many of those. Diffraction gratings are usually based on a known (dry Λ grain Λ wide range) technique known on the single-wafer: multiple maps, such as using different focus settings or different exposures. Another: also know if Obtained from diffraction gratings of various focal points; = = Compared with a theoretical model that generates chirped information: = Gongxun library, the scattering and diffraction gratings can be used to determine. With the actual diffraction metric Let's compare the model $, according to :, Jiao E? The value of ⑶ obtained, and make the result with a throw: Qu = already. However, w method requires considerable time and computer resources, private property theory model. Brief Description of the Invention of the Invention The invention provides a method for measuring various parameters of a lithographic apparatus, which includes the following steps: providing a substrate with a plurality of diffraction gratings formed by a lithographic process on the substrate; Iso-diffraction includes several separated elements; using a radiation source tool to measure diffraction characteristics for at least three of the gratings; and determining the differences between such diffractions to determine the intended parameters of the lithographic apparatus. Here Method 1 board can be wrapped One wafer. This method may further include using a lithographic apparatus to form a plurality of diffraction gratings with known different focus settings, and determine two adjacent diffraction settings of a diffraction grating, wherein the two diffraction gratings are between The diffraction feature difference is lower than the diffraction feature difference between the other two adjacently set burn-in gratings, so the parameter is

552464552464

五、發明說明(6) 光刻裝置的焦點中心。5. Description of the invention (6) Focus center of the lithographic apparatus.

、在一較佳實施例中,該等已知的不同聚焦設定是等增量 =不同聚焦設定。或者,該等已知的不同聚焦設定是不等 曰里的不同聚焦設定,該方法另包括使用一數學算法而讓 不等增量的不同聚焦設定正規化。 鱗是方法另包括繪製繞射特徵的差,其中繞射光柵之間的 心射4寸徵差係以在焦點中心之斜度為零的一拋物曲線的近 以值增量。對繞射光柵之間的繞射特徵差予以確定的梦驟 了包括使用一度篁制來讀定該差。可供使用的一度量制In a preferred embodiment, the known different focus settings are equal increments = different focus settings. Alternatively, the known different focus settings are different focus settings, and the method further includes using a mathematical algorithm to normalize different focus settings of unequal increments. The scale method further includes plotting the difference in diffraction characteristics, in which the 4-inch eigen-differential difference between the diffraction gratings is approximately a value increment of a parabolic curve with a slope of zero at the center of the focus. The dream of determining the difference in diffraction characteristics between diffraction gratings involves reading the difference using a degree of chirp. Available Metrics

是種均方根誤差的資料分析法。確定最小差的步驟可另包 對、、:7〇射光拇之間的繞射特徵差進行加權平均值的比較。 在這方法的一實施例中,另包括使用相同聚焦設定之光 川裝置來开> 成若干繞射光柵,和轉定彼此間的差以供作為 该等繞射光柵在基板上的一個位置函數。在這方法的另一 =^例中,尚包括以已知的不同聚焦設定和已知的不同劑 里設定來形成若干繞射光柵,以及確定劑量對焦點的效應 。該等若干繞射光柵可包括幾組相同的那些已知具有不聚 焦設定的繞射光柵,這幾組則是利用不同的已知劑量設定 而變化。 本發明另提供一種確定光刻裝置之焦點中心的方法,其 包括下列各步驟:提供一基板,該基板上設有利用光刻^ 置所製成的若干繞射光柵’該等若干繞射光栅包括一些不 同的已知聚焦設定;利用一輻射源式工具,對若干繞射光 栅中的至少三個確定繞射特徵;測量相鄰聚焦設定之繞射It is a kind of data analysis method of root mean square error. The step of determining the minimum difference may additionally include a comparison of the weighted average of the diffraction characteristic differences between the 70, 70, and 70 thumbs. In one embodiment of the method, the method further includes using a light beam device with the same focus setting to form a plurality of diffraction gratings, and translating the difference between them for use as a position of the diffraction gratings on the substrate. function. In another example of this method, it also includes forming several diffraction gratings with known different focus settings and known different agent settings, and determining the effect of the dose on the focus. The plurality of diffraction gratings may include several identical groups of diffraction gratings known to have a non-focus setting, which groups are changed using different known dose settings. The present invention further provides a method for determining a focus center of a lithographic apparatus, which includes the following steps: providing a substrate, the substrate is provided with a plurality of diffraction gratings made by photolithography; Includes a number of different known focus settings; uses a radiation source tool to determine diffraction characteristics for at least three of several diffraction gratings; measures the diffraction of adjacent focus settings

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光柵彼此間的繞射特徵差;和確定作為聚焦設定 心’其中相鄰聚焦設定之繞射光柵彼此間的繞射 最小的差。 的焦點中 特徵具有 在這 間的繞 似值增 差予以 用一種 括對相 權平均 例中, 栅,將 ’致使 在所 一實施 束聚焦 所得到 源式工 源式工 具包括 長範圍 知所得 4 i具 相位的 方法的一實施例中,相 射特徵差係以最小差之 量。對相鄰聚焦設定之 確疋的步驟可包括使用 均方根誤差的資料分析 鄰聚焦設定之繞射光柵 值的比較,據以確定最 確定最小差的步驟包括 得自其彼此間繞射特徵 最小差包含該拋物曲線 有前述方法中,輻射源 例中,光源式工具包括 和對某個入射角範圍掃 之測量角度偵知所得到 具可另包括一分角散射 具包括若干雷射束源。 九光谱的入射光源, 照明的一光學系統,和 到之繞射特徵的一偵知 包括一入射光源,若干 級件,使該光束聚焦和 鄰聚焦設定之繞射 斜度為零的一抛物 繞射光柵彼此間的 一度量制,包括但 法來確 彼此間 小差。 對於相 差的資 的最小 式工具 光栅彼此 曲線的近 繞射特徵 不限於使 方法也包 定該差。這 的繞射特徵差進行加 在這方法的另一實施 鄰聚焦設定的繞射光 料應用到一拋物曲線 值。 包括光源式 一入射雷射束源, 瞒的一光學系統, 之繞射特徵的一债計。在一不同實施 在另一 使該光 用以對 器。在 用以改 對某個 實施例中, 聚焦和對某 所得到之測 又一實施例 變S和P偏振 入射相位範 工具。在 使該雷射 和用以對 知器。光 例中,光 光源式工 個入射波 量波長偵 中,光源 之幅度與 圍照明的The diffraction characteristics of the gratings are different from each other; and the smallest difference between the diffraction gratings of the diffraction gratings which are the focus setting centers is determined. The features in the focus have an increase in the similarity value between them. In the example of a pairwise phase weighting average, the grid will 'cause the source-type source tool obtained in the implementation of beam focusing to include a long-range knowledge. 4 In one embodiment of the method with a phase, the phase difference characteristic is a minimum difference amount. The step of ascertaining the adjacent focus setting may include analyzing the comparison of the diffraction grating values of the adjacent focus setting using the data of the root mean square error, and the step of determining the most certain minimum difference includes obtaining the smallest diffraction feature from each other. The difference includes the parabolic curve. In the foregoing method, in the example of the radiation source, the light source-type tool includes a measurement angle obtained by scanning a range of incident angles, and the obtained instrument may further include a sub-angle scatterer including a plurality of laser beam sources. Nine-spectrum incident light source, an optical system for illumination, and a detection of its diffraction characteristics include an incident light source, a number of stages, a parabolic winding with a diffraction slope set to zero for the focus and adjacent focus of the beam A measure of the distance between the gratings, including the Daniel method, to determine the small difference between them. For the difference of the minimum tool, the near diffraction characteristics of the curves of the gratings are not limited to the method that also includes the difference. This difference in diffraction characteristics is added in another implementation of this method. Diffraction light set at the adjacent focus is applied to a parabolic curve value. It includes a light source type, an incident laser beam source, a concealed optical system, and a diffraction scheme for its diffraction characteristics. Implement the light in a different implementation in another. In a method for correcting an embodiment, focusing and measuring an obtained result, another embodiment changes an S and P polarization incident phase range tool. The laser and the detector are used. In the light example, the light source is used to detect the incident wave length.

552464 五、發明說明(8) 一光學系統 器。 在所有前 固定角,一 源式工具源 徵的步驟包 操作的一種 、繞射特徵的 具源來進行 是種透射繞 型的鏡面級 本發明的 點之繞射光 定一光刻裝 本發明的 繞射特徵, 法,其中的 本發明的 ,包括但不 反射式或透 態或可變定 與一光刻裝 ’和用以偵知所得到之繞射特徵相位的一彳貞知 述方法中,測量繞射特徵的步驟包括利用以一 可變角Θ或一可變角φ操作的一種寬光譜輻射 來進行相位測量。在該等方法中,測量繞射特 括利用以一固定角,一可變角㊀或一可變角① 單波長輻射源式工具源來進行相位測量。測量 步驟亦可包括利用一種多離散波長輻射源式工 相1立測量。繞射特徵可以是種反射繞射特徵或 射特徵。此外,繞射特徵也可以是種正型或負 繞射特徵或是種較高級別的繞射特徵。 主要目的在於提供一種可對一系列具有不同焦 柵構件彼此間的繞射特徵差進行分析,據以^ 置之焦點中心的方法。 另目的是利用反射式或透射式繞射而取得一 據以確定或測量與一光刻裝置相關各參數的方 參數包括焦點中心。 再一目的是利用可供產生繞射特徵的任一方法 限於第Oth或鏡面繞射級或任一較高繞射級之 ”分角,可5波長,可變相位,可變偏振狀 向%射,而取得一繞射特徵,據以確定或測量 置相關各參數的方法,纟中的參數包括焦點中 本發明的主要優點在於它不必使用光學,SEM或類似的552464 V. Description of the invention (8) An optical system. At all front fixed angles, a source-type tool is a step-by-step tool that operates with a source of diffraction features to perform a transmission-wound mirror level. The diffraction light of the point of the present invention sets a lithographic device. Diffraction features, methods of the present invention, including but not reflective or transmissive or variable setting with a lithographic apparatus' and a known method for detecting the phase of the obtained diffraction features The step of measuring the diffraction characteristics includes performing a phase measurement using a wide-spectrum radiation operating at a variable angle Θ or a variable angle φ. In these methods, the measurement of diffraction includes phase measurement using a fixed-angle, a variable-angle ㊀, or a variable-angle ① single-wavelength radiation source tool source. The measuring step may also include one-phase measurement using a multi-discrete wavelength radiation source type working phase. The diffraction feature may be a reflection diffraction feature or a diffraction feature. In addition, the diffraction feature can also be a positive or negative diffraction feature or a higher-level diffraction feature. The main purpose is to provide a method that can analyze the difference in diffraction characteristics between a series of members with different focal grids, and place the focal point on it. Another purpose is to use reflection or transmission diffraction to obtain a data to determine or measure the parameters related to a lithographic apparatus. The parameters include the center of focus. A further purpose is to use any method available to generate diffraction characteristics that is limited to the "th" angle of the Oth or specular diffraction level or any higher diffraction level, which can be 5 wavelengths, variable phase, and variable polarization. Method to obtain a diffraction feature to determine or measure various parameters, including the parameters in the focus. The main advantage of the present invention is that it does not require the use of optics, SEM or similar

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五、發明說明(9) 顯微鏡測量工具便能測量與一光刻裝置有 本發明的另一優點是它可以在利用—步進 D參數。 光阻光刻裝置所製成的一傳統晶圓上使^ _系’包括傳統 焦點的繞射光柵,#著確定該等繞射光柵的繞 此間的差,來確定焦點中心。 特徵及彼 本發明料一優點是它提供一種能在幸交 低於傳統與已知方法的成本,獲得一光叶間内和用 進機之各種結果的方法及裝置。 、 例如一步 本發明的其它目的、優點、新穎特點與進一牛 圍,有一部份將在後文中配合圖式詳予說明,二、適用範 在嫻熟本技藝者查看下列内容後即顯然可知,^ ★部份 :的實施而獲悉。s要利用申請寻利範圍特別; ,段及其組合,便可實現與達成本發明的各種目 圖式簡要說明 併入下列内容及構成其一部份的各附圖,係用r | 明本發明的一個實施例,並與後文的說例舉 兔明的原理。該等圖式僅用以例舉說明本發明的一 ^ -較佳實施例,不得據以限制本發明,其中·· 、 固以V. Description of the invention (9) A microscope measuring tool can measure the same as a lithographic apparatus. Another advantage of the present invention is that it can be used in-step D parameter. A conventional wafer made of a photoresist lithography apparatus includes a conventional focal diffraction grating, and the difference between the diffraction gratings of these diffraction gratings is determined to determine the center of focus. Features and advantages of the present invention is that it provides a method and apparatus capable of obtaining various results within and between a lighthouse and a machine at a cost lower than conventional and known methods. For example, one step of the other purposes, advantages, novel features of the present invention, and a step into a cow ring, a part will be explained in detail in the following with drawings. Second, the scope of application will be apparent to those skilled in the art after viewing the following content, ^ ★ Part: Learned about the implementation. s To use the special application for profit-seeking scope; paragraphs and their combinations, you can achieve a variety of schematic diagrams of the invention and incorporate the following content and the drawings that form part of it, using r | An embodiment of the invention, and the following exemplified the principle of Tuming. These drawings are only used to illustrate one of the preferred embodiments of the present invention. The preferred embodiments should not be used to limit the present invention, in which ...

第一圖疋一其上设有若干晶粒之晶圓的示意圖, 粒則包括繞射光柵; ~ # 第二圖是一獲得反射式第Oth級繞射特徵之各種模 示意圖; 、式 第三圖所示者係一 3 D繞射光拇;The first picture is a schematic diagram of a wafer with a plurality of grains on it, and the particles include a diffraction grating; ~ # The second picture is a schematic diagram of various modes for obtaining reflective Oth-level diffraction characteristics; The one shown in the figure is a 3 D diffracted light thumb;

552464 五、發明說明(10) 弟四圖所示者择_ ^ 第者係系列的繞射光栅; 弟五A-C圖所示者係利 _ 出的繞射特徵,各贫特符八刀角散射计而獲得一系列繪 S和/這二偏振連結;*刀別有一個聚焦步距的不同,且 徵按照焦點输製的均方根誤差而確定之繞射特 小值的拋物:ί係分別包含窄和寬範圍焦點中心之最 第八圖所示者係在景域中 焦點中心,據以顯示出作位f之繞射特徵差求出 心的3D圖纟;和 丨“域中—個位置函數之焦點中 第九圖所示者係從景域中一 求出的焦點中心,播_傾斜面(tlit)之繞射特徵差 隹點中心的平A楣舢/處不出作為景域中一個位置函數之 “、、”,、占宁〜的千台傾斜效應的3D圖表。 較佳實施例詳細說明 本發明提供用以測量光刻裝置相 :刻裝置之焦點中心的方法與裝置。在所ΐ的 ΐ = = 得—系列繞射特徵’該等繞射光桃係 =士刻裝置’和運用若干不同的聚焦設定,以及選擇性 運用右干不同的劑量設定而製成。繞射特徵是按序排列, 而這定序可在取得繞射特徵後為之,例如按照聚隹設定的 :減順序,且宜以等增量單位為<,接著即可確;相鄰聚 焦没定繞射光柵的繞射特徵之間的差。選擇性採用一種度 量制,例如均方根誤差分析法,據以比較該等差異。等= 第13頁 552464 五、發明說明(11) 巧點中心時,這些繞射特徵 相鄰聚焦設定之間的差域丨 史仔更⑴集使荨增Ϊ的 徵差分柄氺 //Λ。因此,運用本發明的繞射特 徵差刀析法,不需參照理 =耵特 不需使用直接測量的度量#晉;史貝枓的貝科庫,也552464 V. Description of the invention (10) The first four series of diffraction gratings are selected as shown in the fourth figure; the fifth series of diffraction gratings shown in the fifth series AC chart are characterized by diffracted eight-blade angle scattering. A series of polarized links S and / are obtained by calculation; * There is a difference in focus step between the blades, and a parabola with a small diffraction value determined according to the root mean square error of the focal point loss system: The eighth figure containing the narrow and wide focus centers is shown in the center of the focus in the scene, and the 3D map of the heart is obtained based on the diffraction feature difference showing the position f; and The focus shown in the ninth figure in the focus of the position function is the focus center obtained from the scene area. The plane A 楣 舢 / of the center of the diffraction feature difference point of the tlit is not used as the scene area. One of the position functions, “,,”, 3D chart of the effect of a thousand tilts of Zhanning ~. The preferred embodiment describes in detail the present invention provides a method and device for measuring the center of focus of a lithographic device phase: engraving device. In the = = = 得-series of diffraction features 'such diffraction light peach series = Shike device' and application It is made by several different focus settings and selective use of different dose settings of the right stem. Diffraction features are arranged in order, and this order can be made after obtaining the diffraction features, for example, set according to the poly: Order, and it should be in equal increment units < then it can be determined; the difference between the diffraction characteristics of the adjacent focusing uncertain diffraction gratings. Selectivity uses a measurement system, such as root mean square error analysis, Compare these differences based on. Etc. = Page 13 552464 V. Description of the invention (11) At the center of the coincidence point, the difference between the adjacent focus settings of these diffraction features 丨 Shi Zi's more concentrated set of signs that increase the net Difference handle 氺 / Λ. Therefore, using the diffraction feature difference knife analysis method of the present invention, no reference principle is needed.

(掃猫式電子顯微w i ’例如光學顯微鏡或SEM 進-步說明本發〜J U焦點中心及相關的參數。 光刻裝置係=像先:::列的定義。 案轉移到一基板上和選擇孩 光罩(mask)而將—圖 、古4 ^ 、、 和選擇性轉移到其内的任一裝置。田+ 這匕括習用的光學光刻 光刻方法。就光阻#先刻,也包括其它的 影像轉移到晶圓上案的光罩 劑的特殊材料塗佈在準備製作電路的晶且 光阻劑塗層,另視需要可對晶圓進“要施用 (softbake)加工。不論正型或負 < 烤 =:ϋ]通常:溶於當作光阻顯影劑的化學品;知:感 其它部位卻不2時 路或「匕結構的圖案。就光學光刻而言,係利用 像,,常是用燈照耀到光罩上,再將透射的影像投射到 阻劑薄膜上,據以達成選擇性的曝光。 、 本發明中所述的光刻裝置包括步進機(亦稱為進 機)’其係用來把-電路或其它結構的影像從光罩投射到 ^52464 五、發明說明(12) 明燈τ m::晶圓上。步進機通常包括縮影透鏡及照 平台二射光源,晶圓平台(㈣… 卫作站。步進‘ js)用,晶圓E(wafer cassette)和操作 可用步進-重複林Λ半正型及負型光阻劑這兩種方法,亦 實雜太恭犯* 步進—掃瞄格式,或二者之組合。 裝置而於^=係運用一晶圓或其它基板,並利用一繞射 柵係相對“入系ί的繞射光柵。簡單地說,繞射光 置所制你沾 …、’、s使折射率產生周期變化之光刻裝 物理2或仆岛:結構或影像。這種折射率的變化可能是因 差或化予差所致。物理差包括光阻劑或其它 曰=化,例如使用一種在折射率上與空氣麵合 -^j,(scored)^^ ϊ學差包括具有光阻劑已曝光之繞射光柵, ,4尚未頌影的晶圓。在此情況下,所有的阻劑仍存在 旦已曝光部份的折射率卻與未曝光阻劑的部份不同,以 =產生一種由阻劑之折射率周期變化所構成的繞射光柵。 J =该等結構或化學元件的周期性即可獲得周期差。因此 ,這包括由一系列平行線構成的傳統繞射光柵,但也包括 朝X方向及γ方向二者具有周期性的光柵,例如3 D (立體) 陣列的柱或孔。第二圖所示者即為一種朝X和γ二方向具有 周期性的繞射光柵,而第一圖所示者則為一種由若干平行 、'泉2 5所構成,朝某一方向具有周期性的繞射光柵。是以, 繞射光柵包括光阻光栅,蝕刻薄膜堆疊光柵,金屬光柵和 本技藝中已知的其它光栅。繞射光柵的線寬空間比(1 i n e 552464 五、發明說明(13) width to space ratio)通常約在1 :1 到 1 :3> 匕比率亦可採用。以i : 3比的典型繞射光柵為例,它可 :工:)的線寬和40 0 nm的間距。以光刻裝置的解 析j作為取決的部份原因,可將這寬度和間距大幅減小。 實施本發明時,係以繞射光柵來產生繞射特徵。曰利用'若 干儀器,例如散射計,橢圓率測量儀或反射計中的任一種 ,即可產生繞射特徵。凡以輻射來產生繞射特徵的任一穿 置,在此稱為輻射源式工具(radiation source—based 、 too 1)。通常所用者係可見輻射源式工具,例如光源式工 具,但輻射源亦得為可見輻射以外者,例如χ光源。^此 裝置係以改變至少一個繞射相關參數的方式而產生一二 射圖案或特徵。在-實施例中,係以反射模式產生繞射特 徵,其中是對諸如光之類的輻射予以反射。於是,如二 =;,mi角散射計即可產生一繞射特徵,“ 係用早一的已知波長源,而入射角㊀則在一確定的 ,内變化。第五圖所示者即為所得到的繞射特徵,其 按照入射及反射角㊀繪出光的強度。另一方法是運用、^ 雷射束源,並選擇性地各採取不同的入射角㊀。還有一= 方法是使用寬光譜的入射光源,如第二圖示,其中 係=個波長範圍照出,而入射角㊀則選擇性地保持 園,外::第二圖所示’已知有各種利用某個入射相位範 亚以一偵知器來偵知繞射相位的可變相位光源。此 可利=]?組件或從㈣組件之偏振範圍的 ]文偏振先源。另如第二圖所示,入射角亦可在一範圍。 552464 五、發明說明(14) 光柵轉動,或相對於光源,使 ,即可且已知合m :裝置的任—種,或其組合或變換 债知的光強度係樣本目標的繞射特徵。大體上, 人射光的波長,、入個可變二,如入射角㊀, 。繞射特徵可代表第等,予以繪製 矛第〇th個或鏡面(specular)繞射級,或 任一較高的繞射級。再者,透射模式也可並計劃用 “產生一繞射特徵,例如採用X光輻射源當作輻射源式工 具的一組件。 本發明的一實施例係提供一個如第一圖所示的晶圓1 〇, 其上則設有一系列的晶粒1 5。各晶粒通常表示晶圓上屬於 光刻裝置’例如步進機之照射景域(exp〇sure field)的部 伤。步進-重複系統係在開啟快門(shut ter )時,便照射待 曝光之光罩或光板的整個區域,以致同時讓整個晶粒的照 射景域曝光。步進-掃瞄系統則是在開啟快門時,只讓一 部份的光罩或光板曝光,以致也只有一部份的晶粒照射景 域曝光。不論那一情況,均可移動光罩或光板,以致產生 一個繞射光柵組20,該繞射光栅組20係由一系列不同,且 送擇性具有不同焦點的繞射光柵構成。不過,繞射光柵組 2 0亦可由一系列相同的繞射光柵構成,或由一系列具有相 同焦點,但不同劑量(dose)的繞射光柵構成。在一較佳實 施例中,繞射光柵組20係由一系列具有不同焦點,且宜以 一種已知和可增量的聚焦步距(step)進行改變的繞射光柵 構成,其中所有繞射光柵均屬固定劑量。晶圓1 0上的各晶(Scanning cat-type electron microscopy, such as an optical microscope or SEM, further describes the focal point and related parameters of the present invention. The lithographic apparatus is like the definition of the first ::: column. The solution is transferred to a substrate and Select the mask and transfer any of the devices—pictures, ancient photos, and images to it selectively. Tian + This is a conventional optical lithography lithography method. Special materials including other photoresist for image transfer to the wafer are coated on the crystalline and photoresist coating to prepare the circuit, and the wafer can be "softbake" processed if necessary. Type or negative < baked =: 通常] usually: soluble in chemicals used as photoresist developer; know: sense other parts but does not have a pattern of 2 hours or "dagger structure. As for optical lithography, it is used For example, a lamp is often used to illuminate the mask, and then the transmitted image is projected onto the resist film to achieve selective exposure. The lithographic apparatus described in the present invention includes a stepper (also known as a stepper). For the machine) 'It is used to project the image of a circuit or other structure from the photomask to ^ 52464 V. Description of the invention (12) Bright light τ m :: on the wafer. Stepper usually includes a miniature lens and a two-source light source on the platform, wafer platform (㈣ ... Wei Zuo Station. Stepper 'js), wafer E (wafer cassette) and operation can use the step-repeated Lin Λ semi-positive and negative photoresist two methods, it is too complicated to commit * step-scan format, or a combination of the two. ^ = A wafer or other substrate is used, and a diffraction grating system is used to "differentiate" the diffraction grating. Simply put, the diffraction light sets you to make periodic changes in the refractive index ... The lithographic installation of physical 2 or the island: structure or image. This change in refractive index may be caused by the difference or the difference. The physical difference includes a photoresist or other, such as using a kind of refractive index. Coordinated with air-^ j, (scored) ^^ The difference in chemistry includes wafers with diffraction gratings exposed by photoresist, and 4 wafers that have not been etched. In this case, all the resists are still present. The refractive index of the exposed part is different from that of the non-exposed resist, in order to produce a periodic change in the refractive index of the resist. Diffraction grating. J = The periodicity can be obtained by the periodicity of such structures or chemical elements. Therefore, this includes traditional diffraction gratings composed of a series of parallel lines, but also has periodicity in both the X direction and the γ direction. Gratings, such as columns or holes in a 3D (stereoscopic) array. The one shown in the second figure is a diffraction grating with periodicity in the X and γ directions, while the one shown in the first figure is a A plurality of parallel, springs 5 and 5 have a periodic diffraction grating in a certain direction. Therefore, the diffraction grating includes a photoresist grating, an etched thin film stack grating, a metal grating, and other gratings known in the art. The line-to-space ratio of the diffraction grating (1 ine 552464 V. Description of the invention (13) width to space ratio) is usually about 1: 1 to 1: 3. The dagger ratio can also be used. Taking a typical diffraction grating with an i: 3 ratio as an example, it can be used for: line width and pitch of 40 nm. Depending on the analysis j of the lithographic apparatus as part of the reason, this width and pitch can be greatly reduced. When the present invention is implemented, a diffraction grating is used to generate a diffraction feature. Diffraction features can be generated by using any of several instruments, such as scatterometers, ellipsometry meters, or reflectometers. Any penetration that uses radiation to generate diffraction features is referred to herein as a radiation source-based tool (too 1). Usually people use visible radiation source tools, such as light source tools, but the radiation source must be other than visible radiation, such as χ light source. ^ This device generates a birefringent pattern or feature by changing at least one diffraction related parameter. In the embodiment, the diffraction characteristic is generated in a reflection mode, in which radiation such as light is reflected. Therefore, if two = ;, the mi angle scatterometer can produce a diffraction characteristic, "It uses a known wavelength source earlier, and the incident angle ㊀ changes within a certain, internal. The one shown in the fifth figure is For the obtained diffraction characteristics, it plots the intensity of light according to the incidence and reflection angles. Another method is to use the laser beam source, and optionally adopt different incident angles, respectively. Another method is to use A wide-spectrum incident light source, as shown in the second diagram, in which the wavelength range is emitted, and the angle of incidence 选择性 is selectively maintained. Fan Ya uses a detector to detect the diffractive phase light source with a variable phase. This can be used as the source of polarization of the component or the polarization range of the component. Also, as shown in the second figure, the angle of incidence May also be in a range. 552464 V. Description of the invention (14) Grating rotation, or relative to the light source, can be, and is known to be: any one of the devices, or a combination or conversion of light intensity samples The diffraction characteristics of the target. In general, the wavelength of the light emitted by the person Incidence angle ㊀,. Diffraction feature can represent the first order, draw the spear's 0th or specular diffraction level, or any higher diffraction level. In addition, the transmission mode can also be planned with " Generate a diffraction feature, such as using an X-ray radiation source as a component of a radiation source tool. An embodiment of the present invention provides a wafer 10 as shown in the first figure, and a series of dies 15 are provided thereon. Each die usually indicates a defect on the wafer that belongs to the exposure field of a lithographic apparatus, such as a stepper. The step-and-repeat system illuminates the entire area of the reticle or light plate to be exposed when the shutter is turned on, so that the entire field of exposure of the grain is exposed at the same time. The step-scan system exposes only a part of the mask or light plate when the shutter is opened, so that only a part of the crystal grains are exposed to the scene. In either case, the reticle or light plate can be moved so as to produce a diffraction grating group 20, which is composed of a series of different diffraction gratings with different selective focuss. However, the diffraction grating group 20 may also be composed of a series of identical diffraction gratings, or a series of diffraction gratings having the same focus but different doses. In a preferred embodiment, the diffraction grating group 20 is composed of a series of diffraction gratings having different focal points, and preferably changed by a known and incrementable focusing step. The gratings are fixed doses. Crystals on wafer 10

第17頁 552464 五、發明說明(15) 粒,不論劑量範圍或聚焦設定範圍,或二者均可改變。傳 統上,劑量或焦點係以固定的增量步距進行改變,以致易 於從事後續的分析。因此,以焦點為例,可在一確定範圍 内以50到1 00 nm的步距進行改變,另以劑量為例,則可在 一確定範圍内以1或2 mJ的增量進行改變。繞射光柵2〇可 用若干以空間30隔開的傳統線25,或可用一種如第三圖所 示的3D圖案。 與意欲繞 明區域的 著,將輻 影到位在 亦可選擇 它光學系 生變化時 料之化學 變化,因 施例中, 帶動其它 例中,可 影製程, 以所用阻 程,可在 阻劑層的 的各種方 刁J兀*攝思 光罩,通常便 射源施用在光 光罩另一邊的 性地在輻射源 統。接受輻射 ’即會在阻劑 變化的該等潛 而可用來產生 可讓具有潛在 的化學反應或 用一種顯影製 使阻劑顯影, 劑為正型或負 阻劑層,和選 其它薄膜上產 法和裝置而言 狀、尺寸和 可在阻劑材 罩的一邊, 組態對應之 料中產生繞 致使光罩形 阻劑層上。在光罩和阻 和光罩之間插入一個以 或經激勵到 製備具有 不透明和透 射光柵。接 狀和空間投 劑層之間, 上透鏡或其 在阻劑中發 代表阻劑材 的反射性起 徵。在一實 烘烤,以便 在另一實施 一種化學顯 ’該部份係 稱為餘刻製 如其上設有 就本發明 中形成一個 在影像,會 一個如前所 影像的晶圓 擴散阻劑中 程’就此可 藉以去除一 型而決定。 擇性地在基 生钱刻區域 ’可讓繞射 充分程度而 潛在影像。 導致阻劑層 述的繞射特 接受後照射 的各組件。 選擇性採用 部份的阻劑 顯影製程亦 板材料,例 或空間。 光柵曝光但Page 17 552464 V. Description of the invention (15) Capsules can be changed regardless of the dose range, focus setting range, or both. Traditionally, the dose or focus was changed in fixed increments, making it easier to perform subsequent analyses. Therefore, taking the focal point as an example, it can be changed in steps of 50 to 100 nm within a certain range, and taking the dosage as an example, it can be changed in increments of 1 or 2 mJ within a certain range. The diffraction grating 20 may use a plurality of conventional lines 25 separated by a space 30, or may use a 3D pattern as shown in the third figure. With works intended to illuminate the area, you can also choose the chemical change of the material when the optical system is changed in place. Because in the examples, other examples can be driven. The process can be affected by the resistance range used. The various layers of the photomask are usually applied to the radiation source on the other side of the photomask. "Receiving radiation" will change the potential of the resist and can be used to produce a potential chemical reaction or develop the resist with a developing system, the agent is a positive or negative resist layer, and other films can be produced. In terms of method and device, the shape, size, and configuration of the corresponding material on one side of the resist material cover can cause a photoresist layer on the resist layer. Insert one between the reticle and the reticle or be excited to produce an opaque and transmissive grating. Between the contact and the space dosing layer, the upper lens or its reflection in the resist represents the resistivity of the resist material. Bake in a solid, so as to implement a chemical display in another. This part is called a post-cut system. If it is set thereon, it will form an in-image in the present invention, and a wafer diffusion resist as in the previous image. Cheng 'can thus be decided by removing a type. Selectively in the basal money engraved area 'allows the diffraction to be full and potential image. The components that cause the diffraction characteristics of the resist layer to irradiate after acceptance. Selective use of part of the resist development process also plate materials, such as space. Raster exposure but

五、發明說明(16) 不顯影’或可交替顯影。同 明一種傳統的光柵產生方、去,< ,雖然前述内容大體係說 包括使用相移光罩,各種輕射一方法均可採用, 束照射等。 ’、的其中任一種,包括電子 對於任一光刻裝置,包括 點都是-個重要參數。焦點和隹= ί刻裝置,焦 量子,以及焦點,或從透鏡到目刀別疋4頁,或輻射能 的成像在特定照射景域範s ^ ^㈣函數。所得到 以產生-個明確的可用焦温内須良好,據 素也會影響到焦點和焦深,包 i μ I點以外的因 質,和晶圓平台在X”軸的定4先生透鏡品 機,其解析度約為〇.15m.25微米,可型步進 1· 50微米。 J用/木約為0· 40到 因此’在光刻裝置的有效作業方面,例如 2阻曝光步驟期間的步進機,確定固定 隹曰【力:工之 和=量變化則讓這中心的讀定變得難:二了; 、/’八匕光刻裝置所用的透鏡,其焦深十分有 ^ 2須有極高的精密度。對準焦點的透鏡將會產出‘二 隹光阻影像,而失焦時則會導致無功能的光阻特性。!:斤 ::中:亦可顯著改良製程的重複性。一旦獲知及“焦 "、、中〜呀,即可採用各種不同自動聚焦系統或體 “、、 種來確定透鏡之間的間隔和使晶圓保持固定。這此备一 括諸如採用反射光的光學方法,電容方法’和諸如产、先I 壓空氣的感壓方法。然而,這些系統和體系不能確$ == 552464 五、發明說明(17) 中心,只能使透鏡到 中,須以光刻裝置每 點中心。 現請參閱第五A圖 式工具產生的二個繞 焦步距到下一聚焦步 (specular order)。 用於繞射光柵的光阻 則按增量的聚焦步距 光阻劑曝光之後但在 結構是被蝕刻到阻劑 的基板内。接著測量 繞射特徵,例如記錄 光柵是運用能感知繞 包括但不限於第一和 咼繞射級之繞射特徵 下一步距的繞射特徵 步距到下一步距的繞 論的理想條件下,焦 點。因此,如第五圖 步距的繞射光拇而言 致在第五圖中,二個 並無顯著差異。 如第五圖所示,目 晶圓的距離保持固定。在典型的作業 作業六小時以下的頻率,定期確定焦 ’所不者係用一種分角散射光輻射源 射特徵,該等繞射特徵代表從一個聚 距(聚焦步驟η和η+ 1)的鏡面級 在第五圖的各圖式中,係以固定劑量 幻曝光▲而焦點或透鏡到晶圓的距離 予以改變。因而產生的繞射特徵係在 顯影之前,或在顯影之後獲得,其中 層内和選擇性蝕刻到包括晶圓一部份 一系列的繞射光栅,並記錄所得知的 到處理器相關裝置的記憶體中。繞射 射光之重複或周期特徵的任一結構, &圖慰不的結構。鏡面級,或任一較 差的分析,是以測量從一聚焦步距^ 差為之。接近焦點中心時,從一聚焦 射特徵差就變得越來越小。在合乎= 點中心即為繞射特徵變化最小的那一 所示\接近焦點中心時,對相鄰聚焦 ’分隔其繞射特徵的距離就減少,以 所得知的繞射特徵實質重疊,彼此間 視比較所得知的相鄰聚焦步距的繞射5. Description of the invention (16) No development 'or alternate development. The same goes for a traditional grating generator, although the large system described above includes the use of a phase shift mask, various light-emitting methods can be used, such as beam irradiation. Any one of them, including electrons, is an important parameter for any lithographic device, including dots. Focus and 隹 = 刻 engraving device, focal quantum, and focus, or from the lens to the eyepiece, page 4 or imaging of radiant energy in a specific illumination field range s ^ ^ ㈣ ㈣ function. The obtained result must be good within a clear usable focal temperature, and the factors will also affect the focus and depth of focus, including factors other than the i μ point, and the wafer platform on the X ”axis. Machine with a resolution of about 0.15m.25 microns and a step size of 1.50 microns. J / wood is about 0 · 40 to so 'in terms of effective operation of the lithographic apparatus, such as during a 2-block exposure step The stepper is determined to be fixed. [Force: the sum of the work = the change in quantity makes it difficult to read this center: two; the lens used in the eight-blade lithography device has a very deep focal depth ^ 2 Must have very high precision. A lens that is in focus will produce a 'two-tone photoresist image, and out-of-focus will result in non-functional photoresistance characteristics.!: Jin :: medium: can also be significantly improved Repeatability of the process. Once the "focus" is known, various autofocus systems or bodies can be used to determine the distance between the lenses and keep the wafers fixed. Such as the optical method using reflected light, the capacitive method ', and the pressure-sensing method such as producing and pressing air. However, these systems and systems cannot determine $ == 552464 V. Description of the invention (17) The center can only be centered on the lens, and must be centered at each point of the lithography device. Focusing step to the next specular order. The photoresist for the diffraction grating is exposed in incremental focusing steps after the photoresist is exposed but the structure is etched into the resist substrate. Then measure Diffraction features, such as recording gratings, are the focal point under ideal conditions of diffraction theory that can sense the next step distance of diffraction features including, but not limited to, the first and chirped diffraction features. Therefore, as shown in the fifth figure, the diffracted light thumb is the same in the fifth figure. There is no significant difference between the two. As shown in the fifth figure, the distance between the target wafers remains fixed. In a typical operation, it takes six hours. At the following frequencies, it is determined periodically that the focal point is not a radiated light source with a fractional scattered light. The diffraction characteristics represent the specular order from a focal distance (focusing steps η and η + 1) in the fifth figure. Fixed-dose magic Light ▲ and the focal point or the distance from the lens to the wafer is changed. The resulting diffraction characteristics are obtained before or after development, in-layer and selectively etched to include a series of diffractions of the wafer Grating and record the known memory of the processor-related device. Any structure of the repetitive or periodic characteristics of diffracted light, & structure of the image. Mirror level, or any poor analysis, is based on Measure the difference from a focus step ^ as the difference. As you approach the center of the focus, the difference in the feature of the focus becomes smaller and smaller. At the center of the point = the point with the smallest change in diffraction characteristics is shown. At the center, the distance separating adjacent diffractions from their diffraction features is reduced, and the known diffraction features substantially overlap, and the diffractions of the adjacent focusing steps are known when compared with each other.

第20頁 552464 五、發明說明(18) 特徵’即可確認從一聚焦步距到下一步距的繞射特徵差, 和確定焦點中心。然而,這方法需要操作人員的判斷,並 非直接可計量,而且也較慢。因此,種種不同的度量制和 分析方法的任一種均可用於測量從一聚焦步距到下一步距 的繞射特徵差。該等方法包括但不限於使均方誤差(MSE) 或均方根誤差(RMSE)減至最低,和其它的歐幾里得 (Eucl i dean)距離測量方法。該等方法也包括平均,加權 平均’平均值總和,以及凸顯(c h a r a c ^ e r丨z e )繞射特徵差 的其它方法。 在一實施例中,係從如第四圖所示的一系列依序具有不 同聚焦設定的繞線光柵4〇,45,50,50和50得知繞射特 徵。等40和45之間的RMSE差經確定時,即表示對應聚焦設 定之繞射光柵40的繞射特徵差。等4〇和45之間以及45和50 之間的RSME差平均值經確定時,即表示對應聚焦設定之繞 射光柵4 5的繞射特徵差。等4 5和5 0之間以及5 0和5 5之間的 RSME差平均值經確定時,即表示對應聚焦設定之繞射光柵 50的繞射特徵差。同樣地,等50和55之間以及55和6〇之間 的RSME差平均值經確定時,即表示對應聚焦設定之繞射光 柵55的繞射特徵差。55和60之間的RSME差係當作對應聚焦 設疋之繞射光栅6 0的繞射特徵差。於是,此舉在依序具有 不同焦點的繞射光柵之間,產生一系列與其聚焦設定差對 應的繞射特徵差。 一旦得知繞射特徵差時,即可確定一加權平均值,並利 用其來確定焦點中心。在一個這樣的實施例中,可利用下Page 20 552464 V. Description of the invention (18) Features ′ The diffraction feature difference from a focus step to the next step can be confirmed, and the focus center can be determined. However, this method requires the judgment of the operator and is not directly measurable and slower. Therefore, any of various measurement systems and analysis methods can be used to measure the diffraction characteristic difference from a focus step to a next step. Such methods include, but are not limited to, minimizing mean square error (MSE) or root mean square error (RMSE), and other Euclid distance measurement methods. These methods also include averaging, weighted average ', the sum of averages, and other methods that highlight (c h a r a c ^ e r 丨 z e) diffraction feature differences. In one embodiment, the diffraction characteristics are obtained from a series of winding gratings 40, 45, 50, 50, and 50 having different focus settings in sequence as shown in the fourth figure. When the RMSE difference between 40 and 45 is determined, it means the diffraction characteristic difference of the diffraction grating 40 corresponding to the focus setting. When the average RSME difference between 40 and 45 and between 45 and 50 is determined, it indicates the diffraction characteristic difference of the diffraction grating 45 corresponding to the focus setting. When the average RSME difference between 45 and 50 and between 50 and 55 is determined, it means the diffraction characteristic difference of the diffraction grating 50 corresponding to the focus setting. Similarly, when the average RSME difference between 50 and 55 and between 55 and 60 is determined, it means the diffraction characteristic difference of the diffraction grating 55 corresponding to the focus setting. The RSME difference between 55 and 60 is taken as the diffraction characteristic difference of the diffraction grating 60 corresponding to the focusing setting. Therefore, this method generates a series of diffraction feature differences corresponding to the difference in focus settings between diffraction gratings having sequentially different focal points. Once the diffraction feature difference is known, a weighted average can be determined and used to determine the center of focus. In one such embodiment, the following

第21頁 552464 五、發明說明(19) 列等式(1)來確定焦點中心: y (聚焦步距) (!) (DSDrwse)2 T _I_ (DSDrwse)2 ,而DSDRMSE則是RMSE繞射特徵差 其中C 0 F是焦點中心 (DSD)。 各繞射特徵差的數值表示,亦可用其它方式進行比較, 以確定该焦點中心即為在相鄰聚焦設定的繞射光栅之間具 有最小差那一區域對應的聚焦設定。該數值表示可根據各 聚焦設定步距予以繪製’因而得到如第六圖所示的圖表, 其中顯示出-道以焦點中心為中心的抛物曲線。在焦點中 :處,拋物曲線的斜率為或接近零,因此這位置進一步表 :出在相鄰聚焦設定的繞射光栅之間具有最小差的那一區 確定焦點中心之前, 的任一種來剔除不良品 對繞射光柵曝光時,所 個別繞射光柵也可能因 曝光錯誤,和阻劑瑕症 特定光刻裝置,例如 得知的拋物曲線而予量 A圖所示的緊密拋物線, 少數一些聚焦設定對應 可先用種種濾光片 。尤其,若以實質 得到的焦點曲線即 為與聚焦設定不相 專,以致進一步產 步進機的焦深或堅 化。右是緣圖函數 那麼因為含有最 ,所以焦深也跟著 和相關數學模型 失焦的聚焦設定 可能變得怪異。 關的理由,例如 生異常的結果。 固性可經分析所 具有一道如第七 、差的區域係與 小。若是繪圖函Page 21 552464 V. Description of the invention (19) Column equation (1) to determine the center of focus: y (focus step) (!) (DSDrwse) 2 T _I_ (DSDrwse) 2 and DSDRMSE is the RMSE diffraction feature Difference where C 0 F is the center of focus (DSD). The numerical representation of each diffraction feature difference can also be compared in other ways to determine that the focus center is the focus setting corresponding to the area with the smallest difference between the diffraction gratings of adjacent focus settings. This numerical value indicates that it can be plotted according to each focus setting step, and thus a graph as shown in FIG. 6 is obtained, in which a parabolic curve centered on the focal point is shown as a track. In the focus: at the slope of the parabolic curve is close to zero, so this position further shows: before the focus center is determined in the area with the smallest difference between the diffraction gratings of the adjacent focus settings, remove either When a defective product is exposed to a diffraction grating, the individual diffraction gratings may also be due to exposure errors and resist lithography specific lithography equipment, such as the known parabolic curve, and the tight parabola shown in Figure A is given, with a few focus To set the correspondence, various filters can be used first. In particular, if the focus curve obtained in essence is not specific to the focus setting, the depth of focus or hardening of the stepper is further produced. The right is the edge map function. Because it contains the most, the depth of focus also follows and related mathematical models. The out-of-focus focus setting may become weird. Related reasons, such as abnormal results. The solidity can be analyzed to have the same as the seventh, poor area system and small. If it is a drawing function

第22頁 552464 五、發明說明(20) 數具有-道如第七B圖所示的廣闊拋物線,即表 ·· =的區域大,因此焦深也較大,以致可對種、稽、最小 設定提供良好的聚焦值。 種不同的 如欲獲得拋物回應’須將焦點中心列入那 繞射光柵曝光的增量聚焦設定範圍内。也就是:兒J:來對 範圍並未包括焦點中心,就無法產生在隹點果該 =的㈣”;。此外,在顯著失焦上= 二距右:疋王去除阻劑•,那麼從一聚蝥: 步距的繞射特徵便可能十分接近。這是不會對聚焦 像產生任一顯著差異之各聚隹+ 斤獲传之影 亦可採用一光柵模型戈均勺^ ^ & :固函數。於此 區域。通常,這此ί = 來確定顯著失焦的各 、二點不旎被繪製到一拋物曲線上。 第:圖之範例所示者’雖是當作一入射角函 S^Pi, 3且其中疋按照繞射強度連結與繪製 S和,一偏振,但可輕易理解的*,在其它繞射模式中, 繪製繞射特徵。因此,對於可變波長繞射,、係按昭 =來繪製波長而產生繞射特徵,對於可 ,麵,對於可變偏振狀態是按照強度來繪 悲,對於可變定向繞射則是按照強度來繪製φ等。同樣地 ,第五圖的繞射特徵雖是得自反射繞射,但利用透射繞射 亦可獲付類似的繞射特徵,只要供繞射所用的輻射源式工 具能經由繞射光栅的至少一部份被透射,以致可利用一種 X光輻射源式工具而獲得,或對光源式工具而言,可利用 一種透明或半透明繞射光柵與基板。第五圖所示者係第Page 22 552464 V. Description of the invention (20) The number has a broad parabola as shown in Figure 7B, that is, the area of the table ... is large, so the depth of focus is also large, so that it can be seeded, inspected, and minimized. The setting provides a good focus value. To obtain a parabolic response ’, the center of focus must be included in the incremental focus setting range of the diffraction grating exposure. That is: Er J: The range does not include the center of focus, and it is impossible to produce the ㈣ that should be = at the point of 隹.; In addition, on a significant defocus = two distances right: 疋 王 Removes the inhibitor •, then from One gather: The diffraction characteristics of the step distance may be very close. This is not to cause any significant difference in the focus image of the various gathers + the shadow obtained can also use a grating model Ge Jun spoon ^ ^ & : Solid function. In this area. Usually, this ί = is used to determine the significant and out-of-focus points and two points are plotted on a parabolic curve. Section: The example shown in the figure is used as an incident angle The function S ^ Pi, 3 and where 疋 connects and plots S and according to the diffraction intensity, a polarization, but can be easily understood *, in other diffraction modes, the diffraction characteristics are plotted. Therefore, for variable wavelength diffraction, The diffraction characteristics are generated by plotting the wavelength according to Zhao =. For the surface and surface, the variable polarization state is plotted according to the intensity, and for the variable directional diffraction, the intensity is plotted according to the intensity. Similarly, the first Although the diffraction features of the five figures are derived from reflection diffraction, transmission diffraction can also be used. Obtain a similar diffraction feature, as long as the radiation source tool for diffraction can be transmitted through at least a part of the diffraction grating, so that it can be obtained with an X-ray radiation source tool, or for a light source tool In other words, a transparent or translucent diffraction grating and substrate can be used.

552464 ^-- 五、發明說明(21) 〇 t h個或鏡面級繞射 類似結果。據瞭解, 獲得的繞射特徵最方 在產生如第六圖所 的焦點中心時,據瞭 點之間插值,以便更 技藝已知者,並可照 亦可不用各焦點,反 從事初步分析。各聚 ’但也意圖在聚焦設 但利用任一較高的繞射級也可獲得 對於大部份的實施例,從相同燒射级 便比較。 不的圖表,或在產生如等式⑴所示 解可用_的、统計技術在測定的各焦 精確的測定焦點中心。這些方法屬本 f貝2〜用。同樣地,所用的分析方式 而疋根據多個聚焦設定的繞射特徵差 $設定步距之間的增量差宜保持固定 定步距如不一致時,可運用插值方式 使用本發 即低於0 . 〇 7 裝置,例如 劑量對焦 含焦點中心 ’例如繞射 結果就是一 著’利用如 取得一系列 如前述般加 ;^到的焦點 點中心的效 的劑量設定 明的方法 微米的典 步進機的 點中心的 的一確定 光柵組2G 系列的繞 前所述的 的繞射特 以分析, 中心則可 應。以此 ,以致可 中心的差 步距尺寸 範圍内聚 用類似的 焦範圍產 則以步進 組各有個 射源式工 得到的那 用繞射特 量而繪製 即可確認 焦點曲線 微米, 在光刻 。於包 光柵組 而異。 量。接 光栅組 特徵可 之。所 量對焦 點曲線 ,焦點 型聚焦 解析度 效應可 不同聚 ”劑量 射光栅 一種輻 徵。所 例如利 按照劑 方式, 選用對 通常低 。因此 方式予 生一系 方式隨 不同的 具,為 一系列 徵差分 ,據以 具有最 或焦深 於0· 03 ,這可 以分析 列繞射 光柵組 已知劑 各繞射 的繞射 析法為 獲知劑 堅固焦 影響最552464 ^-5. Description of the invention (21) 0 t h or mirror-level diffraction Similar results. It is understood that when the obtained diffraction features are the best when generating the center of focus as shown in the sixth figure, interpolation between points is performed in order to be more technically known, and each focus may or may not be used to perform preliminary analysis. However, it is also intended to focus on the setting but can also be obtained by using any higher diffraction level. For most embodiments, the comparison is made from the same firing level. Not a chart, or in generating the solution shown in Equation ⑴, statistical techniques are used to determine the focal point of each focal point accurately. These methods belong to this application. Similarly, the analysis method used is based on the diffraction feature difference of multiple focus settings. The incremental difference between the set step distances should be kept at a fixed step distance. If the step distances are inconsistent, the interpolation method can be used, which is lower than 0. 〇7 devices, such as dose focus with focus center 'for example, the diffraction result is a' use of a series of focus points as described above to obtain the effective dose setting method of the micrometer classic stepper The diffraction of the 2G series of the grating group determined by the center of the point is analyzed, and the center can be applied. In this way, the center of the step size range can be gathered with a similar focal range. The focus curve can be confirmed in micrometers by drawing with diffraction features obtained from each of the step groups. Lithography. Depending on the package raster group varies. the amount. It can be connected with the features of grating group. The amount of focus curve, focus-type focus resolution effect can be different. A dose sign of the radiation grating. For example, according to the method of the agent, the choice is usually low. Therefore, the method of pre-generating a series of methods varies with different tools and is a series of The characteristic difference is based on having the most or focal depth greater than 0.03, which can analyze the diffraction analysis of each diffraction of the known agents of the column diffraction grating group to know that the strong focal effect of the agent is the most important.

第24頁 552464 (22) 五、發明說明 量設定。 另外顯而易見的是’使用繞射特徵差,例 者,以及有關繞射光栅在景域中之位置的 2 =不 慣例可以是晶圓平台,便可繪出作為景域中一個:= 數的焦點中心’即如第八圖所示者。㈣表可顯 2 系統的像I,像散性,或造成景域之焦點中心不 = 它瑕疵。同樣地,如第九圖所示,x&y軸二 其 斜(t i 11)也可繪製,據以顯示出作為旦 加厅-的傾 之焦點中心的平台傾斜效應。乍為以中-個位置函數 隹^本方法及裝置,亦可讓繞射特徵差所確定的 焦,中 '特徵與一已知的理論或實際繞射特徵差資訊庫 匹配。該匹配資訊庫與必須包含範圍極為廣泛 之失“、、汉疋的傳統理論資訊庫相比,可以小許多, 更迅速產生資訊庫,且就作為理論資訊庫而言,其儲存^ 求較小,分析時間則較快。 、 、本發2的方法及裝置亦可用於品管測試,包括對其它方 ^所確定的焦點中心進行分析。此舉可跟前述的某種分角 散射計’包括其相關的電腦系統,或與其它能進行前述測 量的適當裝置共同完成。 、 運用分角散射計,將繞射特徵從光柵等式(2)所指定的 各角位置分成若干不同的繞射級: sin ㊀ i + sin θη = η Λ /d (2) 其中㊀1是入射角,作為負角,θη是第nth個繞射級的 角度位置’ λ是入射光的波長,而d則是繞射光栅的空間Page 24 552464 (22) V. Description of the invention Amount setting. It is also obvious that 'using the diffraction feature difference, for example, and the position of the diffraction grating in the field of view 2 = unconventional can be a wafer platform, you can draw as the focus of a field: = number The center is the one shown in the eighth figure. The table can show the image I, astigmatism of the 2 systems, or cause the center of focus of the scene to be different from it. Similarly, as shown in the ninth figure, the x & y axis and its tilt (t i 11) can also be plotted, thereby showing the platform tilt effect as the focal point of the tilt of the Canadian hall. At first glance, this method and device can also use the method and device to match the focal characteristic determined by the diffraction feature difference to a known theoretical or actual diffraction feature difference information database. The matching information database can be much smaller than the traditional theoretical information database that must contain a very wide range of errors, and can be generated more quickly. As a theoretical information database, its storage requirements are smaller The analysis time is faster. The method and device of the present invention can also be used for quality control testing, including analysis of the center of focus determined by other parties. This can be done with some of the aforementioned angular scatterometers. Its related computer system, or together with other appropriate devices capable of performing the aforementioned measurements. Using a fractional scatterometer, the diffraction characteristics are divided into different diffraction levels from each angular position specified by the grating equation (2). : Sin ㊀ i + sin θη = η Λ / d (2) where ㊀1 is the angle of incidence, as a negative angle, θη is the angular position of the nth diffraction order, 'λ is the wavelength of the incident light, and d is the diffraction Raster space

第25頁 552464 —--- 五、發明說明(23) 期或間距。因 射角即等於鏡 射級亦可採用 關係可供作為 繞射特徵產生 射級均可採用 ,而波長λ則 本發明的方 一適當的方式 ,和在一個可 法再加確定。 的其它方式為 本發明尚可 焦系統,因而 確疋焦點,以 以上所舉實 發明之範圍。 化’倶屬本發 此可看 面繞射 ’並如 其它繞 模式而 。以波 改變, 法和裝 ’包括 接受或 至於調 之。 用於自 把有關 便利用 施例僅 舉凡不 明申請 出,對於第Oth個或鏡面繞射級,入 級的角度位置。然而,鏡面以外的繞 前述般確定適宜的角度位置。類似的 射特徵產生模式的準據,以便就任一 言’不論鏡面繞射級或其它較高的繞 長解析裝置為例,角㊀i可保持固定 解算θη的等式係從^定啲η為之。 置還可用來確定焦點中心,據以由任 電腦式控制系統,來調整這焦點中心 最佳的焦點經確定時,以本發明的方 整’則可利用劑量變化或本技藝已知 動確疋焦點中心,其係利用一自動聚 繞射特徵分析的資訊用於控制系統來 ’例如’劑量變化來確定隹點。 !以說明本發明而已,非用以限制本 ,本發明精神所從事的種種修改或變 專利範圍。Page 25 552464 ----- V. Description of the invention (23) Period or interval. Because the angle of incidence is equal to the mirror level, the relationship can also be used as a diffraction feature to generate. The level can be used, and the wavelength λ is an appropriate method of the present invention, and can be determined in a law. The other way is that the present invention can focus the system, so the focus is confirmed, and the scope of the invention is exemplified by the above.倶 ′ is the present invention, so you can see the surface diffraction, and like other diffraction modes. With wave change, law and equipment include accepting or adjusting. It is used for self-contained related convenience examples to mention only the unknown application, for the Oth or mirror diffraction level, the angular position of the step. However, a suitable angular position other than the mirror surface is determined as described above. A similar pattern of radiant features produces the basis of the pattern, so that for any statement 'regardless of the specular diffraction order or other higher radiating length analysis devices, the angle ㊀i can maintain a fixed solution of the equation θη. Of it. The setting can also be used to determine the focus center, so that any computer-based control system can be used to adjust the optimal center. When the best focus is determined, the formula of the present invention can be used to determine the dose change or the known dynamics of the art. The focus center is used to control the system to 'for example' dose change to determine the pupal point using information from an automatic poly-diffraction feature analysis. ! It is only to explain the present invention, not to limit the present invention, the scope of various modifications or changes in the spirit of the invention.

552464552464

弟 Θ疋—其上設有若干晶粒之晶 則包括繞射光栅; 圓的示意圖 s亥專晶粒 第二圖是— 意圖; 獲得反射式第Oth級繞射 特徵之各種模式的示 第三圖所示者係一3D繞射光栅; f四圖所示者係一系列的繞射光柵; =-C圖所示者係利用一分角散射計而獲得一系列繪出 的⑺射特徵,各該特徵分別有一個聚焦步距的不、曰 同,且S和P這二偏振連結; 第六圖係以按照焦點繪製的均方根誤差而確定之繞射特 差的圖表; ' $ 第七A和B圖所示者係分別包含窄和寬範圍焦點中心之最小 值的拋物曲線圖表; 第八圖所示者係在景域中從許多位置之繞射特徵差求出焦 點中心,據以顯示出作為景域中一個位置函數之 焦點中心的3 D圖表;和 第九圖所示者係從景域中一傾斜面(tilt)之繞射特徵差求 出的焦點中心,據以顯示出作為景域中一個位置 函數之焦點中心的平台傾斜效應的3 D圖表。Brother Θ 疋 —a crystal with several grains on it including a diffraction grating; a schematic diagram of a circle; the second graph is—intent; a third diagram of various modes to obtain reflective Oth order diffraction characteristics The one shown is a 3D diffraction grating; the one shown in Figure 4 is a series of diffraction gratings; the one shown in Figure -C is obtained by using a fractional scatterometer to obtain a series of drawn diffraction features. This feature has a different focus step, and the two polarization links S and P. The sixth figure is a chart of the diffraction difference determined by the root mean square error drawn according to the focus; '$ seventh The ones shown in Figures A and B are parabolic curve charts containing the minimum values of the narrow and wide focus centers, respectively. The one shown in Figure 8 is to find the center of focus from the diffraction feature difference of many positions in the scene. A 3D chart showing the center of focus as a function of position in the scene; and the one shown in Figure 9 is the center of focus obtained from the diffraction feature difference of a tilted surface in the scene, showing 3 D of the platform tilt effect as the focal center of a position function in the scene Table.

第27頁Page 27

Claims (1)

552464552464 種用以測量一光刻裴置相關各參數的方法,莫包 括下列各步驟: ^ ^ ^ 基板,該基板上設有利用光刻裝置而以光刻製程 杜;"、的若干繞射光柵,該等繞射光栅包括若干分隔的元 旦:,一輻射源式工具,對若干繞射光 的至少三個測 s繞射特徵;和 確疋該等繞射特徵之間的差,以確定光刻裝置的意欲參數 2·如 一晶圓。 3 · 如 工具包括 4 · 如 具包括一 範圍掃目苗 所得到之 5·如 具包括一 6 ·如 具包括若 7 ·如 申睛專利範圍第1項所述之方法,其 申請專利範 一光源式工 申請專利範 圍第1項所述之方法,其中輻射源式 具。 繞射特徵的 申請專利範 分角散射計 申睛專利範 干雷射束源 申請專利範 圍第3項所述之方法,其中光源式工 入射雷射束源,使該雷射束聚焦和對某個入射角 的一光學系統,和用以對所得到之測量角度偵知 一偵知器 圍第4項所述之方法,其中光源式工 〇 圍第3項所述之方法,其中光源式工 〇 具包括一寬光譜的入 長範圍照明的一光學 圍第3項所述之方法’其中光源式工 射光源,使該光聚焦和對某個入射切 系統,和用以對所得到之測量波長^A method for measuring various parameters related to a photolithography device includes the following steps: ^ ^ ^ a substrate, which is provided with a plurality of diffraction gratings using a photolithography device and a photolithography process; The diffraction gratings include a number of separated New Year's Day: a radiation source tool, measuring at least three s-diffraction features of several diffracted lights; and determining the difference between the diffraction features to determine the lithography Desired parameters of the device 2. Like a wafer. 3 · If the tool includes 4 · If the tool includes a range of eyebrows 5 · If the tool includes a 6 · If the tool includes 7 · The method described in item 1 of the patent scope of Shenjing, its patent application The method described in item 1 of the scope of patent application of a light source type worker, wherein the radiation source type tool. Diffraction feature patent Fan Angular Scatterometer Shen Jing Patent Fangan laser beam source patent application method described in item 3, wherein the light source type incident laser beam source, focus the laser beam and An optical system at each incident angle, and the method described in item 4 for detecting the obtained measurement angle of a detector, wherein the method described in item 3 is used for the light source type, and 〇 A method described in item 3 of an optical range including a wide-spectrum, long-range illumination, wherein the light source is an industrial light source, which focuses the light and cuts a certain incident system, and is used to measure the obtained Wavelength ^ 552464 、申請專利範圍 知所得到之繞射特徵的一偵知器。 8 ·如申請專利範圍第3項所述之方法,其中光源式工 具包括一入射光源,若干用以改變s和?偏振之幅度與相位 的組件’使該光束聚焦和對某個入射相位範圍照明的一光 學糸統’和用以偵知所得到之繞射特徵相位的一偵知器。 9·如申請專利範圍第1項所述之方法,其中測量繞射 特徵的步驟包括利用以一固定角,一可變角㊀或一可變角 Φ操作的一種寬光譜輻射源式工具源來進行相位測量。 10·如申請專利範圍第丨項所述之方法,其中測量繞 特徵的步驟包括利用以一固定角,一可變角㊀或一可變角 Φ操作的一種單波長輻射源式工具源來進行相位測量。 11.如申明專利範圍第1項所述之方法,其中測量繞射 特徵的步驟包括利用一種多離散波長輻射源式工具 行相位測量。 ' +進 其中繞射特徵 其中繞射特徵 其中繞射特徵 其中繞射特徵 12·如申請專利範圍第1項所述之方法 是種反射式繞射特徵。 13·如申請專利範圍第1項所述之方法 是種透射式繞射特徵。 θ 1 4·如申請專利範圍第1項所述之方法 是種鏡面級繞射特徵。 15·如申請專利範圍第1項所述之方法 是種較高繞射級的繞射特徵。 刻裝置而二 16·如申請專利範圍第1項所述之方法552464, A scope of patent application A detector with known diffraction characteristics. 8 · The method as described in item 3 of the scope of patent application, wherein the light source type tool includes an incident light source, and several are used to change s and? The component of the magnitude and phase of polarization is an optical system that focuses the light beam and illuminates a range of incident phases, and a detector for detecting the phase of the diffraction characteristic obtained. 9. The method according to item 1 of the scope of patent application, wherein the step of measuring the diffraction characteristics includes using a wide-spectrum radiation source tool source operating at a fixed angle, a variable angle ㊀, or a variable angle Φ Take a phase measurement. 10. The method according to item 丨 of the patent application scope, wherein the step of measuring the surrounding feature includes using a single-wavelength radiation source tool source operated at a fixed angle, a variable angle ㊀, or a variable angle Φ Phase measurement. 11. The method of claim 1, wherein the step of measuring diffraction characteristics includes performing phase measurements using a multi-discrete wavelength source source tool. '+ 进 Where the diffraction feature Where the diffraction feature Where the diffraction feature Where the diffraction feature 12. The method described in item 1 of the scope of the patent application is a reflective diffraction feature. 13. The method described in item 1 of the scope of patent application is a transmission diffraction feature. θ 1 4 · The method described in item 1 of the scope of patent application is a mirror-level diffraction feature. 15. The method described in item 1 of the scope of patent application is a diffraction feature with a higher diffraction level. Engraving device and the method as described in item 1 of the scope of patent application 552464552464 六、申請專利範圍 確定二個鄰接聚焦設定之繞射光柵,其中該二繞射光栅之 間的繞射特徵差低於其它二個相鄰聚焦設定的繞射光栅之 間的繞射特徵差,因而參數即為光刻裝置的焦點中心。 17·如申請專利範圍第1 6項所述之方法’其中已知的不 同聚焦設定是等增量的不同聚焦設定。 18·如申請專利範圍第1 6項所述之方法,其中已知的不 同聚焦設定是不等增量的不同聚焦設定,該方法另包括使 用一數學算法而讓不等增量的不同聚焦設定正規化。6. The scope of the patent application determines two diffraction gratings adjacent to the focus setting, wherein the diffraction feature difference between the two diffraction gratings is lower than that of the other two adjacent focus settings. Therefore, the parameter is the focal center of the lithographic apparatus. 17. The method as described in item 16 of the scope of the patent application, wherein the known different focus settings are different focus settings in equal increments. 18. The method as described in item 16 of the scope of patent application, wherein the known different focus settings are different focus settings of unequal increments, and the method further includes using a mathematical algorithm to allow different focus settings of unequal increments normalization. 19·如申請專利範圍第1 6項所述之方法,其中繞射光柵 之間的繞射特徵差係以以在焦點中心之斜度為零的一拋物 曲線的近似值增量。 20·如申請專利範圍第1項所述之方法,其中對繞射光 柵之間的繞射特徵差予以確定的步驟包括使用一度量制來 確定該差。 21·如申請專利範圍第2 〇項所述之方法,其中度量制是 種均方根誤差的資料分析法。 2 2 ·如申請專利範圍第1項所述之方法,其中確定最小 I的步驟包括對繞射光栅之間的繞射特徵差進行加權平均 值的比較。 2 3 ·如申請專利範圍第1項所述之方法,另包括使用相 同聚焦設定之光刻裝置來形成若干繞射光柵,和確定彼此 間的差以供作為該等繞射光柵在基板上的一個位置函數。 24·如申請專利範圍第1項所述之方法,另包括以已知 不同♦焦ό又疋和已知的不同劑;g;設定來形成若干繞射光19. The method as described in item 16 of the scope of patent application, wherein the difference in diffraction characteristics between the diffraction gratings is increased by an approximation of a parabolic curve with a slope of zero at the center of the focus. 20. The method according to item 1 of the scope of the patent application, wherein the step of determining a difference in diffraction characteristics between the diffraction gratings includes using a measurement system to determine the difference. 21. The method described in item 20 of the scope of patent application, wherein the measurement system is a data analysis method of root mean square error. 2 2 The method as described in item 1 of the scope of the patent application, wherein the step of determining the minimum I includes a comparison of the weighted average of the diffraction feature differences between the diffraction gratings. 2 3 · The method as described in item 1 of the scope of patent application, further comprising using a lithographic apparatus with the same focus setting to form a plurality of diffraction gratings, and determining the difference between each other for use as the diffraction gratings on the substrate. A position function. 24. The method as described in item 1 of the scope of the patent application, further comprising using known different focal lengths and known different agents; g; set to form a number of diffracted lights 第30頁 552464 六、申請專利範圍 ' _ 1 " -- 柵’以及確定劑量對焦點的效應。 β 2 5 ·如申明專利範圍第2 3項所述之方法,其中若干繞射 光4冊包括幾組相同的那些已知具有不聚焦設定的繞射光柵 ’這1¾組則是利用不同的已知劑量設定而變化。 26· 一種確定光刻裝置之焦點中心的方法,其包括 各步驟: 提供一基板,該基板上設有利用光刻裝置所製成的若干 ,射光柵,該等若干繞射光栅包括一些不同的已知聚焦設 定; 利用一輻射源式工具,對若干繞射光栅中的至少三 定繞射特徵; — 對相鄰聚焦設定之繞射光柵,測量其繞射特徵彼此間的 差;和 讀定作為聚焦設定的焦點中心,其中相鄰聚焦設定之繞 射光栅彼此間的繞射特徵具有最小的差。 " J:·如申請專利範圍第26項所述之方法,其中相鄰聚焦 設定之繞射光柵彼此間的繞射特徵差係以最小差之斜度^ 零的一拋物曲線的近似值增量。 ’ 28·如申請專利範圍第26項所述之方法,其中對相鄰聚 焦没定之繞射光柵彼此間的繞射特徵差予以確定的: 括使用一度量制來確定該差。 ^包 29·如申請專利範圍第28項所述之方法,其中度量制是 種均方根誤差的資料分析法。 疋 30·如申請專利範圍第26項所述之方法,其中確定最小Page 30 552464 VI. Patent Application Scope '_ 1 "-Grid' and determine the effect of dose on focus. β 2 5 · The method described in item 23 of the stated patent scope, in which 4 volumes of diffracted light include several groups of the same diffraction gratings known to have an out-of-focus setting. These 1¾ groups use different known Dose settings vary. 26. A method for determining the center of focus of a lithographic apparatus, comprising the steps of: providing a substrate on which a plurality of diffraction gratings made using the lithographic apparatus are provided; Known focus settings; use a radiation source tool to determine at least three diffraction characteristics of several diffraction gratings;-measure the differences between diffraction characteristics of adjacent grating settings for diffraction gratings; and read the settings As the focus center of the focus setting, the diffraction characteristics of the diffraction gratings of adjacent focus settings have the smallest difference. " J: · The method as described in item 26 of the scope of patent application, wherein the diffraction characteristic difference between the diffraction gratings of the adjacent focus settings is an approximation of a parabolic curve with a minimum difference slope of ^ zero . 28. The method according to item 26 of the scope of patent application, wherein the difference in diffraction characteristics between adjacent focusing diffractive diffraction gratings is determined: including using a metric system to determine the difference. ^ Package 29. The method described in item 28 of the scope of patent application, wherein the measurement system is a data analysis method of root mean square error.疋 30. The method described in item 26 of the scope of patent application, in which the minimum is determined ^2464^ 2464 差的步驟包括對相 徵差進轩‘说、τ鄰聚焦設定 徵差進行加權平聚焦設 差的步驟!: 3範圍第26項所;ί方法,其中確定最小 間繞射特科至對i目鄰聚焦設定的%射光柵,將得自其彼此 ^ u. ., 的資料適用到一摊物曲線,致使這最小差包 3邊拋物曲線的最小值。 匕 」曰曰:·圓如申請專利範圍第26項所述之方法,其中基板包括 工3^ ί中請專利範圍第26項所述之方法,其中輻射源式 工具包括一光源式工具。 飞 且34.如申請專利範圍第33項所述之方法,其中光源式工 II ^括一入射雷射束源,使該雷射束聚焦和對某個入射角 =掃瞄的一光學系統,和用以對所得到之測量角度偵知 得到之繞射特徵的一偵知器。 35·如申請專利範圍第34項所述之方法,其中光源式工 具包括一分角散射計。 3 6·如申請專利範圍第3 3項所述之方法,其中光源式工 具包括右干雷射束源。 3 7·如申請專利範圍第33項所述之方法,其中光源式工 具包括一寬光譜的入射光源,使該光聚焦和對某個入射波 長乾圍照明的一光學系統,和用以對所得到之測量波長债 知所得到之繞射特徵的一偵知器。 、 3 8·如申凊專利範圍第3 3項所述之方法,其中光源式工 具包括一入射光源,若干用以改變S和P偏振之幅度與相位The difference step includes the step of weighting the flat focus difference of the phase difference into the ‘said, τ adjacent focus setting, and the difference of the difference! : The method of 3 range item 26; the method in which the minimum interdiffraction teco to the% -ray grating set for the i-neighbor focus is applied to the data obtained from each other ^ u.., To a spread curve, This causes the minimum difference to include the minimum of the 3-sided parabolic curve. "The method described in item 26 of the scope of patent application, wherein the substrate includes the method described in item 26 of the patent scope, wherein the radiation source tool includes a light source tool. 34. The method as described in item 33 of the scope of patent application, wherein the light source type II includes an incident laser beam source to focus the laser beam and to an optical system with an incident angle = scanning, And a detector for detecting the diffraction characteristics obtained from the obtained measurement angle. 35. The method as described in claim 34, wherein the light source tool includes a fractional angle scatterometer. 36. The method as described in item 33 of the scope of patent application, wherein the light source type tool includes a right dry laser beam source. 37. The method according to item 33 of the scope of patent application, wherein the light source type tool includes a wide-spectrum incident light source, an optical system for focusing the light and dry-illuminating a certain incident wavelength, and an A detector that measures the wavelength characteristics and the diffraction characteristics obtained. 3. 38. The method as described in item 33 of the patent application, wherein the light source type tool includes an incident light source, and several are used to change the amplitude and phase of the S and P polarizations. 552464552464 的組件 學系統 39. 特徵的 Φ操作 40· 特徵的 Φ操作 41· 特徵的 行相位 ’使該 ’和用 如申請 步驟包 的一種 如申請 步驟包 的一種 如申請 步驟包 測量。 光束聚焦和對 所得到 以偵知 專利範 括利用 寬光言普 專利範 括利用 單波長 專利範 括利用 圍第26 以 固 輻射源 圍第26 以一固 輻射源 圍第26 一種多 某個入 之繞射 項所述 定角’ 式工具 項所述 定角’ 式工& 項所述 離散波 特徵相位 之方法, 一可變角 源來進行 之方法, 一可變角 源來進行 之方法, 長輻射源 圍照明 的一偵 其中測 Θ或一 相位測 其中測 ㊀或一 相位測 其中測 式工具 量繞 可變 量。 量繞 可變 量。 量繞 源來 4 2·如申請專利範圍第2 6項所述之方法,其中繞射特徵 是種反射式繞射特徵。 4 3·如申請專利範圍第2 6項所述之方法,其中繞射特徵 是種透射式繞射特徵。 44.如申請專利範圍第26項所述之方法,其中繞射特徵 是種鏡面級繞射特徵。 4 5·如申請專利範圍第2 6項所述之方法,其中繞射特徵 是種較高繞射級的繞射特徵。 4 6·如申請專利範圍第2 6項所述之方法,其中不同的聚 焦設定包括按序的不同聚焦設定之間的固定差。 4 7·如申請專利範圍第2 6項所述之方法,其中不同的已 知聚焦設定是不等增量的不同聚焦設定,該方法另包括使 用一數學算法而讓不等增量的不同聚焦設定正規化。39. Feature Φ operation 40 · Feature Φ operation 41 · Feature line phase ‘Make this’ and use as a kind of application step package as a kind of application step package as a measure of application step package. Focusing on the beam and detecting the obtained patented patents using a wide range of light patented patents using a single-wavelength patented patents using a range of 26 to a fixed radiation source 26th to a fixed radiation source 26th The term "fixed angle" of the diffraction term is used to describe the characteristic phase of the discrete wave described by the tool & term, a method to perform by a variable angle source, and a method by a variable angle source A long-range radiation source illumination has a detection method Θ or a phase measurement method and a phase measurement method or a phase measurement tool. Variables around variable quantities. Quantitative diffraction source 4 2 · The method described in item 26 of the patent application range, wherein the diffraction feature is a reflective diffraction feature. 4 3. The method as described in item 26 of the scope of patent application, wherein the diffraction feature is a transmission diffraction feature. 44. The method of claim 26, wherein the diffraction feature is a specular-level diffraction feature. 4 5. The method as described in item 26 of the scope of patent application, wherein the diffraction feature is a diffraction feature of a higher diffraction level. 46. The method as described in item 26 of the scope of patent application, wherein different focus settings include a fixed difference between sequentially different focus settings. 47. The method as described in item 26 of the scope of patent application, wherein different known focus settings are different focus settings of unequal increments, and the method further includes using a mathematical algorithm to allow different focus of unequal increments. Set normalization. 第33貢33rd Tribute
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553430B (en) * 2013-12-31 2016-10-11 A focusing leveling device
TWI631435B (en) * 2016-05-31 2018-08-01 上海微電子裝備(集團)股份有限公司 Focusing and leveling measuring device and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553430B (en) * 2013-12-31 2016-10-11 A focusing leveling device
TWI631435B (en) * 2016-05-31 2018-08-01 上海微電子裝備(集團)股份有限公司 Focusing and leveling measuring device and method
US10656507B2 (en) 2016-05-31 2020-05-19 Shanghai Micro Electronics Equipment (Group) Co., Ltd. Focusing and leveling measurement device and method

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