TWI547709B - A radiation detector manufacturing method and a radiation detector - Google Patents

Description

Radiation detector manufacturing method and radiation detector

Embodiments of the present invention relate to a method of manufacturing a radiation detector and a radiation detector.

An example of a radiation detector is an X-ray detector. In an X-ray detector, X-rays are converted into visible light, that is, fluorescent light, by a scintillator layer, and an amorphous germanium (a-Si) photodiode or a CCD (Charge Coupled Device) is used. The conversion element converts the fluorescence into a signal charge, thereby acquiring an image.

Further, in order to improve the utilization efficiency of the fluorescent light and improve the sensitivity characteristics, a reflective layer may be further provided on the scintillator layer.

Here, in order to suppress deterioration of characteristics due to water vapor or the like, the scintillator layer and the reflective layer must be isolated from the external gaseous environment. In particular, when the scintillator layer contains a CsI (yttrium iodide): Tl (yttrium) film or a CsI:Na (sodium) film or the like, the deterioration of characteristics due to humidity or the like may increase.

Therefore, there has been proposed a technique of covering a scintillator layer and a reflective layer with a film containing parylene or sealing the scintillator layer with a surrounding member surrounding the scintillator layer and a cover provided on the surrounding member.

Further, as a structure for obtaining a higher moisture-proof property, it has been proposed to cover the scintillator layer and the reflective layer with a cap-shaped moisture-proof body, and to attach the cap edge (flange) portion of the moisture-proof body to the substrate. structure.

In the case of using a cap-shaped moisture-proof body, if it is placed between the cap portion of the moisture-proof body When the amount of the adhesive applied to the substrate is increased, and the pressing force for bringing the cap portion and the substrate into close contact is increased to a certain extent or more, the sealing property between the cap portion and the substrate can be ensured, and High reliability.

However, when the amount of application of the adhesive agent is increased and the pressing force is increased to a certain level or more, the amount of the adhesive agent that overflows from the outer edge portion of the moisture-proof body is increased, and it is difficult to connect in the vicinity of the moisture-proof body. A flexible printed circuit board or the like. Further, when the amount of the adhesive agent overflowing from the outer side of the cap portion of the moisture-proof body is increased, when the final panel size is cut, the overflow portion of the adhesive agent interferes with the cutting blade.

Moreover, in recent years, in order to reduce the size and weight of the X-ray detector, it is desirable to reduce the size of the moisture-proof body cap portion. Therefore, it is further difficult to suppress the adhesion of the adhesive agent from the outer edge portion of the moisture-proof body to the outside.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] US Patent No. 6262422

[Patent Document 2] Japanese Patent Publication No. 05-242847

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2009-128023

The problem to be solved by the present invention is to provide a method and a radiation detector for a radiation detector which can suppress the overflow of the adhesive from the cap portion of the moisture-proof body to the outside.

A method of manufacturing a radiation detector according to an embodiment comprises the steps of: forming a scintillator layer for converting radiation into fluorescence on an array substrate having a photoelectric conversion element; and applying an adhesive to a moisture-proof body provided to cover the scintillator layer And an annular cap portion on the outer side of the scintillator layer or on the array substrate facing the cap portion; the cap portion is in close proximity to the array substrate; and the adhesive is cured. And, to make the above In a step in which the cap portion is in close proximity to the array substrate, the distance between the cap portion and the array substrate is kept constant by a thickness control portion provided outside the cap portion.

1‧‧‧X-ray detector

2‧‧‧Array substrate

2a‧‧‧Substrate

2b‧‧‧Photoelectric Conversion Department

2b1‧‧‧ photoelectric conversion components

2b2‧‧‧film transistor

2c1‧‧‧ control line

2c2‧‧‧ data line

2d1‧‧‧Wiring gasket

2d2‧‧‧Wiring gasket

2e1‧‧‧Flexible printed circuit board

2e2‧‧‧Flexible printed circuit board

2f‧‧‧protective layer

3‧‧‧Signal Processing Department

4‧‧‧ Highlighting the transmission department

4a‧‧‧Wiring

5‧‧‧ scintillation layer

6‧‧‧reflective layer

7‧‧‧Damps

7a‧‧‧Surface

7b‧‧‧ week face

7c‧‧‧Cap

8‧‧‧Next layer

8a‧‧‧Binder

18‧‧‧Next layer

100‧‧‧Tray

100a~100c‧‧‧Tray

101‧‧‧ base

101a‧‧‧ recess

101b‧‧‧Loading surface

102‧‧‧Anti-adhesion layer

103‧‧‧ thickness control department

103a‧‧‧Thickness Control Department

104‧‧‧ plate body

110‧‧‧Tray

111‧‧‧ base

111a‧‧‧ recess

111b‧‧‧Loading surface

111c‧‧‧ recess

112‧‧‧ base

112a‧‧‧ recess

112b‧‧‧Loading surface

112c‧‧‧ thickness control department

113‧‧‧ base

113a‧‧‧ recess

113b‧‧‧Loading surface

113c‧‧‧ recess

113d‧‧‧Thickness Control Department

S1‧‧‧ control signal

S2‧‧‧ image data signal

T‧‧‧layer thickness dimension

W1‧‧‧Band edge width dimension

W2‧‧‧layer width dimension

Fig. 1 is a schematic perspective view showing an example of the X-ray detector 1 of the first embodiment.

2 is a schematic cross-sectional view of the X-ray detector 1.

Figure 3 (a) is a schematic front view of the moisture-proof body; (b) is a schematic side view of the moisture-proof body.

Fig. 4 is a schematic cross-sectional view showing a tray (tool) 100 used for exemplifying the formation of the adhesive layer 8 of the present embodiment.

Fig. 5 is a schematic cross-sectional view showing a state in which the adhesive layer 8 of the present embodiment is formed.

Figure 6 is a schematic cross-sectional view of a tray (tool) 110 used to form the formation of the back layer 18 of the comparative example.

Fig. 7 is a schematic cross-sectional view showing a state in which the adhesive layer 18 of the comparative example is formed.

Fig. 8 is a schematic view showing a method of allowing the adhesive 8a to overflow from the cap portion 7c of the moisture-proof body 7 to the inside.

Fig. 9 is a schematic view showing a method of allowing the adhesive 8a to overflow from the cap portion 7c of the moisture-proof body 7 to the inside.

Fig. 10 is a schematic cross-sectional view showing a thickness control portion of another embodiment.

Fig. 11 is a schematic cross-sectional view showing a thickness control portion of another embodiment.

Fig. 12 is a schematic cross-sectional view showing a thickness control portion of another embodiment.

Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and the detailed description is omitted as appropriate.

Further, the radiation detector according to the embodiment of the present invention may apply various kinds of radiation such as y rays in addition to X-rays. Here, as an example, X-rays are used as radiation An example of a representative case will be described. Therefore, the "X-rays" of the following embodiments can be applied to other radiations by replacing them with "other radiations".

First, the X-ray detector 1 according to the first embodiment of the present invention will be exemplified.

[First Embodiment]

Fig. 1 is a schematic perspective view showing an example of the X-ray detector 1 of the first embodiment.

In addition, in order to avoid complication, in FIG. 1, the reflection layer 6, the moisture-proof body 7, etc. are abbreviate|omitted and it draws.

2 is a schematic cross-sectional view of the X-ray detector 1.

In order to avoid complication, in FIG. 2, the control line 2c1, the data line 2c2, the signal processing unit 3, the image transfer unit 4, and the like are omitted and drawn.

Fig. 3(a) is a schematic front view of the moistureproof body.

Figure 3 (b) is a schematic side view of the moisture barrier.

The X-ray detector 1 which is a radiation detector is an X-ray plane sensor that detects a radiographic image, that is, an X-ray image. The X-ray detector 1 can be used, for example, in general medical use or the like.

As shown in FIGS. 1 and 2, the X-ray detector 1 is provided with an array substrate 2, a signal processing unit 3, an image transfer unit 4, a scintillator layer 5, a reflective layer 6, a moisture-proof body 7, and an adhesive layer. 8.

The array substrate 2 converts visible light (fluorescence) converted from X-rays into an electrical signal by the scintillator layer 5.

The array substrate 2 has a substrate 2a, a photoelectric conversion portion 2b, a control line (or gate line) 2c1, a data line (or signal line) 2c2, and a protective layer 2f.

The substrate 2a has a plate shape and is formed of a light transmissive material such as glass.

The photoelectric conversion unit 2b is provided in plural numbers on one surface of the substrate 2a.

The photoelectric conversion unit 2b has a rectangular shape and is provided in a region partitioned by the control line 2c1 and the data line 2c2. The plurality of photoelectric conversion units 2b are arranged in a matrix.

Further, one photoelectric conversion unit 2b corresponds to one pixel (pixel).

Each of the plurality of photoelectric conversion units 2b is provided with a photoelectric conversion element 2b1 and a thin film transistor (TFT) (Thin Film Transistor) 2b2.

Further, an accumulation capacitor (not shown) that accumulates the converted signal charge is provided in the photoelectric conversion element 2b1. However, the photoelectric conversion element 2b1 may also serve as a cumulative capacitor (not shown) depending on the capacitance of the photoelectric conversion element 2b1.

The photoelectric conversion element 2b1 can be, for example, a photodiode or the like.

The thin film transistor 2b2 performs switching of accumulation and release of charges generated by fluorescence incident on the photoelectric conversion element 2b1, and the thin film transistor 2b2 may be a semiconductor including amorphous germanium (a-Si) or polycrystalline germanium (P-Si). Material. The thin film transistor 2b2 has a gate electrode, a source electrode, and a drain electrode. The gate electrode of the thin film transistor 2b2 is electrically connected to the corresponding control line 2c1. The source electrode of the thin film transistor 2b2 is electrically connected to the corresponding data line 2c2. The drain electrode of the thin film transistor 2b2 is electrically connected to the corresponding photoelectric conversion element 2b1 and an accumulation capacitor (not shown).

The control line 2c1 is provided with a plurality of strips in parallel with each other at a predetermined interval. The control line 2c1 extends in the first direction (for example, the column direction).

The plurality of control lines 2c1 are electrically connected to a plurality of wiring pads 2d1 provided in the vicinity of the periphery of the substrate 2a, respectively. Each of the plurality of wiring pads 2d1 is electrically connected to one end of a plurality of wirings provided on the flexible printed circuit board 2e1. The other ends of the plurality of wirings provided on the flexible printed circuit board 2e1 are electrically connected to a control circuit (not shown) provided in the signal processing unit 3.

The data line 2c2 is provided with a plurality of strips in parallel with each other at a predetermined interval. The data line 2c2 extends in a second direction (for example, a row direction) orthogonal to the first direction.

The plurality of data lines 2c2 are electrically connected to a plurality of wiring pads 2d2 provided in the vicinity of the periphery of the substrate 2a. Each of the plurality of wiring pads 2d2 is electrically connected to one end of a plurality of wirings provided on the flexible printed circuit board 2e2. The other ends of the plurality of wirings provided on the flexible printed circuit board 2e2 are electrically connected to an unillustrated amplifier provided in the signal processing unit 3, respectively. Circuit.

The protective layer 2f is provided to cover the photoelectric conversion portion 2b, the control line 2c1, and the data line 2c2.

The signal processing unit 3 is provided on the side opposite to the side of the photoelectric conversion unit 2b of the installation substrate 2a.

A control circuit (not shown) and an amplifier circuit (not shown) are provided in the signal processing unit 3.

A control circuit (not shown) controls the operation of each of the thin film transistors 2b2, that is, the on state and the off state. For example, a control circuit (not shown) sequentially applies a control signal S1 to each of the control lines 2c1 via the flexible printed circuit board 2e1, the wiring pad 2d1, and the control line 2c1. The thin film transistor 2b2 is turned on by the control signal S1 applied to the control line 2c1, and can receive the image data signal S2 from the photoelectric conversion portion 2b.

The amplifier circuit (not shown) sequentially receives the image data signal S2 from each of the photoelectric conversion units 2b via the data line 2c2, the wiring pad 2d2, and the flexible printed circuit board 2e2. Next, an amplifier circuit (not shown) amplifies the received image data signal S2.

The image transfer unit 4 is electrically connected to an amplifier circuit (not shown) of the signal processing unit 3 via the wiring 4a. Further, the image transfer unit 4 may be integrated with the signal processing unit 3.

The image transfer unit 4 sequentially converts the image data signal S2 sequentially amplified by the signal processing unit 3 into a series signal, and sequentially converts it into a digital signal. Next, the image transfer unit 4 forms an X-ray image based on the sequentially converted digital signals. The data of the configured X-ray image is output from the image transfer unit 4 to an external device. Further, the conversion of the series signal or the conversion of the digital signal can also be performed in the signal processing unit 3.

The scintillator layer 5 is provided on the photoelectric conversion element 2b1, and converts incident X-rays into visible light, that is, fluorescent light. The scintillator layer 5 is provided so as to cover a region of the substrate 2a on which the plurality of photoelectric conversion portions 2b are provided.

The scintillator layer 5 can be formed using, for example, cesium iodide (CsI): strontium (Tl), or sodium iodide (NaI): strontium (Tl) or the like. In this case, an aggregate of columnar crystals can be formed by vacuum deposition or the like.

Further, the scintillator layer 5 may be formed using, for example, bismuth oxysulfide (Gd ₂ O ₂ S) or the like. In this case, for example, the scintillator layer 5 can be formed as follows. First, the particles containing cerium oxysulfide are mixed with a binder. Next, the mixed material is applied so as to cover the region on the substrate 2a where the plurality of photoelectric conversion portions 2b are provided. Next, the coated material is fired. Next, a groove portion is formed on the material after firing using a blade cutting method or the like. In this case, a matrix-shaped groove portion can be formed in such a manner that a quadrangular columnar scintillator layer 5 is provided for each of the plurality of photoelectric conversion portions 2b. The groove portion may be filled with an inert gas such as air (air) or nitrogen gas for oxidation prevention. Further, the groove portion may be in a vacuum state.

In addition, the scintillator layer 5 exemplified in FIG. 2 includes a case of a vapor deposition film of cesium iodide: ruthenium. Therefore, the scintillator layer 5 is an aggregate of columnar crystals. In this case, the thickness of the scintillator layer 5 can be set to about 600 μm. The thickness of the column (column) of the columnar crystal can be set to about 8 to 12 μm on the outermost surface.

The reflective layer 6 is provided for improving the utilization efficiency of the fluorescent light and improving the sensitivity characteristics. In other words, the reflective layer 6 reflects the light generated in the scintillator layer 5 toward the side opposite to the side on which the photoelectric conversion portion 2b is provided, and is incident on the photoelectric conversion portion 2b.

The reflective layer 6 is provided to cover the scintillator layer 5. Further, the reflective layer 6 may be provided so as to cover the surface of the surface side (the incident surface side of the X-ray) of the scintillator layer 5 (for example, refer to FIG. 5).

The reflective layer 6 can be formed by forming a layer of a metal having a high light reflectance such as a silver alloy or aluminum on the scintillator layer 5. Further, the reflective layer 6 may be formed by applying a resin containing light-scattering particles such as titanium oxide (TiO ₂ ) to the scintillator layer 5 .

Further, the reflective layer 6 may be formed, for example, by using a plate having a metal having a high light reflectance such as a silver alloy or aluminum.

Further, the reflective layer 6 exemplified in FIG. 2 is formed by applying a material containing an ultrafine powder containing titanium oxide and a material obtained by mixing a binder and a solvent onto the scintillator layer 5 and drying it. .

The moisture-proof body 7 is provided to suppress deterioration of characteristics of the scintillator layer 5 or the reflective layer 6 due to water vapor contained in the air.

As shown in FIGS. 2, 3(a), and 3(b), the moisture-proof body 7 has a crown cap shape, and has a surface portion 7a, a circumferential surface portion 7b, and a brim (cap) portion 7c.

The moisture-proof body 7 can be formed by integrally molding the surface portion 7a, the circumferential surface portion 7b, and the brim portion 7c.

The moisture-proof body 7 may contain a material having a small moisture permeability coefficient.

The moisture-proof body 7 may include a low moisture-permeable moisture-proof material or the like in which a layer of, for example, aluminum, an aluminum alloy, a resin layer, and an inorganic material (a light metal such as aluminum, a ceramic material such as SiO ₂ , SiON, or Al ₂ O ₃ ) is laminated.

Further, the thickness of the moisture-proof body 7 can be determined in consideration of absorption or rigidity of X-rays. In this case, if the thickness dimension of the moistureproof body 7 is excessively increased, the X-ray absorption is excessive. If the thickness of the moisture-proof body 7 is excessively reduced, the rigidity is lowered and it is easily broken.

The moisture-proof body 7 can be formed, for example, by press molding an aluminum foil having a thickness of 0.1 mm.

The surface portion 7a faces the surface side (the incident surface side of the X-ray) of the scintillator layer 5.

The peripheral surface portion 7b is provided to surround the periphery of the surface portion 7a. The peripheral surface portion 7b extends from the peripheral edge of the surface portion 7a toward the substrate 2a.

The scintillator layer 5 and the reflective layer 6 are provided inside the space formed by the surface portion 7a and the peripheral surface portion 7b. Further, when the reflective layer 6 is not provided, the scintillator layer 5 is provided inside the space formed by the surface portion 7a and the peripheral surface portion 7b. There may be a gap between the surface portion 7a and the peripheral surface portion 7b, and the reflective layer 6 or the scintillator layer 5, or the surface portion 7a and the peripheral surface portion 7b may be in contact with the reflective layer 6 or the scintillator layer 5.

The cap portion 7c is provided to surround the end portion of the circumferential surface portion 7b on the side opposite to the surface portion 7a side. The cap portion 7c extends outward from the end portion of the peripheral surface portion 7b. The cap portion 7c is annular and is provided in parallel with the surface of the substrate 2a on the side where the photoelectric conversion portion 2b is provided.

The cap portion 7c is connected to the surface of the substrate 2a on the side where the photoelectric conversion portion 2b is provided via the bonding layer 8.

That is, the moistureproof body 7 has an annular brim portion 7c located outside the scintillator layer 5 and covers at least the scintillator layer.

If the cap-shaped moisture-proof body 7 is used, high moisture resistance can be obtained. In this case, since the moisture-proof body 7 is formed of aluminum or the like, it is considered that the water vapor is transmitted very little. However, since the adhesive layer 8 contains the adhesive 8a (resin), it is necessary to suppress the permeation of water vapor.

Next, the layer 8 is provided between the cap portion 7c and the surface of the array substrate 2 on the side where the photoelectric conversion portion 2b is provided. Next, the layer 8 is formed by curing the adhesive 8a.

The adhesive 8a used in forming the adhesive layer 8 is selected in consideration of the moisture permeability coefficient and the adhesion between the moisture-proof body 7 and the substrate 2a. The adhesive 8a used when forming the adhesive layer 8 may be, for example, an ultraviolet curable epoxy resin adhesive or a thermosetting epoxy resin adhesive.

Here, a case where a light-blocking member such as a wiring is provided in a region where the adhesive 8a of the substrate 2a contacts is provided. Therefore, in the case of using an ultraviolet curable adhesive, it is preferred to select a person who can be appropriately cured even if there is uneven irradiation. An ultraviolet curable adhesive which can be suitably cured even in the case of uneven irradiation, for example, an epoxy resin-based ultraviolet curable adhesive which promotes a curing reaction by cationic polymerization (for example, Nagase ChemteX (X) XNR- 5516ZHV-B1: specific gravity ρ specific gravity ρ5516Z ³ ) and so on.

Further, in order to lower the moisture permeability (transmission rate of water vapor) of the adhesive layer 8, it is preferred to select a material having a moisture permeability coefficient as small as possible.

For example, when 70% by weight or more of an inorganic material talc (talcite: Mg ₃ Si ₄ O ₁₀ (OH) ₂ ) is added to an epoxy resin-based adhesive, the moisture permeability coefficient of the adhesive layer 8 can be greatly reduced.

Here, the moisture permeability of the adhesive layer 8 will be described.

The moisture permeability of the moisture-proof structure including the moisture-proof body 7 and the adhesive layer 8 can be expressed by the following approximate formula (1).

QT=Q7+Q8......(1)

Q8=P. S/W =P. L. T/W......(2)

QT: moisture permeability of the moisture-proof structure as a whole

Q7: moisture permeability of moisture-proof body 7

Q8: moisture permeability of layer 8

P: moisture permeability coefficient of layer 8

S: moisture permeability cross-sectional area of layer 8

W: the width dimension of the layer 8

L: the perimeter of layer 8

T: thickness dimension of layer 8

In this case, the first term Q7 of the formula (1) indicates the moisture permeability of the moisture-proof body 7 which accounts for most of the moisture-proof structure. As the material of the moisture-proof body 7, if an aluminum foil having a thickness of 0.1 mm or the like is used, Q7 can be substantially suppressed to a zero level. Therefore, the perspective ratio of the entire moisture-proof structure is mainly the second item Q8 of the formula (1).

As shown in the formula (2), Q8 is determined by the dimensionality (L, T, W) of the adhesive layer 8 and the moisture permeability coefficient (P) of the material of the adhesive layer 8. That is, the moisture permeability in a constant temperature and humidity environment is determined by the dimension of the layer 8 and the moisture permeability coefficient of the material of the layer 8.

Here, in the case of the X-ray detector 1 requiring miniaturization or weight reduction, it is preferable that the width dimension W2 of the bonding layer 8 is as small as possible. However, in order to achieve both a decrease in the moisture permeability and an improvement in reliability, it is preferable to set the width dimension W2 of the adhesive layer 8 to 2 mm or more.

However, if the thickness dimension T of the adhesive layer 8 is excessively reduced, there is a possibility that the deviation of the width dimension W2 is increased when the adhesive layer 8 is formed. When the thickness T of the adhesive layer 8 is excessively reduced, the influence of the thickness dimension T of the cap portion 7c with respect to the adhesive layer 8 or the thickness dimension deviation of the thickness control portion 103 to be described later is increased.

On the other hand, if the thickness dimension T of the adhesive layer 8 is excessively increased, as shown in the formula (2), the moisture permeability of the subsequent layer 8 becomes large, and the function as a moisture-proof structure is lowered.

Therefore, the thickness dimension T of the subsequent layer 8 is preferably set to 0.1 mm or more and 0.4 mm or less.

Here, when the adhesive layer 8 is formed, the amount of the adhesive 8a applied is increased to the appropriate level. When the pressing force for bringing the cap portion 7c into close contact with the substrate 2a is increased to a certain value or more, the adhesive layer 8 having a large width W2 can be formed. Therefore, it is easy to ensure moisture resistance.

However, when the coating amount of the adhesive 8a is increased and the pressing force is increased to a certain level or more, the amount of the adhesive 8a overflowing from the outside of the cap portion 7c is increased, and it is difficult to connect in the vicinity of the moistureproof body 7. The flexible printed circuit boards 2e1, 2e2, etc. are the same. Further, when the amount of the adhesive 8a overflowing from the outside of the cap portion 7c is increased, when the final panel size is cut, the overflow portion of the adhesive 8a interferes with the cutting blade.

Moreover, in recent years, in order to reduce the size and weight of the X-ray detector 1, it is desirable to reduce the size of the brim portion 7c. Therefore, it is further difficult to suppress the overflow of the adhesive 8a from the cap portion 7c to the outside.

Therefore, it is necessary to set the thickness dimension T and the width dimension W2 of the adhesive layer 8 within an appropriate range, and to suppress the adhesive 8a from overflowing from the outside of the cap portion 7c.

In the X-ray detector 1 of the present embodiment, the end portion of the layer 8 opposite to the side of the scintillator layer 5 is disposed closer to the scintillator layer 5 than the wiring pads 2d1 and 2d2 provided on the periphery of the array substrate 2.

Further, as will be described later, the back layer 8 (see FIG. 9) may be used to overflow the inner edge portion 7c of the moisture-proof body 7.

In other words, the end portion of the layer 8 on the side of the scintillator layer 5 may be provided on the side of the scintillator layer 5 on the side of the scintillator layer 5 side of the cap portion 7c.

Next, a method of manufacturing the X-ray detector 1 and a method of forming the adhesive layer 8 according to the second embodiment of the present invention will be exemplified.

[Second Embodiment]

The X-ray detector 1 can be manufactured, for example, in the following manner.

First, the photoelectric conversion unit 2b, the control line 2c1, the data line 2c2, the wiring pad 2d1, the wiring pad 2d2, and the protective layer 2f are sequentially formed on the substrate 2a to form the array substrate 2. Array The column substrate 2 can be fabricated, for example, using a semiconductor process.

Next, the scintillator layer 5 is formed so as to cover the region on the array substrate 2 on which the plurality of photoelectric conversion portions 2b are formed. The scintillator layer 5 is formed by forming a film containing cerium iodide: cerium by, for example, vacuum deposition. In this case, the thickness of the scintillator layer 5 can be set to about 600 μm. The thickness of the column of the columnar crystal can be set to about 8 to 12 μm on the outermost surface.

Next, the reflective layer 6 is formed to cover the scintillator layer 5. The reflective layer 6 is formed by applying a material prepared by mixing an ultrafine powder containing, for example, titanium dioxide, a binder resin, and a solvent onto the scintillator layer 5 and drying it.

Next, a cap-shaped moisture-proof body 7 is attached to the substrate 2a, and the scintillator layer 5 and the reflective layer 6 are sealed by the moisture-proof body 7 and the adhesive layer 8.

The moisture-proof body 7 can be formed by, for example, press-forming an aluminum foil having a thickness of 0.1 mm. Moreover, the width dimension W1 of the brim portion 7c can be set to, for example, 2 mm.

The details of the method of forming the adhesive layer 8 will be described later.

Next, the array substrate 2 and the signal processing unit 3 are electrically connected via the flexible printed boards 2e1 and 2e2.

Moreover, the signal processing unit 3 and the image transfer unit 4 are electrically connected via the wiring 4a.

In addition, properly install circuit parts and the like.

Next, the array substrate 2, the signal processing unit 3, the image transfer unit 4, and the like are housed inside a casing (not shown).

Next, if necessary, an electrical test, an X-ray image test, a high-temperature high-humidity test, a hot and cold cycle test, and the like for confirming the presence or absence of abnormality or electrical connection abnormality of the photoelectric conversion element 2b1 are performed.

As described above, the X-ray detector 1 can be manufactured.

Next, a method of forming the subsequent layer 8 will be exemplified.

4 is a tray for exemplifying the formation of the adhesive layer 8 of the present embodiment. A schematic cross-sectional view of 100).

Fig. 5 is a schematic cross-sectional view showing a state in which the adhesive layer 8 of the present embodiment is formed.

First, the tray 100 to be used for forming the adhesive layer 8 of the present embodiment will be described.

As shown in FIG. 4, the tray 100 is provided with a base portion 101, an adhesion preventing layer 102, and a thickness control portion 103.

The base portion 101 has a plate shape, and a concave portion 101a is provided at a central portion. The depth dimension of the concave portion 101a can be set such that a gap can be formed between the bottom surface of the concave portion 101a and the surface portion 7a of the moistureproof body 7 when the moistureproof body 7 is placed on the tray 100. Moreover, the planar size of the concave portion 101a can be set such that a gap can be formed between the side wall surface of the concave portion 101a and the circumferential surface portion 7b of the moisture-proof body 7 when the moisture-proof body 7 is placed on the tray 100.

The periphery of the recessed portion 101a is a mounting surface 101b on which the cap portion 7c of the moistureproof body 7 is placed.

The adhesion preventing layer 102 is provided on the mounting surface 101b. The adhesion preventing layer 102 can be formed by, for example, applying a fluororesin coating to the mounting surface 101b or adhering a tape containing a fluororesin to the mounting surface 101b. When the adhesion preventing layer 102 is provided, even if the adhesive 8a for forming the adhesive layer 8 is adhered, it can be easily removed.

The control unit 103 is provided to receive the thickness dimension of the adhesive layer 8 within a specific range.

The thickness control unit 103 is disposed on the adhesion prevention layer 102. Further, the thickness control unit 103 may be provided on the mounting surface 101b. The thickness control unit 103 is provided at a position outside the brim portion 7c when the moisture-proof body is placed on the tray 100. In other words, the thickness control unit 103 is provided on the outer side of the region on which the moistureproof body 7 is placed. The thickness control unit 103 may be provided continuously (for example, in a ring shape) so as to surround the region on which the moisture-proof body 7 is placed, or may be intermittently provided on the outer side of the region on which the moisture-proof body 7 is placed.

The material of the thickness control unit 103 is not particularly limited, but it is preferable to consider setting the thickness control. The durability of the step of the portion 103, the smoothness of the surface, the stability of the thickness, and the like are selected.

Here, the thickness control unit 103 is a one in which the pressing size of the adhesive 8a is set to a constant value when the adhesive 8a is pressurized. Therefore, the thickness control unit 103 may be a member that is substantially stable in thickness and flat. However, as described later, since the thickness control unit 103 is in contact with the array substrate 2 (substrate 2a), it is preferable that at least the surface side (contact surface side) is not made of an inorganic material such as metal or ceramic, but has flexibility (softness). Material formation. For example, when the thickness control unit 103 includes an inorganic material, there is a risk of damage to the substrate 2a. Further, the thickness control unit 103 is pressed against the tray 100 side, and the effective thickness dimension of the thickness control unit 103 changes over time.

Therefore, the thickness control unit 103 can be made flexible at least on the side contacting the array substrate 2.

For example, the thickness control portion 103 may be formed of a fluororesin.

The thickness dimension of the thickness control portion 103 can be appropriately determined depending on the thickness dimension of the formed back layer 8. For example, in the case shown in FIG. 5, when the thickness of the cap portion 7c is 0.1 mm, and the pressing size of the adhesive 8a (the thickness of the formed back layer 8) is 0.15 mm, the thickness control portion The thickness of 103 can be set to 0.25 mm.

Further, the thickness control unit 103 may be held at a specific position when the adhesive 8a is pressurized. However, if the position of the thickness control unit 103 is shifted, there is a possibility that the pressing size of the adhesive 8a cannot be set to a constant value. Further, the thickness control unit 103 is in contact with the adhesive 8a, the brim portion 7c, and the like to deteriorate the quality of the formed backing layer 8 or the moisture-proof body 7.

Therefore, the thickness control unit 103 is preferably a fixed person.

For example, the thickness control unit 103 may be provided with a resin layer and an adhesive layer provided on the resin layer, and provided on the tray 100 via the adhesive layer. The thickness control unit 103 can be formed, for example, by adhering a fluororesin adhesive tape or the like.

In this case, if the thickness control unit 103 is fixed to the tray 100 side, it is only thick. The degree control unit 103 can be reused without being worn and damaged.

The thickness control unit 103 may be fixed to the substrate 2a side. However, since the substrate 2a itself is a product, the thickness control unit 103 must be fixed in this case. Further, the thickness control unit 103 must be removed after the formation of the adhesive layer 8.

Therefore, the thickness control unit 103 is preferably fixed to the tray 100 side.

Next, the formation of the adhesive layer 8 using the tray 100 (the subsequent step of the moisture-proof body 7) will be described.

First, the surface (adjoining surface) of the brim portion 7c of the moisture-proof body 7 is cleaned.

Purification can be carried out, for example, by organic solvent washing, ultraviolet ozone treatment (Ultraviolet-Ozone Surface Treatment), plasma treatment, or the like.

Next, the moistureproof body 7 is placed on the tray 100, and the adhesive 8a is applied to the surface of the cap portion 7c. The subsequent agent 8a is applied over the entire circumference of the cap portion 7c.

Here, if the coating amount of the adhesive 8a is not appropriate, the amount of overflow increases, or the width dimension W2 of the layer 8 is reduced.

Therefore, the coating amount of the adhesive 8a is determined in consideration of the volume of the formed adhesive layer 8.

The subsequent agent 8a can be applied in a specific amount using, for example, a liquid dosing device (dispenser).

The subsequent agent 8a is selected in consideration of the moisture permeability coefficient and the adhesion between the moisture-proof body 7 and the substrate 2a. The adhesive 8a can be, for example, an ultraviolet curable epoxy resin adhesive or a thermosetting epoxy resin adhesive. The subsequent agent 8a may be applied to the array substrate 2 (substrate 2a) side opposite to the cap portion 7c.

Next, the cap portion 7c applied to the moisture-proof body 7 or the adhesive 8a on the array substrate 2 (substrate 2a) facing the cap portion 7c is brought into contact with the array substrate 2 (substrate 2a).

First, as shown in FIG. 5, the array substrate 2 on which the scintillator layer 5 and the reflective layer 6 are formed is held by the plate-like body 104.

Next, the tray 100 on which the moistureproof body 7 is placed is opposed to the plate-like body 104.

Next, the plate-like body 104 and the tray 100 are relatively moved in the proximity direction, and the thickness control unit 103 is brought into contact with the array substrate 2 (substrate 2a). In the case shown in FIG. 5, the tray 100 is pushed up to bring the thickness control unit 103 into contact with the array substrate 2 (substrate 2a). Alternatively, the plate-like body 104 may be pressed down, or the tray 100 may be pushed up and the plate-shaped body 104 may be pressed down. Further, although the tray 100 is disposed below the plate-shaped body 104, the plate-like body may be disposed below the tray 100.

The thickness control unit 103 is in contact with the array substrate 2 to define the pressing size of the adhesive 8a (the thickness dimension of the formed back layer 8).

Next, in a state where the thickness control unit 103 is brought into contact with the array substrate 2 (substrate 2a), the adhesive 8a is cured to form the adhesive layer 8.

For example, when the adhesive 8a is an ultraviolet curable adhesive, the adhesive 8a can be cured by irradiating ultraviolet rays to the adhesive 8a.

In this case, when the adhesive 8a is an epoxy resin-based ultraviolet curable adhesive which promotes the curing reaction by cationic polymerization, even if the ultraviolet light is unevenly irradiated by the wiring provided on the substrate 2a, the irradiation can be performed. Proper hardening.

Further, when the adhesive 8a is a thermosetting adhesive, the adhesive 8a can be cured by heating the adhesive 8a.

Moreover, the step of bringing the adhesive 8a applied to the cap portion 7c of the moisture-proof body 7 into contact with the array substrate 2 (substrate 2a) and the step of curing the adhesive 8a to form the adhesive layer 8 can be used for the decompressed gas. The environment is carried out indoors. When the steps are performed in a reduced-pressure gas atmosphere, the scintillator layer 5 and the reflective layer 6 can be pressure-tightly sealed inside the moisture-proof body 7.

As above, the adhesive layer 8 can be formed.

As described above, the method of manufacturing the X-ray detector of the present embodiment includes the steps of: forming a scintillator layer 5 for converting X-rays into fluorescence on the array substrate 2 having the photoelectric conversion element 2b1; and coating the adhesive 8a Between the moisture-proof body disposed on the layer covering the scintillator layer 5 7 and an annular brim portion 7c located on the outer side of the scintillator layer 5; the cap portion 7c is in close proximity to the array substrate 2; and the adhesive 8a is cured.

Next, in the step of bringing the cap portion 7c into close contact with the array substrate 2, the distance between the cap portion 7c and the array substrate 2 is kept constant by the thickness control portion 103 provided on the outer side of the cap portion 7c.

Further, in the step of bringing the cap portion 7c into close proximity to the array substrate 2, the moistureproof body 7 is placed on the tray 100. Next, the thickness control unit 103 provided outside the region on which the moisture-proof body 7 is placed on the tray 100 is in contact with the array substrate 2.

Next, the formation of the adhesive layer 18 of the comparative example will be described.

Fig. 6 is a schematic cross-sectional view showing a tray (tool) 110 used to form the adhesive layer 18 of the comparative example.

Fig. 7 is a schematic cross-sectional view showing a state in which the adhesive layer 18 of the comparative example is formed.

As shown in FIG. 6, the tray 110 is provided with a base 101 and an adhesion preventing layer 102.

That is, the thickness control unit 103 is not provided in the tray 110. Further, the tray 110 is the same as the tray 100 except that the thickness control unit 103 is not provided.

The formation of the adhesive layer 18 of the comparative example is carried out using the tray 110.

First, as in the case where the adhesive layer 8 is formed, the surface (adjacent surface) of the cap portion 7c of the moisture-proof body 7 is cleaned, and the adhesive 8a is applied to the surface of the cap portion 7c.

Next, the adhesive 8a applied to the cap portion 7c of the moisture-proof body 7 is brought into contact with the array substrate 2 (substrate 2a).

In the formation of the adhesive layer 18 of the comparative example, as shown in Fig. 7, the plate-like body 104 and the tray 110 are relatively moved in the immediate direction, and the adhesive 8a applied to the cap portion 7c of the moisture-proof body 7 is brought into contact. On the array substrate 2 (substrate 2a).

In this case, since the thickness control unit 103 is not provided on the tray 110, the pressing size of the adhesive 8a (the thickness dimension of the formed adhesive layer 18) is specified, for example, by controlling the pressing force.

However, due to the hardness or viscosity of the adhesive 8a, the wettability of the adhesive 8a with respect to the substrate 2a or the brim portion 7c, the in-plane distribution of the pressing force, etc., the flattening manner and expansion mode of the adhesive 8a may vary. . It is extremely difficult to control the influence factors and press the adhesive 8a throughout the entire circumference and control the pressing size of the adhesive 8a, or even the width dimension or the overflow amount of the layer 8. Therefore, the pressing size deviation of the adhesive 8a is increased, and as shown in Fig. 7, the overflow amount of the adhesive 8a is increased or the width dimension of the layer 18 is decreased.

For example, when the coating amount of the adhesive 8a is increased and the pressing force is increased, the amount of overflow of the subsequent layer 8 is remarkably increased.

Moreover, when the coating amount of the adhesive 8a is reduced, the width dimension of the subsequent layer 8 is reduced, and the width dimension deviation is also increased. Therefore, there is a case where the width of the adhesive layer 8 is extremely small, and the moisture resistance is deteriorated.

On the other hand, according to the method of forming the adhesive layer 8 using the tray 100, the amount of overflow of the adhesive 8a can be suppressed, and the adhesive layer 8 having an appropriate size can be easily formed.

Next, the characteristics of the adhesive layer 8 of the present embodiment will be described.

First, the dimensional accuracy of the adhesive layer 8 of the present embodiment will be described.

Here, the adhesive layer 8 of this embodiment is formed using the tray 100.

The adhesive layer 18 of the comparative example is formed using the tray 110.

Further, the specific gravity of the adhesive 8a was set to be about 1.4 g/cc, and the amount of the adhesive 8a applied to the brim portion 7c was set to two levels of 0.4 mg/mm and 0.6 mg/mm.

Further, when the press conditions set then the brim portion 7c of per unit area of ^{0.5kgf / cm 2, 1.0kgf / cm} 2, 1.5kgf / cm 2 of 3 standard.

Moreover, the width dimension W1 of the brim portion 7c is set to 2 mm.

The measurement results of the thickness dimension T of the subsequent layer 8 and the subsequent layer 18 are shown in Tables 1 and 2 below.

In addition, Table 1 shows the case where the amount of the adhesive 8a is 0.4 mg/mm.

Table 2 shows the case where the amount of the adhesive 8a is 0.6 mg/mm.

The measurement of the width dimension W2 of the bonding layer 8 and the bonding layer 18 is shown in Tables 3 and 4 below. fruit.

Further, Table 3 is a case where the amount of the adhesive 8a is 0.4 mg/mm.

Table 4 shows the case where the amount of the adhesive 8a is 0.6 mg/mm.

Further, the width dimension W2 of the subsequent layer also includes the size when the portion of the cap portion 7c overflows.

As is apparent from Tables 1 to 4, in the adhesive layer 8 of the present embodiment, the deviation between the thickness dimension T and the width dimension W2 was reduced as compared with the adhesive layer 18 of the comparative example. It means high stability and high reliability for moisture resistance.

Moreover, the width dimension W1 of the brim portion 7c is 2 mm. Therefore, as is clear from Tables 3 and 4, in the adhesive layer 8 of the present embodiment, the amount of overflow from the cap portion 7c is reduced as compared with the adhesive layer 18 of the comparative example.

Next, the reliability of the moisture barrier of the adhesive layer 8 of the present embodiment will be described.

In the reliability test regarding moisture prevention, the use of the moisture-proof body 7 on the dummy panel is used. The dummy panel is formed by forming only the protective layer 2f on the substrate 2a, and the photoelectric conversion portion 2b, the control line 2c1, and the data line 2c2 are not formed. The scintillator layer 5 and the reflective layer 6 are formed in order to confirm the change in characteristics.

The reason why the dummy panel is used is that the transmission of the scintillation light such as the pixel pattern existing in the array substrate is not formed, so that the characteristics of the luminance or the resolution are measured from the back side of the substrate. Further, regarding the moisture-proof reliability or the cold-heat reliability, even when a dummy substrate is used, the same evaluation as in the case of using the array substrate 2 can be achieved.

Samples 1 to 6 are the case where the adhesive layer 100 of the present embodiment formed by the tray 100 is used.

Samples 7 to 12 are the case of using the adhesive layer 18 of the comparative example formed by the tray 110.

The formation conditions of the samples 1 to 12 are as shown in Table 5.

Moreover, the width dimension W1 of the brim portion 7c was set to 2 mm.

In the high-temperature and high-humidity test, the resolution characteristics obtained by the scintillator layer 5 and the reflective layer 6 were evaluated in a high-temperature and high-humidity environment (60°-90% RH) as the storage time elapsed.

In addition, it is evaluated based on the resolution characteristics that are more sensitive to humidity than brightness.

The resolution characteristic is obtained by arranging a resolution chart on the surface side of each sample, irradiating an X-ray equivalent to RQA-5, and measuring a CTF (Contrast transfer function) of 2 Lp/mm from the back side. .

Table 6 shows the results of the high temperature and high humidity test.

In addition, the numerical value in Table 6 is the maintenance rate (%) in the case where the CTF of the initial apparatus was set to 100 (%).

As is clear from Table 6, the adhesion layer 8 of the present embodiment and the adhesion layer 18 of the comparative example are almost equal to the reliability of high temperature and high humidity. However, the adhesion layer 8 of the present embodiment is considered to be relatively stable as a whole.

Here, if the portion overflowing from the cap portion 7c is provided and the width dimension W2 of the subsequent layer 18 is lengthened, it is easy to suppress the permeation of water vapor.

In the adhesive layer 8 of the present embodiment, the width dimension W2 and the width dimension W1 of the cap portion 7c are almost the same, and the deviation is reduced. Further, the deviation of the thickness dimension T of the layer 8 is also reduced. Therefore, there is no portion that is likely to pass through the thickness T of the water vapor or a portion where the width W2 is reduced. As a result, it is considered that the reliability of high temperature and high humidity equivalent to the case of the subsequent layer 18 can be ensured even without the portion overflowing from the cap portion 7c. That is, it is considered to be due to The entire area of the layer is sufficient to ensure the dimensionality (width size and thickness dimension) necessary to suppress the adhesion of water vapor.

In the thermal cycle test, the temperature conditions were set to (-20 ° C × 1 h) → (room temperature × 30 minutes) → (60 ° C × 1 h) → (room temperature × 30 minutes), and the number of cycles was set to a maximum of 100 cycles.

Next, every 10 cycles in the middle of the process, it was confirmed whether or not an abnormality such as peeling or breakage occurred in the adhesive layer of each sample.

Table 7 shows the results of the thermal cycle test.

In addition, in the numerical values in Table 7, "2" indicates that there is no abnormality, and "1" indicates that there is an abnormality.

As can be seen from Table 7, the reliability of the thermal cycle test is almost the same as that of the adhesive layer 8 of the present embodiment, and the laminate layer 18 of the comparative example. Layer 8 is relatively stable.

The adhesive layer 8 of the present embodiment is sufficiently formed in a region in the vicinity of the end portion of the cap portion 7c. Therefore, the effective area of the interface between the cap portion 7c and the adhesive layer 8 and the effective area of the interface between the substrate 2a and the adhesive layer 8 are inferior to those of the adhesive layer 18. Further, as described above, the subsequent quality of the layer 8 is relatively stable throughout the entire area. As a result, it is considered that the reliability of the hot and cold cycle can be ensured.

As described above, according to the adhesive layer 8 of the present embodiment, the reliability against high temperature and high humidity and the reliability against the hot and cold cycle can be ensured.

As described above, when the adhesive 8a overflows from the cap portion 7c of the moisture-proof body 7, it is difficult to connect with the flexible printed boards 2e1, 2e2, etc., or it is difficult to reduce the size or weight of the X-ray detector 1. Wait a minute.

However, when the adhesive 8a overflows from the cap portion 7c of the moisture-proof body 7 to the inside, it is acceptable as long as it does not affect the effective pixel region portion of the scintillator layer 5.

Also, there are the following advantages.

For example, when the adhesive 8a overflows from the cap portion 7c of the moisture-proof body 7, the effective transmission path of the layer 8 becomes long. Therefore, this portion can suppress the permeation of water vapor.

Further, when the adhesive 8a overflows from the cap portion 7c of the moisture-proof body 7, the contact area between the moisture-proof body 7 and the adhesive layer 8 and the contact area between the adhesive layer 8 and the substrate 2a can be increased. Therefore, the reliability of the cold and heat cycle test and the like can be improved.

8 and 9 are schematic views for explaining a method of allowing the adhesive 8a to overflow from the cap portion 7c of the moisture-proof body 7 to the inside.

First, as shown in Fig. 8, the moisture-proof body 7 is placed on the tray 100, and the adhesive 8a is applied to the surface of the cap portion 7c.

At this time, the adhesive 8a is applied over the entire circumference of the vicinity of the center position of the cap portion 7c.

Further, the adhesive 8a is applied over the entire circumference of the adhesive 8a applied in the vicinity of the center position of the brim portion 7c.

In other words, the adhesive 8a is applied annularly in the vicinity of the center position of the cap portion 7c, and the adhesive agent 8a is applied in a ring shape at an appropriate interval (for example, from about 0.5 mm to 1.0 mm).

Next, as shown in FIG. 9, the plate-like body 104 and the tray 100 are relatively moved in the proximity direction, and the thickness control part 103 is contacted with the array substrate 2 (substrate 2a).

The thickness control unit 103 is in contact with the array substrate 2 to define the pressing size of the adhesive 8a (the thickness dimension of the formed back layer 8).

At this time, the adhesive 8a which is applied to the inner side of the center edge of the cap portion 7c in an annular shape overflows from the cap portion 7c of the moisture-proof body 7 to the inside.

In this case, if the amount of the adhesive 8a applied to the inner side of the brim portion 7c in the annular shape or the interval between the cyclically applied adhesives 8a is appropriately selected, it is possible to suppress The subsequent agent 8a overflows from the cap portion 7c to the outside, and allows the adhesive 8a to overflow from the cap portion 7c to the inside.

For example, when the width W1 of the brim portion 7c is 2 mm, the thickness of the brim portion 7c is 0.1 mm, and the thickness of the thickness control portion 103 is 0.25 mm, the pressing size of the adhesive 8a is 0.15mm.

In this case, the adhesive 8a was applied at a coating amount of 0.4 mg/mm in the vicinity of the center position of the cap portion 7c, and was applied at a gap of 0.8 mm on the inner side thereof at a coating amount of 0.4 mg/mm. Cloth adhesive 8a. (The specific gravity of the adhesive is, for example, the specific gravity of the ρ agent is, for example, ρ ³ )

In this manner, the adhesive 8a can be prevented from overflowing from the outside of the cap portion 7c, and the adhesive 8a can be allowed to overflow from the cap portion 7c to the inside.

Next, the thickness control unit of another embodiment will be exemplified.

10 to 12 are schematic cross-sectional views for illustrating a thickness control unit according to another embodiment.

As shown in FIG. 10, the tray 100a is provided with a base portion 111, an adhesion preventing layer 102, and a thickness control portion 103a.

The base portion 111 has a plate shape, and a concave portion 111a is provided at the center portion. The concave portion 111a can be the same as the above-described concave portion 101a. The periphery of the recessed portion 111a is a mounting surface 111b on which the cap portion 7c of the moistureproof body 7 is placed. A concave portion 111c is provided on the outer side of the mounting surface 111b. That is, the tray 100a is attached to the above-described tray 100 and further provided with the concave portion 111c.

The thickness control unit 103a is provided in the recess 111c. Therefore, the thickness dimension can be extended as compared with the thickness control unit 103 described above. Therefore, it is easy to manufacture the thickness control part 103a by mechanical processing or shaping|molding.

As shown in FIG. 11, the base 100, the adhesion prevention layer 102, and the thickness control part 112c are provided in the tray 100b.

The base portion 112 has a plate shape, and a concave portion 112a is provided at a central portion. The concave portion 112a can be made the same as the above-described concave portion 101a. A mounting surface 112b of the brim portion 7c of the moistureproof body 7 is placed around the recess 112a.

A thickness control portion 112c that protrudes from the mounting surface 112b is provided in the vicinity of the periphery of the base portion 112. That is, one of the base portions 112 serves as the thickness control portion 112c.

Therefore, the dimensional accuracy of the thickness dimension of the thickness control portion 112c can be improved.

As shown in FIG. 12, the tray 100c is provided with a base portion 113, an adhesion preventing layer 102, and a thickness control portion 113d.

The base portion 113 has a plate shape, and a concave portion 113a is provided at the center portion. The concave portion 113a can be the same as the above-described concave portion 101a. The periphery of the recessed portion 113a serves as a mounting surface 113b on which the cap portion 7c of the moistureproof body 7 is placed. A concave portion 113c is provided on the outer side of the mounting surface 113b.

The thickness control unit 113d protrudes from the concave portion 113c. That is, one of the base portions 113 serves as the thickness control portion 113d. That is, the base portion 113 is integrally formed with the base portion 111 and the thickness control portion 103a described above.

Therefore, the thickness control portion 113d can be easily formed by machining or forming. Moreover, the dimensional accuracy of the thickness dimension of the thickness control portion 113d can be improved.

The embodiments of the present invention have been exemplified above, but the embodiments are described as examples. The present invention is not intended to limit the scope of the invention. The present invention can be implemented in various other forms, and various omissions, substitutions, changes and the like can be made without departing from the scope of the invention. The inventions and their modifications are intended to be included within the scope of the inventions and the scope of the invention. Further, each of the above embodiments can be implemented in combination with each other.

2‧‧‧Array substrate

2a‧‧‧Substrate

5‧‧‧ scintillation layer

6‧‧‧reflective layer

7‧‧‧Damps

7a‧‧‧Surface

7b‧‧‧ week face

7c‧‧‧Cap

8‧‧‧Next layer

8a‧‧‧Binder

100‧‧‧Tray

101‧‧‧ base

102‧‧‧Anti-adhesion layer

103‧‧‧ thickness control department

104‧‧‧ plate body

Claims (7)

A method of manufacturing a radiation detector comprising the steps of: forming a scintillator layer for converting radiation into fluorescence on an array substrate including a photoelectric conversion element; and applying an adhesive to a moisture-proof body disposed on the scintillator layer And an annular cap portion on the outer side of the scintillator layer or on the array substrate facing the cap portion; the cap portion is in close proximity to the array substrate; the adhesive is cured; and the cap is made In the step of the portion adjacent to the array substrate, the distance between the cap portion and the array substrate is kept constant by a thickness control portion provided outside the cap portion. The method of manufacturing a radiation detector according to claim 1, wherein in the step of bringing the cap portion into proximity with the array substrate, the moisture-proof system is placed on a tray, and the moisture-proof body is placed on the tray. The thickness control unit outside the region is in contact with the array substrate. The method of manufacturing a radiation detector according to claim 1 or 2, wherein the thickness control portion has flexibility at least on a side contacting the array substrate. The method of manufacturing a radiation detector according to claim 2, wherein the thickness control unit includes a resin layer and an adhesive layer provided on the resin layer, and the thickness control unit is provided on the tray via the adhesive layer. The method of manufacturing a radiation detector according to claim 3, wherein the thickness control unit includes a resin layer and an adhesive layer provided on the resin layer, and the thickness control unit is provided on the tray via the adhesive layer. A radiation detector comprising: an array substrate comprising a photoelectric conversion element; a scintillator layer disposed on the photoelectric conversion element and converting the radiation into a fluorescent light; and a moistureproof body comprising the outer side of the scintillator layer An annular cap portion covering the scintillator layer; a second layer disposed between the cap portion and the array substrate; and an end portion of the adhesive layer opposite to the scintillator layer side disposed on the end portion The wiring spacer around the array substrate is further on the side of the scintillator layer; the thickness of the adhesive layer is 0.1 mm or more and 0.4 mm or less; and the width of the subsequent layer is 2 mm or more. The radiation detector according to claim 6, wherein the end portion of the adhesive layer on the scintillator layer side is provided on the side of the scintillator layer on the side of the scintillator layer side of the cap portion.