TWI550111B - 自行鈍化機制穩定密閉性薄膜 - Google Patents
自行鈍化機制穩定密閉性薄膜 Download PDFInfo
- Publication number
- TWI550111B TWI550111B TW100124693A TW100124693A TWI550111B TW I550111 B TWI550111 B TW I550111B TW 100124693 A TW100124693 A TW 100124693A TW 100124693 A TW100124693 A TW 100124693A TW I550111 B TWI550111 B TW I550111B
- Authority
- TW
- Taiwan
- Prior art keywords
- inorganic layer
- oxygen
- sno
- hermetic
- inorganic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/087—Oxides of copper or solid solutions thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3417—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials all coatings being oxide coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/23—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron
- C03C3/247—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron containing fluorine and phosphorus
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
- C23C14/5853—Oxidation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/322—Oxidation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
- Sealing Material Composition (AREA)
- Electroluminescent Light Sources (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36801110P | 2010-07-27 | 2010-07-27 | |
| US12/879,578 US20120028011A1 (en) | 2010-07-27 | 2010-09-10 | Self-passivating mechanically stable hermetic thin film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201217556A TW201217556A (en) | 2012-05-01 |
| TWI550111B true TWI550111B (zh) | 2016-09-21 |
Family
ID=44514994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100124693A TWI550111B (zh) | 2010-07-27 | 2011-07-13 | 自行鈍化機制穩定密閉性薄膜 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20120028011A1 (enExample) |
| EP (1) | EP2598667A1 (enExample) |
| JP (2) | JP5816281B2 (enExample) |
| KR (1) | KR101801425B1 (enExample) |
| CN (1) | CN103025911B (enExample) |
| TW (1) | TWI550111B (enExample) |
| WO (1) | WO2012018487A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10158057B2 (en) | 2010-10-28 | 2018-12-18 | Corning Incorporated | LED lighting devices |
| KR101931177B1 (ko) * | 2012-03-02 | 2018-12-21 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| TW201343940A (zh) * | 2012-03-14 | 2013-11-01 | Corning Inc | 用於形成密封阻障層之濺射靶材與相關濺射方法 |
| JP5776630B2 (ja) * | 2012-06-01 | 2015-09-09 | 日立金属株式会社 | 銅系材料及びその製造方法 |
| DE102012109207B4 (de) * | 2012-09-28 | 2018-05-09 | Osram Oled Gmbh | Verfahren und Vorrichtung zum Herstellen eines optoelektronischen Bauelementes |
| US10017849B2 (en) | 2012-11-29 | 2018-07-10 | Corning Incorporated | High rate deposition systems and processes for forming hermetic barrier layers |
| US9202996B2 (en) | 2012-11-30 | 2015-12-01 | Corning Incorporated | LED lighting devices with quantum dot glass containment plates |
| US9666763B2 (en) | 2012-11-30 | 2017-05-30 | Corning Incorporated | Glass sealing with transparent materials having transient absorption properties |
| JP5765323B2 (ja) * | 2012-12-07 | 2015-08-19 | 日立金属株式会社 | 銅ボンディングワイヤ及びその製造方法 |
| KR20140077020A (ko) * | 2012-12-13 | 2014-06-23 | 삼성디스플레이 주식회사 | 스퍼터링 장치 |
| KR101434367B1 (ko) * | 2012-12-14 | 2014-08-27 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조방법 |
| US8754434B1 (en) | 2013-01-28 | 2014-06-17 | Corning Incorporated | Flexible hermetic thin film with light extraction layer |
| KR20140120541A (ko) * | 2013-04-03 | 2014-10-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| KR101428378B1 (ko) | 2013-04-05 | 2014-08-07 | 현대자동차주식회사 | 커먼레일 시스템용 고압펌프의 윤활장치 |
| KR102072805B1 (ko) * | 2013-04-15 | 2020-02-04 | 삼성디스플레이 주식회사 | 유기발광표시장치 및 그의 제조방법 |
| KR102096053B1 (ko) * | 2013-07-25 | 2020-04-02 | 삼성디스플레이 주식회사 | 유기발광표시장치의 제조방법 |
| KR102093392B1 (ko) * | 2013-07-25 | 2020-03-26 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
| KR20150012541A (ko) * | 2013-07-25 | 2015-02-04 | 삼성디스플레이 주식회사 | 대향 타겟 스퍼터링 장치, 이를 이용한 유기발광표시장치 및 그 제조방법 |
| KR20150012540A (ko) * | 2013-07-25 | 2015-02-04 | 삼성디스플레이 주식회사 | 유기발광표시장치의 제조방법. |
| WO2015123254A1 (en) | 2014-02-13 | 2015-08-20 | Corning Incorporated | Ultra low melting glass frit and fibers |
| JP6020972B2 (ja) * | 2015-06-11 | 2016-11-02 | 日立金属株式会社 | 銅ボンディングワイヤ |
| WO2017066261A2 (en) * | 2015-10-13 | 2017-04-20 | Alphabet Energy, Inc. | Oxidation and sublimation prevention for thermoelectric devices |
| FR3061404B1 (fr) * | 2016-12-27 | 2022-09-23 | Packaging Sip | Procede de fabrication collective de modules electroniques hermetiques |
| CN110077073B (zh) * | 2019-04-03 | 2021-09-14 | 乐凯胶片股份有限公司 | 一种聚烯烃膜、制备方法及太阳能电池背板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200501340A (en) * | 2003-04-16 | 2005-01-01 | Shinko Electric Ind Co | Conductor substrate, semiconductor device and production method thereof |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0664935B2 (ja) * | 1985-10-18 | 1994-08-22 | ティーディーケイ株式会社 | 透明導電膜およびその形成方法 |
| JPH07310184A (ja) * | 1994-05-13 | 1995-11-28 | Mitsubishi Heavy Ind Ltd | SiOX 蒸着フィルムの後処理方法及びその装置 |
| JPH08197675A (ja) * | 1995-01-27 | 1996-08-06 | Toppan Printing Co Ltd | 酸化珪素蒸着フィルム及びその製造方法 |
| JP4371539B2 (ja) * | 2000-05-31 | 2009-11-25 | 電気化学工業株式会社 | 酸化けい素質蒸着膜の製造方法 |
| JP4235551B2 (ja) * | 2001-10-02 | 2009-03-11 | 独立行政法人産業技術総合研究所 | 金属酸化物薄膜及びその製造方法 |
| EP1466997B1 (en) * | 2003-03-10 | 2012-02-22 | OSRAM Opto Semiconductors GmbH | Method for forming and arrangement of barrier layers on a polymeric substrate |
| JP4398265B2 (ja) * | 2004-01-27 | 2010-01-13 | 三菱樹脂株式会社 | ガスバリア性フィルム及びガスバリア性積層体 |
| US7722929B2 (en) * | 2005-08-18 | 2010-05-25 | Corning Incorporated | Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device |
| US20080206589A1 (en) * | 2007-02-28 | 2008-08-28 | Bruce Gardiner Aitken | Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device |
| US20070040501A1 (en) | 2005-08-18 | 2007-02-22 | Aitken Bruce G | Method for inhibiting oxygen and moisture degradation of a device and the resulting device |
| WO2008073485A2 (en) * | 2006-12-12 | 2008-06-19 | Quantum Leap Packaging, Inc. | Plastic electronic component package |
| JP2009037811A (ja) * | 2007-07-31 | 2009-02-19 | Sumitomo Chemical Co Ltd | 有機el装置の製造方法 |
-
2010
- 2010-09-10 US US12/879,578 patent/US20120028011A1/en not_active Abandoned
-
2011
- 2011-07-13 TW TW100124693A patent/TWI550111B/zh not_active IP Right Cessation
- 2011-07-13 CN CN201180036263.2A patent/CN103025911B/zh not_active Expired - Fee Related
- 2011-07-13 KR KR1020137002468A patent/KR101801425B1/ko not_active Expired - Fee Related
- 2011-07-13 JP JP2013521807A patent/JP5816281B2/ja not_active Expired - Fee Related
- 2011-07-13 WO PCT/US2011/043772 patent/WO2012018487A1/en not_active Ceased
- 2011-07-13 EP EP11745616.0A patent/EP2598667A1/en not_active Ceased
-
2015
- 2015-07-24 JP JP2015146729A patent/JP6180472B2/ja not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200501340A (en) * | 2003-04-16 | 2005-01-01 | Shinko Electric Ind Co | Conductor substrate, semiconductor device and production method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6180472B2 (ja) | 2017-08-16 |
| KR20130037220A (ko) | 2013-04-15 |
| JP2013539502A (ja) | 2013-10-24 |
| JP2015231948A (ja) | 2015-12-24 |
| CN103025911B (zh) | 2016-07-13 |
| KR101801425B1 (ko) | 2017-11-24 |
| JP5816281B2 (ja) | 2015-11-18 |
| EP2598667A1 (en) | 2013-06-05 |
| TW201217556A (en) | 2012-05-01 |
| US20120028011A1 (en) | 2012-02-02 |
| WO2012018487A1 (en) | 2012-02-09 |
| CN103025911A (zh) | 2013-04-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |