TWI546234B - Method and device for conveying components of electronic component bonding process - Google Patents

Description

Component transfer method and device for electronic component bonding process

The present invention relates to a transport method and apparatus, and more particularly to a method and apparatus for transporting components of an electronic component bonding process for transporting an electronic component to be bonded to a component of a flexible substrate.

According to the general types of electronic components, there are often two or more electronic component combinations, such as a flexible substrate and a key, depending on the necessity. The actuating element is pressed, so that it cannot be connected by a fixed hardware circuit, and the circuit printed on the flexible substrate must be used for telecommunications conduction with the control system, and the flexibility of the substrate forming the circuit provides the button to be constantly actuated. Displacement response; a method of bonding electronic components of such a flexible substrate to a carrier such as a button, in the prior art, a flexible substrate having a plurality of matrix arrays on a carrier is often used, and the flexibility is artificially applied. The substrate is covered with a carrier to be attached thereto, so that the carrier is transported to the rail under the pressing device, and then the clamping module arranged in a plurality of matrixes in the pressing device is synchronized with the carrier. The flexible substrate and the carrier arranged in a plurality of matrixes are subjected to one-time press bonding.

The prior art uses a plurality of matrix-arranged clamping modules to simultaneously perform a one-time press-fitting of a plurality of matrix-arranged flexible substrates and carriers carried on the carrier, but must be manually applied to each flexible substrate. The overall efficiency is not improved by the flexible substrate and the carrier which are arranged by pressing a plurality of matrixes at one time; and the flexible substrate and the plurality of matrix arrays are pressed at one time. The press-fit quality of each of the flexible substrate and the carrier may be uneven. Due to the flexibility of the flexible substrate itself, the positioning variation may occur during the transport of the carrier, resulting in the bonding of the press-fit. When working, it is impossible to detect and form a defective product.

In view of the above, an object of the present invention is to provide a component transfer method for an electronic component bonding process in which the carrier is more efficiently transported and the component bonding quality is more preferable.

Another object of the present invention is to provide an electronic component bonding apparatus which is more efficient in transporting a carrier and having better component bonding quality.

It is still another object of the present invention to provide an element transport apparatus for performing the electronic component bonding process according to any one of claims 1 to 9.

An element carrying method for an electronic component bonding process according to the present invention includes: causing a first component to be transported by a first transport flow path; and causing the second component to be transported by a second transport flow path; a transfer mechanism is transferred from the first transfer flow path to the second transfer flow path to the second component according to a transfer path; the first component and the second component complete the bonded product, and the second transfer is performed Flow back.

According to another object of the present invention, a component transfer method for an electronic component bonding process includes: a first rail mount provided with a first transport slide rail, wherein the first transport slide rail is provided with a driveable horizontally The first carrier of the displacement, the path of the displacement provides a first conveying flow path for conveying a first carrier tray; the second rail seat is provided with a second conveying rail, and the second conveying rail is provided with a a second carrier that can be driven to be displaced in a horizontal direction, the path of displacement providing a second transport flow path for transporting a second carrier; a transfer mechanism comprising: a transfer rail mount thereon There is a transfer track, and a transfer slide is arranged on the transfer track, and a transfer mechanism is arranged on the transfer slide to be displaced on the transfer rail on the first transport slide and the first transport and the second transport The second carrier between the slide rails.

A device for transporting a component of an electronic component bonding process according to any one of claims 1 to 9 of the present invention.

In the electronic component bonding process component transfer method and device according to the embodiment of the present invention, since the first component is covered by the first upper cover on the first carrier, the first transport flow path formed by entering the first transport slide When the point is sent, the first upper cover has been disengaged from the first carrier, and the first carrier of the conveying mechanism receives the first carrier carrying the first component, and then directly follows the X-axis of the first rail seat. The first conveying flow path of the conveying slide is transported to the near transfer mechanism for the transfer mechanism to extract, and the transfer of the second component is also the same, so that the first component and the second component can be automatically transferred respectively, the first upper cover and the second cover. The upper cover can be efficiently opened and closed, and the first carrier and the second carrier can be efficiently transferred respectively; and the first carrier and the second carrier are parallel to the first conveying rail with a long side Abutting to provide a stable transmission, and the long side of the other side is unsupported to suspend the first carrier below to transmit the heating mechanism under the second carrier under the transfer path From the bottom to the top, the heating head is placed on the second carrier. The port is heated to make the first component and the second component smoothly complete the bonding; and the pressing mechanism of the transfer mechanism picks up the first component one by one to fit the second component one by one, and the first viewing unit is Viewing from top to bottom, and through the Y-axis transfer path, completing the second view unit to view the underside of the first component from bottom to top, and thereby obtaining alignment information under the first component, the first component Transfer to the second component on the second carrier in the second carrier for bonding, and to perform inspection of the third inspection unit of the finished product after finishing bonding on the second transport flow path, and returning by the first delivery flow path The empty first carrier and the second carrier that is fed back by the second transport flow path to complete the bonding process not only make each bonding process more precise, but also improve the quality, and the overall transportation process is planned and efficient.

Referring to FIG. 1 , an embodiment of the present invention is used for performing different component bonding processing. The first component A1 to be processed is held by a rectangular first carrier B1, each first load. A plurality of first elements A1 arranged in a matrix are covered by a rectangular first upper cover B11 on the disk B1, wherein the area of the first carrier B1 is larger than the first upper cover B11, and the first element A1 is flexible, for example, in this embodiment. The substrate (the first component A1 in the figure is only a schematic, non-actual flexible substrate shape); the second component A2 to be processed and fitted is carried by a rectangular second carrier B2, each of the second carrier B2 Each of the second elements A2 arranged in a matrix is covered by a rectangular second upper cover B21, wherein the area of the second carrier B2 is larger than that of the second upper cover B21. In the embodiment, the second component A2 is, for example, a button type carrier ( In the figure, the second component A2 is only a schematic, non-actual button shape); between the first upper cover B11 and the first carrier B1, or between the second upper cover B21 and the second carrier B2, a magnet such as a magnet may be disposed. When the two are covered, the whole set of components is formed into a better combined positioning.

Referring to FIG. 2 and FIG. 3, an embodiment of a method and apparatus for transporting components of an electronic component bonding process according to an embodiment of the present invention may be described as shown in the figure, including: a machine C, which is central to the machine table C1. A working section C2 is formed to be recessed downward, so that the two sides of the machine table C1 are higher and each side forms a seat C3, and a convex seat C4 is formed in the center of the working section C2 toward the rear section, and the two sides of the seat C3 are formed. And the upper surface of the fixed seat C4 is at the same height and forms the machine table C1; the fixed seat C4 is separated from the recessed working section C2 and forms a first conveying section C5 and a fixed recess between the fixed seat C4 and the one seat C3. The second conveying section C6 recessed between the seat C4 and the other side seat C3, the first conveying section C5 and the second conveying section C6 are at approximately the same level; a conveying mechanism G is disposed under the machine table C1 of the machine C The recessed working section C2 includes: a first rail seat G1 and a second rail seat G2 that are erected in the Z-axis and extend along the X-axis; wherein the first rail seat G1 is disposed in the first conveying section of the recess In C5, it has an X axis on one side of the machine table C. a first conveying rail G11, and a first carrier G12 disposed on the first conveying rail G11 perpendicular to the first conveying rail G11 and capable of being driven to be disposed in a horizontal direction for sliding displacement, The displacement path provides a first transport flow path for transporting the first carrier B1 of the first upper cover B11 of FIG. 1 that has been opened; the first carrier G12 has a substantially rectangular shape with a long side The first conveying rail G11 is abutted in parallel to provide stable transmission, and the long side of the other side is unsupported to be suspended below the first carrier G12; the first carrier G12 is provided with a plurality of matrices A suction port G121 is arranged in which a suction nozzle is disposed, and a negative pressure can be introduced therein. The first clamping seat G12 is respectively provided with a corresponding first clamping mechanism G122, which can be driven. The operation of expanding or clamping; the second rail seat G2 is disposed in the second conveying section C6 of the recess, and the X-axis second conveying rail G21 is disposed on one side in the machine C, and the second The conveying rail G21 is disposed perpendicular to the second conveying rail G21 and can be driven thereon to be disposed in a horizontal direction. The second carrier G22 performing the sliding displacement, the path of the displacement thereof provides a second conveying flow path for conveying the second carrier B2 in which the second upper cover B21 of FIG. 1 has been opened; the second carrier G22 is approximately momentarily In a morphological manner, a long side is abutted in parallel with the second conveying rail G21 to provide stable transmission, and the long side of the other side is unsupported to hang below the second carrier G22; The second carrier G22 is provided with a plurality of matrix-arranged hollow heating ports G221; the second carrier G22 is respectively provided with a corresponding second clamping mechanism G222 on the front and rear ends, which can be driven to expand Or a clamping operation; a transfer mechanism H, comprising: a transfer rail seat H1, the two ends of which are fixed on the side seats C3 of the machine C, and the Y-axis transfer track H11 is arranged thereon The transfer rail H11 is provided with a transfer carriage H12, and the transfer carriage H12 is provided with a Z-axis synchronous linkage pressing mechanism H13 and a first inspection unit H14, which can be displaced on the transfer rail H11. Between the first carrier G12 on the first conveying rail G11 of the mechanism G and the second carrier G22 on the second conveying rail G21; The mechanism H13 has an absorbing and pressing member, and the pressing device disclosed in, for example, the "Pressing Method and Apparatus" of the applicant's application No. 104107816; the first viewing unit H14 can be performed from top to bottom. The CCD lens is inspected; a second inspection unit I is disposed in the working section C2 recessed by the machine C, and is between the first conveying rail G11 and the second conveying rail G21, and is on the transfer sliding seat H12. The pressing mechanism H13 moves from the first carrier G12 on the first conveying rail G11 to the second carrier G22 on the second conveying rail G21, which can be a CCD lens that is viewed from the bottom up; The heating mechanism J is disposed in the working section C2 of the machine C recessed, and is between the first conveying rail G11 and the second conveying rail G21, and the second carrier G22 is sliding on the second conveying rail G21. In the moving path, the heating mechanism J is located below the second carrier G22, and is provided with a heating head J1 that can be pushed into the hollowing port G221 of the second carrier G22 from bottom to top, and the number of the heating head J1 corresponds to The number of columns of the heating port G221 on the second carrier G22 is two in this embodiment; A third inspection unit K can be a CCD lens that is viewed from the top down, and is disposed on the side seat C3 of the machine table C on the side of the second conveying rail G21 by a rail K1. The rail K1 is driven to slide in the Y direction, and the third inspection unit K corresponds to the path in which the second carrier G22 slides on the second transport rail G21 and is above the second carrier G22. The second inspection unit I and the heating mechanism J are on the linear transfer path provided by the transfer rail H11 on the transfer rail seat H1 in the transfer mechanism H, the first The connection between the second inspection unit I and the heating mechanism J on the transfer path is a line parallel to the transfer track H11.

The component carrying method of the electronic component bonding process of the embodiment of the present invention comprises: a placing step, referring to FIG. 4 and FIG. 5, the embodiment of the present invention can be used for picking up and dropping by using a suction seat D, which has a peripheral portion and a suction port. a low first group of adsorption elements D1 (for example, a nozzle), and a second group of adsorption elements D2 (for example, nozzles) located inside the first group of adsorption elements D1 and having a higher suction port, when each group in FIG. When the first carrier B1 of the first component A1, the first upper cover B11 (the second carrier B2 with the second component A2 and the second upper cover B21 are also attached) are adsorbed, the first group of adsorption elements D1 adsorbs the lower area. The first carrier B1 is larger, and the second group of adsorption elements D2 adsorbs the first upper cover B11 having a smaller area; as shown in FIG. 6, the suction D transfers the entire assembly to the conveying mechanism G waiting underneath. When a seat G12 is mounted, the first group of adsorption elements D1 in the suction seat D is closed to the negative pressure, and only the second upper group of the adsorption elements D2 is moved up, and the first upper cover B11 is moved up, as shown in the figure. As shown in FIG. 7, the first clamping mechanism G122 can perform a pair of operations of forcibly fixing the first carrier B1. The first carrier B1 carrying the first component A1 is placed on the first carrier G12 and adsorbed by the suction nozzle G123 in the suction port G121; the entire group is attached to the second carrier A2 with the second component A2 as shown in FIG. B2, the assembly of the second upper cover B21 can also be in the foregoing manner. Similarly, the second carrier B2 is placed on the second heating seat G221 of the second carrier G22 as shown in FIG. 8 by another suction seat D; 1 is attached with the first carrier B1 of the first component A1, the assembly of the first upper cover B11, the entire set of the second carrier B2 with the second component A2, and the second upper cover B21, which can be synchronized or Unsynchronized transmission, a more efficient transmission plan, based on the first component A1 will be preferentially extracted, so that the entire set of components of the first carrier B1 and the first upper cover B11 with the first component A1 attached are first performed. Referring to FIG. 1 and FIG. 9, the first component A1 is covered by the first upper cover B11 on the first carrier B1, and is formed in the first transport flow path formed by entering the first transport slide G11. When the feeding point is up, the first upper cover B11 has been disengaged from the first carrier B1, and the first carrier G12 receives the first component carrying the first component A1. After the carrier B1, the first transport flow path of the first transport slide G11 on the X-axis of the first rail seat G1 is transported to the near transfer mechanism H for the transfer mechanism H to extract; similarly, the second component A2 Covered by a second upper cover B21 in the second carrier B2, the second upper cover B21 has been separated from the second carrier B2 when entering the first delivery flow path formed by the second delivery slide G21. After the second carrier G22 receives the second carrier B2 carrying the second component A2, the second carrier G2 that follows the X-axis of the second rail seat G2 is transported to the near-transfer mechanism. H; the first transport flow path and the second transport flow path are parallel to each other at a spacing interval, and the first carrier G12 and the second carrier G22 can be transmitted synchronously or asynchronously, a more efficient transmission plan, due to the A carrier G12 receives the first carrier B1 carrying the first component A1, and the first component A1 is preferentially extracted based on the first component A1, so that the first carrier G12 is first transmitted, the first transmission flow path and the second transmission The travel distance from the starting point to the end point of the flow path is equivalent and corresponding; a transfer step, please refer to Figure 1, 10, being transported The first carrier A1 on the first carrier G12 at the transfer mechanism H, the first component A1 thereon is to be inspected by the CCD lens of the first inspection unit H14 on the transfer mechanism H for viewing from top to bottom. The position, the pressing mechanism H13 will detect the information obtained by the alignment according to the first inspection unit H14, and the first component A1 that passes through the inspection is provided by the transfer axis H11 of the Y-axis that is traversed on the carrier rail H1. The Y-axis transfer path is moved to the top of the second inspection unit I on the transfer path, and the CCD lens that is viewed from the bottom up is detected under the first component A1, thereby obtaining the first The information about the lower part of the component A1, the pressing mechanism H13 transfers the first component A1 to the second component A2 of the second carrier B2 in the second carrier G22 under the alignment information obtained by the second viewing unit 1. Referring to FIGS. 1, 10, and 11, the pressing mechanism H13 moves the first member A1 down to the second member A2, and is applied through the pressing mechanism H13 during the bonding process. Pressing and passing the heating mechanism J on the transfer path below the second carrier G22, causing the heating mechanism J to pass from the bottom to the bottom The heating head J1 is heated against the hollow heating port G221 of the second carrier G22 to complete the bonding of the first component A1 and the second component A2, and then the finished product is displaced by the second carrier G22. And to the third inspection unit K, the CCD lens for viewing from top to bottom is used for product inspection; for the returning step, please refer to FIG. 1 and FIG. 12, all the first in the first carrier B1 on the first carrier G12. After the components A1 are extracted one by one, the first carrier G12, together with the first carrier B1 above it, follows the first transport path of the first transport rail G11 on the X-axis of the first rail seat G1 and will be sent back to the original The first rail seat G1 picks up the delivery point; the second carrier G22 completes and inspects all the second components A2 of the second carrier B2 on all the first component A1 and the second carrier G22, and the second carrier The seat G22 is coupled with the second carrier B2 of the finished product on which the first component A1 and the second component A2 are loaded, and the second transmission of the second transporting rail G21 according to the X-axis of the second rail seat G2. The flow path is sent back to the original second rail seat G2 to pick up the point; a collection step, please refer to FIG. 13, and is returned to the first point of the original starting point. The carrier B1, the suction cup D will be driven down, and the first upper cover B11 which is still adsorbed by the original second group of adsorption elements D2 covers the first carrier B1 on the first carrier G12, and is as shown in FIG. The first group of adsorption elements D1 are shown adsorbing the first carrier B1 and the second group of adsorption elements D2 are adsorbed to the first upper cover B11, and the whole set of components is delivered to the first suction cup E21 for sending and collecting; similarly, the second The carrier B2 and the second upper cover B21 are sent out in the same manner for collection.

In the electronic component bonding process component transfer method and apparatus according to the embodiment of the present invention, the first component A1 is covered by the first upper cover B11 on the first carrier B1, and is formed in the first transport slide G11. When the transport flow path starts from the delivery point, the first upper cover B11 has been detached from the first carrier B1, and the first carrier G12 of the transport mechanism G receives the first carrier B1 carrying the first component A1, and Directly following the first transport path of the first transport rail G11 on the X-axis of the first rail seat G1, it is transported to the near transfer mechanism H for the transfer mechanism H to be extracted, and the second component A2 is also transmitted, so that the first The component A1 and the second component A2 can be automatically transferred respectively, and the first upper cover B11 and the second upper cover B21 can be efficiently opened and closed, and the first carrier B1 and the second carrier B2 can be efficiently transferred respectively; The first carrier G12 and the second carrier G22 are in parallel with the first conveying rail G11 with a long side to provide stable transmission, and the long side of the other side is unsupported for the first carrier. The seat G12 is suspended below to transmit heat through the heating mechanism J on the transfer path below the second carrier G22. The mechanism J is heated from bottom to top by the heating head J1 against the hollow heating port G221 of the second carrier G22, so that the first component A1 and the second component A2 are smoothly bonded; and the pressing mechanism of the transfer mechanism H The first element A1 is taken one by one to be attached one by one with the second element A2, and the first inspection unit H14 is viewed from the top to the bottom, and the second inspection unit I is completed by the Y-axis transfer path. Viewing the underside of the first component A1 from the bottom up, and thereby obtaining the alignment information under the first component A1, transferring the first component A1 to the second component on the second carrier B2 of the second carrier G22 The upper side of the A2 is bonded, and the third inspection unit K of the finished product after the completion of the bonding is performed on the second transport flow path, and the first carrier B1 that is returned by the first transport flow path and the second transport flow path are The second carrier B2 of the finished composite product is returned, which not only makes each bonding process more precise, but also improves the quality, and the overall transportation process is planned and efficient.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

A1‧‧‧ first component
A2‧‧‧ second component
B1‧‧‧first carrier
B11‧‧‧ first cover
B2‧‧‧second carrier
B21‧‧‧Second cover
C‧‧‧ machine
C1‧‧‧ machine table
C2‧‧‧ working area
C3‧‧‧ side seat
C4‧‧‧ fixed seat
C5‧‧‧First delivery interval
C6‧‧‧Second transport interval
D‧‧‧ suction seat
D1‧‧‧First group of adsorption elements
D2‧‧‧Second group of adsorption elements
G‧‧‧Transportation agency
G1‧‧‧First rail seat
G11‧‧‧First conveyor rail
G12‧‧‧ first carrier
G121‧‧‧ mouthpiece
G122‧‧‧First clip mechanism
G123‧‧ ‧ nozzle
G2‧‧‧Second rail seat
G21‧‧‧Second transport rail
G22‧‧‧Second carrier
G221‧‧‧heating port
G222‧‧‧Second clip mechanism
H‧‧‧Transportation mechanism
H1‧‧‧Loading rail seat
H11‧‧‧Transfer track
H12‧‧‧Transfer slide
H13‧‧‧Compression mechanism
H14‧‧‧First inspection unit
I‧‧‧Second inspection unit
J‧‧‧heating mechanism
J1‧‧‧ heating head
K‧‧‧ Third inspection unit
K1‧‧‧ rail rack

1 is a perspective exploded view showing the relationship between the carrier and the upper cover and the first and second components, respectively, in the embodiment of the present invention. 2 is a schematic plan view showing the arrangement relationship of each mechanism in the embodiment of the present invention. 3 is a schematic side view showing the first rail seat and the second rail seat in the first transport section and the second transport section of the machine in the embodiment of the present invention. Figure 4 is a schematic illustration of the loading step in the embodiment of the present invention. FIG. 5 is a schematic view showing the first group of adsorption elements and the second group of adsorption elements of the suction cup jointly adsorbing the carrier and the upper cover in the embodiment of the present invention. Fig. 6 is a schematic view showing the suction of the suction cap by the second group of adsorption elements in the embodiment of the invention. Figure 7 is a cross-sectional view showing the carrier in the first carrier in the embodiment of the present invention. Figure 8 is a schematic view showing the cross section of the carrier in the second carrier in the embodiment of the present invention. Figure 9 is a schematic illustration of the transport step in the embodiment of the present invention. Figure 10 is a schematic illustration of the transfer step in the embodiment of the present invention. Figure 11 is a schematic view showing the heating of the bonding step in the embodiment of the present invention. FIG. 12 is a schematic diagram of a loopback step in an embodiment of the present invention. Figure 13 is a schematic view showing the suction cap of the collecting step of the embodiment of the present invention covering the carrier with the upper cover adsorbed by the original second group of adsorbing elements. Figure 14 is a schematic view showing the suction and holding of the carrier and the upper cover by the first group of adsorption elements and the second group of adsorption elements in the suction step of the collecting step in the embodiment of the present invention.

C‧‧‧ machine

C1‧‧‧ machine table

C2‧‧‧ working area

C3‧‧‧ side seat

C4‧‧‧ fixed seat

C5‧‧‧First delivery interval

C6‧‧‧Second transport interval

G‧‧‧Transportation agency

G1‧‧‧First rail seat

G11‧‧‧First conveyor rail

G12‧‧‧ first carrier

G121‧‧‧ mouthpiece

G122‧‧‧First clip mechanism

G2‧‧‧Second rail seat

G21‧‧‧Second transport rail

G22‧‧‧Second carrier

G221‧‧‧heating port

G222‧‧‧Second clip mechanism

H‧‧‧Transportation mechanism

H1‧‧‧Loading rail seat

H11‧‧‧Transfer track

H12‧‧‧Transfer slide

H13‧‧‧Compression mechanism

H14‧‧‧First inspection unit

I‧‧‧Second inspection unit

J‧‧‧heating mechanism

J1‧‧‧ heating head

K‧‧‧ Third inspection unit

K1‧‧‧ rail rack

Claims (17)

A component transfer method for an electronic component bonding process, comprising: causing a first component to be transported by a first transport flow path; causing a second component to be transported by a second transport flow path; and causing the first component to be transferred by a transfer mechanism The transfer path is transferred from the first transfer flow path to the second transfer flow path to be bonded to the second component; the finished product of the first component and the second component is returned to the original second transfer flow path. The component transfer method of the electronic component bonding process according to the first aspect of the invention, wherein the first component and the second component are each arranged in a matrix in a first and a second carrier. The component transfer method of the electronic component bonding process according to the first aspect of the invention, wherein the transfer mechanism scans the first component from the top to the bottom by the first viewing unit after the transfer path is transferred to the first component. element. The component transfer method of the electronic component bonding process according to the first aspect of the invention, wherein the transfer mechanism transfers the first component to a second inspection unit according to the transfer path to view the bottom-up view. The first component. The component transfer method of the electronic component bonding process according to the first aspect of the invention, wherein the bonding step is performed by a pressing mechanism and is heated from the bottom to the top through a heating mechanism below the second carrier. , the first component and the second component are completed. The component transfer method of the electronic component bonding process according to the first aspect of the invention, wherein the completed finished product is subjected to a third inspection unit for viewing from top to bottom. The component transfer method of the electronic component bonding process according to the first aspect of the invention, wherein the first component is a flexible substrate and the second component is a carrier of a button type. The component transfer method of the electronic component bonding process of claim 2, wherein the first component is covered by a first upper cover on the first carrier, and when entering the first delivery flow path, the delivery point The first upper cover is detached from the first carrier; the second component is covered by the second upper cover in the second carrier, and the second upper cover is coupled to the second carrier when entering the first delivery flow path Get rid of. The component transfer method of the electronic component bonding process according to the second aspect of the invention, wherein the finished product of the first component and the second component is returned to the original by the second carrier according to the second transfer channel. After the delivery point, a second upper cover is placed on the second carrier. A component conveying device for an electronic component bonding process, comprising: a first rail seat provided with a first conveying rail, wherein the first conveying rail is provided with a first carrier that can be driven to be displaced in a horizontal direction The displacement path provides a first conveying flow path for conveying a first carrier disk; a second rail seat is provided with a second conveying slide rail, and the second conveying sliding rail is provided with a driveable horizontally a second carrier having a displacement direction, a path of displacement providing a second transport flow path for transporting a second carrier; a transfer mechanism comprising: a transfer rail mount having a transfer track thereon A transfer carriage is disposed on the transfer rail, and a pressing mechanism is disposed on the transfer carriage to be displaced between the first carrier on the first conveyor rail and the second carrier on the second conveyor rail. The component transfer device of the electronic component bonding process according to claim 10, wherein the first carrier and the second carrier are in parallel with the first transport rail and the other side The sides are unsupported and left below. The component transfer device of the electronic component bonding process according to claim 10, wherein the first carrier is provided with a plurality of matrix arrays and a suction port having a nozzle therein, wherein a negative pressure can be applied thereto. The component transfer device of the electronic component bonding process of claim 10, wherein the first carrier and the second carrier are provided with a clamping mechanism that can be driven to expand or The operation of the clamp. The component transfer apparatus of the electronic component bonding process according to claim 10, wherein the second carrier is provided with a plurality of matrix-arranged hollow heating ports. The component transfer device of the electronic component bonding process of claim 10, wherein the first rail seat and the second rail seat are respectively disposed in a first transport section and a second transport section of a machine recess. in. The component transfer device of the electronic component bonding process according to claim 10, wherein the transfer slide is provided with a first inspection unit, which can be viewed from top to bottom. An apparatus for transporting a component of an electronic component bonding process according to any one of claims 1 to 9 of the present invention.