TWI544602B - 可適性靜電放電保護電路 - Google Patents
可適性靜電放電保護電路 Download PDFInfo
- Publication number
- TWI544602B TWI544602B TW100146298A TW100146298A TWI544602B TW I544602 B TWI544602 B TW I544602B TW 100146298 A TW100146298 A TW 100146298A TW 100146298 A TW100146298 A TW 100146298A TW I544602 B TWI544602 B TW I544602B
- Authority
- TW
- Taiwan
- Prior art keywords
- gate
- transistor
- integrated circuit
- circuit device
- pmos transistor
- Prior art date
Links
- 230000003044 adaptive effect Effects 0.000 title claims description 9
- 239000003990 capacitor Substances 0.000 claims description 115
- 239000004065 semiconductor Substances 0.000 claims description 32
- 238000010168 coupling process Methods 0.000 claims description 28
- 230000008878 coupling Effects 0.000 claims description 27
- 238000005859 coupling reaction Methods 0.000 claims description 27
- 229910044991 metal oxide Inorganic materials 0.000 claims description 26
- 150000004706 metal oxides Chemical class 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 230000036039 immunity Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000004891 communication Methods 0.000 description 8
- 238000005457 optimization Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
- H01L27/0285—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements bias arrangements for gate electrode of field effect transistors, e.g. RC networks, voltage partitioning circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
- H02H9/045—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere
- H02H9/046—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere responsive to excess voltage appearing at terminals of integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201061425552P | 2010-12-21 | 2010-12-21 | |
US13/288,080 US8462473B2 (en) | 2010-12-21 | 2011-11-03 | Adaptive electrostatic discharge (ESD) protection circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201232749A TW201232749A (en) | 2012-08-01 |
TWI544602B true TWI544602B (zh) | 2016-08-01 |
Family
ID=46234096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100146298A TWI544602B (zh) | 2010-12-21 | 2011-12-14 | 可適性靜電放電保護電路 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8462473B2 (de) |
EP (1) | EP2656386A1 (de) |
CN (1) | CN103339727B (de) |
TW (1) | TWI544602B (de) |
WO (1) | WO2012087614A1 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8829967B2 (en) * | 2012-06-27 | 2014-09-09 | Triquint Semiconductor, Inc. | Body-contacted partially depleted silicon on insulator transistor |
US8817437B2 (en) * | 2013-01-03 | 2014-08-26 | Amazing Microelectronics Corp. | High voltage open-drain electrostatic discharge (ESD) protection device |
US9214932B2 (en) | 2013-02-11 | 2015-12-15 | Triquint Semiconductor, Inc. | Body-biased switching device |
US9203396B1 (en) | 2013-02-22 | 2015-12-01 | Triquint Semiconductor, Inc. | Radio frequency switch device with source-follower |
US9130562B2 (en) | 2013-03-13 | 2015-09-08 | Alpha And Omega Semiconductor Incorporated | Active ESD protection circuit |
US9373612B1 (en) * | 2013-05-31 | 2016-06-21 | Altera Corporation | Electrostatic discharge protection circuits and methods |
JP2014241497A (ja) | 2013-06-11 | 2014-12-25 | ローム株式会社 | 半導体集積回路 |
US9153958B2 (en) * | 2013-08-15 | 2015-10-06 | Nxp B.V. | Bias-insensitive trigger circuit for bigFET ESD supply protection |
US9379698B2 (en) * | 2014-02-04 | 2016-06-28 | Triquint Semiconductor, Inc. | Field effect transistor switching circuit |
CN103887306B (zh) * | 2014-03-05 | 2017-03-01 | 晶焱科技股份有限公司 | 高电压开漏极静电放电(esd)保护装置 |
DE102016111641A1 (de) * | 2016-06-24 | 2017-12-28 | Infineon Technologies Ag | Schalter |
CN107945829A (zh) * | 2016-10-13 | 2018-04-20 | 中国矿业大学 | 一种忆导值可调的门极可控三端口忆阻器模拟电路 |
FR3059164B1 (fr) | 2016-11-18 | 2020-09-18 | Continental Automotive France | Dispositif de protection d'un calculateur electronique contre un court-circuit |
US10749337B2 (en) | 2017-02-09 | 2020-08-18 | Texas Instruments Incorporated | Integrated ESD event sense detector |
CN109922394B (zh) * | 2017-12-13 | 2020-09-29 | 华为终端有限公司 | 偏置电压输出电路及驱动电路 |
US20200243512A1 (en) * | 2019-01-28 | 2020-07-30 | Stmicroelectronics International N.V. | Nmos transistor with bulk dynamically coupled to drain |
TWI729493B (zh) * | 2019-09-12 | 2021-06-01 | 友達光電股份有限公司 | 畫素陣列基板 |
DE102020103706A1 (de) * | 2020-02-13 | 2021-08-19 | Infineon Technologies Ag | Halbleiterschalter mit esd-schutzschaltung |
US10938387B1 (en) | 2020-06-24 | 2021-03-02 | Cypress Semiconductor Corporation | Local interconnect network (LIN) driver circuit |
CN112074065A (zh) * | 2020-08-31 | 2020-12-11 | 上海法雷奥汽车电器系统有限公司 | 静电防护方法、设备、计算机设备以及可读存储介质 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6747861B2 (en) * | 2001-11-15 | 2004-06-08 | Industrial Technology Research Institute | Electrostatic discharge protection for a mixed-voltage device using a stacked-transistor-triggered silicon controlled rectifier |
TWI264106B (en) | 2002-04-30 | 2006-10-11 | Winbond Electronics Corp | Static charge protection circuit of adopting gate-coupled MOSFET (metal-oxide-semiconductor field effect transistor) |
US7102862B1 (en) * | 2002-10-29 | 2006-09-05 | Integrated Device Technology, Inc. | Electrostatic discharge protection circuit |
TWI296439B (en) * | 2005-08-08 | 2008-05-01 | Silicon Integrated Sys Corp | Esd protection circuit |
US7495878B2 (en) * | 2007-03-22 | 2009-02-24 | Bae Systems Information And Electronic Systems Integration Inc. | Decoupling capacitor control circuit and method for enhanced ESD performance |
US7876540B2 (en) | 2007-11-21 | 2011-01-25 | Microchip Technology Incorporated | Adaptive electrostatic discharge (ESD) protection of device interface for local interconnect network (LIN) bus and the like |
US8345396B2 (en) * | 2010-03-08 | 2013-01-01 | Macronix International Co., Ltd. | Electrostatic discharge protectors having increased RC delays |
-
2011
- 2011-11-03 US US13/288,080 patent/US8462473B2/en not_active Expired - Fee Related
- 2011-12-09 CN CN201180066374.8A patent/CN103339727B/zh not_active Expired - Fee Related
- 2011-12-09 WO PCT/US2011/064180 patent/WO2012087614A1/en active Application Filing
- 2011-12-09 EP EP11808414.4A patent/EP2656386A1/de not_active Withdrawn
- 2011-12-14 TW TW100146298A patent/TWI544602B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN103339727A (zh) | 2013-10-02 |
US8462473B2 (en) | 2013-06-11 |
EP2656386A1 (de) | 2013-10-30 |
WO2012087614A1 (en) | 2012-06-28 |
US20120154963A1 (en) | 2012-06-21 |
TW201232749A (en) | 2012-08-01 |
CN103339727B (zh) | 2016-03-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |