TWI545016B - 用於層壓第一與第二疊片之裝置及方法 - Google Patents

用於層壓第一與第二疊片之裝置及方法 Download PDF

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Publication number
TWI545016B
TWI545016B TW099140492A TW99140492A TWI545016B TW I545016 B TWI545016 B TW I545016B TW 099140492 A TW099140492 A TW 099140492A TW 99140492 A TW99140492 A TW 99140492A TW I545016 B TWI545016 B TW I545016B
Authority
TW
Taiwan
Prior art keywords
carrier
drum
lamination
alignment mark
mode
Prior art date
Application number
TW099140492A
Other languages
English (en)
Chinese (zh)
Other versions
TW201127634A (en
Inventor
德 布蘭 杰洛 凡
安德司 黑因瑞奇 戴兒特傑
山德 克里斯登 包爾司
米藍 沙明克
Original Assignee
荷蘭Ｔｎｏ自然科學組織公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荷蘭Ｔｎｏ自然科學組織公司 filed Critical 荷蘭Ｔｎｏ自然科學組織公司
Publication of TW201127634A publication Critical patent/TW201127634A/zh
Application granted granted Critical
Publication of TWI545016B publication Critical patent/TWI545016B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Electroluminescent Light Sources (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW099140492A 2009-11-27 2010-11-24 用於層壓第一與第二疊片之裝置及方法 TWI545016B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09177368A EP2327547A1 (en) 2009-11-27 2009-11-27 Apparatus and method for laminating a first and a second sheet

Publications (2)

Publication Number Publication Date
TW201127634A TW201127634A (en) 2011-08-16
TWI545016B true TWI545016B (zh) 2016-08-11

Family

ID=42097398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099140492A TWI545016B (zh) 2009-11-27 2010-11-24 用於層壓第一與第二疊片之裝置及方法

Country Status (6)

Country Link
US (1) US9174425B2 (enExample)
EP (2) EP2327547A1 (enExample)
JP (1) JP5865256B2 (enExample)
CN (1) CN102666099B (enExample)
TW (1) TWI545016B (enExample)
WO (1) WO2011065819A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2612757B1 (en) * 2012-01-04 2016-07-20 LG Electronics Inc. Film laminating method for a flat or curved plate member
JP5961105B2 (ja) * 2012-12-25 2016-08-02 日本飛行機株式会社 積層装置および積層体形成方法
KR102173043B1 (ko) * 2013-07-29 2020-11-03 삼성디스플레이 주식회사 기판 처리 시스템, 이에 포함된 라미네이팅 장치, 및 기판 처리 시스템을 이용한 기판 처리 방법
CN107894680B (zh) * 2017-12-19 2020-07-31 武汉华星光电技术有限公司 一种配向膜涂布方法及装置
CN110181934B (zh) * 2019-07-03 2021-01-26 京东方科技集团股份有限公司 一种印刷装置、印刷系统及其印刷方法
TWI707776B (zh) * 2019-12-30 2020-10-21 輝能科技股份有限公司 氣浮式薄膜貼合設備及其氣浮滾輪

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4360266A (en) 1979-08-24 1982-11-23 Dai Nippon Insatsu Kabushiki Kaisha Contact printing method and apparatus
US4491492A (en) * 1982-10-28 1985-01-01 At&T Technologies, Inc. Methods of and apparatus for applying a sheet to a rigid board
US5407519A (en) * 1993-07-07 1995-04-18 Interserv Corp. Apparatus for manufacturing liquid crystal display screens
US5788802A (en) 1996-10-22 1998-08-04 Preco Industries, Inc. Vacuum drum feed and alignment apparatus for multiple layer laminator
JP4543491B2 (ja) * 2000-03-31 2010-09-15 コニカミノルタホールディングス株式会社 表示パネルの製造方法及び装置
US6547229B1 (en) * 2000-11-22 2003-04-15 3M Innovative Properties Company Stacking apparatus and method for laminated products and packaging
KR100720422B1 (ko) 2002-11-15 2007-05-22 엘지.필립스 엘시디 주식회사 액정표시소자 제조 장치 및 이를 이용한 제조 방법
TWI257515B (en) 2002-11-16 2006-07-01 Lg Philips Lcd Co Ltd Substrate bonding apparatus for liquid crystal display device
US7275577B2 (en) 2002-11-16 2007-10-02 Lg.Philips Lcd Co., Ltd. Substrate bonding machine for liquid crystal display device
JP2005246773A (ja) 2004-03-04 2005-09-15 Toppan Printing Co Ltd パターン形成方法
DE102005020456B4 (de) * 2005-04-29 2008-12-04 Siempelkamp Maschinen- Und Anlagenbau Gmbh & Co. Kg Verfahren zum Herstellen von strukturierten Verbundwerkstoffplatten, insbesondere Laminatplatten
KR101367661B1 (ko) * 2006-08-25 2014-02-27 엘아이지에이디피 주식회사 척의 평행도 및 평편도 조절유닛을 가진 기판 합착장치
JP4769165B2 (ja) 2006-10-27 2011-09-07 富士フイルム株式会社 感光性積層体の製造装置及び製造方法
US8016963B2 (en) * 2007-12-27 2011-09-13 Lasx Industries, Inc. Precision lamination of multilayered structures
EP2100730A1 (en) * 2008-03-14 2009-09-16 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Laminating device and laminating method
CN101249739B (zh) 2008-03-31 2010-06-09 刘苏海 一种夹层板材成型机
CN101980934B (zh) * 2008-04-14 2013-01-02 柯达图像传递加拿大公司 滚轮对准

Also Published As

Publication number Publication date
JP2013512563A (ja) 2013-04-11
EP2504169B1 (en) 2017-02-22
US20120305163A1 (en) 2012-12-06
EP2504169A1 (en) 2012-10-03
WO2011065819A1 (en) 2011-06-03
EP2327547A1 (en) 2011-06-01
CN102666099B (zh) 2015-04-15
JP5865256B2 (ja) 2016-02-17
TW201127634A (en) 2011-08-16
US9174425B2 (en) 2015-11-03
CN102666099A (zh) 2012-09-12

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