CN104109537B - 使用混合酸液无铬刻蚀有机聚合物的方法 - Google Patents

使用混合酸液无铬刻蚀有机聚合物的方法 Download PDF

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Publication number
CN104109537B
CN104109537B CN201410245518.1A CN201410245518A CN104109537B CN 104109537 B CN104109537 B CN 104109537B CN 201410245518 A CN201410245518 A CN 201410245518A CN 104109537 B CN104109537 B CN 104109537B
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solution
iii
acid
ions
concentration
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Chinese (zh)
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CN104109537A (zh
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K·魏特邵斯
W·张-伯格林格
A·沙耶伯
J·格比
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DuPont Electronic Materials International LLC
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Rohm and Haas Electronic Materials LLC
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Weting (AREA)
CN201410245518.1A 2013-04-16 2014-04-16 使用混合酸液无铬刻蚀有机聚合物的方法 Active CN104109537B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/863,979 2013-04-16
US13/863,979 US9267077B2 (en) 2013-04-16 2013-04-16 Chrome-free methods of etching organic polymers with mixed acid solutions

Publications (2)

Publication Number Publication Date
CN104109537A CN104109537A (zh) 2014-10-22
CN104109537B true CN104109537B (zh) 2017-01-11

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Country Link
US (1) US9267077B2 (enExample)
EP (1) EP2792702B1 (enExample)
JP (1) JP6444610B2 (enExample)
KR (1) KR102227656B1 (enExample)
CN (1) CN104109537B (enExample)
TW (1) TWI541327B (enExample)

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BR112015016031A2 (pt) 2013-10-22 2017-07-11 Okuno Chem Ind Co composição para tratamento de decapagem de material de resina
MX381315B (es) 2014-07-10 2025-03-12 Okuno Chem Ind Co Método para recubrir resina.
EP3323910B1 (en) * 2016-11-22 2018-11-14 MacDermid Enthone GmbH Chromium-free plating-on-plastic etch
US20190009185A1 (en) * 2017-07-10 2019-01-10 Srg Global, Inc. Hexavalent chromium free etch manganese vacuum evaporation system
KR102172092B1 (ko) * 2017-09-19 2020-10-30 주식회사 엘지화학 열가소성 수지 조성물, 이의 제조방법 및 성형품
ES2646237B2 (es) * 2017-09-28 2018-07-27 Avanzare Innovacion Tecnologica S.L. Formulación para el mordentado de materiales poliméricos previo al recubrimiento de los mismos
JP6477832B1 (ja) * 2017-10-31 2019-03-06 栗田工業株式会社 ポリプロピレン樹脂の親水化処理方法
JP6477831B1 (ja) * 2017-10-31 2019-03-06 栗田工業株式会社 ポリフェニレンサルファイド樹脂の親水化処理方法
FR3074808B1 (fr) 2017-12-13 2020-05-29 Maxence RENAUD Outillage de galvanoplastie
CN111519225B (zh) * 2018-11-27 2021-09-14 广州三孚新材料科技股份有限公司 Abs塑料的无铬无锰粗化液及其使用方法
US10889905B2 (en) * 2018-12-11 2021-01-12 Rohm And Haas Electronic Materials Llc Methods of generating manganese (III) ions in mixed aqueous acid solutions using ozone
WO2021134205A1 (zh) * 2019-12-30 2021-07-08 瑞声声学科技(深圳)有限公司 一种lcp薄膜的表面处理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1148153A2 (en) * 2000-03-27 2001-10-24 Daishin Chemical Co., Ltd. Electroless plating process and pretreating agent used therefor
CN1958844A (zh) * 2005-10-28 2007-05-09 恩通公司 蚀刻非传导基材表面的方法
LT5645B (lt) * 2008-07-18 2010-03-25 Chemijos Institutas, , Plastikų ėsdinimo kompozicija
CN101835924A (zh) * 2007-08-10 2010-09-15 恩索恩公司 用于塑料表面的无铬酸洗液

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US4349421A (en) * 1979-09-17 1982-09-14 Allied Corporation Preparation of metal plated polyamide thermoplastic articles having mirror-like metal finish
US5143592A (en) * 1990-06-01 1992-09-01 Olin Corporation Process for preparing nonconductive substrates
US5556787A (en) 1995-06-07 1996-09-17 Hach Company Manganese III method for chemical oxygen demand analysis
GB9714275D0 (en) * 1997-07-08 1997-09-10 Ciba Geigy Ag Oxidation process
US10260000B2 (en) * 2012-01-23 2019-04-16 Macdermid Acumen, Inc. Etching of plastic using acidic solutions containing trivalent manganese
US9752241B2 (en) 2012-01-23 2017-09-05 Macdermid Acumen, Inc. Electrolytic generation of manganese (III) ions in strong sulfuric acid using an improved anode
US9534306B2 (en) 2012-01-23 2017-01-03 Macdermid Acumen, Inc. Electrolytic generation of manganese (III) ions in strong sulfuric acid
US8603352B1 (en) 2012-10-25 2013-12-10 Rohm and Haas Electroncis Materials LLC Chrome-free methods of etching organic polymers
CA2955467C (en) * 2013-03-12 2021-03-16 Macdermid Acumen, Inc. Method of etching a plastic part
US20140318983A1 (en) * 2013-04-25 2014-10-30 Macdermid Acumen, Inc. Regeneration of Etch Solutions Containing Trivalent Manganese in Acid Media

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1148153A2 (en) * 2000-03-27 2001-10-24 Daishin Chemical Co., Ltd. Electroless plating process and pretreating agent used therefor
CN1958844A (zh) * 2005-10-28 2007-05-09 恩通公司 蚀刻非传导基材表面的方法
CN101835924A (zh) * 2007-08-10 2010-09-15 恩索恩公司 用于塑料表面的无铬酸洗液
LT5645B (lt) * 2008-07-18 2010-03-25 Chemijos Institutas, , Plastikų ėsdinimo kompozicija

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Oxidation of L-Aspartic Acid and L-Glutamic Acid by Manganese(Ⅲ) Ions in Aqueous Sulphuric Acid, Acetic Acid, and Pyrophosphate Media: A Kinetic Study;B.S. SHERIGARA，etal;《International Journal of Chemical Kinetics》;19950101;第675-690页 *

Also Published As

Publication number Publication date
EP2792702A1 (en) 2014-10-22
TWI541327B (zh) 2016-07-11
KR20140124341A (ko) 2014-10-24
EP2792702B1 (en) 2017-06-07
KR102227656B1 (ko) 2021-03-15
US9267077B2 (en) 2016-02-23
JP6444610B2 (ja) 2018-12-26
TW201446939A (zh) 2014-12-16
US20140306147A1 (en) 2014-10-16
CN104109537A (zh) 2014-10-22
JP2014212319A (ja) 2014-11-13

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Address after: Massachusetts, USA

Patentee after: DuPont Electronic Materials International LLC

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Address before: Massachusetts, USA

Patentee before: ROHM AND HAAS ELECTRONIC MATERIALS, LLC

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