TWI550283B - High voltage detection module of high voltage detection device and its detection method - Google Patents

High voltage detection module of high voltage detection device and its detection method Download PDF

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TWI550283B
TWI550283B TW104114650A TW104114650A TWI550283B TW I550283 B TWI550283 B TW I550283B TW 104114650 A TW104114650 A TW 104114650A TW 104114650 A TW104114650 A TW 104114650A TW I550283 B TWI550283 B TW I550283B
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electrode group
high voltage
multilayer capacitor
module
voltage detecting
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TW104114650A
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TW201640127A (en
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De-Kun Huang
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Description

積層電容器之高壓檢測模組、高壓檢測設備及其檢測方法 High-voltage detection module of multilayer capacitor, high-voltage detection device and detection method thereof

本發明係關於一種積層電容器之高壓檢測模組、高壓檢測設備及其檢測方法,尤指一種適用於對積層電容器施予高電壓測試之檢測模組、檢測設備及其檢測方法。 The invention relates to a high voltage detecting module, a high voltage detecting device and a detecting method thereof for a laminated capacitor, in particular to a detecting module, a detecting device and a detecting method thereof suitable for applying a high voltage test to a laminated capacitor.

隨著電子裝置的尺寸不斷地追求輕薄短小,積層電容器相較於傳統陶瓷電容器在體積上明顯具備優勢,故積層電容器的需求量不斷地攀升,且電容器規格上的發展也益趨多元。然而,就現有積層電容器的檢測設備可容許之檢測規格及檢測方法而言,實已無法符合需求。 As the size of electronic devices is constantly pursuing lightness and thinness, multilayer capacitors have obvious advantages in volume compared with conventional ceramic capacitors, so the demand for multilayer capacitors continues to rise, and the development of capacitor specifications is also diversified. However, in terms of the test specifications and detection methods that the existing multilayer capacitor test equipment can tolerate, it has not been able to meet the demand.

請同時參閱圖1A、及圖1B,圖1A係習知轉盤式檢測設備之示意圖,圖1B係習知轉盤式檢測設備之A-A線段局部剖面示意圖。圖1A、及圖1B中顯示一種轉盤式檢測設備,其主要利用一轉盤機構91進行進料和移載,而待測和完測的積層電容器C容設於轉盤機構91上的凹槽910內,轉盤機構91的兩側都設有滾輪式電極92,當轉盤機構91兩側的滾輪式電極92滾到並接觸積層電容器C時即進行檢測。 Please refer to FIG. 1A and FIG. 1B simultaneously. FIG. 1A is a schematic diagram of a conventional rotary type detecting device, and FIG. 1B is a partial cross-sectional view of the A-A line segment of the conventional rotary type detecting device. 1A and 1B show a rotary disc type detecting device which mainly uses a turntable mechanism 91 for feeding and transferring, and the laminated capacitor C to be tested and completed is accommodated in the recess 910 on the turntable mechanism 91. Roller electrodes 92 are provided on both sides of the turntable mechanism 91, and are detected when the roller electrodes 92 on both sides of the turntable mechanism 91 roll up and contact the laminated capacitor C.

然而,習知轉盤式檢測設備之高壓測試最多 僅能進行1000伏特以下之測試;而且,長久測試下來,積層電容器C難免會殘留金屬餘屑於凹槽910內,當累積至一定的量,很容易因為高電壓而形成突波,輕則影響檢測之準確度,重則突波可能擊傷積層電容器C,或甚至損壞檢測設備。 However, the high-voltage test of the conventional rotary type testing equipment is the most Only the test below 1000 volts can be performed; and, for a long time test, the laminated capacitor C inevitably leaves residual metal chips in the groove 910. When accumulated to a certain amount, it is easy to form a glitch due to the high voltage, which affects lightly. The accuracy of the detection, in the case of a sudden surge, may damage the build-up capacitor C, or even damage the detection device.

請同時參閱圖2A、及圖2B,圖2A係習知並聯式檢測設備之示意圖,圖2B係習知並聯式檢測設備B-B線段之局部剖面示意圖。圖2A、及圖2B中顯示一種並聯式檢測設備,其主要利用一震動軌道93進行進料,當待測試之積層電容器C進給至一定位件94時,會透過一移載機構(圖中未示)將積層電容器C移載到一檢測裝置95內進行高壓檢測。如圖2B中所示,該檢測裝置95包括多個貫穿槽951,而積層電容器C則置於貫穿槽951內,並有二個針狀電極96伸入貫穿槽951內並接觸積層電容器C後進行高壓測試。 Please refer to FIG. 2A and FIG. 2B simultaneously. FIG. 2A is a schematic diagram of a conventional parallel detecting device, and FIG. 2B is a partial cross-sectional view of a conventional parallel detecting device B-B line segment. 2A and 2B show a parallel type detecting device, which mainly uses a vibration track 93 for feeding. When the multilayer capacitor C to be tested is fed to a positioning member 94, it passes through a transfer mechanism (in the figure). The multilayer capacitor C is transferred to a detecting device 95 for high voltage detection. As shown in FIG. 2B, the detecting device 95 includes a plurality of through slots 951, and the multilayer capacitor C is placed in the through slot 951, and two needle electrodes 96 extend into the through slots 951 and contact the laminated capacitor C. Perform a high voltage test.

然而,此一並聯式檢測設備必須由貫穿槽951來協助固定積層電容器C,如同前段所述之習知轉盤式檢測設備,長久使用下來因為金屬餘屑之殘留,很容易會產生突波,將影響檢測之準確度,或有可能造成積層電容器C或檢測設備之損毀。另一方面,並聯式檢測設備係同時對同批次檢測之積層電容器C進行並聯測試,故一旦檢測出有異常的量測值時,將無法即時辨別該批次中究竟哪一個或哪些為不良品,通常整批次淘汰,否則將必須逐一的重新檢測。 However, this parallel type detecting device must be assisted by the through-groove 951 to fix the laminated capacitor C. As in the conventional rotary-type detecting device described in the preceding paragraph, it is easy to generate a surge due to the residual metal scrap. Affects the accuracy of the test, or may cause damage to the multilayer capacitor C or the detection device. On the other hand, the parallel type detection equipment performs parallel test on the multilayer capacitor C of the same batch detection at the same time, so once an abnormal measurement value is detected, it is impossible to immediately identify which one or which of the batch is not Good products, usually eliminated in the whole batch, otherwise they will have to be re-tested one by one.

此外,上述之習知轉盤式檢測設備或習知並 聯式檢測設備不論有無與積層電容器C構成電性接觸,都是直接進行高壓測試。也就是說,習知的檢測設備並未進行所謂的接觸測試(contact check),故無法排除因電性接觸問題所產生之測試失效。然而,針對此一情況,習知設備都會將積層電容器C直接判斷為不良品,無法偵測接觸不良之情形,嚴重影響測試的準確度。 In addition, the above-mentioned conventional rotary type detecting device or conventional The joint test equipment is directly subjected to high voltage test regardless of whether it is in electrical contact with the multilayer capacitor C. That is to say, the conventional detecting device does not perform a so-called contact check, so that the test failure due to the electrical contact problem cannot be excluded. However, in this case, the conventional device will directly judge the laminated capacitor C as a defective product, and cannot detect the situation of poor contact, which seriously affects the accuracy of the test.

本發明之主要目的係在提供一種積層電容器之高壓檢測模組、高壓檢測設備及其檢測方法,俾能提供高電壓之檢測,且能完全避免突波的形成,藉此提高檢測之準確率,不會造成積層電容器及檢測設備之毀損。 The main object of the present invention is to provide a high voltage detecting module, a high voltage detecting device and a detecting method thereof for a laminated capacitor, which can provide high voltage detection and can completely avoid the formation of a surge, thereby improving the accuracy of detection. Will not cause damage to the laminated capacitors and testing equipment.

本發明之另一目的係在提供一種積層電容器之高壓檢測模組、高壓檢測設備及其檢測方法,俾能先檢測電極組與積層電容器之電極端面是否完整接觸後再進行高壓測試,以先行確保檢測電極組與積層電容器構成導通後再進行高壓測試,避免測試失效或失準。 Another object of the present invention is to provide a high voltage detecting module, a high voltage detecting device and a detecting method thereof for a laminated capacitor, which can first detect whether the electrode end faces of the electrode group and the multilayer capacitor are in complete contact, and then perform a high voltage test to ensure first After the detection electrode group and the multilayer capacitor are turned on, a high voltage test is performed to avoid test failure or misalignment.

為達成上述目的,本發明一種積層電容器之高壓檢測模組主要包括一第一電極組、一第二電極組、以及一致動器;其中,第一電極組和第二電極組係分別對應於一積層電容器之二相對應的電極端面,且致動器係驅使第一電極組、及第二電極組中至少其一者朝彼此趨近以夾持積層電容器、或朝彼此遠離使積層電容器脫離。據此,本發明單純藉由第一電極組和第二電極組來夾持積層電容器並對其進行測試,並無其他的任何機構 或裝置來協助支撐或固定積層電容器,亦即進行懸空測試,直接以空氣作為絕緣,故將不會殘留金屬餘屑,亦不會產生突波。 In order to achieve the above object, a high voltage detecting module of a multilayer capacitor of the present invention mainly comprises a first electrode group, a second electrode group, and an actuator; wherein the first electrode group and the second electrode group respectively correspond to one The second electrode of the multilayer capacitor corresponds to the end face of the electrode, and the actuator drives at least one of the first electrode group and the second electrode group toward each other to sandwich the multilayer capacitor or to move away from each other to disengage the multilayer capacitor. Accordingly, the present invention simply sandwiches and tests the multilayer capacitor by the first electrode group and the second electrode group, and there is no other mechanism. Or the device to assist in supporting or fixing the laminated capacitor, that is, the suspension test, directly using air as insulation, so that no metal residuals will remain and no glitch will occur.

較佳的是,本發明一種積層電容器之高壓檢測模組之第一電極組和第二電極組可分別包括二片狀電極,而該二片狀電極係彼此絕緣;而且,第一電極組、及第二電極組係以該等片狀電極彼此相對應之側端面來夾持積層電容器。據此,本發明透過二片狀電極之設置,可進行俗稱之凱文(Kelvin)測試規範或稱四線(4-wire)測試規範,亦即透過接觸測試來檢測二片狀電極是否與積層電容器的電極端面完整接觸而構成導通,可充分避免因接觸不良所導致之測試失效。 Preferably, the first electrode group and the second electrode group of the high voltage detecting module of the multilayer capacitor of the present invention may respectively comprise two chip electrodes, and the two chip electrodes are insulated from each other; and, the first electrode group, And the second electrode group sandwiches the multilayer capacitor with the side end faces of the sheet electrodes corresponding to each other. Accordingly, the present invention can perform a commonly known Kelvin test specification or a 4-wire test specification through a two-piece electrode arrangement, that is, a contact test to detect whether a two-piece electrode is laminated or not. The electrode end faces of the capacitor are completely in contact to form a conduction, and the test failure due to poor contact can be sufficiently avoided.

另外,本發明一種積層電容器之高壓檢測模組可更包括一基座、及一滑台,而滑台可載置於基座上,且致動器可組設於基座上並連接於滑台,致動器可驅使滑台滑移於基座上,第一電極組可組設於滑台。據此,本發明可透過基座和滑台之設置,可輕易地使第一電極組受致動器之驅動而趨近或遠離第二電極組。 In addition, the high voltage detecting module of the multilayer capacitor of the present invention may further include a base and a sliding table, and the sliding table may be placed on the base, and the actuator may be assembled on the base and connected to the sliding. The actuator can drive the sliding table to slide on the base, and the first electrode group can be assembled on the sliding table. Accordingly, the present invention can easily drive the first electrode group to be driven toward or away from the second electrode group by the actuator through the arrangement of the susceptor and the slide table.

為達成前述目的,本發明一種積層電容器之高壓檢測設備,主要包括入料模組、前述之高壓檢測模組、移載模組、分選模組、以及主控制器;主控制器係電性連接入料模組、高壓檢測模組、移載模組、及分選模組;主控制器控制入料模組供應待測試之積層電容器,主控制器控制移載模組移載待測試之積層電容器於入料模組與高壓檢測模組之間,主控制器控制高壓檢測模 組檢測積層電容器,主控制器控制分選模組對經高壓檢測模組測完之積層電容器分類。 In order to achieve the foregoing objective, a high voltage detecting device for a laminated capacitor of the present invention mainly comprises a feeding module, the aforementioned high voltage detecting module, a transfer module, a sorting module, and a main controller; the main controller is electrically Connecting the feeding module, the high-voltage detecting module, the transferring module, and the sorting module; the main controller controls the feeding module to supply the laminated capacitor to be tested, and the main controller controls the transfer module to be transferred for testing The multilayer capacitor is between the input module and the high voltage detection module, and the main controller controls the high voltage detection mode The group detects the multilayer capacitor, and the main controller controls the sorting module to classify the multilayer capacitors measured by the high voltage detecting module.

再者,本發明一種積層電容器之高壓檢測設備之分選模組可更包括一入料口,其係位於第一電極組、及第二電極組下方;當積層電容器脫離第一電極組、及第二電極組時,積層電容器落入入料口內。據此,當積層電容器完成測試時,就直接進入分選模組進行分類,其間並未再透過任何的移載裝置進行移載,除了顯著提升檢測效率外,亦減少設備的硬體成本。 Furthermore, the sorting module of the high-voltage detecting device of the multilayer capacitor of the present invention may further include an inlet port located below the first electrode group and the second electrode group; when the multilayer capacitor is separated from the first electrode group, and In the second electrode group, the multilayer capacitor falls into the feed port. Accordingly, when the multilayer capacitors are tested, they are directly classified into the sorting module, and no further transfer is performed through any transfer device. In addition to significantly improving the detection efficiency, the hardware cost of the device is also reduced.

為達成前述目的,本發明一種積層電容器之高壓檢測方法,包括以下步驟:首先,步驟(A),移載模組移載待測試之積層電容器至高壓檢測模組,並置於高壓檢測模組之第一電極組和第二電極組之間;再者,步驟(B),第一電極組、及第二電極組中至少其一者朝彼此趨近以夾持積層電容器;再且,步驟(C),高壓檢測模組對積層電容器進行高壓測試;最後,步驟(D),第一電極組、及第二電極組中至少其一者朝彼此遠離以使積層電容器脫離。 In order to achieve the foregoing object, a high voltage detecting method for a multilayer capacitor of the present invention comprises the following steps: First, in step (A), the transfer module transfers the multilayer capacitor to be tested to a high voltage detecting module, and is placed in the high voltage detecting module. Between the first electrode group and the second electrode group; further, at least one of the step (B), the first electrode group, and the second electrode group approaches each other to sandwich the multilayer capacitor; and further, the step C), the high voltage detecting module performs high voltage test on the laminated capacitor; finally, in step (D), at least one of the first electrode group and the second electrode group is away from each other to disengage the multilayer capacitor.

較佳的是,本發明之第一電極組、及第二電極組可分別包括二片狀電極,該二片狀電極係彼此絕緣;而於步驟(B)和步驟(C)之間更包括一接觸測試之步驟,其係檢測第一電極組、及第二電極組之該二片狀電極分別與積層電容器之二相對應的電極端面構成導通與否。據此,本發明積層電容器之高壓檢測方法中包括透過接觸測試來檢測二片狀電極是否與積層電容器的電極端 面完整接觸而構成導通,可充分避免因接觸不良所導致之測試失效,亦即符合業界俗稱之凱文(Kelvin)測試規範或稱四線(4-wire)測試規範。 Preferably, the first electrode group and the second electrode group of the present invention may respectively comprise two sheet electrodes, which are insulated from each other; and further included between step (B) and step (C) A step of a contact test for detecting whether the two electrode electrodes of the first electrode group and the second electrode group respectively correspond to the electrode end faces corresponding to the two of the multilayer capacitors. Accordingly, the high voltage detecting method of the multilayer capacitor of the present invention includes detecting a two-piece electrode and an electrode end of the multilayer capacitor through a contact test. The complete contact of the surface constitutes a conduction, which can completely avoid the test failure caused by poor contact, that is, it conforms to the Kelvin test specification or the 4-wire test specification commonly known in the industry.

而且,本發明積層電容器之高壓檢測方法中,於該步驟(C)中,主控制器分別對第一電極組、及第二電極組之該二片狀電極其中之一輸入一導通電壓,並量測第一電極組、及第二電極組之該二片狀電極其中之另一之輸出電壓。換言之,本發明之第一電極組、及第二電極組可同時進行導通測試,而導通測試的方式是對一片狀電極輸入一導通電壓,其通常是低電壓、微電流,並量測另一片狀電極之輸出,藉此判斷二者間是否構成導通。 Further, in the high voltage detecting method of the multilayer capacitor of the present invention, in the step (C), the main controller inputs a turn-on voltage to one of the first electrode group and the two chip electrodes of the second electrode group, and The output voltage of the other of the two electrode electrodes of the first electrode group and the second electrode group is measured. In other words, the first electrode group and the second electrode group of the present invention can perform the conduction test at the same time, and the conduction test is performed by inputting a turn-on voltage to the one-piece electrode, which is usually a low voltage, a micro current, and the measurement is performed. The output of the one-piece electrode is used to determine whether or not the conduction is made between the two.

此外,積層電容器之高壓檢測方法中,該步驟(D)中,高壓測試係對積層電容器輸入一預定電壓,其通常為高達數千伏特之電壓,以檢測積層電容器之絕緣阻抗(IR)、靜電容量(CAP)、介電材質衰減係數(TanD)、漏電流(IL)、耐電壓(HV)、及其他電容規格上的相關參數。 In addition, in the high voltage detecting method of the multilayer capacitor, in the step (D), the high voltage test inputs a predetermined voltage to the multilayer capacitor, which is usually a voltage of several thousand volts to detect the insulation resistance (IR) and static electricity of the laminated capacitor. Capacity (CAP), dielectric material attenuation factor (TanD), leakage current (IL), withstand voltage (HV), and other parameters related to capacitance specifications.

〔習知〕 [study]

91‧‧‧轉盤機構 91‧‧‧Carousel mechanism

910‧‧‧凹槽 910‧‧‧ Groove

92‧‧‧滾輪式電極 92‧‧‧Roller electrode

93‧‧‧震動軌道 93‧‧‧Vibration track

94‧‧‧定位件 94‧‧‧ Positioning parts

95‧‧‧檢測裝置 95‧‧‧Detection device

951‧‧‧貫穿槽 951‧‧‧through slot

96‧‧‧針狀電極 96‧‧‧needle electrode

C‧‧‧積層電容器 C‧‧‧ multilayer capacitor

C1、C2‧‧‧電極端面 C1, C2‧‧‧ electrode end face

〔本創作〕 [this creation]

2‧‧‧入料模組 2‧‧‧Feed module

21‧‧‧震動盤 21‧‧‧Vibration plate

22‧‧‧輸送軌道 22‧‧‧Transportation track

3‧‧‧高壓檢測模組 3‧‧‧High voltage detection module

31‧‧‧第一電極組 31‧‧‧First electrode group

32‧‧‧第二電極組 32‧‧‧Second electrode group

33‧‧‧致動器 33‧‧‧Actuator

34‧‧‧基座 34‧‧‧Base

35‧‧‧滑台 35‧‧‧ slide table

4‧‧‧移載模組 4‧‧‧Transfer module

41‧‧‧升降取放裝置 41‧‧‧ Lifting and lowering device

42‧‧‧吸取頭 42‧‧‧Sucking head

5‧‧‧分選模組 5‧‧‧Sorting module

51‧‧‧入料口 51‧‧‧Inlet

52‧‧‧旋轉分料管 52‧‧‧Rotating distributor

521‧‧‧出料口 521‧‧‧Outlet

53‧‧‧容倉 53‧‧‧ 容仓

54‧‧‧轉動驅動器 54‧‧‧Rotating drive

6‧‧‧主控制器 6‧‧‧Master controller

P‧‧‧片狀電極 P‧‧‧chip electrode

圖1A係習知轉盤式檢測設備之示意圖。 Fig. 1A is a schematic view of a conventional rotary type detecting device.

圖1B係習知轉盤式檢測設備之A-A線段局部剖面示意圖。 Fig. 1B is a partial cross-sectional view showing the A-A line segment of the conventional rotary type detecting device.

圖2A係習知並聯式檢測設備之示意圖。 2A is a schematic diagram of a conventional parallel detecting apparatus.

圖2B係習知並聯式檢測設備B-B線段之局部剖面示 意圖。 2B is a partial cross-sectional view showing a line segment of the parallel detecting device B-B. intention.

圖3係本發明一較佳實施例之系統架構圖。 3 is a system architecture diagram of a preferred embodiment of the present invention.

圖4係本發明一較佳實施例之俯視圖。 4 is a top plan view of a preferred embodiment of the present invention.

圖5係常見積層電容器之立體圖。 Figure 5 is a perspective view of a conventional multilayer capacitor.

圖6A係本發明一較佳實施例之高壓檢測模組、分選模組和移載模組之示意圖。 6A is a schematic diagram of a high voltage detection module, a sorting module, and a transfer module in accordance with a preferred embodiment of the present invention.

圖6B係本發明一較佳實施例之高壓檢測模組之俯視圖。 6B is a top plan view of a high voltage detection module in accordance with a preferred embodiment of the present invention.

圖6C係本發明一較佳實施例之第一電極組和第二電極組夾持積層電容器時之立體圖。 Fig. 6C is a perspective view showing a state in which a first electrode group and a second electrode group are sandwiched by a multilayer capacitor in accordance with a preferred embodiment of the present invention.

本發明積層電容器之高壓檢測模組、高壓檢測設備及其檢測方法在本實施例中被詳細描述之前,要特別注意的是,以下的說明中,類似的元件將以相同的元件符號來表示。 Before the high-voltage detection module, the high-voltage detection device, and the detection method thereof are described in detail in the present embodiment, it is to be noted that in the following description, like elements will be denoted by the same reference numerals.

請同時參閱圖3、及圖4,圖3係本發明一較佳實施例之系統架構圖,圖4係本發明一較佳實施例之俯視圖。如圖中所示,本實施例之積層電容器之高壓檢測設備主要包括入料模組2、高壓檢測模組3、移載模組4、分選模組5、以及主控制器6。如圖4中所示,本實施例之入料模組2主要包括一震動盤21、及一輸送軌道22,而震動盤21透過震動進給,將積層電容器C推送至輸送軌道22末端,以供移載模組4搬運。 Please refer to FIG. 3 and FIG. 4, FIG. 3 is a system architecture diagram of a preferred embodiment of the present invention, and FIG. 4 is a top view of a preferred embodiment of the present invention. As shown in the figure, the high-voltage detecting device of the multilayer capacitor of the embodiment mainly comprises a feeding module 2, a high-voltage detecting module 3, a transfer module 4, a sorting module 5, and a main controller 6. As shown in FIG. 4, the feeding module 2 of the present embodiment mainly includes a vibrating plate 21 and a conveying rail 22, and the vibrating plate 21 pushes the laminated capacitor C to the end of the conveying rail 22 through the vibration feeding. It is transported by the transfer module 4.

再者,本實施例之設備設置有二高壓檢測模組3,其分設於輸送軌道22末端二側。另外,本實施例之 移載模組4包括二升降取放裝置41,其呈V型配置,該二升降取放裝置41迴旋往復擺轉以輪流至輸送軌道22末端吸取待測試之積層電容器C,並移載至二側的高壓檢測模組3進行檢測,並透過二側高壓檢測模組3下方各自的分選模組5來對檢測結果進行分類。據此,本實施例利用V型配置之升降取放裝置41構成雙進給,並利用二高壓檢測模組3構成雙邊測試,可大幅提高檢測效率。 Furthermore, the apparatus of this embodiment is provided with two high-voltage detecting modules 3, which are respectively disposed on two sides of the end of the conveying rail 22. In addition, this embodiment The transfer module 4 includes two lifting and lowering devices 41, which are in a V-shaped configuration. The two lifting and lowering devices 41 swing back and forth to take turns to the end of the conveying rail 22 to suck the multilayer capacitor C to be tested, and transfer to the second The high-voltage detecting module 3 on the side performs detection, and the detection results are classified through the respective sorting modules 5 under the two-side high-voltage detecting module 3. Accordingly, the present embodiment utilizes the V-shaped arrangement of the lift-and-place device 41 to form a double feed, and the two high-voltage detection modules 3 constitute a bilateral test, which can greatly improve the detection efficiency.

請同時參閱圖5、圖6A、圖6B、及圖6C,圖5圖5係常見積層電容器C之立體圖,圖6A係本發明一較佳實施例之高壓檢測模組3、分選模組5和移載模組4之示意圖,圖6B係本發明一較佳實施例之高壓檢測模組3之俯視圖,圖6C係本發明一較佳實施例之第一電極組31和第二電極組32夾持積層電容器C時之立體圖。如圖5所示,常見積層電容器C係由複數內部電極、以及複數電介質層彼此交錯層疊而成,而層疊構造之二端另外設置電極端面C1、C2。 Please refer to FIG. 5, FIG. 6A, FIG. 6B, and FIG. 6C. FIG. 5 is a perspective view of a conventional multilayer capacitor C. FIG. 6A is a high voltage detecting module 3 and a sorting module 5 according to a preferred embodiment of the present invention. FIG. 6B is a plan view of a high voltage detecting module 3 according to a preferred embodiment of the present invention, and FIG. 6C is a first electrode group 31 and a second electrode group 32 according to a preferred embodiment of the present invention. A perspective view of the laminated capacitor C. As shown in FIG. 5, the conventional multilayer capacitor C is formed by interlacing a plurality of internal electrodes and a plurality of dielectric layers, and electrode end faces C1 and C2 are provided at both ends of the laminated structure.

再者,高壓檢測模組3主要包括一第一電極組31、一第二電極組32、一致動器33、基座34、及一滑台35;其中,滑台35載置於基座34上,而致動器33組設於基座34上並連接於滑台35,且致動器33驅使滑台35滑移於基座34上。另外,第一電極組31係組設於滑台35,第二電極組32組設於基座34,且第一電極組31和第二電極組32係分別對應於積層電容器C之二相對應的電極端面C1、C2。 Furthermore, the high voltage detecting module 3 mainly includes a first electrode group 31, a second electrode group 32, an actuator 33, a base 34, and a sliding table 35. The sliding table 35 is placed on the base 34. Above, the actuator 33 is assembled on the base 34 and connected to the slide table 35, and the actuator 33 drives the slide table 35 to slide on the base 34. In addition, the first electrode group 31 is disposed on the slide table 35, the second electrode group 32 is disposed on the base 34, and the first electrode group 31 and the second electrode group 32 correspond to the second layer of the multilayer capacitor C, respectively. Electrode end faces C1, C2.

另外,第一電極組31和第二電極組32分別包 括二片狀電極P,且該二片狀電極P係彼此絕緣。據此,致動器33可驅使滑台35往復滑移,進而帶動第一電極組31趨近第二電極組32,並以該等片狀電極P彼此相對應之側端面來夾持積層電容器C,或者朝彼此遠離使積層電容器C脫離。 In addition, the first electrode group 31 and the second electrode group 32 are respectively packaged The two sheet electrodes P are included, and the two sheet electrodes P are insulated from each other. Accordingly, the actuator 33 can drive the slide table 35 to reciprocate and slide, thereby driving the first electrode group 31 toward the second electrode group 32, and sandwiching the multilayer capacitor with the side end faces of the sheet electrodes P corresponding to each other. C, or away from each other to separate the multilayer capacitor C.

請再參閱圖6A,如圖中所示之移載模組4,其包括一吸取頭42,其可形成負壓藉以吸附積層電容器C,或可取消負壓來釋放積層電容器C。另一方面,關於分選模組5,在本實施例中,每一分選模組5包括一旋轉分料管52、一轉動驅動器54、以及八個容倉53,且旋轉分料管52包括一入料口51、及一出料口521。其中,入料口51係連通至旋轉分料管52之出料口521,而轉動驅動器54係連接並驅動旋轉分料管52旋轉,且八個容倉53分別為不同等級之積層電容器C所放置之處。換言之,本實施例之分選模組5可透過轉動驅動器54驅動旋轉分料管52旋轉並使出料口521對準於八個容倉53其中之一,以對積層電容器C進行分類。 Referring to FIG. 6A again, the transfer module 4 shown in the figure includes a suction head 42 which can form a negative pressure to adsorb the laminated capacitor C, or can cancel the negative pressure to release the laminated capacitor C. On the other hand, regarding the sorting module 5, in the present embodiment, each sorting module 5 includes a rotating branching tube 52, a rotating actuator 54, and eight receiving compartments 53, and the rotating dispensing tube 52 The utility model comprises an inlet port 51 and a discharge port 521. The inlet port 51 is connected to the discharge port 521 of the rotary branching pipe 52, and the rotary actuator 54 is connected to drive the rotary branching pipe 52 to rotate, and the eight receiving compartments 53 are respectively different grades of the multilayer capacitor C. Placed. In other words, the sorting module 5 of the present embodiment can drive the rotary branching tube 52 to rotate through the rotary actuator 54 and align the discharge port 521 with one of the eight housings 53 to classify the laminated capacitor C.

再且,關於主控制器6,其係電性連接入料模組2、高壓檢測模組3、移載模組4、及分選模組5;且主控制器6主要用於控制入料模組2供應待測試之積層電容器C、控制移載模組4移載待測試之積層電容器C於入料模組2與高壓檢測模組3之間、控制高壓檢測模組3檢測積層電容器C、以及控制分選模組5對經高壓檢測模組3測完之積層電容器C分類。 Furthermore, regarding the main controller 6, it is electrically connected to the feeding module 2, the high pressure detecting module 3, the transfer module 4, and the sorting module 5; and the main controller 6 is mainly used for controlling the feeding The module 2 supplies the multilayer capacitor C to be tested, and the control transfer module 4 transfers the multilayer capacitor C to be tested between the feeding module 2 and the high voltage detecting module 3, and controls the high voltage detecting module 3 to detect the laminated capacitor C. And controlling the sorting module 5 to classify the multilayer capacitor C measured by the high voltage detecting module 3.

請一併參閱圖4、圖6A、圖6B、以及圖6C, 以下簡述本實施例積層電容器C之高壓檢測模組3的運作流程:首先,震動盤21透過震動進給,將積層電容器C自震動盤21經由輸送軌道22,而推送至輸送軌道22末端,以供移載模組4搬運。 Please refer to FIG. 4, FIG. 6A, FIG. 6B, and FIG. 6C together. The operation flow of the high voltage detecting module 3 of the multilayer capacitor C of the present embodiment will be briefly described. First, the vibrating plate 21 is pushed by the vibration feeding, and the laminated capacitor C is pushed from the vibrating plate 21 to the end of the conveying rail 22 via the conveying rail 22. It is transported by the transfer module 4.

再者,二升降取放裝置41其中之一至輸送軌道22末端,透過吸取頭42吸取一待測試之積層電容器C,並移送至一高壓檢測模組3,而置於高壓檢測模組3之第一電極組31和一第二電極組32之間。 Furthermore, one of the two lifting and lowering devices 41 is connected to the end of the conveying rail 22, and the multilayer capacitor C to be tested is sucked through the suction head 42 and transferred to a high voltage detecting module 3, and placed in the high voltage detecting module 3 Between an electrode group 31 and a second electrode group 32.

接著,致動器33驅使第一電極組31朝第二電極組32趨近,以夾持積層電容器C;當第一電極組31和第二電極組32穩固地夾持積層電容器C之後,升降取放裝置41釋放該積層電容器C並返回輸送軌道22末端準備移載次一積層電容器C。 Next, the actuator 33 drives the first electrode group 31 toward the second electrode group 32 to sandwich the multilayer capacitor C; after the first electrode group 31 and the second electrode group 32 firmly hold the multilayer capacitor C, the lift The pick-and-place device 41 releases the multilayer capacitor C and returns to the end of the transport track 22 to prepare for transfer of the next multilayer capacitor C.

再且,高壓檢測模組3對該積層電容器C進行接觸測試,其主要係檢測第一電極組31、及第二電極組32之該二片狀電極P是否分別與積層電容器C之二相對應的電極端面C1、C2構成導通。其中,主控制器6分別對第一電極組31、及第二電極組32之該二片狀電極P其中之一輸入一導通電壓,並量測第一電極組31、及第二電極組32之該二片狀電極P其中之另一之輸出電壓。然而,在本實施例中,接觸測試所輸入之導通電壓屬於低電壓,一般為5V(伏特)以下,如果第一電極組31、及第二電極組32之該二片狀電極P構成導通,則所反饋的電壓並不會相差太多。 Further, the high voltage detecting module 3 performs a contact test on the multilayer capacitor C, which mainly detects whether the two chip electrodes P of the first electrode group 31 and the second electrode group 32 correspond to the two of the multilayer capacitors C, respectively. The electrode end faces C1 and C2 constitute conduction. The main controller 6 inputs a turn-on voltage to one of the two electrode electrodes P of the first electrode group 31 and the second electrode group 32, and measures the first electrode group 31 and the second electrode group 32. The output voltage of the other of the two sheet electrodes P. However, in this embodiment, the on-voltage input by the contact test belongs to a low voltage, generally 5 V (volts) or less. If the two electrode electrodes P of the first electrode group 31 and the second electrode group 32 constitute conduction, The voltages fed back will not differ too much.

接著,如果第一電極組31、及第二電極組32 之該二片狀電極P正確地構成導通,高壓檢測模組3對積層電容器C進行高壓測試;其係對該積層電容器C輸入一預定電壓,其屬於高電壓例如1000V(伏特)至6000V(伏特),並檢測該積層電容器C之絕緣阻抗(IR)、靜電容量(CAP)、介電材質衰減係數(TanD)、漏電流(IL)、及耐電壓(HV)中至少一者。 Next, if the first electrode group 31 and the second electrode group 32 The two chip electrodes P are correctly configured to be turned on, and the high voltage detecting module 3 performs a high voltage test on the multilayer capacitor C; it inputs a predetermined voltage to the multilayer capacitor C, which belongs to a high voltage such as 1000 V (volts) to 6000 V (volts). And detecting at least one of an insulation resistance (IR), a capacitance (CAP), a dielectric material attenuation coefficient (TanD), a leakage current (IL), and a withstand voltage (HV) of the multilayer capacitor C.

另一方面,如果第一電極組31、及第二電極組32和積層電容器C有接觸不良之情形,亦即第一電極組31、及第二電極組32之該二片狀電極P未構成導通時,將不再進行高壓測試,則使該積層電容器C直接進入分選模組5,亦即第一電極組31朝第二電極組32遠離,以使積層電容器C脫離而落入下方的入料口51,並將之分類為接觸不良,並待累積至一定數量時,倒回震動盤21以重新進行檢測。 On the other hand, if the first electrode group 31, the second electrode group 32, and the multilayer capacitor C have poor contact, that is, the two electrode electrodes P of the first electrode group 31 and the second electrode group 32 are not formed. When conducting, the high voltage test will not be performed, and the multilayer capacitor C is directly entered into the sorting module 5, that is, the first electrode group 31 is away from the second electrode group 32, so that the multilayer capacitor C is detached and falls below. The feed port 51 is classified as poor contact, and when it is accumulated to a certain amount, the vibration disk 21 is returned to be re-detected.

最後,高壓檢測完畢後,第一電極組31朝第二電極組32遠離以使積層電容器C脫離而落入下方的入料口51;同時,主控制器6對檢測結果進行分析,並根據分析的結果控制分選模組5對積層電容器C分類,使之落入對應的容倉53內。 Finally, after the high voltage detection is completed, the first electrode group 31 is moved away from the second electrode group 32 to disengage the multilayer capacitor C and falls into the lower inlet port 51; at the same time, the main controller 6 analyzes the detection result, and according to the analysis As a result, the sorting module 5 sorts the laminated capacitor C to fall into the corresponding housing 53.

綜上所述,本發明至少具備以下優勢: In summary, the present invention has at least the following advantages:

(1).本發明係直接透過第一電極組31、及第二電極組32來夾持並固定積層電容器C;亦即,當進行高壓測試時,僅有第一電極組31、及第二電極組32和積層電容器C接觸,並無其他的任何機構或裝置來協助支撐或固定積層電容器,亦即進行懸空測試,直接以空氣作為絕緣, 故將不會產生突波。 (1) The present invention directly clamps and fixes the multilayer capacitor C through the first electrode group 31 and the second electrode group 32; that is, when performing the high voltage test, only the first electrode group 31, and the second The electrode group 32 is in contact with the multilayer capacitor C, and there is no other mechanism or device to assist in supporting or fixing the multilayer capacitor, that is, the suspension test is performed, and the air is directly insulated. Therefore, there will be no surge.

(2).在進行高壓測試前,先進行接觸測試(contact check),其主要利用凱文(Kelvin)測試規範或稱四線(4-wire)測試規範,先行檢測第一電極組31、及第二電極組32之該二片狀電極P與積層電容器C之二相對應的電極端面C1、C2是否構成導通,可以有效地初步排除因接觸不良所產生之誤判。 (2). Before performing the high voltage test, a contact check is first performed, which mainly uses the Kelvin test specification or the 4-wire test specification to detect the first electrode group 31 first, and Whether or not the electrode end faces C1 and C2 of the second electrode group 32 corresponding to the two of the multilayer capacitors P and the multilayer capacitor C are electrically connected can effectively eliminate the misjudgment caused by the contact failure.

(3).本發明採用二升降取放裝置41、二高壓檢測模組3、以及二分選模組5,以構成雙移載、雙測試、以及雙分類,可大幅提高檢測效率。 (3) The present invention adopts two lifting and lowering device 41, two high pressure detecting modules 3, and two sorting modules 5 to form double transfer, double test, and double classification, which can greatly improve the detection efficiency.

(4).當積層電容器完成接觸測試或高壓測試時,就直接進入分選模組進行分類,其間並未再透過任何的移載裝置進行移載,除了顯著提升檢測效率外,亦減少設備的硬體成本。 (4) When the multilayer capacitors are subjected to the contact test or the high-voltage test, they are directly entered into the sorting module for sorting, and no transfer is carried out through any transfer device. In addition to significantly improving the detection efficiency, the device is also reduced. Hardware cost.

上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。 The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

31‧‧‧第一電極組 31‧‧‧First electrode group

32‧‧‧第二電極組 32‧‧‧Second electrode group

33‧‧‧致動器 33‧‧‧Actuator

34‧‧‧基座 34‧‧‧Base

35‧‧‧滑台 35‧‧‧ slide table

4‧‧‧移載模組 4‧‧‧Transfer module

41‧‧‧升降取放裝置 41‧‧‧ Lifting and lowering device

42‧‧‧吸取頭 42‧‧‧Sucking head

51‧‧‧入料口 51‧‧‧Inlet

52‧‧‧旋轉分料管 52‧‧‧Rotating distributor

521‧‧‧出料口 521‧‧‧Outlet

53‧‧‧容倉 53‧‧‧ 容仓

54‧‧‧轉動驅動器 54‧‧‧Rotating drive

P‧‧‧片狀電極 P‧‧‧chip electrode

Claims (10)

一種積層電容器之高壓檢測模組,包括:一第一電極組;一第二電極組;以及一致動器;其中,該第一電極組和該第二電極組係分別對應於一積層電容器之二相對應的電極端面,該致動器係驅使該第一電極組、及該第二電極組中至少其一者朝彼此趨近以夾持該積層電容器、或朝彼此遠離使該積層電容器脫離。 A high voltage detecting module of a multilayer capacitor, comprising: a first electrode group; a second electrode group; and an actuator; wherein the first electrode group and the second electrode group respectively correspond to a multilayer capacitor Corresponding electrode end faces, the actuator driving at least one of the first electrode set and the second electrode set toward each other to clamp the multilayer capacitor or away from each other to disengage the laminated capacitor. 如請求項1之積層電容器之高壓檢測模組,其中,該第一電極組和該第二電極組分別包括二片狀電極,其係彼此絕緣。 The high voltage detecting module of the multilayer capacitor of claim 1, wherein the first electrode group and the second electrode group respectively comprise two chip electrodes which are insulated from each other. 如請求項2之積層電容器之高壓檢測模組,其中,該第一電極組、及該第二電極組係以該等片狀電極彼此相對應之側端面來夾持該積層電容器。 The high voltage detecting module of the multilayer capacitor of claim 2, wherein the first electrode group and the second electrode group sandwich the multilayer capacitor with the side end faces of the chip electrodes corresponding to each other. 如請求項1之積層電容器之高壓檢測模組,其更包括一基座、及一滑台,該滑台載置於該基座上,該致動器組設於該基座上並連接於該滑台,該致動器驅使該滑台滑移於該基座上,該第一電極組係組設於該滑台。 The high voltage detecting module of the multilayer capacitor of claim 1, further comprising a base and a sliding table, wherein the sliding table is placed on the base, and the actuator is disposed on the base and connected to the base The sliding table, the actuator drives the sliding table to slide on the base, and the first electrode assembly is assembled on the sliding table. 一種積層電容器之高壓檢測設備,包括:一入料模組;一如請求項1至4中任一項之高壓檢測模組;一移載模組;一分選模組;以及 一主控制器;其中,該主控制器係電性連接該入料模組、該高壓檢測模組、該移載模組、及該分選模組;該主控制器控制該入料模組供應待測試之積層電容器,該主控制器控制該移載模組移載待測試之該積層電容器於該入料模組與該高壓檢測模組之間,該主控制器控制該高壓檢測模組檢測該積層電容器,該主控制器控制該分選模組對經該高壓檢測模組測完之該積層電容器分類。 A high-voltage detecting device for a laminated capacitor, comprising: a feeding module; a high-voltage detecting module according to any one of claims 1 to 4; a transfer module; a sorting module; a main controller; wherein the main controller is electrically connected to the feeding module, the high voltage detecting module, the transferring module, and the sorting module; the main controller controls the feeding module Supplying a multilayer capacitor to be tested, the main controller controlling the transfer module to transfer the multilayer capacitor to be tested between the input module and the high voltage detection module, and the main controller controls the high voltage detection module The laminated capacitor is detected, and the main controller controls the sorting module to classify the laminated capacitor measured by the high voltage detecting module. 如請求項5之積層電容器之高壓檢測設備,其中,該分選模組包括一入料口,其係位於該第一電極組、及該第二電極組下方;當該積層電容器脫離該第一電極組、及該第二電極組時,該積層電容器落入該入料口。 The high voltage detecting device of the multilayer capacitor of claim 5, wherein the sorting module comprises an inlet port located below the first electrode group and the second electrode group; when the multilayer capacitor is separated from the first In the electrode group and the second electrode group, the laminated capacitor falls into the inlet port. 一種積層電容器之高壓檢測方法,包括以下步驟:(A).一移載模組移載一待測試之積層電容器至一高壓檢測模組,並置於該高壓檢測模組之一第一電極組和一第二電極組之間;(B).該第一電極組、及該第二電極組中至少其一者朝彼此趨近以夾持該積層電容器;(C).該高壓檢測模組對該積層電容器進行高壓測試;以及(D).該第一電極組、及該第二電極組中至少其一者朝彼此遠離以使該積層電容器脫離。 A high voltage detecting method for a multilayer capacitor includes the following steps: (A). A transfer module transfers a multilayer capacitor to be tested to a high voltage detecting module, and is placed in a first electrode group of the high voltage detecting module and Between a second electrode group; (B) at least one of the first electrode group and the second electrode group approaching each other to clamp the multilayer capacitor; (C). The multilayer capacitor is subjected to a high voltage test; and (D). at least one of the first electrode group and the second electrode group are away from each other to disengage the multilayer capacitor. 如請求項7之積層電容器之高壓檢測方法,其中,該第一電極組、及該第二電極組分別包括二片狀電極,其 係彼此絕緣;於該步驟(B)和該步驟(C)之間更包括一接觸測試之步驟,該接觸測試係檢測該第一電極組、及該第二電極組之該二片狀電極分別與該積層電容器之二相對應的電極端面構成導通與否。 The high voltage detecting method of the multilayer capacitor of claim 7, wherein the first electrode group and the second electrode group respectively comprise two chip electrodes, Insulating each other; further comprising a step of contacting a test between the step (B) and the step (C), wherein the contact test detects the first electrode group and the two electrode electrodes of the second electrode group respectively The end faces of the electrodes corresponding to the two of the multilayer capacitors constitute conduction or not. 如請求項8之積層電容器之高壓檢測方法,其中,於該步驟(C)中,一主控制器分別對該第一電極組、及該第二電極組之該二片狀電極其中之一輸入一導通電壓,並量測該第一電極組、及該第二電極組之該二片狀電極其中之另一之輸出電壓。 The high voltage detecting method of the multilayer capacitor of claim 8, wherein in the step (C), a main controller respectively inputs one of the first electrode group and the two chip electrodes of the second electrode group And conducting a voltage, and measuring an output voltage of the other of the first electrode group and the two electrode electrodes of the second electrode group. 如請求項7之積層電容器之高壓檢測方法,其中,該步驟(D)中,該高壓測試係對該積層電容器輸入一預定電壓,以檢測該積層電容器之絕緣阻抗(IR)、靜電容量(CAP)、介電材質衰減係數(TanD)、漏電流(IL)、及耐電壓(HV)中至少一者。 The high voltage detecting method of the multilayer capacitor of claim 7, wherein in the step (D), the high voltage test inputs a predetermined voltage to the multilayer capacitor to detect an insulation resistance (IR) and a capacitance (CAP) of the laminated capacitor. ), at least one of a dielectric material attenuation coefficient (TanD), a leakage current (IL), and a withstand voltage (HV).
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI671531B (en) * 2018-10-05 2019-09-11 臺北歆科科技有限公司 Floating type capacitance detecting device and detecting method thereof
TWI821694B (en) * 2021-06-22 2023-11-11 萬潤科技股份有限公司 Electronic component testing device and testing method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI689732B (en) * 2019-07-29 2020-04-01 致茂電子股份有限公司 Device for testing capacitor
CN112379186B (en) * 2019-07-29 2024-03-29 致茂电子(苏州)有限公司 Capacitance testing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7724498B2 (en) * 2006-06-30 2010-05-25 Intel Corporation Low inductance capacitors, methods of assembling same, and systems containing same
TWM479510U (en) * 2013-11-11 2014-06-01 Think Technologies Ltd Multitrack feeding rotation die testing apparatus
TWM483263U (en) * 2013-12-26 2014-08-01 Think Technologies Co Ltd Die sucking rail with replaceable sucking sections
TWM506971U (en) * 2015-05-08 2015-08-11 Think Technologies Co Ltd High pressure detection module and high pressure detection apparatus for multilayer capacitor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7724498B2 (en) * 2006-06-30 2010-05-25 Intel Corporation Low inductance capacitors, methods of assembling same, and systems containing same
TWM479510U (en) * 2013-11-11 2014-06-01 Think Technologies Ltd Multitrack feeding rotation die testing apparatus
TWM483263U (en) * 2013-12-26 2014-08-01 Think Technologies Co Ltd Die sucking rail with replaceable sucking sections
TWM506971U (en) * 2015-05-08 2015-08-11 Think Technologies Co Ltd High pressure detection module and high pressure detection apparatus for multilayer capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI671531B (en) * 2018-10-05 2019-09-11 臺北歆科科技有限公司 Floating type capacitance detecting device and detecting method thereof
TWI821694B (en) * 2021-06-22 2023-11-11 萬潤科技股份有限公司 Electronic component testing device and testing method

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