TWI551206B - Multilayer printed circuit board and method of manufacturing the same - Google Patents

Description

Multilayer printed circuit board and method of manufacturing same

The present invention relates to a multilayer printed circuit board and a method of fabricating the same.

Conventionally, regarding a method of manufacturing a multilayer printed circuit board having conductive patterns formed on two sides, there is a method of laminating a plurality of resin films in which a conductive pattern is formed only on one side thereof (for example, refer to Japanese Patent Application Publication No. 2003-86948).

In this manufacturing method, first, a plurality of resin films each having the same thickness are prepared.

Next, among the plurality of resin films, two arbitrary resin films are laminated such that the sides on which the conductive patterns are not formed face each other.

Then, the remaining resin films are laminated such that the side where the conductive pattern is formed and the side where the conductive pattern is not formed face each other.

Then, the laminated resin film is heated by applying pressure to manufacture a multilayer circuit board.

According to the manufacturing method, since only a resin film in which a conductive pattern is formed on one side is used, a conductive pattern is formed on both sides of the resin film. The processing becomes unnecessary, so that the process of the multilayer printed circuit board is simplified as compared with the case where the resin film having the conductive pattern formed on one side and the resin film having the conductive pattern formed on both sides are used together .

Further, when resin films each having a different thickness are used, these resin films having respective thicknesses must be separately manufactured. However, according to the above manufacturing method, since only a plurality of resin films each having a single thickness are manufactured, the process of the multilayer printed circuit board can be simplified.

However, since a plurality of resin films each having the same thickness are laminated, the following problems occur in the multilayer printed wiring board after being manufactured by the above-described conventional manufacturing method.

That is, when considering the thickness of the dielectric disposed between the conductive patterns of the adjacent resin films, the resin thickness of the single resin film is equal to the thickness of the dielectric in the laminated portion of the other resin film.

On the other hand, the resin thickness of the two resin film is equal to the thickness of the dielectric in the portion where the two resin films are laminated.

Therefore, since the thickness of the dielectric is different in the portion where the two resin films are laminated and the portion laminated on the other resin film, high frequency signals are obtained when a high frequency circuit is formed in the multilayer printed circuit board. The formula of the impedance of the transmission line becomes complicated.

For example, in the case of a conductive pattern in which a portion of the other resin film is laminated, when a conductive pattern of a portion of the above-mentioned two resin film lamination is used as a transmission line, an interval between the transmission line and a conductive pattern located outside the transmission line will be different.

For this reason, the conductive pattern in the outer side of the transmission line and the transmission line The effect of the dielectric thickness on the impedance will vary.

Therefore, if a conductive pattern of a portion in which the above two resin films are laminated is used as a transmission line, the formula for calculating the impedance of the transmission line becomes complicated, and the circuit design will be very complicated.

Further, when the conductive pattern on the two sides of the multilayer printed circuit board is assigned to the ground line, and the conductive pattern inside the multilayer printed circuit board is used as the transmission line of the high-frequency signal, when forming the resin film of the multilayer printed circuit board When the number is an odd number, the interval between the transmission line and the ground line may be different on one side and the other side in the stacking direction.

That is, the transmission line becomes off-center in the stacking direction of the multilayer printed circuit board.

For this reason, the formula for calculating the impedance of the transmission line becomes complicated, and the circuit design becomes very complicated.

The present invention has been made in view of the problems disclosed above, and an object of the present invention is to provide a multilayer printed circuit board capable of facilitating circuit design in consideration of impedance, and a method of manufacturing a multilayer printed circuit board.

In the multilayer printed circuit board according to the first aspect, the multilayer printed circuit board includes a plurality of resin films and conductive patterns formed only on one side of each of the resin films.

In the plurality of resin films, the two resin films are laminated such that the sides where the conductive patterns are not formed may face each other.

Other resins excluding the previously described two resin films in a plurality of resin films The films are laminated such that the side where the conductive pattern is formed and the side where the conductive pattern is not formed face each other.

All the intervals between the conductive patterns in the lamination direction are the same in the portion where the other resin films are laminated.

The interval between the conductive patterns in the lamination direction in the portion where the two resin films are laminated is the same as the interval in the portion in which the other resin film is laminated.

In the method of manufacturing a multilayer printed circuit board according to the second aspect, the method includes: a preparation process for preparing a plurality of resin films, wherein the conductive pattern is formed only on one side of each resin film; a lamination process for A plurality of resin films are laminated; and a pressure heat treatment is performed to apply pressure when a plurality of resin films are laminated by heating.

In the plurality of resin films, in the lamination process, the two resin films are laminated such that the sides where the conductive patterns are not formed face each other.

In the lamination process, other resin films excluding the previously described two resin films in the plurality of resin films are laminated such that the side where the conductive pattern is formed and the side where the conductive pattern is not formed face each other.

A plurality of resin films each having the same resin thickness are prepared for use in other resin films in the preparation process, and, in the preparation process, a two-resin film having a resin thickness sum equal to that of the other single resin films is prepared. Used for these two resin films.

According to the invention, in the portion where the two resin films are laminated and the portion where the other resin films are laminated, the dielectric thickness between the conductive patterns formed in the adjacent resin films is made equal.

Therefore, when using a conductive pattern of a multilayer printed circuit board as a high frequency signal When the transmission line of the number is used, it is easy to calculate the impedance of the high-frequency signal line, and the circuit design can be made easy.

For example, even when any conductive pattern formed in a plurality of resin films is used as a transmission line of a high frequency signal, the dielectric between the transmission line in all transmission lines requiring impedance control and the conductive pattern located outside the transmission line can be made. The thickness is equal.

As a result, the influence of the dielectric thickness on the impedance is made equal in all transmission lines requiring impedance control.

Therefore, it is easy to calculate the impedance.

Further, when the conductive pattern on the two sides of the multilayer printed circuit board is assigned to the ground line, and when the conductive pattern in the inside of the multilayer printed circuit board is used as the transmission line of the high-frequency signal, when the resin film constituting the multilayer printed circuit board When the number is an odd number, the transmission line can be centered in the stacking direction.

Therefore, it is easy to calculate the impedance.

1‧‧‧Multilayer printed circuit board

2‧‧‧Active components

2a‧‧‧ lower electrode

10‧‧‧ resin film

10a‧‧‧ side

10b‧‧‧ side

11‧‧‧ conductive pattern

12‧‧‧ pathway

13‧‧‧ access hole

14‧‧‧through hole

15‧‧‧Metal powder

101‧‧‧Minyl resin film

102‧‧‧Minyl resin film

103‧‧‧ resin film

111‧‧‧ transmission line

111a‧‧‧ transmission line

111b‧‧‧ transmission line

112‧‧‧ Grounding wire

113‧‧‧ Grounding wire

201‧‧‧Multilayer printed circuit board

J1‧‧‧Multilayer printed circuit board

J201‧‧‧Multilayer printed circuit board

In the drawings: FIG. 1 is a cross-sectional view showing a multilayer printed circuit board in a first embodiment; FIG. 2 is an explanatory view showing a manufacturing method of the multilayer printed circuit board in the first embodiment; and FIG. 3 is a first comparative example. Description of a method of manufacturing a multilayer printed circuit board; FIG. 4 shows a section of a multilayer printed circuit board in the first comparative embodiment Figure 5 is an explanatory view showing a manufacturing method of the multilayer printed circuit board in the second embodiment; Figure 6 is a sectional view showing the multilayer printed circuit board in the second embodiment; and Figure 7 is a multi-layer printing in the third embodiment. FIG. 8 is a cross-sectional view showing a method of manufacturing a multilayer printed circuit board in a third embodiment; FIG. 9 is a cross-sectional view showing a multilayer printed circuit board in a fourth embodiment; FIG. 11 is a cross-sectional view showing a multilayer printed circuit board in a fifth embodiment; and FIG. 12 is an explanatory view showing a method of manufacturing the multilayer printed circuit board in the fifth embodiment; Figure 13 is an explanatory view showing a method of manufacturing a multilayer printed circuit board in a second comparative embodiment; Figure 14 is a cross-sectional view showing a multilayer printed circuit board in a second comparative embodiment;

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

It is to be understood that in the second embodiment and the subsequent embodiments, the same or similar components as those in the first embodiment will be given the same reference numerals, and the structure and features thereof will not be described.

[First Embodiment]

As shown in FIG. 1, the multilayer printed circuit board 1 of the present embodiment (hereinafter, simply referred to as the circuit board 1) is a circuit board having a conductive pattern 11 on both sides of the assembly, and an active component using a high frequency signal. 2 is built in circuit board 1.

The circuit board 1 has a structure in which a plurality of resin films 10 are laminated, wherein the conductive patterns 11 are formed only on one side of each of the resin films 10.

Each of the resin films 10 is made of a thermoplastic resin and adheres to each other. Each of the conductor patterns 11 is made of a metal foil such as copper foil. A via 12 is formed in each of the resin films 10 as an interlayer connection member. A plurality of stacked conductive patterns 11 are connected by vias 12. Each passage 12 is formed by a sintered metal powder embryo.

In the plurality of resin films 10, the two lowest resin films 101, 102 are laminated such that the side 10b where the conductive patterns 11 are not formed may face each other.

Further, the vias 12 formed in the two lowest resin films 101, 102 are joined.

The other resin films 103 excluding the two lowest resin films among the plurality of resin films 10 are laminated such that the side 10a on which the conductive patterns 11 are formed and the side 10b on which the conductive patterns 11 are not formed face each other.

The active component 2 using the high frequency signal is inserted into the through hole 14 of the other resin film 10. For example, active component 2 is an LSI (large scale) Component. The frequency band of the high frequency signal used in this specification is a digital signal of 3 kHz or higher.

The lower electrode 2a of the active component 2 is connected to the conductive pattern 11 and to the transmission line 111 of the high frequency signal disposed inside the circuit board 1.

Each of the conductive patterns 11 formed on the plurality of resin films 10 constitutes a transmission line 11 of high frequency signals and ground lines 112, 113.

In the present embodiment, one of the conductive patterns 11 formed on the two lowest resin films 101, 102 is assigned to the transmission line 111b of the high frequency signal requiring impedance control.

Further, some of the conductive patterns 11 formed on the other resin film 10 are assigned to the transmission line 111a of the high frequency signal requiring impedance control.

The conductive patterns 11 above and below the respective transmission lines 111a, 111b are assigned to the ground lines 112, 113.

In any of the transmission lines 111a, 111b, the interval between the transmission line 111 and the conductive patterns 112, 113 located outside the transmission line 111 is equal.

Next, a method of manufacturing the circuit board 1 of the present embodiment will be described using FIG.

Further, Fig. 2 shows the arrangement order of the plurality of resin films 10 before the pressure heating.

First, a preparation process for preparing a plurality of resin films 10 in which the conductive patterns 11 are formed only on one side of each of the resin films 10 is performed.

At this time, as shown in FIG. 2, a plurality of resin films each having the same resin thickness d3 are prepared for use in the second lowest film removal of the plurality of resin films 10. The other resin film 103 is external.

On the other hand, a two-resin film having a total resin thickness d1, d2 which is the same as the resin thickness d3 of the other single resin film 103 is prepared for use in the two lowest resin films 101, 102.

In the present embodiment, the respective resin thicknesses d1 and d2 of the two lowest resin films 101 and 102 are set to be one-half of the resin thickness d3 of the other single resin film 103.

For example, the resin thickness d3 of the other single resin film 103 before the pressure heating is set to 50 μm (micrometer), and the respective resin thicknesses d1 and d2 of the lowest resin films 101 and 102 are set to 25 μm.

Next, a metal foil is placed on one side of each resin film 10, and a conductive pattern 11 is formed by patterning a metal foil.

Then, via holes 13 are formed in each of the resin films 10 by laser light processing.

At this time, the laser output is adjusted in accordance with the thicknesses d1 and d2 of the two lowest resin films 101 and 102 and the thickness d3 of the other resin film 103.

Then, the via hole 13 is filled with the paste metal powder 15 for via formation.

Further, in the laser light processing, in some other resin film 103, a through hole 14 for inserting the active component 2 is formed.

Then, a lamination process for laminating a plurality of resin films 10 is performed.

At this time, as shown in FIG. 2, first, the two lowest resin films 101, 102 are laminated such that the sides 10b where the conductive patterns 11 are not formed face each other.

Then, the other resin films 103 among the plurality of resin films 10 excluding the two lowest films are laminated such that the side 10a on which the conductive patterns 11 are formed and the side 10b on which the conductive patterns 11 are not formed face each other.

In other words, the resin film 10 except the lowest resin film 101 is laminated on the side 10a on the surface on which the conductive pattern 11 is formed, and the lowest resin film 101 is turned upside down and laminated.

Further, when the other resin film 103 is laminated, the active component 2 is inserted in the through hole 14.

Then, a pressure applying heat treatment is performed to pressurize when the plurality of laminated resin films 10 are heated.

Therefore, when the resin flows in to fill the gap between the active component 2 and the resin film 10 and is integrated, the resin films 10 are adhered to each other and integrated.

Further, the metal powder 15 is sintered and the passage 12 is formed by heat during the treatment.

Thus, the circuit board 1 shown in Fig. 1 is fabricated.

Here, a method of manufacturing a multilayer printed wiring board and a multilayer printed wiring board after the first comparative example is manufactured will be described.

In the first comparative example, as shown in FIG. 3, the respective thicknesses d1, d2 of the two lowest resin films 101, 102 are set to be the same as the thickness d3 of the other resin film 10. That is, all of the plurality of resin films 10 prepared are identical to each other. Other configurations are the same as those of the present embodiment.

In this case, as shown in FIG. 4, the multilayer printed circuit board J1 after fabrication is formed on the laminated portion of the two lowest resin films 101, 102. In the transmission line 111b composed of the conductive pattern 11 and the transmission line 111a composed of the conductive pattern 11 formed on the laminated portion of the other resin film 103, the interval between the transmission line 111 and the conductive patterns 112, 113 located outside thereof is different.

Specifically, in the transmission line 111a, the interval above and below the conductive pattern 11 located outside the transmission line 111 is equal to the resin thickness T1 of the single resin film 10.

On the other hand, in the transmission line 111b, the interval between the transmission line 111 and the conductive pattern 11 located above it is equal to the resin thickness T1 of the other signal resin film 103.

Then, the interval between the transmission line 111 and the conductive pattern 11 located thereunder is equal to the resin thickness T2 of the two resin films 10.

For this reason, in the portion where the two resin films 101 and 102 are laminated, the thickness of the dielectric on the two sides in the stacking direction of the transmission line 111b is different from that of the other resin film 103. The thickness of the dielectric located on both sides in the stacking direction of the transmission line 111a is different.

In other words, in the portion where the other resin films 103 are laminated, the transmission line 111 located between the ground lines 112, 113 is located at the center between the ground lines 112, 113.

However, in the portion where the two lowest resin films 101, 102 are stacked, the transmission line 111 located between the ground lines 112, 113 is disposed away from the center between the ground lines 112, 113.

Here, if the thicknesses of the dielectrics on the two sides in the stacking direction of the transmission line are the same, the dielectric thickness is for the transmission line 111 of the high-frequency signal. The impedance has the same effect, so that the impedance of the transmission line can be calculated using the general formula.

However, since the thickness of the dielectric located in the two sides in the stacking direction of the transmission line 111b is different in the portion where the two lowest resin films 101, 102 are stacked, the influence of the dielectric thickness on the impedance of the transmission line 111 will be different.

For this reason, for the transmission line 111b formed of the conductive pattern 11 formed in the laminated portion of the two lowest resin films 101, 102, the formula for calculating the impedance will become complicated, and the range of the degree of effectiveness will be narrowed to a given Accuracy.

Therefore, in the multilayer printed circuit board J1 of the first comparative embodiment, the problem of generating a formula for calculating the impedance of the transmission line 111 becomes complicated, and the circuit design will be very complicated.

In contrast, in the manufacturing method of the circuit board 1 of the present embodiment, first, a plurality of resin films having the same resin thickness d3 as each other are prepared for use in other resins among the plurality of resin films 10 excluding the two lowest films. Membrane 103.

Then, a total of two resin films having the resin thicknesses d1, d2 of the resin thickness d3 of the other single resin film 103 are prepared for use in the two lowest resin films 101, 102.

For this reason, when viewing the cross-sectional structure of the manufactured circuit board 1, as shown in FIG. 1, in the portion where the two lowest resin films 101, 102 are laminated, and the portion where the other resin film 103 is laminated, adjacent The intervals T1 and T2 of the conductive pattern 11 of the resin film 10 become equal.

In other words, the thicknesses T1 and T2 of the dielectric disposed between the conductive patterns 11 of the adjacent resin films 10 become equal.

Therefore, according to the present embodiment, even if the portion of the conductive pattern 11 in which the two minimum resin films 101, 102 are laminated and the conductive pattern 11 in which the other resin film 103 is laminated serves as the transmission line 111 of the high-frequency signal, the transmission line 111 and The interval between the conductive patterns 11 located outside the transmission line 111 is disposed with the resin thickness of a single piece of the other resin film 10 among all the transmission lines 111 of the high-frequency signal.

As a result, the thickness of the dielectric disposed between the transmission line 111 and the conductive pattern 11 located outside the transmission line 111 is made equal, and the dielectric thickness of all the transmission lines 111 has the same influence on the impedance.

Therefore, it is easy to calculate the impedance, and it is possible to make the circuit design considering the impedance easy.

[Second embodiment]

The present embodiment changes the thickness of the two lowest resin films 101, 102 with respect to the thickness of the lowest resin films 101, 102 of the first embodiment.

In the present embodiment, as shown in FIG. 5, in the preparation process for manufacturing the multilayer printed circuit board 1, a total contract for preparing the resin thicknesses d1, d2 and having the resin thicknesses d1, d2 is obtained from the other single resin film 103. A resin film having a resin thickness d3 of two is used for the two lowest resin films 101, 102.

For example, the resin thickness d3 of the other single resin film 103 before the pressure heating is set to 50 μm (micrometer), and the second minimum resin film The resin thicknesses d1 and d2 of 101 and 102 were set to 20 μm and 30 μm, respectively.

The rest is the same as the first embodiment.

Therefore, also in the present embodiment, as shown in Fig. 6, the total thickness T2 of each resin thickness T1 of the other resin film 103 and the resin thickness of the two lowest resin films 101, 102 becomes equal to a single one in the circuit board 1 after manufacture. The resin thickness of the resin film 10 is T1.

Therefore, the present embodiment can also achieve the same effects as the first embodiment.

[Third embodiment]

This embodiment changes the positioning of the active component 2 with respect to the active component 2 of the first embodiment.

That is, as shown in Fig. 7, the active unit 2 is mounted on the outer surface of the circuit board in the circuit board 1 of the present embodiment.

The rest of the structure is the same as that of the first embodiment.

As shown in FIG. 8, the circuit board 1 is manufactured by changing the manufacturing method described in the first embodiment to position the active component 2 on the outer surface of the circuit board.

Specifically, after the circuit board 1 is manufactured, the lower electrode 2a of the active component 2 is attached to the conductive pattern 11 of the outer surface of the circuit board by soldering or the like.

In the present embodiment, since the positioning of the active unit 2 is excluded, the structure of the circuit board 1 is the same as that of the first embodiment, so that the same effects as those of the first embodiment can be obtained.

[Fourth embodiment]

This embodiment is a combination of the second and third embodiments.

That is, as shown in FIG. 9, the active unit 2 is mounted on the outer surface of the circuit board in the circuit board 1 of the present embodiment.

Further, as shown in FIG. 10, in the preparation process for manufacturing the multilayer printed circuit board 1, the resin thickness d3 which is contracted to the other single resin film 103, which has different resin thicknesses d1, d2 and which have the resin thicknesses d1, d2, is prepared. The resin film is used for the two lowest resin films 101 and 102.

For this reason, except for the positioning of the active component 2 in the circuit board 1 of the present embodiment, the structure of the circuit board 1 is the same as that of the second embodiment.

Therefore, the present embodiment can also achieve the same effects as the first embodiment.

[Fifth Embodiment]

As shown in FIG. 11, the multilayer printed circuit board 201 of the present embodiment has a conductive pattern 11 on both sides thereof and serves as a cable for transmitting a high frequency signal.

This multilayer printed circuit board 201 has a structure similar to that of the first embodiment in which a plurality of resin films 10 are laminated, and in the resin film 10, the conductive patterns 11 are formed only on one side.

The conductive patterns 11 formed on both sides of the multilayer printed circuit board 201 constitute ground lines 112, 113, and the conductive patterns 11 located at the center in the stacking direction of the multilayer printed circuit board 201 constitute a transmission line 111 of high frequency signals.

Specifically, five resin films 10 are laminated in the multilayer printed circuit board 201.

The two lowest resin films 101, 102 are laminated such that the sides 10b where the conductive patterns 11 are not formed face each other.

The other resin films 103 excluding the two lowest resin films are laminated such that the side 10a on which the conductive patterns 11 are formed and the side 10b on which the conductive patterns 11 are not formed face each other.

One of the conductive patterns 11 formed on the other resin film 103 of the third sheet starting from the bottom is assigned to the transmission line 111 of the high frequency signal.

Further, the ground lines 112 and 113 are electrically connected via vias 12 formed in the respective resin films 10.

As shown in Fig. 12, a multilayer printed circuit board 201 having this structure was fabricated in the same manner as the manufacturing method of the first embodiment.

That is, also in the present embodiment, a resin film having a resin thickness d1, d2 having a total resin thickness d3 of the other resin film 103 is prepared for use in the two lowest resin films 101, 102.

At this time, the respective resin thicknesses d1 and d2 of the two lowest resin films 101 and 102 may be set to be half of the resin thickness d3 of the other single resin film 103, or may be different thicknesses.

Here, a method of manufacturing the multilayer printed circuit board in the second comparative example and a multilayer printed circuit board after the manufacture will be described.

In the second comparative example, as shown in FIG. 13, the respective thicknesses d1, d2 of the two lowest resin films 101, 102 are set to be the same as the thickness d3 of the other resin film 10. That is, all of the plurality of resin films 10 prepared are the same of. The rest of the configuration is the same as this embodiment.

In this case, as shown in FIG. 14, since the odd-numbered resin films 10 are stacked, in the multilayer printed circuit board J201 after fabrication, between the transmission line 111 and the ground lines 112, 113 located outside the transmission line 111. The interval is different in one side in the stacking direction from the other side.

That is, the transmission line 111 of the high-frequency signal becomes off-center in the stacking direction of the multilayer printed circuit board J201.

For this reason, in the multilayer printed circuit board J201, the equation for calculating the impedance becomes complicated for the transmission line, and the range of the operation parameters will be narrowed.

Therefore, in the multilayer printed circuit board J201 of the second comparative example, a problem that the equation for calculating the impedance of the transmission line 111 is complicated becomes complicated, and the circuit design will be very complicated.

On the contrary, the present embodiment and the manufacturing method of the circuit board 201 of the first embodiment are prepared by using a plurality of resin films each having the same resin thickness d3 for the other resin film 103, and manufacturing the resin thicknesses d1 and d2. The resin film of the resin film thickness d3 of the other resin film 103 is mainly contracted for the two lowest resin films 101 and 102.

For this reason, when viewing the cross-sectional structure of the manufactured circuit board 201, as shown in FIG. 11, in the portion where the two lowest resin films 101, 102 are laminated and the portion laminated on the other resin film 103, adjacent The intervals T1 and T2 of the conductive patterns 11 of the resin film 10 become equal.

In other words, the thicknesses T1 and T2 of the dielectric between the conductive patterns 11 of the adjacent resin films 10 become equal.

Therefore, when the number of sheets of the resin film 10 constituting the multilayer printed circuit board 201 is considered to be an odd number, the interval between the transmission line 111 and the ground lines 112, 113 located outside the transmission line 111 can be made equal.

In other words, the transmission line 111 of the high-frequency signal is disposed at the center in the stacking direction of the multilayer printed circuit board J201.

Therefore, it is easy to calculate the impedance, and it is possible to make the circuit design considering the impedance easy.

[Other Embodiments]

The present invention is not limited to the above embodiments, and may be appropriately changed without departing from the scope of the invention.

(1) In the above embodiments, although the two resin films 101, 102 are disposed at the lowest portion of the multilayer printed circuit board 1, 201, the two resin films 101, 102 may be located outside the lowest portion of the configuration, for example, At the center of the multilayer printed circuit board 1, 201.

(2) Although the grounding lines 112 and 113 are disposed above and below the transmission line 111 in the first to fourth embodiments, the present invention is not limited to this configuration.

When the transmission line 111 of the high frequency signal is constituted by the conductive pattern 11 on the surface of the multilayer printed circuit board, the ground line will be disposed on only one side in the vertical direction.

(3) Although all of the plurality of resin films 10 are made of a thermoplastic resin in the above embodiment, all of the plurality of resin films 10 may be made of a thermosetting resin.

Further, a resin film made of a thermoplastic resin can be used as the resin film 10 together with a resin film made of a thermosetting resin.

(4) Each of the above embodiments is not mutually exclusive, and may be combined as appropriate in addition to the case of being unambiguous.

Further, in each of the above embodiments, the elements constituting the embodiment are not necessarily indispensable, except that the case where the element is indispensable is clearly stated, or the case where the element is theoretically indispensable is clearly explained.

2‧‧‧Active components

2a‧‧‧ lower electrode

10‧‧‧ resin film

10a‧‧‧ side

10b‧‧‧ side

11‧‧‧ conductive pattern

13‧‧‧ access hole

14‧‧‧through hole

15‧‧‧Metal powder

101‧‧‧Minyl resin film

102‧‧‧Minyl resin film

103‧‧‧ resin film

D1, d2, d3‧‧‧ resin thickness

Claims (2)

A multilayer printed circuit board comprising: a plurality of resin films (10); and a conductive pattern (11) formed only on one side of each of the resin films and constituting a transmission line (111) of a high frequency signal of 3 kHz or higher And a grounding wire (112, 113); wherein, in the plurality of resin films, the two resin films (101, 102) are laminated such that sides (10b) not forming the conductive patterns face each other; The other resin films (103) except the two resin films in the resin film are laminated such that the side (10a) on which the conductive patterns are formed and the side on which the conductive patterns are not formed face each other; the other resin film is laminated In the portion, all the intervals (T1) between the conductive patterns are the same in the stacking direction; and in the portion where the two resin films are stacked, between the conductive patterns in the stacking direction The interval (T2) is the same as the interval (T1) in the portion in which the other resin film is laminated. A manufacturing method of a multilayer printed circuit board, comprising: a preparation process for preparing a plurality of resin films (10), wherein a conductive pattern (11) is formed only on one side of each of the resin films, and constitutes 3 kHz or a higher high frequency signal transmission line (111) and a ground line (112, 113); a lamination process for laminating the plurality of resin films; and a pressure heat treatment for applying pressure when heating the stacked plurality of resin films Wherein, in the plurality of resin films, in the lamination process, two The resin films (101, 102) are laminated such that sides (10b) where the conductive patterns are not formed face each other; in the lamination process, other resin films excluding the two resin films in the plurality of resin films ( 103) laminating such that sides (10a) on which the conductive patterns are formed and sides on which the conductive patterns are not formed face each other; in the preparation process, a plurality of resins each having the same resin thickness (d3) are prepared a film for use in the other resin films; and in the preparation process, preparing two resin films having a resin thickness (d1, d2) which is the same as a resin thickness of the other single resin film, for use in the preparation Wait for two resin films.