JP2007071836A - Radiation detector, and radiation imaging system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stably obtain the resolution of a sensor panel by making the thickness of an adhesive layer constant. <P>SOLUTION: A buffer material 140 is disposed between a CsI substrate 126 having a CsI layer 123 and a sensor panel 107 including a photoelectric conversion element. A buffer material is disposed between a sensor panel unit where a plurality of sensor modules having the photoelectric conversion element are arranged on a CFRP substrate and the CsI substrate 126 having the CsI layer 123. Since the buffer material has a function of making the thickness of the adhesive layer constant, the resolution is stably obtained without being affected by thickness variation every lot of phosphors. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a radiation detection apparatus and a radiation imaging system, and more particularly to a radiation detection apparatus suitable for a medical radiation diagnostic apparatus, an industrial nondestructive inspection apparatus, and the like, and a radiation imaging system using the radiation detection apparatus.

  2. Description of the Related Art Conventionally, there is an indirect X-ray area sensor that converts X-rays into light once by a phosphor and then converts the light into charges by a photoelectric conversion element such as a CCD, CMOS, or a-Si. There are two methods for manufacturing this X-ray area sensor.

  One is a method in which a phosphor is directly deposited on a sensor or formed by coating. The other is a method in which a phosphor is formed on a substrate different from the sensor, and the substrate is bonded to the sensor via an adhesive.

  In the case of manufacturing an indirect X-ray area sensor by the latter bonding, since the risk can be dispersed, the yield increases. Therefore, at present, it has become the mainstream as a method for manufacturing an indirect X-ray area sensor.

  The latter manufacturing method includes two manufacturing methods, which will be described as Conventional Example 1 and Conventional Example 2.

  FIGS. 9A and 9B are schematic perspective views showing the manufacturing process of the X-ray area sensor in the conventional example 1. FIGS. First, in the phosphor substrate 105, a reflective layer 102 made of aluminum or the like is formed on a phosphor base 101 made of glass, amorphous carbon, a polymer film, or the like, and CsI: Tl or Gd2O2S: Tb3 + is formed thereon. A phosphor 103 is formed. Actually, the phosphor base 101, the reflective layer 102, and the entire phosphor 103 are covered with a protective film 104 (shown in FIG. 10).

  When the phosphor 103 is vapor-deposited, if it is fixed with a substrate holder so as to include a part of the outer periphery of the phosphor base 101 in order to hold the phosphor base, about 1 mm to 5 mm held by the substrate holder In this region, the phosphor 103 is not deposited.

  The phosphor substrate 105 thus manufactured is bonded to the sensor panel 107 to which the adhesive 108 is applied. Then, as shown in FIG. 9B, the adhesive 109 is pushed away by pressing with a roller 109 from above the phosphor substrate 105. The roller 109 is made of elastic silicone rubber in order to press the entire surface uniformly.

  Actually, the sensor panel 107 is fixed to a stage (not shown) by suction or the like, and the phosphor substrate 105 is bonded together in this state. When the roller 109 is pressed, the stage is moved in a direction opposite to the rotation direction. By pressing the roller 109, the force generated in the plane direction of the phosphor substrate 105 is canceled, and the phosphor substrate 105 and the sensor panel 107 are moved. The deviation is avoided.

  Thus, the distribution of the adhesive 108 is uniform and air bubbles are prevented from being mixed between the phosphor substrate 105 and the sensor panel 107. Here, the uniform distribution of the thickness of the adhesive 108 between the phosphor 103 and the sensor panel 107 and the prevention of air bubbles are caused by absorption and refraction of light, and deterioration of sensitivity and MTF. Because it is connected.

  However, Conventional Example 1 has the following problems. FIG. 10 is a cross-sectional view of the bonded phosphor substrate 105 and the sensor panel 107 as viewed from the roller axis direction when the roller 109 is pressure-bonded. Since the phosphor 103 is not formed up to the end portion at the bonding start position and the end position of the roller 109, when the roller 109 is positioned above the formation region 106 of the phosphor 103, the phosphor as shown in FIG. The substrate 105 is bent. Such bending has the following effects.

  (1) Depending on the roller load, the phosphor base is cracked or cracked.

  (2) Since the deposited phosphor is very brittle, it is deformed or destroyed by bending, resulting in unstable light emission.

  (3) The adhesive used for bonding has a film thickness distribution within the sensor panel, which affects the absorption of light generated by the phosphor and the resolution of the sensor panel (the resolution becomes worse as the film thickness increases). Become).

  Therefore, a method for solving these problems will be described as Conventional Example 2. In the method of Conventional Example 2, it is possible to prevent the phosphor substrate from being bent when the phosphor substrate and the sensor panel are bonded together. As a representative example of Conventional Example 2, there is a radiation detection apparatus described in Japanese Patent Application Laid-Open No. 2002-341039 (Patent Document 1).

  FIG. 11A and FIG. 11B are a schematic perspective view and a cross-sectional view showing the manufacturing process of the X-ray area sensor in Conventional Example 2. 11A and 11B show a CsI (Cesium Iodide) substrate 126 and a sensor panel 107 to which an adhesive 108 is applied.

  The CsI substrate 126 includes an amorphous carbon substrate 121 that is a phosphor base, an aluminum layer 122 that is a reflective layer formed on the amorphous carbon substrate 121 by vapor deposition, and the like. And a CsI layer 123 which is a phosphor layer formed with a thickness of. Furthermore, a PET (polyethylene terephthalate) material 127, which is a buffer material having a thickness of about 550 μm, is bonded to an area to be formed 124 of about 5 mm where the CsI layer 123 is not formed with an ultraviolet curable acrylic resin or the like, and CsI. And a CsI protective film (not shown) formed on the layer 123.

  The CsI protective layer covers the entire amorphous carbon substrate 121, the aluminum layer 122, and the CsI layer 123 like the protective layer 104 shown in FIG.

Next, as shown in FIGS. 11A and 11B, the CsI substrate 126 and the sensor panel 107 are bonded together via the PET material 127 and the adhesive 108, and then bonded by the roller 109. At this time, since the PET 127 is provided, the CsI substrate 126 does not bend even when the roller 109 is positioned on the formation region 124. As a result, the amorphous carbon substrate 121 is cracked or cracked, and the CsI layer 123 is broken. Does not occur.
JP 2002-341039 A

  The PET material 127 in FIG. 11 is abutted on the basis of the amorphous carbon surface of the CsI substrate 126 (strictly speaking, the PET material 127 is in contact with the aluminum layer and the CsI protective layer, but these The layer of is so thin that it is ignored). However, since the film pressure of the CsI layer 123 varies by ± 20 μm from lot to lot, the CsI output surface of the CsI substrate 126 and the light receiving surface of the sensor panel 107 as shown in FIGS. 12 (a) and 12 (b). The bonding distance, that is, the adhesive layer thickness 130 changes.

  12A shows a state where the adhesive layer thickness 130 is thin, and FIG. 12B shows a state where the adhesive layer thickness 130 is thick. Such changes in the adhesive layer thickness have the following effects.

  (1) When the CsI layer 123 in the phosphor substrate is thinner than 550 μm, the adhesive layer thickness increases. As a result, light generated by CsI is absorbed by the adhesive layer and light incident on the photoelectric conversion element is reduced. Further, light is easily diffused by the adhesive layer, and the resolution is also lowered.

  (2) When the CsI layer 123 in the phosphor substrate is thicker than 550 μm, the adhesive layer decreases. This improves resolution and reduces light loss. However, the thermal stress due to the difference in thermal expansion coefficient between the CsI substrate and the sensor panel is less likely to be relaxed, and peeling of the adhesive layer is likely to occur.

  An object of the present invention is to provide a radiation detection apparatus and a radiation imaging system capable of obtaining the resolution of a sensor panel with a constant thickness of an adhesive layer.

  In order to solve the above problems, the radiation detection apparatus of the present invention includes a phosphor substrate on which a phosphor that converts radiation into light is formed, and a photoelectric conversion element that converts light converted by the phosphor into charges. In the radiation detection apparatus for fixing the photoelectric conversion element substrate thus formed with an adhesive, a buffer material is provided between the region of the phosphor substrate where the phosphor is formed and the photoelectric conversion element substrate. .

  The radiation detection apparatus of the present invention also includes a photoelectric conversion element substrate in which a plurality of sensor modules on which photoelectric conversion elements are formed are arranged two-dimensionally on a base, and radiation having a larger area than the photoelectric conversion element substrate. In a radiation imaging apparatus for fixing a phosphor substrate on which a phosphor to be converted into a phosphor is formed with an adhesive, a base of an outer peripheral portion of the photoelectric conversion element substrate and a region where the phosphor of the phosphor substrate is formed It is characterized by having a cushioning material between.

  The radiation imaging system of the present invention includes the radiation detection apparatus, a signal processing means for processing a signal from the radiation detection apparatus, a recording means for recording a signal from the signal processing means, and the signal processing. It comprises a display means for displaying a signal from the means, a transmission processing means for transmitting a signal from the signal processing means, and a radiation source for generating the radiation.

  The buffer material according to the present invention functions to make the thickness of the adhesive layer that bonds the photoelectric conversion element substrate and the phosphor substrate constant even when the phosphor substrate is pressurized. Therefore, the resolution of the sensor panel can be stably obtained without being affected by the thickness variation of each phosphor lot. Further, since the buffer material is provided, the phosphor substrate does not bend.

  According to the present invention, since the buffer material is provided between the phosphor forming region of the phosphor substrate and the photoelectric conversion element substrate, the thickness of the adhesive layer for bonding the phosphor substrate and the photoelectric conversion element substrate Can be made constant, and the resolution of the sensor panel can be stably obtained. In addition, since a certain thickness of the adhesive layer is ensured, peeling of the adhesive layer due to thermal stress can be prevented. Furthermore, the buffer material can also prevent the phosphor substrate from being bent.

  Next, the best mode for carrying out the invention will be described in detail with reference to the drawings. In the present specification, X-rays are used as radiation, but α-rays, β-rays, γ-rays, and the like can be used in addition thereto.

(Embodiment 1)
FIGS. 1A and 1B are a schematic perspective view and a cross-sectional view for explaining the configuration and manufacturing process of the radiation detection apparatus (X-ray area sensor) according to the first embodiment of the present invention. 1A and 1B show a CsI (Cesium Iodide) substrate 126 and a sensor panel 107 to which an adhesive 108 is applied. The sensor panel 107 is formed by two-dimensionally forming a plurality of pixels including photoelectric conversion elements on a semiconductor substrate.

  The CsI substrate 126 is formed by forming a reflective layer 122 made of aluminum or the like on an amorphous carbon substrate 121 made of glass, amorphous carbon, a polymer film or the like, and a CsI layer 123 made of CsI: Tl or Gd2O2S: Tb3 +. Is forming. Actually, as shown in FIG. 1B, the entire surface of the amorphous carbon substrate 121, the aluminum layer 122, and the CsI layer 123 is covered with a protective film 125.

  The CsI substrate 126 includes an amorphous carbon substrate 121 that is a phosphor base, an aluminum layer 122 that is a reflective layer formed on the amorphous carbon substrate 121 by vapor deposition, and the like. And a CsI layer 123 which is a phosphor layer formed with a thickness of. Furthermore, a CsI protective film 125 formed on the CsI layer 123 and a buffer material 140 are provided on the outer peripheral portion of the CsI substrate 126.

  The buffer material 140 is bonded with a buffer material adhesive 141 with reference to the surface of the CsI protective layer 125 in the formation region of the CsI layer 123. In consideration of peeling due to thermal stress, the adhesive thickness is required to be 10 μm or more. Therefore, the thickness of the buffer material 140 is set so that the adhesive layer thickness is 10 μm.

  Examples of the material of the buffer material 140 include metal materials such as stainless steel and aluminum, polymer materials such as PET and polycarbonate, and inorganic materials such as silicon and glass. However, since the buffer material 140 always has a thickness variation, it is preferable to use silicon or glass so that the thickness variation can be reduced by back grinding. When a cushioning material is used from the same back-grinded substrate, the variation is further reduced.

  The shape is preferably a plate shape or a prismatic shape so that it can be easily picked up and bonded. The size of the cushioning material 140 may be the same side length as the CsI formation region as in the conventional example 2, but the roller entrance / exit part has a gap with several short cushioning materials as shown in FIG. By holding and sticking, it is possible to release the excess adhesive pushed out by the roller from the gap.

  The buffer material 140 is attached to the outermost peripheral portion in the formation region of the CsI layer 123 and a place corresponding to 2 to 5 mm outside from the photoelectric conversion element formation region of the sensor panel. At that time, the buffer material adhesive 141 is applied onto the CsI layer 123, and the buffer material 140 picked up by a suction jig (not shown) is bonded onto the CsI with a constant load. The buffer adhesive 141 includes a resin that cures without increasing the temperature, such as a condensation type liquid silicone rubber, a curing agent addition type epoxy, silicon, and an acrylic adhesive, and an ultraviolet curing type epoxy, silicone, and acrylic adhesive. Etc. are preferred.

  In the present embodiment, the buffer material 140 is attached outside the photoelectric conversion element formation region of the sensor panel 107 within the formation region of the CsI layer 123 on the CsI substrate 126 side, but may be a photoelectric conversion element formation region.

  Next, as shown in FIG. 1B, the CsI substrate 126 and the sensor panel 107 are bonded together with the buffer material 140 and the adhesive 108, and then bonded by the roller 109. At this time, when the roller 109 is pressed after the CsI substrate 126 and the sensor panel 107 are bonded together, the load of the roller 109 is set to 0.00098 to 0.00 in consideration of the breaking strength of the CsI layer 123 and the sensor panel 107. Pressurization is performed in the range of 196 MPa.

  In the present embodiment, since the buffer material 140 is provided so that the adhesive 108 has a desired value, the adhesive layer thickness 130 is constant even when the CsI substrate 126 is pressurized. As a result, the resolution of the sensor panel can be stably obtained without being affected by the thickness variation of each phosphor lot. Further, the CsI substrate 126 does not bend by the buffer material 140, and as a result, the amorphous carbon substrate 121 is not cracked or cracked, and the CsI layer 123 is not broken.

(Embodiment 2)
FIGS. 2A and 2B are a schematic perspective view and a cross-sectional view for explaining the configuration and manufacturing process of the radiation detection apparatus (X-ray area sensor) according to the second embodiment of the present invention. Here, the thickness of the CsI layer 123 is set to 550 μm, and the CsI substrate 126 is the same as that of the first embodiment except that the buffer material 140 is attached. In FIG. 2, the same parts as those in FIG.

  The sensor panel unit 150 shown in FIGS. 2A and 2B includes a plurality of sensor modules 143, a CFRP substrate 149 (Carbon Composite Rayon Plate), and a module adhesive 148. In the first embodiment, the sensor panel is a single unit, but in the second embodiment, the sensor module 143, the CFRP substrate 149, the flexible substrate 146 and the like are modularized to form the sensor panel unit 150.

  The sensor module 143 corresponds to the sensor panel of FIG. 1 and is referred to as a sensor module in this embodiment. The sensor module is a two-dimensional array of a plurality of pixels including photoelectric conversion elements on a semiconductor substrate. The plurality of sensor modules 143 are two-dimensionally bonded on the CFRP substrate 149.

  Next, the sensor module will be described with reference to FIG. 3A is a top view of the sensor module, and FIG. 3B is a cross-sectional view thereof. The sensor module 143 is provided with 1000 light-receiving pixels in almost the entire area. Lead electrodes 147 for outputting signals obtained from the light receiving pixels to the outside are arranged at regular intervals at the panel ends. A bump 144 is formed on the electrode 147 by a stat bump method, a plating method, or the like.

  Further, the bump 144 and the inner lead 145 of the flexible substrate 146 are bonded to each other by ultrasonic waves. And the inner lead 145 is bent about 90 degrees to the lower side of the drawing at the end of the sensor module to form a sensor module 143. As described above, the sensor panel unit 150 includes a plurality of sensor modules 143 arranged two-dimensionally on a substrate and bonded together.

  4A to 4F show a manufacturing process of the sensor panel unit 150. FIG. First, a plurality of sensor modules 143 provided with a flexible substrate 146 are placed on a stage 154 movable in the X, Y, Z and θ (rotation) directions while being aligned using the alignment head 152 and the alignment camera 153. To do. At this time, as shown in FIG. 4A, each sensor module 143 is fixed on the stage 154 by being sucked by a vacuum device or the like from a hole formed in the stage 154.

  Next, as shown in FIG. 4B, it is inspected whether each sensor module 143 performs a required operation. In this inspection, the inspection jig 155 is connected to the flexible circuit board to check whether the sensor module 143 is destroyed by static electricity or the like, for example. Then, as shown in FIG. 4C, if a defect is found in the sensor module 143 as a result of the inspection, the vacuum device below the photoelectric conversion element substrate is turned off and the alignment head 152 is used. The defective chip 156 is replaced.

  Subsequently, as shown in FIG. 4 (d), a module adhesive 148 for holding a substrate such as silicon, acrylic, epoxy, or polyurethane resin that is cured by applying ultraviolet rays, moisture, or a curing agent is applied on each sensor module 143. . Then, as shown in FIG. 4E, the flexible substrate 146 is inserted into the long hole 151 provided in the CFRP substrate 149, and the sensor module 143 and the CFRP substrate 149 are brought into close contact with each other, and then irradiated with ultraviolet light or pressurized. Glue together.

  The CFRP substrate 149 is preferably made of glass or a permalloy (iron + nickel) alloy in consideration of the coefficient of thermal expansion between the sensor module 143 and the like.

  Finally, as shown in FIG. 4F, the sensor module 143 and the CFRP substrate 149 bonded thereto are removed from the stage 154.

  In the first embodiment, the cushioning material 140 is provided on the sensor panel 107, but in this embodiment, it is provided on the CFRP substrate 149 instead of on the sensor module of the sensor panel unit. The buffer material 140 is fixed with a buffer material adhesive 141 so as to surround the plurality of sensor modules. At this time, the height of the cushioning material 140 is set higher than the inner lead 145 attached to the sensor module.

  Actually, the height of the inner lead portion from the light receiving surface of the sensor module is 40 μm, the thickness of the sensor panel of the sensor module is 750 μm, and the thickness of the module adhesive for fixing the sensor module and the CFRP substrate is 50 μm. The height to the lead portion is 840 μm. The module adhesive is mixed with a 50 μm diameter spherical spacer to control the thickness. The buffer material has a thickness of 800 μm and is fixed to the CFRP substrate with the module adhesive containing the spacer. The height of the upper surface of the buffer material from the CFRP substrate surface is 850 μm and is located higher than the inner lead portion.

  Next, as shown in FIGS. 2 (a) and 2 (b), a buffer material adhesive 141 is applied to the outermost peripheral portion of the sensor module 143 on the sensor panel unit 150, 2-5 mm outside the sensor module, and adsorbed. The cushioning material 140 attached to the jig is bonded and fixed with a constant load. The buffer adhesive 141 includes a resin that cures without increasing the temperature, such as a condensation type liquid silicone rubber, a curing agent addition type epoxy, silicon, and an acrylic adhesive, and an ultraviolet curing type epoxy, silicone, and acrylic adhesive. Etc. are preferred.

  Next, the CsI substrate 126 is bonded to the sensor panel unit including the buffer material 141 via the CsI substrate adhesive sheet 142. In order to make effective use of the light receiving area of the sensor panel unit 150, the CsI layer 123 must be larger than the sensor module unit, and moreover larger than the outermost periphery of the buffer material in order to abut the upper surface of the buffer material and the CsI layer output surface. .

  Next, an actual CsI substrate bonding method will be described below with reference to FIGS. 2 (a) and 2 (b). On the sensor module 143 excluding the inner lead portion of the sensor panel unit 150, the CsI substrate adhesive sheet 142 is bonded to the sensor panel 150 by a laminate method without removing the separator.

  Then, the separator of the CsI substrate adhesive sheet 142 is peeled off, and the CsI substrate 126 is placed on the cushioning material 140 of the sensor panel unit 150 and is pressure-bonded with a roller by a laminator method. Further, the outer peripheral sealing agent 135 is applied to the gap between the outer peripheral portions of the CsI substrate 126 and the sensor panel unit 150.

  When the pressure is applied by the roller, the buffer material 140 is provided. Therefore, when the CsI substrate 126 is pressed, the distance that does not contact the input / output flexible substrate attached to the sensor module 143, the bump 144, and the inner lead 145. Is secured. As a result, disconnection of the inner lead portion and CsI crystal destruction due to contact with the CsI layer do not occur.

  Further, since the CsI substrate 126 is not bent, the amorphous carbon substrate 121 is not cracked or cracked, and the CsI layer 123 is not broken. Furthermore, since a certain adhesive layer thickness can be ensured, peeling due to thermal stress does not occur. Moreover, since the buffer material upper surface and the CsI layer output surface are abutted and bonded together, a predetermined thickness can be secured without being affected by the phosphor thickness variation, and the resolution can be stabilized.

(Embodiment 3)
FIGS. 5A to 5C are a schematic perspective view, a cross-sectional view, and a side view for explaining the configuration and manufacturing process of the radiation detection apparatus (X-ray area sensor) according to the third embodiment of the present invention. . Here, the thickness of the CsI layer 123 is 550 μm, the CsI substrate 126 is the same as in the second embodiment, and the structure and manufacturing process of the CsI substrate 126 are omitted. In FIG. 5, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  FIGS. 5A to 5C show a sensor panel module 163 in which a sensor panel unit (2) 162 and a CsI substrate 126 are attached by a CsI substrate adhesive sheet (2) 161. FIG.

  As the buffer material, the buffer material 160 is provided on the sensor panel unit (2) 162 side as in the second embodiment. At this time, the buffer material 160 is a silicon substrate having the same material and thickness as the sensor module, and is bonded to the sensor panel unit (2) 162 with a buffer material adhesive 141 or the like. The buffer adhesive 141 may be the same as the module adhesive mentioned in the process described later.

  Next, a process for manufacturing the sensor panel unit (2) 162 will be described with reference to FIG. The component parts to be mounted on the sensor panel unit (2) 162 and the manufacturing process are the same up to the chip replacement process in FIG. 4C in the second embodiment (FIGS. 6A to 6C). 4 (a) to 4 (c). In the present embodiment, the cushioning material (2) installation step and the subsequent steps in FIG. 6D will be described.

  First, when the step of FIG. 6C is completed, as shown in FIG. 6D, the cushioning material (2) 160 is arranged at an arbitrary position (the outermost peripheral portion of the sensor module 143) by the alignment head 152 and vacuumed. .

  Next, as shown in FIG. 6 (e), the CFRP substrate 149 is fixed to the printing stage 164, and the printing plate 157 is placed on the CFRP substrate 149. Then, a module adhesive 148 for holding a substrate such as silicon, acrylic, epoxy, or polyurethane resin that is cured by application of ultraviolet rays, moisture, or a curing agent is applied outside the effective printing area on the printing plate 157, and printing is effective with the squeegee 158. Print on the area.

  Next, as shown in FIG. 6 (f), the flexible substrate 146 is inserted into the long hole 151 provided in the CFRP substrate 149, and then the sensor module 143 and the CFRP substrate 149 are brought into close contact with each other, and then irradiated with ultraviolet rays. Adhere by pressurizing. The CFRP substrate 149 is preferably made of glass or a permalloy (iron + nickel) alloy in consideration of the coefficient of thermal expansion between the sensor module 143 and the like.

  Next, as shown in FIG. 6G, the sensor module 143, the cushioning material (2) 160, and the CFRP substrate 149 are bonded, and then removed from the stage. FIG. 6H shows a top view of the sensor panel unit (2) 162 thus completed.

  Next, as shown in FIG. 7, a masking tape 170 is attached to the portion where the long hole 151 of the CFRP substrate 149 is provided so as to close the hole from the surface where the sensor panel unit 160 (2) is provided. An adhesive is applied with a dispenser from the surface where the hole is not blocked, and the hole is filled to form a hole-filling sealing portion 159. In FIG. 6, the long hole 151, the buffer material 160, etc. are not shown. Examples of the sealing material used here include an epoxy resin, a silicon resin, an acrylic resin, and a polyurethane resin. However, the heat-curing resin decreases in viscosity when the temperature is raised, and is not suitable for flowing out from the gap between the masking tape 170 and the CFRP substrate 149.

  For this reason, condensate liquid silicone rubber, hardener-added epoxy, silicon, acrylic adhesive, etc. that cure without increasing the temperature, UV-curable epoxy, silicon, acrylic adhesive, etc. Is preferred.

  Also, from the viewpoint of reliability testing, the sealing material contacts the sensor module 143, so that the content of ionic impurities such as Na, K, Cl, etc. is 10 ppm or less, taking into consideration that the wiring is eroded. Is preferred. In consideration of the above, in this embodiment, a one-component condensed liquid silicone rubber having a viscosity of about 60 to 80 Pa · S is employed.

  Next, an X-ray area sensor comprising a CsI substrate 126 and a sensor panel unit (2) 162 bonded together with a CsI substrate adhesive sheet (2) 161 based on FIGS. 5 (a) to 5 (c). The manufacturing process will be described.

  The CsI substrate adhesive sheet (2) 161 has the same size as the sensor panel unit (2) 162 including the cushioning material (2) 160. However, as shown in FIG. 5A, the adhesive sheet that contacts the inner lead portion on the sensor module 143 is removed, and only the separator is used. Then, the separator on the sensor module side is peeled off, the CsI substrate adhesive sheet (2) 161 is aligned with the cushioning material (2) 160 on the sensor panel unit (2) 162, and is bonded onto the sensor module by a laminator method.

  Next, the separator on the CsI substrate side is peeled off, and the CsI substrate 126 is placed on the cushioning material 160 of the sensor panel module 163 and is pressure-bonded by the roller 109 by a laminator method. Then, the outer peripheral sealing agent 135 is applied to the gap between the outer peripheral portions of the CsI substrate 126 and the sensor panel module 163. As a result, the light shielding property of the X-ray area sensor is improved, and there is also an effect of preventing entry of foreign matters and penetration of moisture.

  Further, by using the cushioning material 160 as the same member as the sensor module, it is possible to secure a more stable adhesive layer thickness (distance from the sensor panel to the CsI layer) than in the first and second embodiments. The resolution of the area sensor can be improved.

(Embodiment 4)
FIG. 8 is a schematic configuration diagram showing an embodiment of a radiation diagnostic system using the radiation detection apparatus (X-ray area sensor) of the present invention as described above. X-rays 6060 generated in the X-ray tube 6050 pass through the chest 6062 of the patient or subject 6061 and enter a photoelectric conversion device (corresponding to the radiation detection device of the present invention) 6040 having a phosphor. This incident X-ray includes information inside the body of the patient 6061.

  The phosphor emits light in response to the incidence of X-rays, and this is photoelectrically converted to obtain electrical information. This information is converted to digital, image processed by an image processor 6070, and can be observed on a display 6080 in the control room.

  In addition, this information can be transferred to a remote place by transmission means such as a telephone line 6090, and can be displayed on a display 6081 in a doctor room or the like in another place, or stored in a storage means such as an optical disk, and can be diagnosed by a remote doctor. It is also possible to do. It can also be recorded on the film 6110 by the film processor 6100.

  In the above embodiments, X-rays are used as radiation, an X-ray area sensor is shown as a radiation detection apparatus, and the case where it is applied to an X-ray diagnostic system has been described. As described above, the present invention can use α rays, β rays, γ rays, etc. in addition to X-rays, and the radiation detection apparatus of the present invention is not limited to a medical radiation diagnostic system, but is a nondestructive inspection apparatus. It can also be used for radiation imaging systems such as

It is a figure which shows the structure of Embodiment 1 of this invention. It is a figure which shows the structure of Embodiment 2 of this invention. It is a figure which shows the sensor module of Embodiment 2. It is a figure explaining the manufacturing method of the sensor panel unit of Embodiment 2. FIG. It is a figure which shows the structure of Embodiment 3 of this invention. It is a figure explaining the manufacturing method of the sensor panel unit of Embodiment 3. FIG. It is a figure explaining the hole-filling sealing process of Embodiment 3. FIG. It is a typical block diagram which shows one Embodiment of the radiation imaging system using the radiation detection apparatus of this invention. It is a figure which shows the X-ray area sensor of the prior art example 1. FIG. It is sectional drawing seen from the roller axial direction at the time of crimping | bonding the fluorescent substance board | substrate and sensor panel of the X-ray area sensor of FIG. 9 with a roller. It is a figure which shows the X-ray area sensor of the prior art example 2. It is a figure which shows the change of an adhesive bond layer when a fluorescent substance layer changes in the X-ray area sensor of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Phosphor base 102 Reflective layer 103 Phosphor 104 Protection film 105 Phosphor substrate 106 Formation area 107 Sensor panel 108 Adhesive 109 Roller 121 Amorphous carbon substrate 122 Aluminum layer 123 CsI layer 124 Formation area 125 CsI protection layer 126 CsI Substrate 127 PET material 128 CsI layer thickness 129 Pet material thickness 130 Adhesive layer 135 Peripheral sealant 140 Buffer material 141 Buffer material adhesive 142 CsI substrate adhesive sheet 143 Sensor module 144 Bump 145 Inner lead 146 Flexible substrate 147 Lead electrode 148 Module adhesive 149 CFRP substrate 150 Sensor panel unit 151 Hole 152 Alignment head (X, Y, Z, Θ)
153 Alignment camera 154 Stage 155 Inspection jig 156 Defective chip 157 Printing plate 158 Squeegee 159 Filling and sealing part 160 Buffer material (2)
161 CsI substrate adhesive sheet (2)
162 Sensor panel unit (2)
163 Sensor panel module 164 Printing stage 170 Masking tape

Claims (7)

Radiation detection in which a phosphor substrate on which a phosphor that converts radiation into light is formed and a photoelectric conversion element substrate on which a photoelectric conversion element that converts light converted by the phosphor into charges is formed are fixed with an adhesive. In the apparatus, the radiation detecting apparatus includes a buffer material between a region of the phosphor substrate where the phosphor is formed and the photoelectric conversion element substrate. Fluorescence in which a photoelectric conversion element substrate in which a plurality of sensor modules on which photoelectric conversion elements are formed is two-dimensionally arranged on a base and a phosphor that converts radiation having a larger area than the photoelectric conversion element substrate into light are formed In the radiation imaging apparatus for fixing the body substrate with an adhesive, a buffer material is provided between a base of the outer peripheral portion of the photoelectric conversion element substrate and a region where the phosphor of the phosphor substrate is formed. Radiation detection device. The radiation detection apparatus according to claim 2, wherein an extraction electrode part for external output is provided on the photoelectric conversion element substrate, and an upper surface of the buffer material is at a position higher than the extraction electrode part. The radiation detection apparatus according to claim 2, wherein the buffer material has the same thickness as the sensor module. The radiation detection apparatus according to claim 2, wherein the buffer material is the same material as the sensor module. The radiation detection apparatus according to claim 2, wherein the adhesive is the same material as the adhesive that bonds the buffer material and the sensor module. The radiation detection apparatus according to any one of claims 1 to 6,
Signal processing means for processing signals from the radiation detection device;
Recording means for recording a signal from the signal processing means;
Display means for displaying a signal from the signal processing means;
Transmission processing means for transmitting a signal from the signal processing means;
A radiation imaging system comprising: a radiation source for generating the radiation.