TWI545811B - 遠端磷光體發光二極體結構 - Google Patents

遠端磷光體發光二極體結構 Download PDF

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Publication number
TWI545811B
TWI545811B TW100149350A TW100149350A TWI545811B TW I545811 B TWI545811 B TW I545811B TW 100149350 A TW100149350 A TW 100149350A TW 100149350 A TW100149350 A TW 100149350A TW I545811 B TWI545811 B TW I545811B
Authority
TW
Taiwan
Prior art keywords
light
led
source
layer
phosphor
Prior art date
Application number
TW100149350A
Other languages
English (en)
Chinese (zh)
Other versions
TW201240163A (en
Inventor
安卓 約翰 奧德奇爾克
萊維 潘拉尼斯西娃
艾羅奇亞瑞杰 傑蘇多斯
Original Assignee
３Ｍ新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ３Ｍ新設資產公司 filed Critical ３Ｍ新設資產公司
Publication of TW201240163A publication Critical patent/TW201240163A/zh
Application granted granted Critical
Publication of TWI545811B publication Critical patent/TWI545811B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/141—Beam splitting or combining systems operating by reflection only using dichroic mirrors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Luminescent Compositions (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Optical Filters (AREA)
TW100149350A 2010-12-29 2011-12-28 遠端磷光體發光二極體結構 TWI545811B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201061428034P 2010-12-29 2010-12-29

Publications (2)

Publication Number Publication Date
TW201240163A TW201240163A (en) 2012-10-01
TWI545811B true TWI545811B (zh) 2016-08-11

Family

ID=45496281

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100149350A TWI545811B (zh) 2010-12-29 2011-12-28 遠端磷光體發光二極體結構

Country Status (6)

Country Link
US (2) US8912562B2 (OSRAM)
JP (2) JP6104174B2 (OSRAM)
KR (1) KR20130128445A (OSRAM)
CN (1) CN103283048B (OSRAM)
TW (1) TWI545811B (OSRAM)
WO (1) WO2012091971A1 (OSRAM)

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Also Published As

Publication number Publication date
CN103283048B (zh) 2017-04-12
CN103283048A (zh) 2013-09-04
WO2012091971A1 (en) 2012-07-05
US20150084500A1 (en) 2015-03-26
TW201240163A (en) 2012-10-01
US9360176B2 (en) 2016-06-07
JP2016197756A (ja) 2016-11-24
KR20130128445A (ko) 2013-11-26
JP6104174B2 (ja) 2017-03-29
US20130270587A1 (en) 2013-10-17
JP2014508398A (ja) 2014-04-03
US8912562B2 (en) 2014-12-16

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MM4A Annulment or lapse of patent due to non-payment of fees