TWI541993B - 有機發光顯示器及製造其之方法 - Google Patents
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- TWI541993B TWI541993B TW099140329A TW99140329A TWI541993B TW I541993 B TWI541993 B TW I541993B TW 099140329 A TW099140329 A TW 099140329A TW 99140329 A TW99140329 A TW 99140329A TW I541993 B TWI541993 B TW I541993B
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- organic light
- light emitting
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 230000000903 blocking effect Effects 0.000 claims description 66
- 239000000758 substrate Substances 0.000 claims description 31
- 238000002161 passivation Methods 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 8
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 7
- 229910002113 barium titanate Inorganic materials 0.000 claims description 7
- 239000011572 manganese Substances 0.000 claims description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 6
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 181
- 239000012044 organic layer Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910000449 hafnium oxide Inorganic materials 0.000 description 3
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- -1 ZnO Chemical compound 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910007717 ZnSnO Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- MELCHESAQRWXNO-UHFFFAOYSA-N bismuth zinc indium(3+) oxygen(2-) Chemical compound [O-2].[Zn+2].[Bi+3].[In+3].[O-2].[O-2].[O-2] MELCHESAQRWXNO-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thin Film Transistor (AREA)
Description
實施例涉及一種有機發光顯示器和一種製造其之方法。
主動矩陣式有機發光顯示器可包括在每個像素中的薄膜電晶體(thin film transistor,TFT)和連接到電晶體的有機發光二極體(organic light emitting diode,OLED)。
TFT的主動層可由非晶矽或多晶矽形成。最近,已經對使用氧化物半導體來形成TFT的主動層作出嘗試。
實施例的特點它是提供一種包括薄膜電晶體(TFT)的有機發光顯示器,以及一種製造有機發光顯示器的方法,其中可預防光、水和/或氧氣的滲透。
實施例的另一個特點是提供一種有機發光顯示器,以及一種製造有機發光顯示器的方法,其可方便地應用於大型的顯示裝置並且大規模地生產。
上述與其他特點和優勢的至少一個可藉由提供有機發光顯示器來實現,該有機發光顯示器包括:閘極電極,在基板上;主動層,與該閘極電極絕緣;源極和汲極電極,與該閘極電極絕緣並接觸該主動層;絕緣層,在該主動層與該源極和汲極電極之間;光阻擋層,在該主動層上並且自該主動層阻擋預定波長的光;以及有機發光裝置,電連接到該源極和汲極電極其中一者。
該光阻擋層可以阻擋藍光。
該光阻擋層可包括錳摻雜鈦酸鋇、氮化鈦和電致變色氧化鎳中的至少一者。
該光阻擋層可在該絕緣層上。
該光阻擋層可直接在該絕緣層上。
有機發光顯示器可進一步包括鈍化層,其覆蓋該閘極絕緣層、該源極和汲極電極和該絕緣層。該光阻擋層可在該鈍化層上。
該光阻擋層可配置在從該有機發光裝置發出的光的路徑上,其中該光的路徑入射到該主動層。
至少一部分從該有機發光裝置發出的光可藉由該光阻擋層所反射。
該主動層可包括氧化物半導體。
從該有機發光裝置發出的光可朝向該基板發出。
上述與其他特點和優勢的至少一個也可藉由提供製造有機發光顯示器的方法來實現,該方法包括:在基板上形成閘極電極;形成與該閘極電極絕緣的主動層;形成源極和汲極電極,其與該閘極電極絕緣並且接觸該主動層;形成絕緣層,該絕緣層是在該主動層與該源極和汲極電極之間;在該主動層上形成光阻擋層,該光阻擋層至少覆蓋該主動層的通道區;以及形成有機發光裝置,其電連接到該源極和汲極電極。
該方法可進一步包括:在該基板上形成閘極絕緣層,以覆蓋該閘極電極;在該閘極絕緣層上形成該主動層;形成該絕緣層,以至少覆蓋該主動層的通道區;以及在該絕緣層上形成該光阻擋層,致使至少覆蓋該主動層的通道區。
該方法可進一步包括:在該基板上形成閘極絕緣層,以覆蓋該閘極電極;在該閘極絕緣層上形成該主動層;形成該絕緣層,以至少覆蓋該主動層的通道區;在該絕緣層上形成該源極和汲極電極,以接觸該主動層;形成鈍化層,以覆蓋該閘極絕緣層、該源極和汲極電極與該絕緣層;以及在該鈍化層上形成該光阻擋層,致使至少覆蓋該主動層的通道區。
該光阻擋層可以阻擋藍光。
該光阻擋層可包括錳摻雜鈦酸鋇、氮化鈦和電致變色氧化鎳中的至少一者。
該光阻擋層可配置在從該有機發光裝置發出的光的路徑上,其中該路徑入射到該通道區。
至少一部分從該有機發光裝置發出的光可藉由該光阻擋層所反射。
從該有機發光裝置發出的光可朝向該基板發出。
該主動層可包括氧化物半導體。
1‧‧‧基板
2‧‧‧薄膜電晶體
3‧‧‧有機發光元件
21‧‧‧閘極電極
22‧‧‧閘極絕緣層
23‧‧‧主動層
23a‧‧‧通道區
24‧‧‧絕緣層
25‧‧‧源極電極
26‧‧‧汲極電極
27‧‧‧鈍化層
28‧‧‧像素定義層
29‧‧‧光阻擋層
29'‧‧‧光阻擋層
31‧‧‧第一電極
32‧‧‧有機層
33‧‧‧第二電極
該領域中通常技術人士可參考所附圖式來詳細描述示範性實施例以對上述的其他特點和優點更加明顯,其中:圖1為根據第一實施例來說明有機發光顯示器的橫截面圖;圖2為根據第二實施例來說明有機發光顯示器的橫截面圖;圖3說明用於解釋第一和第二實施例的特點的光路徑圖;以及圖4A至4E說明在製造圖1的有機發光顯示器的方法中的階段的橫截面圖。
韓國專利申請第10-2009-0130020號,於2009年12月23日在韓國知識產權局提申,名稱為:“有機發光顯示器及製造其之方法(ORGANIC LIGHT EMITTING DISPLAY AND MANUFACTURING METHOD THEREOF)”,其以參考形式將它全部內容併入於此。
示範性實施例現在將參照以下所附的圖式以更加充分地描述,但是他們可能會以不同的形式來實施,並且不應被解釋為僅限於此處本描述的實施例。相反地,提供這些實施例使這這些披露將更徹底和完整,並且對該領域中的技術人士充分表達本發明的範圍。
在圖式中,元素和區域的尺寸可被誇大以清晰的說明。它也可以理解成,當層或元素被稱為是“在另一元素或基板上”,它可以直接在其他元素或基板,或者也可以介入元素來呈現。此外,它也可以理解成,當元素被稱為是“在兩個元素之間”,它可以是在兩個元素之間的唯一個元素,或者也可以介入一個或多個元素來呈現。從頭到尾相似的參考數字是指相似的元素。
實施例涉及一種有機發光顯示器和一種製造其之方法。有機發光顯示器可包括在其像素單位中的一個或多個薄膜電晶體(TFT)。
圖1為根據第一實施例來說明有機發光顯示器的橫截面圖。
在圖1,為方便解釋,說明有機發光顯示器的像素的部分。將了解有機發光顯示器可包括複數個這樣的像素。
參考圖1,薄膜電晶體(TFT)2和有機發光元件3可配置在基板1上。在圖1,TFT 2是作為底部閘極型(或閘極第一)TFT來說明。但是,將理解的是實施例也可應用於頂部閘極型TFT,其中該主動層配置在閘極之下。有機發光顯示器可以是頂部發射型顯示器,其中顯示器是從基板1對面來看,或是底部發射型顯示器,其中顯示器是從基板1側來看(在圖1中的底部)。
基板1可由透明材料來形成,例如,在底部發射型顯示器的狀況下。緩衝層(未顯示)由例如氧化矽的材料來形成,可進一步形成在基板1上。
當TFT 2是底部閘極型,TFT 2可包括形成在基板1上的閘極電極21、覆蓋閘極電極21的閘極絕緣層22以及形成在閘極絕緣層22上的主動層23。絕緣層24可形成在閘極絕緣層22上以覆蓋主動層23以及源極電極25和汲極電極26可形成在絕緣層24上。源極電極25和汲極電極26可分別接觸主動層23的源極和汲極區。
正如文中詳細描述,光阻擋層29可被形成在主動層23上以減少或消除光線的照射。在圖1所示的實施例中,光阻擋層29可被形成在絕緣層24上以覆蓋主動層23的至少一部分,例如,通道區23a和鄰近其的部分源極/汲極區。在實施中,光阻擋層29可直接形成在絕緣層24上。相較於應用塗覆基板1的整個表面的層,光阻擋層29可相對較小、節省並容易形成,當基板的大小(即顯示器大小)增加時,該些特點成為更有利的。
閘極電極21由例如導電金屬所形成。閘極電極21可以單層或多層來形成。閘極電極21可包括鉬。
閘極絕緣層22可由絕緣材料(例如,氧化矽、氧化鉭、氧化鋁等)所形成
主動層23可在閘極絕緣層22上圖案化。主動層23可由(例如,氧化物半導體)所形成。例如,氧化物半導體主動層23包括半導體材料,其包括氧(O)以及鎵(Ga)、磷(I)、鉿(Hf)、鋅(Zn)和錫(Sn)
中之至少一者,諸如ZnO、ZnGaO、ZnInO、GaInO、GaSnO、ZnSnO、InSnO、HfInZnO或ZnGaInO。在實施中,氧化物半導體主動層23可以是H-I-Z-O層或一層a(In2O3)b(Ga2O3)c(ZnO)(G-I-Z-O層),其中a、b和c是實數,其分別滿足a0、b0和c>0。
絕緣層24可被形成以覆蓋主動層23。絕緣層24可保護主動層23的通道區23a。在實施中,絕緣層24可只被形成在通道區23a。另一實施中,絕緣層24可完全覆蓋主動層23,除了接觸源極和汲極25和26的主動層23的部分。
光阻擋層29可被形成以覆蓋絕緣層24。光阻擋層29可保護主動層23的通道區23a以避免暴露在光線下。在實施中,光阻擋層29可阻擋或對藍光有選擇性,例如,具有約450奈米波長的光。在實施中,光阻擋層可只在通道區23a上形成。另一實施(未顯示),光阻擋層29可覆蓋主動層23,除了接觸源極和汲極25和26的其的部分。光阻擋29層將進一步詳細說明如下。
源極電極25和汲極電極26可在光阻擋層29上形成,以便接觸主動層23。鈍化層27可在光阻擋層29上形成以覆蓋源極電極25和汲極電極26。接觸汲極電極26的有機發光元件3的第一電極31可形成在鈍化層27上。第一電極31可藉由如圖案而形成於每個像素中。
暴露第一電極31的部分的像素定義層(pixel defining layer,PDL)28可形成在鈍化層27上。有機層32可形成在第一電極31的部分上,其藉由PDL 28所暴露。第二電極33可形成在有機層32上。
PDL 28可被形成以覆蓋第一電極31的兩端。除了定義發光區,PDL 28可擴大在第一電極31和第二電極33兩端之間的距離,從而防止在第一電極兩端上的電場集中。因此,在第一電極31和第二電極33之間的短路可被預防。
在頂部發射型有機發光顯示器中,其中圖像是朝第二電極33所形成,第一電極31可以是反射電極。在這種情況下,由鋁、銀等合金所形成的反射層可用於第一電極31。
當第一電極31作為陽極電極使用時,第一電極31可包括由金屬氧化物所形成之層,諸如ITO、IZO或ZnO,其具有高功函數(絕對值)。當第一電極31被作為陰極電極來使用時,第一電極31可包括具有低功函數(絕對值)的高導電金屬,如Ag、Mg、Al、Pt、Pd、Au、Ni、Nd、Ir、Cr、Li或Ca。在這種情況下,分開的反射層可被省略。
在頂部發射型有機發光顯示器中,第二電極33可以是光透射電極。在這種情況下,第二電極33可包括半透射反射層(包括Ag、Mg、Al、Pt、Pd、Au、Ni、Nd、Ir、Cr、Li或Ca所形成的薄膜)或者透光金屬氧化物(諸如ITO、IZO或ZnO)。當第一電極31作為陽極使用,則第二電極33作為陰極使用,當第一電極31作為陰極使用,則第二電極33作為陽極使用。
插入在第一電極31和第二電極33之間的有機層32可以是,或可包括發光層。在實施中,有機層32可由堆疊結構所形成,其中電洞注入層、發光層、電子注入層和傳輸層等被堆積在其中。
雖然沒有顯示在圖1,保護層可進一步形成在第二電極33上,並且像素可使用例如在其頂部的玻璃來封裝。
圖1的有機發光顯示器的光阻擋層29現在將進一步詳細說明。
當使用氧化物半導體來形成主動層23時,最好阻擋光線、氧氣和水。其中,當製造有機發光顯示器,在一定程度上可使用第一電極31與第二電極33或使用封裝過程來阻擋氧氣和水。入射到TFT 2的光線、外部光線可藉由使用(UV塗層)黑色矩陣等所阻擋。但是,從顯示器本身發射的光可對TFT 2造成負面影響,例如從有機發光元件3的有機層32所發射的具有約450nm藍光波長的光。
圖3說明用於解釋第一和第二實施例的特點的光路徑圖。參考圖3,有兩條路,從有機層32發出的光可透過其入射到TFT 2。第一路徑是在圖3中以字母A所表示的路徑,通過從有機層32發出的光線照射到主動層23,其通過在源極和汲極電極25和26以及閘極電極21之間。凡在源極和汲極電極25和26以及閘極電極21之間的距離僅約350奈米,即藍光波長(約450nm),光線照射到的TFT 2有可能是比較低的。第二路徑是在圖3中以字母B所表示的路徑,通過從有機層32發出的光線照射到主動層23,其通過PDL 28和鈍化層27。在第二情況下,光線通過源極25和汲極電極26之間。另外,在源極和汲極電極25和26以及第二電極33之間的距離可以是約1800nm或以上,這樣,從有機層32發射的光可被引導到主動層23。
在根據第一實施例的有機發光顯示器中,絕緣層24和光阻擋層29可形成在主動層23上。因此,在根據第一實施例的有機發光顯示器中,從有機層32發射的光可被阻擋或過濾以避免直接入射到主動層23。
光阻擋層29在光的光路徑上形成,其從有機層32入射到TFT 2。光阻擋層29可由材料所形成,其能夠阻擋藍光。例如,錳(Mn)摻雜的鈦酸鋇(BaTiO3)、氮化鈦(TiN)或電致變色氧化鎳(NiO)可作為光阻擋層29使用。這些材料主要是棕色和可阻擋藍光。在實施中,絕緣層(未顯示)可形成在光阻擋層29及源極/汲極電極25,26之間,以防止其間的電接觸。
如與第一實施例有關的上述,有機發光顯示器可以被構成,致使可禁止藍光直接入射到主動層23,其可增加氧化物半導體層的穩定性,減少產品缺陷並且增加用戶的便利。
圖2為根據第二實施例來說明有機發光顯示器的橫截面圖。
參考圖2,光阻擋層29'可在鈍化層27上形成。例如,源極電極25、汲極電極26並且鈍化層27可依序形成在絕緣層24上,並且光阻擋層29'可被形成在對應於主動層23的鈍化層27的部分。光阻擋層29'的大小和位置以攔截光路徑,其從有機層32入射到TFT 2。因此,可增加有機發光顯示裝置的可靠性。
圖4A至4E說明在製造包括圖1所式的光阻擋層29的有機發光顯示器的方法中的階段的橫截面圖。
參考圖4A,首先,可提供基板1。基材1可由矽(Si)、玻璃或有機材料所形成。凡有機發光顯示裝置是底部發射型顯示器,基材1可是透明的。當使用矽基板,絕緣層(如氧化矽(未顯示))可形成在(使用例如熱氧化過程)矽基板的表面上。再者,基板1可以導電材料(如金屬或導電氧化物)所塗覆,然後圖案化以形成閘極電極21。
再者,參考圖4B,絕緣材料可被塗覆在閘極電極21上並且圖案化以形成閘極絕緣層22。
再者,參考圖4C,半導體材料(例如氧化物半導體材料)可配置在對應於閘極電極21的閘極絕緣層22的一部分的。可使用例如物理氣相沉積(physical vapor deposition,PVD)方法、化學氣相沉積(chemical vapor deposition,CVD)方法或者原子層沉積(atomic layer deposition,ALD)方法來沉積半導體材料。可圖案化半導體材料以形成主動層23。半導體材料的例子包括一層a(In2O3)b(Ga2O3)c(ZnO)(G-I-Z-O層),其中a、b和c是實數,其分別滿足a0、b0和c>0,以及鉿銦鋅氧化物(H-I-Z-O)層。
再者,參考圖4D,絕緣材料可在主動層23上塗覆以覆蓋主動層23的通道層23a。可圖案化絕緣材料以形成絕緣層24。然後,可在絕緣層24上塗覆光阻擋材料(用於光阻擋層29)以覆蓋被圖案化的絕緣層24。光阻擋層29可由能夠阻擋藍光的材料所形成。例如,錳摻雜鈦酸鋇(BaTiO3)、氮化鈦(TiN)或電致變色氧化鎳(NiO)可作為光阻擋層29使用。這些材料大多是棕色,並能阻斷藍光。光阻擋層29形成在從有機層32入射到TFT 2的光的路徑上。
再者,參考圖4E,金屬或導電金屬氧化物(源極和汲極電極25,26)可在閘極絕緣層22、主動層23和光阻擋層29上塗覆。金屬或導電金屬氧化物可被圖案化以形成源極電極25和汲極電極26。
隨後,可形成鈍化層27以覆蓋源極電極25和汲極電極26。接觸孔可形成在鈍化層27上,並且接觸汲極電極26的有機發光元件3的第一電極可透過接觸孔而形成。再者,暴露第一電極31的部分的PDL 28可形成在鈍化層27上,並且有機層32和第二電極33可形成在第一電極31的部分上,其藉由PDL 28所暴露,從而完成如圖1所示的結構。
如上所述,根據實施例的有機發光顯示可以防止光線,如藍光,以避免直接入射到TFT 2,其可增加在TFT 2中的氧化物半導體的穩定性、降低產品缺陷並增加用戶的便利。
氧化物半導體的特性(諸如臨界電壓、S因子等)可由於水、氧氣或光的滲透而改變。此外,由於水、氧氣或光所致的臨界電壓的變化可能會在TFT驅動期間由閘極電極的DC偏壓而進一步增加,因此,關於使用氧化物半導體的DC穩定性是最大的問題。為了提高對水或氧氣的氧化物半導體的阻隔特性,可以使用氧化鋁(AlOx)層或氮化鈦(TiN)層。然而,當應用到大尺寸基板時,使用反應濺射方法或原子層沉積(ALD)方法來形成這些層可能是困難的,這樣這些層的大量生產可能較低。相比之下,如上所述涉嫌第一和第二實施例的有機發光顯示器可以使用光阻擋層29來防止光線(如藍光)以避免直接入射到TFT 2。
示範性實施例已揭露於此,雖然特定的用語是使用的,並且它們被使用且以通用且能描述的理解來解釋,而不是用於限制的目的。因此,在該領域中通常技藝者將是理解成各種形式的變化和細節可在不偏離下列所規定的申請專利範圍中的本發明的精神和範圍內完成。
1‧‧‧基板
2‧‧‧薄膜電晶體
3‧‧‧有機發光元件
21‧‧‧閘極電極
22‧‧‧閘極絕緣層
23‧‧‧主動層
23a‧‧‧通道區
24‧‧‧絕緣層
25‧‧‧源極電極
26‧‧‧汲極電極
27‧‧‧鈍化層
28‧‧‧像素定義層
29‧‧‧光阻擋層
31‧‧‧第一電極
32‧‧‧有機層
33‧‧‧第二電極
Claims (19)
- 一種有機發光顯示器,包括:閘極電極,在基板上;主動層,與該閘極電極絕緣;源極和汲極電極,與該閘極電極絕緣並接觸該主動層;絕緣層,在該主動層與該源極和汲極電極之間;光阻擋層,在該主動層上並且自該主動層阻擋預定波長的光,其中該光阻擋層之寬度係實質上等於該主動層之一通道區之寬度;以及有機發光裝置,電連接到該源極和汲極電極其中一者。
- 根據申請專利範圍第1項的有機發光顯示器,其中該光阻擋層阻擋藍光。
- 根據申請專利範圍第2項的有機發光顯示器,其中該光阻擋層包括錳摻雜鈦酸鋇、氮化鈦和電致變色氧化鎳中的至少一者。
- 根據申請專利範圍第1項的有機發光顯示器,其中該光阻擋層是在該絕緣層上。
- 根據申請專利範圍第4項的有機發光顯示器,其中該光阻擋層是直接在該絕緣層上。
- 根據申請專利範圍第4項的有機發光顯示器,進一步包括鈍化層,其覆蓋該閘極絕緣層、該源極和汲極電極以及該絕緣層,其中該光阻擋層是在該鈍化層上。
- 根據申請專利範圍第1項的有機發光顯示器,其中該光阻擋層配置在從該有機發光裝置發出的光的路徑上,其中該光的路徑入射到該主動層。
- 根據申請專利範圍第1項的有機發光顯示器,其中至少一部分從該有機發光裝置發出的光是藉由該光阻擋層所反射。
- 根據申請專利範圍第1項的有機發光顯示器,其中該主動層包括氧化物半導體。
- 根據申請專利範圍第1項的有機發光顯示器,其中從該有機發光裝置發出的光朝向該基板發出。
- 一種製造有機發光顯示器的方法,該方法包括:在基板上形成閘極電極;形成與該閘極電極絕緣的主動層;形成源極和汲極電極,其與該閘極電極絕緣並且接觸該主動層;形成絕緣層,該絕緣層是在該主動層與該源極和汲極電極之間; 在該主動層上形成光阻擋層,其中該光阻擋層之寬度係實質上等於該主動層之一通道區之寬度;以及形成有機發光裝置,其電連接到該源極和汲極電極。
- 根據申請專利範圍第11項的方法,進一步包括:在該基板上形成閘極絕緣層,以覆蓋該閘極電極;在該閘極絕緣層上形成該主動層;形成該絕緣層,以至少覆蓋該主動層的該通道區;以及在該絕緣層上形成該光阻擋層,致使至少覆蓋該主動層的該通道區。
- 根據申請專利範圍第11項的方法,進一步包括:在該基板上形成閘極絕緣層,以覆蓋該閘極電極;在該閘極絕緣層上形成該主動層;形成該絕緣層,以至少覆蓋該主動層的該通道區;在該絕緣層上形成該源極和汲極電極,以接觸該主動層;形成鈍化層,以覆蓋該閘極絕緣層、該源極和汲極電極及該絕緣層;以及在該鈍化層上形成該光阻擋層,致使至少覆蓋該主動層的該通道區。
- 根據申請專利範圍第11項的方法,其中該光阻擋層阻擋藍光。
- 根據申請專利範圍第14項的方法,其中該光阻擋層包括錳摻雜鈦酸鋇、氮化鈦或電致變色氧化鎳中的至少一者。
- 根據申請專利範圍第11項的方法,其中該光阻擋層配置在從該有機發光裝置發出的光的路徑上,其中該路徑入射到該通道區。
- 根據申請專利範圍第11項的方法,其中至少一部分從該有機發光裝置發出的光是藉由該光阻擋層所反射。
- 根據申請專利範圍第11項的方法,其中從該有機發光裝置發出的光朝向該基板發出。
- 根據申請專利範圍第11項的方法,其中該主動層包括氧化物半導體。
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