JP2003255050A - Radiation detecting apparatus, its manufacturing method, and radiation detecting system - Google Patents

Radiation detecting apparatus, its manufacturing method, and radiation detecting system

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Publication number
JP2003255050A
JP2003255050A JP2002058848A JP2002058848A JP2003255050A JP 2003255050 A JP2003255050 A JP 2003255050A JP 2002058848 A JP2002058848 A JP 2002058848A JP 2002058848 A JP2002058848 A JP 2002058848A JP 2003255050 A JP2003255050 A JP 2003255050A
Authority
JP
Japan
Prior art keywords
light
photoelectric conversion
element substrate
shielding plate
conversion element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002058848A
Other languages
Japanese (ja)
Inventor
Masato Inoue
正人 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2002058848A priority Critical patent/JP2003255050A/en
Publication of JP2003255050A publication Critical patent/JP2003255050A/en
Pending legal-status Critical Current

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  • Light Receiving Elements (AREA)
  • Measurement Of Radiation (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To simplify a manufacturing process so as to both reduce the costs of radiation detecting apparatuses and mass produce them. <P>SOLUTION: In the radiation detecting apparatus, a light-shielding plate 4-1 for efficiently guiding light to the side of a photoelectric conversion element substrate 1, a fluorescent substance 2 for converting radiation into light, and the photoelectric conversion element substrate 1 for converting light into an electrical signal are located from the incidence side of radiation. The fluorescent substance 2 and the light-shielding plate 4-1 are glued to each other by an adhesive 7, and the fluorescent substance 2 and the photoelectric converting element substrate 1 are glued to each other by an adhesive 6. The side surfaces of the fluorescent substance 2 and the side surfaces of the photoelectric conversion element substrate 1 are sealed. The end parts of the light-shielding plate 4-1 are bent to the side of the photoelectric conversion element substrate 1 so as to cover the side surfaces of the fluorescent substance 2 and the side surfaces of the photoelectric conversion element substrate 1 by guiding to the side of the photoelectric converting element substrate 1 the adhesive 7 (8-1), which is applied between the fluorescent substance 2 and the light-shielding plate 4-1 and is extruded, when they are pressed against each other. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、放射線検出装置、
その製造方法、放射線検出システムに関し、特に、特に
医療用のX線撮像装置、産業用の非破壊検査装置などに
用いる放射線検出装置、その製造方法、放射線検出シス
テムに関する。
TECHNICAL FIELD The present invention relates to a radiation detection device,
The present invention relates to a manufacturing method and a radiation detection system, and more particularly, to a radiation detection apparatus used particularly for medical X-ray imaging apparatuses, industrial nondestructive inspection apparatuses, etc., a manufacturing method thereof, and a radiation detection system.

【0002】なお、本明細書では、放射線の範ちゅう
に、X線、α線、β線、γ線などを含むものとして説明
する。
[0002] In the present specification, description will be given assuming that X-rays, α rays, β rays, γ rays and the like are included in the category of radiation.

【0003】[0003]

【従来の技術】従来、X線撮像装置等には、縮小光学系
とCCD型センサを用いた読み取り系が用いられていた
が、近年、水素化アモルファスシリコン(以下、「a−
Si」と称する。)に代表される光電変換半導体材料の
開発により、光電変換素子及び信号処理部を大面積の基
板に形成し、情報源と等倍の光学系で読み取るいわゆる
密着型センサの開発がめざましい。
2. Description of the Related Art Conventionally, a reading system using a reduction optical system and a CCD type sensor has been used for an X-ray image pickup device or the like, but in recent years, hydrogenated amorphous silicon (hereinafter referred to as "a-
"Si". The development of a photoelectric conversion semiconductor material represented by (1) is remarkable in the development of a so-called contact type sensor in which a photoelectric conversion element and a signal processing unit are formed on a large-area substrate and read by an optical system having the same magnification as the information source.

【0004】特にa−Siは光電変換材料としてだけで
なく、薄膜電界効果型トランジスタ(以下、「TFT」
と称する。)としても用いることができるので光電変換
半導体層とTFTの半導体層とを同時に形成することが
できる利点を有している。
In particular, a-Si is used not only as a photoelectric conversion material but also as a thin film field effect transistor (hereinafter referred to as "TFT").
Called. Since it can also be used as a), it has an advantage that the photoelectric conversion semiconductor layer and the semiconductor layer of the TFT can be simultaneously formed.

【0005】また、同時に形成する薄膜電界効果トラン
ジスタ等のスイッチ素子および容量素子とはマッチング
が良く、同一膜構成で形成できるため共通な膜として同
時に形成可能であり、さらに光電変換装置を高SN化、
低コスト化することができる。
Further, it is well matched with a switch element and a capacitive element such as a thin film field effect transistor which are formed at the same time and can be formed as a common film at the same time because they can be formed with the same film structure. ,
The cost can be reduced.

【0006】またコンデンサも中間層として共通に使用
される絶縁層を含んで構成することに加えて、良好な特
性で形成でき複数の光電変換素子で得られた光情報の積
分値を簡単な夫々構成で出力できる高機能の光電変換装
置が提供出来る。また低コストで大面積、高機能、高特
性である点を利用してX線レントゲン装置等を提供でき
る。
Further, in addition to the capacitor including an insulating layer commonly used as an intermediate layer, the capacitor can be formed with good characteristics and the integrated value of the optical information obtained by a plurality of photoelectric conversion elements can be easily calculated. It is possible to provide a high-performance photoelectric conversion device that can output with a configuration. Further, it is possible to provide an X-ray roentgen apparatus and the like by taking advantage of its large area, high function, and high characteristics at low cost.

【0007】ところで、一般的にこのような光電変換素
子は、薄型、軽量化あるいは製造のしやすさ、コスト面
から、薄板ガラスの表面に幾重層からなる薄膜層で製造
される。この場合、薄板ガラスは大判になればなるほ
ど、歪あるいは割れ等が発生しやすくなり、これに対処
するために、ガラス板あるいは金属等による支持基台に
接着あるいはメカニカルな固定を行うことが必須とな
る。
By the way, such a photoelectric conversion element is generally manufactured by a thin film layer composed of several layers on the surface of a thin glass plate in view of thinness, weight reduction, easiness of manufacturing, and cost. In this case, the larger the thin glass, the more likely it is that distortion or cracks will occur, and in order to deal with this, it is essential to adhere or mechanically fix it to a support base made of glass plate or metal. Become.

【0008】図9は、従来のX線検出装置の模式的側面
図である。図9において、101は複数の光電変換素子
を配した光電変換素子基板102はシート状の波長変換
体である蛍光体、103は支持基台、104は遮光板、
51は蛍光体102を光電変換素子基板101を固定す
る接着剤であり、52は光電変換素子基板101を支持
基台103に固定する接着剤であり、53は遮光板10
4を蛍光体102に固定する接着剤であり、54は4部
材(支持基台103、光電変換素子基板101、蛍光体
102、遮光板104)からなる光電変換装置を外気か
ら遮断するシールド材である。
FIG. 9 is a schematic side view of a conventional X-ray detector. In FIG. 9, 101 is a photoelectric conversion element substrate on which a plurality of photoelectric conversion elements are arranged, 102 is a phosphor that is a sheet-shaped wavelength conversion element, 103 is a support base, 104 is a light shielding plate,
Reference numeral 51 is an adhesive for fixing the phosphor 102 to the photoelectric conversion element substrate 101, 52 is an adhesive for fixing the photoelectric conversion element substrate 101 to the support base 103, and 53 is the light shielding plate 10.
4 is an adhesive for fixing 4 to the phosphor 102, and 54 is a shield material that shields the photoelectric conversion device including four members (support base 103, photoelectric conversion element substrate 101, phosphor 102, and light shielding plate 104) from the outside air. is there.

【0009】図10は、図9を上から見た概略図であ
る。図10に示すように、光電変換素子基板101およ
び蛍光体102の周辺端部からの光の漏れこみを軽減す
るために、遮光板104の大きさは光電変換素子基板1
01および蛍光体102の大きさよりも大きくしてい
る。
FIG. 10 is a schematic view of FIG. 9 seen from above. As shown in FIG. 10, in order to reduce the leakage of light from the peripheral end portions of the photoelectric conversion element substrate 101 and the phosphor 102, the size of the light shielding plate 104 is set to the photoelectric conversion element substrate 1
01 and the size of the phosphor 102 are made larger.

【0010】図11は、図10の光電変換素子基板1の
模式図である。光電変換素子基板1は、図11に示すよ
うに、蛍光体102からの光を受光し、電流に変換する
ための複数の光電変換素子10とそれぞれの光電変換素
子10に対応して、光電変換された電気信号を処理する
ための複数の集積回路素子11で構成され、光電変換素
子10と集積回路素子11は一対となり、それらが光電
変換素子基板1内に2次元的に配されている。
FIG. 11 is a schematic view of the photoelectric conversion element substrate 1 of FIG. As shown in FIG. 11, the photoelectric conversion element substrate 1 includes a plurality of photoelectric conversion elements 10 for receiving light from the phosphor 102 and converting the light into current, and photoelectric conversion elements corresponding to the respective photoelectric conversion elements 10. A plurality of integrated circuit elements 11 for processing the generated electric signal are formed, and the photoelectric conversion element 10 and the integrated circuit element 11 are paired, and they are two-dimensionally arranged in the photoelectric conversion element substrate 1.

【0011】ところで、接着剤51〜53、シールド剤
54には、空気中にさらすことによって硬化するもの、
湿気により硬化するもの、加熱あるいは紫外線を照射す
ることにより硬化するものが知られているが、光電変換
素子基板1が大面積であることから、接着剤51〜53
等の塗布にある程度の時間を要するため、塗布中には硬
化が進行せず、塗布完了後に硬化を開始させることが可
能であることが必要であり、かつ、遮光板等光を遮断す
る部材があるため光以外で硬化するものが必要なことか
ら、熱硬化型のものを採用することが多い。
By the way, the adhesives 51 to 53 and the shield agent 54 are those which are cured by being exposed to the air.
There are known ones that are hardened by moisture and ones that are hardened by heating or irradiating ultraviolet rays. However, since the photoelectric conversion element substrate 1 has a large area, the adhesives 51 to 53 are used.
Since it takes a certain amount of time to apply the coating, it is necessary that the curing does not proceed during the coating, and it is possible to start the curing after the coating is completed. Therefore, a thermosetting type is often used because a type other than light is required.

【0012】具体的な接着工程は、いくつかあるが概要
は次の通りである。すなわち、光電変換素子基板101
と支持基台103との間に接着剤52を塗布する。この
段階で接着剤52に熱を加えて硬化させてもよいし、後
述するようにこの段階では加熱はしなくてもよい。
[0012] There are several specific bonding steps, but the outline is as follows. That is, the photoelectric conversion element substrate 101
The adhesive 52 is applied between the support base 103 and the support base 103. At this stage, the adhesive 52 may be heated to be hardened, or may not be heated at this stage as described later.

【0013】つぎに、光電変換素子基板101と蛍光体
102との間に接着剤51を塗布する。この段階で接着
剤51に熱を加えて硬化させてもよいし、後述するよう
にこの段階では加熱はしなくてもよい。
Next, an adhesive 51 is applied between the photoelectric conversion element substrate 101 and the phosphor 102. At this stage, the adhesive 51 may be heated to be hardened, or may not be heated at this stage as described later.

【0014】さらに、遮光板104と蛍光体102との
間に接着剤53を塗布する。この段階で既に接着剤5
1,52を硬化させていれば、接着剤53に熱を加えて
硬化させればよい。一方、接着剤51,52を硬化させ
ていなければ、接着剤51〜53に熱を加えて硬化させ
る。
Further, an adhesive 53 is applied between the light shielding plate 104 and the phosphor 102. Adhesive 5 already at this stage
If the adhesives 1, 52 are cured, the adhesive 53 may be heated to be cured. On the other hand, if the adhesives 51 and 52 have not been cured, heat is applied to the adhesives 51 to 53 to cure them.

【0015】こうして、光電変換素子基板101、蛍光
体102、103は支持基台、遮光板104の接着を終
えると、光電変換素子基板101及び蛍光体102の側
面に接着剤を塗布し、それを加熱することでシールド材
54を形成する。
In this way, after the photoelectric conversion element substrate 101 and the phosphors 102 and 103 have been adhered to the support base and the light shielding plate 104, an adhesive is applied to the side surfaces of the photoelectric conversion element substrate 101 and the phosphor 102, and the adhesive is applied. The shield material 54 is formed by heating.

【0016】[0016]

【発明が解決しようとする課題】しかし、従来の技術
は、少なくとも接着剤51〜53の塗布及び加熱という
製造工程と、シールド剤54を形成するという製造工程
とを必要とする。このため、製品のコストダウン、製品
の量産が困難であった。
However, the conventional technique requires at least a manufacturing process of applying and heating the adhesives 51 to 53 and a manufacturing process of forming the shield agent 54. Therefore, it is difficult to reduce the cost of the product and mass-produce the product.

【0017】そこで、本発明は、放射線検出装置のコス
トダウン及び量産が図れるように、製造工程を簡素化す
ることを課題とする。
Therefore, an object of the present invention is to simplify the manufacturing process so that the cost and mass production of the radiation detecting apparatus can be achieved.

【0018】[0018]

【課題を解決するための手段】上記課題を解決するため
に、本発明は、放射線の入射側から、光を光電変換素子
基板側へ効率よく導く遮光板、放射線を光に変換する波
長変換体、光を電気信号に変換する光電変換素子基板が
位置し、前記波長変換体と前記遮光板と、前記波長変換
体と前記光電変換素子基板とをそれぞれ接着剤で接着す
るとともに、前記波長変換体の側面及び前記光電変換素
子基板の側面を封止した放射線検出装置において、前記
波長変換体と前記遮光板との間に塗布した後にこれらを
互いに押圧した際に押し出される接着剤を前記光電変換
素子基板側に導くことにより、前記波長変換体の側面及
び前記光電変換素子基板の側面を覆えるように、前記遮
光板の端部を前記光電変換素子基板側に曲げている。
In order to solve the above-mentioned problems, the present invention provides a light-shielding plate that efficiently guides light from the incident side of radiation to the photoelectric conversion element substrate side, and a wavelength converter that converts the radiation into light. , A photoelectric conversion element substrate for converting light into an electric signal is located, and the wavelength conversion body and the light shielding plate, the wavelength conversion body and the photoelectric conversion element substrate are respectively bonded with an adhesive, and the wavelength conversion body In the radiation detection device in which the side surface of the photoelectric conversion element substrate and the side surface of the photoelectric conversion element substrate are sealed, the photoelectric conversion element is an adhesive that is extruded when the wavelength conversion body and the light shielding plate are pressed against each other after being applied. The end portion of the light shielding plate is bent toward the photoelectric conversion element substrate side so as to cover the side surface of the wavelength conversion body and the side surface of the photoelectric conversion element substrate by guiding the light shielding plate to the substrate side.

【0019】また、本発明は、放射線の入射側から、光
を光電変換素子基板側へ効率よく導く遮光板、放射線を
光に変換する波長変換体、光を電気信号に変換する光電
変換素子基板が位置し、前記波長変換体と前記遮光板
と、前記波長変換体と前記光電変換素子基板とをそれぞ
れ接着剤で接着するとともに、前記波長変換体の側面及
び前記光電変換素子基板の側面を封止した放射線検出装
置の製造方法において、前記遮光板の端部を曲げる工程
と、前記波長変換体と前記遮光板の端部が曲げられてい
る側との間に接着剤を塗布する工程と、前記波長変換体
と前記遮光板とを互いに押圧する工程とを含む。
Further, according to the present invention, a light-shielding plate for efficiently guiding light from the incident side of radiation to the photoelectric conversion element substrate side, a wavelength converter for converting radiation into light, and a photoelectric conversion element substrate for converting light into electric signals. Is located, and the wavelength converter and the light shielding plate, the wavelength converter and the photoelectric conversion element substrate are respectively bonded by an adhesive, and the side surface of the wavelength conversion body and the side surface of the photoelectric conversion element substrate are sealed. In the method of manufacturing the radiation detection device that has stopped, a step of bending the end portion of the light shielding plate, a step of applying an adhesive between the wavelength converter and the side where the end portion of the light shielding plate is bent, And a step of pressing the wavelength conversion body and the light shielding plate against each other.

【0020】さらに、本発明の放射線検出システムは、
上記放射線検出装置を備える。
Further, the radiation detection system of the present invention comprises:
The radiation detection device is provided.

【0021】[0021]

【発明の実施の形態】以下、本発明の実施形態につい
て、図面を用いて説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

【0022】(実施形態1)図1は、本発明の実施形態
1のX線検出装置の模式的な側面図である。図1におい
て、1はガラス基板の表面に複数の光電変換素子を形成
した光電変換素子基板、2はX線を含むX線を可視光に
変換するための波長変換体としての蛍光体、3は光電変
換素子基板1を固定および保持するための支持基台、4
−1は蛍光体2で変換された光を効率よく光電変換素子
へ入射するための遮光板、5は支持基台3と光電変換素
子基板1とを接着するための接着剤、6は蛍光体2との
光電変換素子基板1とを接着するための接着剤、7は蛍
光体2と遮光板4−1とを接着するための接着剤、8は
光電変換装置の周辺端部を封止するシールド材である。
(Embodiment 1) FIG. 1 is a schematic side view of an X-ray detection apparatus according to Embodiment 1 of the present invention. In FIG. 1, 1 is a photoelectric conversion element substrate in which a plurality of photoelectric conversion elements are formed on the surface of a glass substrate, 2 is a phosphor as a wavelength converter for converting X-rays including X-rays into visible light, and 3 is Support base for fixing and holding the photoelectric conversion element substrate 1, 4
-1 is a light-shielding plate for efficiently entering the light converted by the phosphor 2 into the photoelectric conversion element, 5 is an adhesive for bonding the support base 3 and the photoelectric conversion element substrate 1, and 6 is a phosphor 2 is an adhesive for adhering the photoelectric conversion element substrate 1 to 2; 7 is an adhesive for adhering the phosphor 2 and the light shielding plate 4-1; 8 is a peripheral end portion of the photoelectric conversion device. It is a shield material.

【0023】本実施形態では、蛍光体2と遮光板と4を
接着する工程で光電変換装置の周辺端部に押し出される
接着剤7の余分な量を、遮光板4−1の周辺を変型させ
た接着剤溜で確保し、その確保した接着剤を光電変換装
置の周辺端部を封止するシールド材8として用いてい
る。
In the present embodiment, in the step of adhering the phosphor 2 and the light shield plate 4, the surplus amount of the adhesive 7 extruded to the peripheral end portion of the photoelectric conversion device is deformed around the light shield plate 4-1. The secured adhesive is used as the shield material 8 for sealing the peripheral end portion of the photoelectric conversion device.

【0024】光電変換素子基板1、図11に示したもの
と同様である。
The photoelectric conversion element substrate 1 is the same as that shown in FIG.

【0025】支持基台3の材質は、X線等を透過可能な
アルミニウム、マグネシウム、ベリリウム等の金属、ガ
ラス、セラミック、カーボン等を用いている。
As the material of the support base 3, a metal such as aluminum, magnesium, beryllium, etc., which can transmit X-rays, glass, ceramic, carbon or the like is used.

【0026】蛍光体2は、Gd22S、CsI、Y22
S等のいずれかを材料としたシート状のものである。
The phosphor 2 is composed of Gd 2 O 2 S, CsI, Y 2 O 2
It is a sheet-shaped material made of any one of S and the like.

【0027】遮光板4−1は、X線等を透過し、X線以
外を遮断するもので、たとえばアルミ二ウム、アモルフ
ァス−カーボン等を材料としたシート状のものである。
なお、光電変換素子基板1および蛍光体2の周辺端部か
らの光の漏れこみを軽減するために、遮光板4−1の大
きさは光電変換素子基板1および蛍光体2よりも大きく
している。また、遮光板4−1の中央部と周辺部とのな
す角度や、周辺部の大きさ等は接着剤7の粘度によって
決定している。
The light-shielding plate 4-1 transmits X-rays and the like and blocks other than X-rays, and is a sheet-like member made of, for example, aluminum or amorphous carbon.
In order to reduce the leakage of light from the peripheral ends of the photoelectric conversion element substrate 1 and the phosphor 2, the size of the light shielding plate 4-1 is made larger than that of the photoelectric conversion element substrate 1 and the phosphor 2. There is. Further, the angle formed by the central portion and the peripheral portion of the light shielding plate 4-1 and the size of the peripheral portion are determined by the viscosity of the adhesive 7.

【0028】次に各部材の実装について説明する。Next, mounting of each member will be described.

【0029】まず、支持基台3に光電変換素子基板1の
光電変換素子を配置していない面を、接着剤5によって
接着する。接着剤5を均一に塗布することが必要である
が、その方法として、図示しない接着装置で一定の圧力
をかけたローラを用いて、塗布した接着剤を押し出すよ
うにしている。
First, the surface of the photoelectric conversion element substrate 1 on which the photoelectric conversion elements are not arranged is adhered to the support base 3 with the adhesive 5. Although it is necessary to apply the adhesive 5 uniformly, as a method therefor, the applied adhesive is pushed out by using a roller to which a certain pressure is applied by an adhesive device (not shown).

【0030】なお、ローラにかける圧力は、光電変換素
子基板1の強度に基づいて求めればよい。接着剤5は、
支持基台3が紫外線を透過する部材であれば紫外線硬化
型接着剤が時間的にも効果的である。
The pressure applied to the roller may be obtained based on the strength of the photoelectric conversion element substrate 1. The adhesive 5 is
If the support base 3 is a member that transmits ultraviolet rays, an ultraviolet curable adhesive is effective in terms of time.

【0031】また、支持基台3が紫外線や可視光を透過
しない部材の場合は、熱硬化型接着剤を用いればよい。
If the support base 3 is a member that does not transmit ultraviolet rays or visible light, a thermosetting adhesive may be used.

【0032】次に、光電変換素子基板2の光電変換素子
を配置した面に蛍光体2を、接着剤6によって接着す
る。その際、接着方法は支持基台3と光電変換素子基板
1の場合と同様である。接着剤6は、蛍光体2の紫外線
や可視光透過率が低いため、熱硬化型接着剤を用いるよ
うにしている。
Next, the phosphor 2 is adhered to the surface of the photoelectric conversion element substrate 2 on which the photoelectric conversion elements are arranged by the adhesive 6. At that time, the bonding method is the same as in the case of the support base 3 and the photoelectric conversion element substrate 1. Since the adhesive 6 has a low ultraviolet ray and visible light transmittance of the phosphor 2, a thermosetting adhesive is used.

【0033】さらに、接着剤7によって蛍光体2に遮光
板4−1を接着する。その際、接着方法は支持基台3と
光電変換素子基板1の場合と同様である。接着剤7は、
遮光板が紫外線や可視光を遮断するため、熱硬化型接着
剤を用いてしている。
Further, the light shielding plate 4-1 is adhered to the phosphor 2 with the adhesive 7. At that time, the bonding method is the same as in the case of the support base 3 and the photoelectric conversion element substrate 1. The adhesive 7 is
Since the light shielding plate blocks ultraviolet rays and visible light, a thermosetting adhesive is used.

【0034】なお、熱硬化型接着剤とは、たとえばアク
リル系の接着剤であり、熱硬化の開始反応基であるイソ
シアネート基あるいはエポキシ基等を有してなるもので
ある。
The thermosetting adhesive is, for example, an acrylic adhesive having an isocyanate group or an epoxy group which is a reaction group for initiating thermosetting.

【0035】つぎに、遮光板4−1の接着剤溜の構造に
ついて説明する。前述のとおり、遮光板4−1は蛍光体
2および光電変換素子基板1よりも広い面積を有してお
り、蛍光体2および光電変換素子基板1よりも外側のは
み出た部位を蛍光体2側に折り曲げた構造にしてある。
Next, the structure of the adhesive reservoir of the light shielding plate 4-1 will be described. As described above, the light shielding plate 4-1 has a larger area than the phosphor 2 and the photoelectric conversion element substrate 1, and the protruding portion outside the phosphor 2 and the photoelectric conversion element substrate 1 is located on the phosphor 2 side. It has a bent structure.

【0036】遮光板4−1の4隅は、各周辺端部を折り
曲げやすくするように、切れ目をいれておくとよい。ま
た、遮光板4−1を作成する際、折り曲げ部位を一括成
形したものでも問題ない。
It is preferable that the four corners of the light shield plate 4-1 be provided with cuts so that the peripheral end portions can be easily bent. Further, when the light-shielding plate 4-1 is formed, there is no problem even if the bent portions are collectively molded.

【0037】図2,図3は、図1の蛍光体2に遮光板4
−1を接着する工程の説明図である。図2に示すよう
に、蛍光体2の上部に接着剤7を塗布し、その上部に遮
光板4−1を重ね、遮光板4−1の上部より、ローラで
圧力をかける。この工程で接着剤7の一部は蛍光体2お
よび光電変換素子基板1の周辺端部に押し出される。
In FIGS. 2 and 3, the light shielding plate 4 is provided on the phosphor 2 of FIG.
It is explanatory drawing of the process of adhering -1. As shown in FIG. 2, the adhesive 7 is applied to the upper portion of the phosphor 2, a light shielding plate 4-1 is placed on the upper portion thereof, and pressure is applied by a roller from above the light shielding plate 4-1. In this step, a part of the adhesive 7 is extruded to the peripheral edges of the phosphor 2 and the photoelectric conversion element substrate 1.

【0038】つぎに、図3に示すように、押し出された
接着剤は遮光板4−1の周辺端部である接着剤溜に収ま
るので、この状態で加熱することにより、接着剤7およ
び接着剤溜に溜まった接着剤が硬化し、その結果、接着
剤溜に溜まった接着剤はシールド材8となる。
Next, as shown in FIG. 3, since the extruded adhesive is contained in the adhesive reservoir at the peripheral end of the light shielding plate 4-1, the adhesive 7 and the adhesive are adhered by heating in this state. The adhesive agent accumulated in the agent reservoir is cured, and as a result, the adhesive agent accumulated in the adhesive agent reservoir becomes the shield material 8.

【0039】(実施形態2)図4,図5は、本発明の実
施形態2のX線検出装置の製造工程の説明図であり、実
施形態1の図2,図3に相当するものである。
(Second Embodiment) FIGS. 4 and 5 are explanatory views of a manufacturing process of an X-ray detection apparatus according to a second embodiment of the present invention, and correspond to FIGS. 2 and 3 of the first embodiment. .

【0040】実施形態1では、遮光板4−1の端部が支
持基台3に接触するように構成しているが、本実施形態
では、遮光板4−1の端部が支持基台3に接触しないよ
うに構成している。
In the first embodiment, the end of the light shield plate 4-1 is configured to contact the support base 3, but in the present embodiment, the end of the light shield plate 4-1 is supported by the support base 3. It is configured not to come into contact with.

【0041】接着剤7の量が十分ある場合とか粘り気が
少ない場合には、押し出された接着剤7が光電変換素子
基板1の周辺まで到達するので、遮光板4−1の端部が
支持基台3に接触しないように構成してもよくなるし、
この場合、厳密に遮光板4−1を設計しなくてもよいと
いうメリットがある。
When the amount of the adhesive 7 is sufficient or when the adhesive 7 is less sticky, the extruded adhesive 7 reaches the periphery of the photoelectric conversion element substrate 1, so that the end portion of the light shielding plate 4-1 is supported by the support substrate. It may be configured so that it does not touch the table 3,
In this case, there is an advantage that it is not necessary to strictly design the light shielding plate 4-1.

【0042】(実施形態3)図6,図7は、本発明の実
施形態3のX線検出装置の製造工程の説明図であり、実
施形態1の図2,図3に相当するものである。
(Embodiment 3) FIGS. 6 and 7 are explanatory views of a manufacturing process of an X-ray detection apparatus according to Embodiment 3 of the present invention, and correspond to FIGS. 2 and 3 of Embodiment 1. .

【0043】本実施形態の遮光板4−3は、周辺端部を
曲げることで接着剤溜を形成している。遮光板4−3の
端部間の距離は、支持基台3の幅に略一致させている。
なお、図6,図7では接着剤溜を半円筒形状としている
が、形状は限定されず、例えば図8に示すように遮光板
4−4の端部を蛍光体2側に2度折することで、接着剤
溜を形成してもよい。
The light shielding plate 4-3 of this embodiment forms an adhesive reservoir by bending the peripheral end portion. The distance between the ends of the light-shielding plate 4-3 is substantially matched with the width of the support base 3.
Although the adhesive reservoir has a semi-cylindrical shape in FIGS. 6 and 7, the shape is not limited. For example, as shown in FIG. 8, the end portion of the light shielding plate 4-4 is folded twice toward the phosphor 2 side. Therefore, the adhesive reservoir may be formed.

【0044】(実施形態4)図12は本発明の実施形態
4のX線検出システムの模式的な構成図である。
(Fourth Embodiment) FIG. 12 is a schematic configuration diagram of an X-ray detection system according to a fourth embodiment of the present invention.

【0045】X線チューブ6050で発生したX線60
60は患者あるいは被験者6061の胸部6062を透
過し、実施形態1〜3で説明したX線検出装置であると
ころのイメージセンサ6040に入射する。この入射し
たX線には患者6061の体内部の情報が含まれてい
る。X線の入射に対応して蛍光体は発光し、これを光電
変換して、電気的情報を得る。この情報はディジタルに
変換されイメージプロセッサ6070により画像処理さ
れ制御室のディスプレイ6080で観察できる。
X-ray 60 generated by X-ray tube 6050
60 passes through the chest 6062 of the patient or subject 6061 and enters the image sensor 6040 which is the X-ray detection device described in the first to third embodiments. The incident X-ray contains information on the inside of the body of the patient 6061. The phosphor emits light in response to the incident X-ray, and photoelectrically converts the light to obtain electrical information. This information is converted to digital, image-processed by the image processor 6070, and can be viewed on the display 6080 in the control room.

【0046】また、この情報は電話回線6090等の伝
送手段により遠隔地へ転送でき、別の場所のドクタール
ームなどディスプレイ6081に表示もしくは光ディス
ク等の保存手段に保存することができ、遠隔地の医師が
診断することも可能である。またフィルムプロセッサ6
100によりフィルム6110に記録することもでき
る。
Further, this information can be transferred to a remote place by a transmission means such as a telephone line 6090, can be displayed on a display 6081 such as a doctor room at another place, or can be stored in a storage means such as an optical disc. It is also possible to diagnose. Also the film processor 6
It is also possible to record by 100 on the film 6110.

【0047】[0047]

【発明の効果】以上説明したように、本発明によると、
放射線検出装置の製造工程を簡素化することが可能とな
り、コストダウン及び量産を図ることができる。
As described above, according to the present invention,
It is possible to simplify the manufacturing process of the radiation detection apparatus, and it is possible to achieve cost reduction and mass production.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施形態1のX線検出装置の模式的な
側面図である。
FIG. 1 is a schematic side view of an X-ray detection device according to a first embodiment of the present invention.

【図2】図1の蛍光体2に遮光板4−1を接着する工程
の説明図である。
FIG. 2 is an explanatory diagram of a step of adhering a light shielding plate 4-1 to the phosphor 2 of FIG.

【図3】図1の蛍光体2に遮光板4−1を接着する工程
の説明図である。
FIG. 3 is an explanatory diagram of a step of adhering a light shielding plate 4-1 to the phosphor 2 of FIG.

【図4】本発明の実施形態2のX線検出装置の製造工程
の説明図である。
FIG. 4 is an explanatory diagram of a manufacturing process of the X-ray detection apparatus according to the second embodiment of the present invention.

【図5】本発明の実施形態2のX線検出装置の製造工程
の説明図である。
FIG. 5 is an explanatory diagram of a manufacturing process of the X-ray detection apparatus according to the second embodiment of the present invention.

【図6】本発明の実施形態3のX線検出装置の製造工程
の説明図である。
FIG. 6 is an explanatory diagram of a manufacturing process of the X-ray detection apparatus according to the third embodiment of the present invention.

【図7】本発明の実施形態3のX線検出装置の製造工程
の説明図である。
FIG. 7 is an explanatory diagram of a manufacturing process of the X-ray detection apparatus according to the third embodiment of the present invention.

【図8】本発明の実施形態2の遮光板4−4の説明図で
ある。
FIG. 8 is an explanatory diagram of a light shielding plate 4-4 according to the second embodiment of the present invention.

【図9】従来のX線検出装置の模式的側面図である。FIG. 9 is a schematic side view of a conventional X-ray detection device.

【図10】図9を上から見た概略図である。FIG. 10 is a schematic view of FIG. 9 seen from above.

【図11】図10の光電変換素子基板1の模式図であ
る。
11 is a schematic view of the photoelectric conversion element substrate 1 of FIG.

【図12】本発明の実施形態4のX線検出システムの模
式図である。
FIG. 12 is a schematic diagram of an X-ray detection system according to a fourth embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1、101 光電変換素子基板 2、102 蛍光体 3、103 支持基台 4−1、4−2、4−3、4−4、104 遮光板 5、6,7、51、52、53 接着剤 8 シールド部 10 光電変換素子 11 集積回路素子 1, 101 Photoelectric conversion element substrate 2,102 phosphor 3, 103 Support base 4-1, 4-2, 4-3, 4-4, 104 Light-shielding plate 5, 6, 7, 51, 52, 53 Adhesive 8 Shield 10 Photoelectric conversion element 11 Integrated circuit elements

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 放射線の入射側から、光を光電変換素子
基板側へ効率よく導く遮光板、放射線を光に変換する波
長変換体、光を電気信号に変換する光電変換素子基板が
位置し、 前記波長変換体と前記遮光板と、前記波長変換体と前記
光電変換素子基板とをそれぞれ接着剤で接着するととも
に、前記波長変換体の側面及び前記光電変換素子基板の
側面を封止した放射線検出装置において、 前記波長変換体と前記遮光板との間に塗布した後にこれ
らを互いに押圧した際に押し出される接着剤を前記光電
変換素子基板側に導くことにより、前記波長変換体の側
面及び前記光電変換素子基板の側面を覆えるように、前
記遮光板の端部を前記光電変換素子基板側に曲げている
ことを特徴とする放射線検出装置。
1. A light-shielding plate that efficiently guides light from the incident side of radiation to the photoelectric conversion element substrate side, a wavelength converter that converts the radiation into light, and a photoelectric conversion element substrate that converts the light into an electrical signal are located. Radiation detection in which the wavelength converter and the light-shielding plate, the wavelength converter and the photoelectric conversion element substrate are respectively bonded with an adhesive, and the side surface of the wavelength conversion body and the side surface of the photoelectric conversion element substrate are sealed. In the device, by applying an adhesive that is extruded when the wavelength converter and the light-shielding plate are applied to each other after applying between the wavelength converter and the light shielding plate to the photoelectric conversion element substrate side, the side surface of the wavelength converter and the photoelectric converter. A radiation detecting apparatus, wherein an end portion of the light shielding plate is bent toward the photoelectric conversion element substrate side so as to cover a side surface of the conversion element substrate.
【請求項2】 前記接着剤は、熱硬化型接着剤又は紫外
線硬化型接着剤であることを特徴とする請求項1記載の
放射線検出装置。
2. The radiation detecting apparatus according to claim 1, wherein the adhesive is a thermosetting adhesive or an ultraviolet curable adhesive.
【請求項3】 前記遮光板の曲げる角度及び、前記遮光
板の曲げた位置から先端までの長さは、前記接着剤の塗
布量と粘度とに基づいて定めていることを特徴とする請
求項1又は2記載の放射線検出装置。
3. The bending angle of the light shielding plate and the length from the bent position to the tip of the light shielding plate are determined based on the application amount and the viscosity of the adhesive. The radiation detection device according to 1 or 2.
【請求項4】 前記遮光板の曲げた位置は前記波長変換
体の大きさに応じて定めていることを特徴とする請求項
1から3のいずれか1項記載の放射線検出装置。
4. The radiation detecting apparatus according to claim 1, wherein the bent position of the light shielding plate is determined according to the size of the wavelength conversion body.
【請求項5】 放射線の入射側から、光を光電変換素子
基板側へ効率よく導く遮光板、放射線を光に変換する波
長変換体、光を電気信号に変換する光電変換素子基板が
位置し、 前記波長変換体と前記遮光板と、前記波長変換体と前記
光電変換素子基板とをそれぞれ接着剤で接着するととも
に、前記波長変換体の側面及び前記光電変換素子基板の
側面を封止した放射線検出装置の製造方法において、 前記遮光板の端部を曲げる工程と、 前記波長変換体と前記遮光板の端部が曲げられている側
との間に接着剤を塗布する工程と、 前記波長変換体と前記遮光板とを互いに押圧する工程と
を含むことを特徴とする放射線検出装置の製造方法。
5. A light-shielding plate that efficiently guides light from the radiation incident side to the photoelectric conversion element substrate side, a wavelength converter that converts the radiation into light, and a photoelectric conversion element substrate that converts the light into an electric signal are located. Radiation detection in which the wavelength converter and the light-shielding plate, the wavelength converter and the photoelectric conversion element substrate are respectively bonded with an adhesive, and the side surface of the wavelength conversion body and the side surface of the photoelectric conversion element substrate are sealed. In the method of manufacturing a device, a step of bending an end portion of the light shielding plate, a step of applying an adhesive between the wavelength conversion body and a side where the end portion of the light shielding plate is bent, the wavelength conversion body And a step of pressing the light shielding plate against each other.
【請求項6】 さらに、前記接着剤に熱を加える又は紫
外線を照射することを含むことを特徴とする請求項5記
載の放射線検出装置の製造方法。
6. The method according to claim 5, further comprising applying heat to the adhesive or irradiating it with ultraviolet rays.
【請求項7】 請求項1から4のいずれか1項記載の放
射線検出装置を備えることを特徴とする放射線検出シス
テム。
7. A radiation detection system comprising the radiation detection device according to claim 1. Description:
JP2002058848A 2002-03-05 2002-03-05 Radiation detecting apparatus, its manufacturing method, and radiation detecting system Pending JP2003255050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002058848A JP2003255050A (en) 2002-03-05 2002-03-05 Radiation detecting apparatus, its manufacturing method, and radiation detecting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002058848A JP2003255050A (en) 2002-03-05 2002-03-05 Radiation detecting apparatus, its manufacturing method, and radiation detecting system

Publications (1)

Publication Number Publication Date
JP2003255050A true JP2003255050A (en) 2003-09-10

Family

ID=28668706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002058848A Pending JP2003255050A (en) 2002-03-05 2002-03-05 Radiation detecting apparatus, its manufacturing method, and radiation detecting system

Country Status (1)

Country Link
JP (1) JP2003255050A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012007949A (en) * 2010-06-23 2012-01-12 Canon Inc Radiation imaging apparatus, radiation imaging system and method for manufacturing radiation imaging apparatus
JP2015021898A (en) * 2013-07-22 2015-02-02 株式会社東芝 Radiation detector and manufacturing method of the same
CN114210594A (en) * 2021-12-09 2022-03-22 合肥泰禾卓海智能科技有限公司 Intelligent dry separator X-ray detector mounting and accommodating device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012007949A (en) * 2010-06-23 2012-01-12 Canon Inc Radiation imaging apparatus, radiation imaging system and method for manufacturing radiation imaging apparatus
JP2015021898A (en) * 2013-07-22 2015-02-02 株式会社東芝 Radiation detector and manufacturing method of the same
CN114210594A (en) * 2021-12-09 2022-03-22 合肥泰禾卓海智能科技有限公司 Intelligent dry separator X-ray detector mounting and accommodating device

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