TWI541327B - 以混合之酸溶液蝕刻有機聚合物之無鉻方法 - Google Patents

以混合之酸溶液蝕刻有機聚合物之無鉻方法 Download PDF

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Publication number
TWI541327B
TWI541327B TW103113823A TW103113823A TWI541327B TW I541327 B TWI541327 B TW I541327B TW 103113823 A TW103113823 A TW 103113823A TW 103113823 A TW103113823 A TW 103113823A TW I541327 B TWI541327 B TW I541327B
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Taiwan
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iii
solution
ions
acid
concentration
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TW103113823A
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English (en)
Chinese (zh)
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TW201446939A (zh
Inventor
凱撒琳娜 威特史葛司
王 章貝林格
安卓 史奇巴爾
瓊納斯 辜貝
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羅門哈斯電子材料有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • C09K13/04Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • C08J7/14Chemical modification with acids, their salts or anhydrides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • C09K13/04Etching, surface-brightening or pickling compositions containing an inorganic acid
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/24Roughening, e.g. by etching using acid aqueous solutions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Weting (AREA)
TW103113823A 2013-04-16 2014-04-16 以混合之酸溶液蝕刻有機聚合物之無鉻方法 TWI541327B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/863,979 US9267077B2 (en) 2013-04-16 2013-04-16 Chrome-free methods of etching organic polymers with mixed acid solutions

Publications (2)

Publication Number Publication Date
TW201446939A TW201446939A (zh) 2014-12-16
TWI541327B true TWI541327B (zh) 2016-07-11

Family

ID=50478771

Family Applications (1)

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TW103113823A TWI541327B (zh) 2013-04-16 2014-04-16 以混合之酸溶液蝕刻有機聚合物之無鉻方法

Country Status (6)

Country Link
US (1) US9267077B2 (enExample)
EP (1) EP2792702B1 (enExample)
JP (1) JP6444610B2 (enExample)
KR (1) KR102227656B1 (enExample)
CN (1) CN104109537B (enExample)
TW (1) TWI541327B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3327175B1 (en) 2013-10-22 2019-12-18 Okuno Chemical Industries Co., Ltd. Composition for etching treatment of resin material
EP3168326B2 (en) 2014-07-10 2023-09-20 Okuno Chemical Industries Co., Ltd. Resin plating method
ES2708341T3 (es) 2016-11-22 2019-04-09 Macdermid Enthone Gmbh Grabado exento de cromo para un galvanizado sobre plástico
US20190009185A1 (en) * 2017-07-10 2019-01-10 Srg Global, Inc. Hexavalent chromium free etch manganese vacuum evaporation system
KR102172092B1 (ko) * 2017-09-19 2020-10-30 주식회사 엘지화학 열가소성 수지 조성물, 이의 제조방법 및 성형품
ES2646237B2 (es) * 2017-09-28 2018-07-27 Avanzare Innovacion Tecnologica S.L. Formulación para el mordentado de materiales poliméricos previo al recubrimiento de los mismos
JP6477832B1 (ja) * 2017-10-31 2019-03-06 栗田工業株式会社 ポリプロピレン樹脂の親水化処理方法
JP6477831B1 (ja) * 2017-10-31 2019-03-06 栗田工業株式会社 ポリフェニレンサルファイド樹脂の親水化処理方法
FR3074808B1 (fr) 2017-12-13 2020-05-29 Maxence RENAUD Outillage de galvanoplastie
CN109440156A (zh) * 2018-11-27 2019-03-08 广州三孚新材料科技股份有限公司 一种abs塑料的无铬粗化液及其使用方法
US10889905B2 (en) * 2018-12-11 2021-01-12 Rohm And Haas Electronic Materials Llc Methods of generating manganese (III) ions in mixed aqueous acid solutions using ozone
WO2021134205A1 (zh) * 2019-12-30 2021-07-08 瑞声声学科技(深圳)有限公司 一种lcp薄膜的表面处理方法

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US4349421A (en) * 1979-09-17 1982-09-14 Allied Corporation Preparation of metal plated polyamide thermoplastic articles having mirror-like metal finish
US5143592A (en) * 1990-06-01 1992-09-01 Olin Corporation Process for preparing nonconductive substrates
US5556787A (en) 1995-06-07 1996-09-17 Hach Company Manganese III method for chemical oxygen demand analysis
GB9714275D0 (en) * 1997-07-08 1997-09-10 Ciba Geigy Ag Oxidation process
JP2001271171A (ja) * 2000-03-27 2001-10-02 Daishin Kagaku Kk 無電解めっき処理法、および前処理剤
DE102005051632B4 (de) 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
ATE445667T1 (de) * 2007-08-10 2009-10-15 Enthone Chromfreie beize für kunststoffoberflächen
LT5645B (lt) * 2008-07-18 2010-03-25 Chemijos Institutas, , Plastikų ėsdinimo kompozicija
US9534306B2 (en) 2012-01-23 2017-01-03 Macdermid Acumen, Inc. Electrolytic generation of manganese (III) ions in strong sulfuric acid
US9752241B2 (en) 2012-01-23 2017-09-05 Macdermid Acumen, Inc. Electrolytic generation of manganese (III) ions in strong sulfuric acid using an improved anode
US10260000B2 (en) * 2012-01-23 2019-04-16 Macdermid Acumen, Inc. Etching of plastic using acidic solutions containing trivalent manganese
US8603352B1 (en) 2012-10-25 2013-12-10 Rohm and Haas Electroncis Materials LLC Chrome-free methods of etching organic polymers
WO2014164272A1 (en) * 2013-03-12 2014-10-09 Macdermid Acumen, Inc. Electrolytic generation of manganese (iii) ions in strong sulfuric acid
US20140318983A1 (en) * 2013-04-25 2014-10-30 Macdermid Acumen, Inc. Regeneration of Etch Solutions Containing Trivalent Manganese in Acid Media

Also Published As

Publication number Publication date
CN104109537B (zh) 2017-01-11
EP2792702A1 (en) 2014-10-22
TW201446939A (zh) 2014-12-16
KR102227656B1 (ko) 2021-03-15
EP2792702B1 (en) 2017-06-07
US9267077B2 (en) 2016-02-23
KR20140124341A (ko) 2014-10-24
JP6444610B2 (ja) 2018-12-26
US20140306147A1 (en) 2014-10-16
JP2014212319A (ja) 2014-11-13
CN104109537A (zh) 2014-10-22

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