TWI542465B - Transparent conductive film - Google Patents

Transparent conductive film Download PDF

Info

Publication number
TWI542465B
TWI542465B TW102139866A TW102139866A TWI542465B TW I542465 B TWI542465 B TW I542465B TW 102139866 A TW102139866 A TW 102139866A TW 102139866 A TW102139866 A TW 102139866A TW I542465 B TWI542465 B TW I542465B
Authority
TW
Taiwan
Prior art keywords
tin oxide
indium tin
oxide layer
layer
transparent conductor
Prior art date
Application number
TW102139866A
Other languages
English (en)
Chinese (zh)
Other versions
TW201429702A (zh
Inventor
Tomotake Nashiki
Motoki Haishi
Tomonori Noguchi
Kuniaki Ishibashi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201429702A publication Critical patent/TW201429702A/zh
Application granted granted Critical
Publication of TWI542465B publication Critical patent/TWI542465B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3492Variation of parameters during sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Physical Vapour Deposition (AREA)
TW102139866A 2012-11-07 2013-11-01 Transparent conductive film TWI542465B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012245694A JP6242571B2 (ja) 2012-11-07 2012-11-07 透明導電性フィルム

Publications (2)

Publication Number Publication Date
TW201429702A TW201429702A (zh) 2014-08-01
TWI542465B true TWI542465B (zh) 2016-07-21

Family

ID=50684427

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102139866A TWI542465B (zh) 2012-11-07 2013-11-01 Transparent conductive film

Country Status (5)

Country Link
JP (1) JP6242571B2 (ja)
KR (2) KR20150080587A (ja)
CN (1) CN104903975A (ja)
TW (1) TWI542465B (ja)
WO (1) WO2014073310A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI528075B (zh) 2014-08-12 2016-04-01 群創光電股份有限公司 顯示面板
WO2016104046A1 (ja) * 2014-12-22 2016-06-30 日東電工株式会社 透明導電性フィルム
JP6661335B2 (ja) * 2014-12-22 2020-03-11 日東電工株式会社 透明導電性フィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1049306A (ja) * 1996-08-02 1998-02-20 Oji Paper Co Ltd タッチパネル用透明導電性フィルム
EP2610231A2 (en) * 1998-08-31 2013-07-03 Idemitsu Kosan Co., Ltd. Target for transparent electroconductive film, transparent electroconductive material, transparent electroconductive glass, and transparent electroconductive film
JP2010212085A (ja) * 2009-03-10 2010-09-24 Toppan Printing Co Ltd 透明導電薄膜
JP5101719B2 (ja) * 2010-11-05 2012-12-19 日東電工株式会社 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル

Also Published As

Publication number Publication date
KR20150080587A (ko) 2015-07-09
KR20170052697A (ko) 2017-05-12
JP6242571B2 (ja) 2017-12-06
TW201429702A (zh) 2014-08-01
JP2014096222A (ja) 2014-05-22
CN104903975A (zh) 2015-09-09
WO2014073310A1 (ja) 2014-05-15

Similar Documents

Publication Publication Date Title
TWI413699B (zh) Transparent conductive film
TW201301310A (zh) 導電膜用素材、導電膜積層體、電子機器及其等之製造方法
JP5101719B2 (ja) 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル
TWI386954B (zh) Method for manufacturing transparent conductive film
WO2012173192A1 (ja) 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス
JP2013001009A5 (ja)
CN103941918A (zh) 一种石墨烯薄膜触控传感器及其制造方法
US9304635B2 (en) Conductive film
KR20190013777A (ko) 투명 전극 형성 압전 필름 및 압력 센서
TWI542465B (zh) Transparent conductive film
TW201446981A (zh) 觸控面板,其製備方法及用於觸控面板之銀-鈀-釹(ag-pd-nd)合金
JP5988671B2 (ja) 導電性基板、タッチパネル、および導電性基板の製造方法
TWI617460B (zh) 透明導電層積膜及其製造方法
JP6096869B2 (ja) 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス
JP5848786B2 (ja) 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。
WO2015159805A1 (ja) 積層体、導電性積層体、および電子機器
JP2017123333A (ja) 透明導電性フィルム
KR101816972B1 (ko) TiO2/Ag/TiO2 다층박막 구조를 갖는 플렉시블 투명 전극 및 그 제조방법
JPWO2014087847A1 (ja) タッチパネル用透明電極、タッチパネル、および表示装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees